CN102015240A - Glass structure having sub-micron and nano-size bandgap structures and method for producing same - Google Patents
Glass structure having sub-micron and nano-size bandgap structures and method for producing same Download PDFInfo
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- CN102015240A CN102015240A CN2009801146879A CN200980114687A CN102015240A CN 102015240 A CN102015240 A CN 102015240A CN 2009801146879 A CN2009801146879 A CN 2009801146879A CN 200980114687 A CN200980114687 A CN 200980114687A CN 102015240 A CN102015240 A CN 102015240A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C11/00—Multi-cellular glass ; Porous or hollow glass or glass particles
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Abstract
A glass structure having sub-micron and nano-size bandgap structures and a method of fabricating the glass structure is provided. A first glass structure having micron-scale features is made and then the first glass structure is drawn into a second glass structure that has sub-micron and nano-sized features that allow the structure to perform as a polarizer for visible and infrared light.
Description
Background of invention
Cross-reference to related applications
The application requires the priority of No. the 12/148591st, the non-provisional patent application of the U.S. that is entitled as " glass structure and manufacture method (Glass Structure Having Sub-Micron and Nano-Size Bandgap Structures and Method of Producing Same) thereof with sub-micron and nano-scale bandgap structure " submitted on April 21st, 2008, this paper with reference to the content of this application, is incorporated into this based on this application and with it by in full.
Invention field
The present invention relates to make the method for sub-micron and nano-scale structure, especially glass structure.
Technical background
By using ceramic material and various technology to make the structure that is used as millimeter and micron order bandgap structure.For example, a kind of method of making such micron order structure is to adopt so-called rapid prototype development (rapid prototyping).This technology combines CAD usually with the planting of layer, in order to manufacturing structure.A kind of model of desired structure is carried out electronics layering (electronically sectioned), form some layers of predetermined thickness.By each layer of stacked this structure of reconstruction, and rebuild primitive part.The details of net shape and complexity depend on the thickness of independent initial each layer.Then this structure is carried out organic binder bond burnout technology and final sintering process.There are some patents to describe this technology.These patents for example comprise United States Patent (USP) the 5738817th and No. 5997795, and the disclosure of these patents is by with reference to being incorporated into this clearly.
Summary of the invention
This paper has disclosed the method for making sub-micron and nano-scale glass structure, this method may further comprise the steps: primary distribution one deck glass mixture, form predetermined structure, described glass mixture comprises glass powder and binding agent, in burnouting process, binding agent removes at least 75% binding agent from predetermined structure, with predetermined structure sintering, formation has first glass structure of predetermined cross-sectional area, this glass structure is drawn into second glass structure, the cross-sectional area that this second glass structure has is littler 10 times than the predetermined cross-sectional area of first glass structure at least, in some cases to when young 50 times, in some cases to when young 100 times.Preferred this allocation step comprises distributes a plurality of layers, layer of each layer primary depositing, some preferred embodiment in, this deposition can comprise that deposition surpasses 10, more preferably surpasses 20 layers.Some preferred embodiment in, the thickness of each layer can be more preferably less than 1 millimeter less than 2 millimeters, in some embodiments less than 500 microns.In some embodiments, the cross-sectional area that the drawing step causes second glass structure to have is littler 500 times than the predetermined cross-sectional area of first glass structure at least, in some cases to when young 800 times.Therefore, this process causes forming width, length or the diameter rising structure (standing structure) in 10 times or 100 times magnitudes of nanometer.
In one aspect of the method, disclosed the glass structure that is used to make light polarization, this glass structure comprises integral glass structure and a plurality of perforate that extends through this integral glass structure, and these perforates that are arranged in the integral glass structure have the diameter of about 200 nanometers.
In below describing in detail other features and advantages of the present invention will be proposed, for those of ordinary skills, by reading specification or implementing the present invention, comprise following detailed description, claims and accompanying drawing, the part in these feature and advantage will be conspicuous.
Should be appreciated that, all be exemplary and explanat for the above general remark and the following detailed description of embodiment of the present invention, and the character of the present invention and the feature that are intended to understand prescription provide general view or framework.Comprise accompanying drawing to provide further understanding of the present invention, accompanying drawing is combined in the specification, and constitutes the part of specification.Accompanying drawing illustrates the embodiments of the present invention in conjunction with specification, explains principle of the present invention and work.
Accompanying drawing is briefly described
Fig. 1 is the front view according to the first integral glass structure of the present invention; With
Fig. 2 is the guide wire of alternative shape of the integral glass structure of Fig. 1.
Preferred implementation describes in detail
Specifically, the example of these embodiments is described in the accompanying drawings with reference to the preferred implementation of the present invention's proposition.In institute's drawings attached, use identical Reference numeral to represent identical or similar part as far as possible.
In one embodiment, prepare a kind of glass mixture, be used to make predetermined structure 100 as shown in figs. 1 and 2.These structures can adopt and can deposit or form any method manufacturing that its size is equal to or less than several millimeters structure.Preferred deposition technique includes, but are not limited to differential and joins technology, as rapid prototype development and miniature pen (micropen).For example, in one embodiment, can adopt the rapid prototype development machine to make predetermined structure 100, adopt a plurality of layers of this machine " printing " glass mixture, one of each layer one-step print, thus form three-dimensional structure.Described glass mixture can be any glass composition.For example, in some embodiments, glass mixture can be silica-based glass, as borosilicate glass.The glass powder preparation that glass mixture preferably is made up of required glass.Glass size in the preferred glass powder is in micrometer range.Glass mixture also preferably comprises organic binder bond, can be any suitable binding agent that is purchased.Glass mixture is preferably 60-90% glass powder and 10-40% binding agent, more preferably 70-80% glass powder and 20-30% binding agent.Regulate the denseness of glass mixture then, fully distribute by the rapid prototype development machine.
By described machine assignment glass mixture, form predetermined structure 100 as shown in figs. 1 and 2 then.Though should be noted that the predetermined structure shown in Fig. 1 and 2 is the square/rectangle structure, can " print " any structure, all falls within the scope of the present invention.Should also be noted that the predetermined structure shown in Fig. 1 and 2 is made of a plurality of substructures, these substructures are about 50 millimeters * 50 millimeters * 2 millimeters, but the definite size of substructure or predetermined structure is to the present invention and non-key.The substructure of a plurality of 2 millimeters thickness is welded together, makes the predetermined structure 100 of growing (or thicker).But predetermined structure can be independent substructure also, belongs within the scope of the present invention.As illustrated in fig. 1 and 2, predetermined structure has about 0.20 millimeter hole or perforate 102, but also can be any suitable dimensions, and following stationery volume description is the 100-1500 nanometer in final structure.In fact, though these perforates are described as circle, need not be circle, its diameter can be about 0.10-0.5 millimeter.Though should be noted that preferably and carrying out welding with before making long predetermined structure 100, make perforate 102 marshallings in perforate 102 and the adjacent substructure in each substructure, not necessarily require like this.
Then predetermined structure 100 is placed in the suitable baking oven, the binding agent that burnouts only stays glass powder in predetermined structure.Preferably, be mingled with to avoid malformation and gas at the temperature that the is lower than glass transition temperature Tg binding agent that burnouts.Preferably be lower than glass crystallization temperature T then
xTemperature carry out following sintering process step, avoiding the glass crystallization, otherwise may hinder subsequently structure drawing process step again.These requirements are stricter than other materials (as pottery, metal, metal alloy etc.), and for other materials, binding agent burnouts and the sintering process step can be carried out under the condition that is up to the material therefor sintering temperature.In addition, preferably carrying out binding agent in inert atmosphere such as helium, argon or nitrogen burnouts.If burnout in the presence of oxygen, and glass is for example silica-based glass, then may form cristobalite in predetermined structure, may cause to be used for intended purposes.
A kind of preferred embodiment in, by predetermined structure was heated to 150 ℃ from room temperature (or environment temperature) in 1 hour, begin the program of burnouting.Then by predetermined structure being heated to 350 ℃ and keep continuing at least 1 hour the program of burnouting 350 ℃ of temperature from 150 ℃ with about 10 ℃/hour speed.At last, predetermined structure is heated to 650 ℃ from 350 ℃, and 650 ℃ of temperature were kept 1 hour at least with about 10 ℃/hour speed.
This program of burnouting will be removed about 90% binding agent from predetermined structure.Scale less (reduced) program that burnouts can be carried out, but preferably in binding agent burnouts processing step, at least 75% binding agent should be removed from predetermined structure.
The sintering predetermined structure 100 then, make glass powder fixed, equally preferably carry out with similar inert atmosphere conditions in identical baking oven.If carry out sintering, then should SC during at moving structure before the sintering step, in order to avoid destroy this structure at different baking ovens or position.In sintering step, predetermined structure 100 becomes first glass structure, and the basic and predetermined structure of this first glass structure has identical construction and size.
Then as known in the art, with first glass structure heating and draw or be drawn into the diameter that dwindles, make second glass structure that cross sectional dimensions dwindles with respect to the size of first glass structure.First glass structure can be heated to the temperature that is suitable for drawing this first glass structure, this depends on the composition of glass structure.For example, if glass is silicate glass, then can adopt to be higher than 1000 ℃ or even be higher than 1100 ℃ temperature and glass structure be drawn into the diameter that dwindles.But, also can adopt lower drawing temperature, especially when glass is formed for non-silicate glass.In a kind of exemplary embodiment, first glass structure is drawn into about 1000 times of its original length.When drawing first glass structure, can the cross section of second glass structure be dwindled with respect to first glass structure and surpass 100 times, surpass 500 times even above 800 times.Therefore, for example when first glass structure is drawn into second glass structure, diameter is that 0.2 millimeter perforate becomes diameter and is about 200 nanometers in second glass structure in first glass structure, perhaps in addition diameter less than 200 nanometers, the cross section of second glass structure becomes about 0.5 millimeter and takes advantage of 0.5 millimeter.The preferred differential partial pressure control system (differential partial pressure control system) that uses keeps the symmetry of first glass structure when passing through again pulling process.In the differential partial pressure control system, first glass structure is kept pressurization, the differential dividing potential drop of control during by the whole step of drawing process again.Therefore, for example can make these Kong Buhui in the reduced step, be destroyed to hole 102 pressurizations in pulling process.
Second glass structure that elongates can be divided into suitable length then, for required application.A kind of exemplary application is photon or phonon band gap structure, and described structure is made by the glass with sub-micron and nano-scale feature.For example, these structures can be used as the polarizer in the visible or infra-red range of spectrum.For example referring to Fig. 2, the structure that can use hole with about 2-300 nanometer spacing (pitch) (distance between the center, hole) or perforate 102 is as the photon polarizer.First glass structure that can be about 100 microns to 1 millimeter by the spacing that draws its mesopore obtains this structure.In one embodiment, the spacing in the hole of initial (first) glass structure is about 100 microns, and being drawn into spacing is second glass structure of 100 nanometers, is equivalent to diameter and reduces 1000 times.This explanation can reduce below 3000 times by the diameter that makes initial glass structure, more preferably below 2000 times and even more preferably no more than 1000 times, the spacing that obtains repetitive structure (as the hole) wherein less than 500 microns, be more preferably less than 250 microns glass structure.In the time of with the second glass structure segmentation, any not lining up of perforate 102 all is clearly between the substructure, can discard these sections simply.
Can modifications and variations of the present invention are and without departing from the spirit and scope of the present invention to it will be evident to one of ordinary skill in the art that.Therefore, the invention is intended to contain and drop on claims and be equal to various modifications and variations of the present invention within the scope.
Claims (13)
1. method of making sub-micron or nano-scale glass structure, this method may further comprise the steps:
Primary distribution one deck glass mixture forms predetermined structure, and described glass mixture comprises glass powder and binding agent;
In binding agent burnouts processing step, remove at least 75% binding agent from predetermined structure;
The sintering predetermined structure, first glass structure of formation integration, described first glass structure has predetermined cross-sectional area; With
The glass structure of integration is drawn into second glass structure of integration, the cross-sectional area that second glass structure of described integration has than the predetermined cross-sectional area of first glass structure of integration to when young 10 times.
2. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, described structure is a kind of in photon and the phonon band gap structure.
3. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, described structure is the photon polarizer.
4. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, the described step of removing comprises and removes at least 90% binding agent.
5. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure, it is characterized in that the cross-sectional area that second glass structure of described integration has is littler at least 500 times than the predetermined cross-sectional area of first glass structure of described integration.
6. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, first glass structure of described integration has the perforate that diameter is about the 100-500 micron.
7. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, second glass structure of described integration has the perforate that diameter is about the 50-1500 nanometer.
8. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, described step and the sintering step of removing binding agent carries out in inert atmosphere.
9. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, the glass mixture in the described allocation step comprises the glass powder of 60-90% and the binding agent of 10-40%.
10. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, described glass mixture comprises the glass powder of 70-80% and the binding agent of 20-30%.
11. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, described step of removing binding agent may further comprise the steps:
Predetermined structure is heated to 150 degree from room temperature;
With set rate predetermined structure is heated to 350 degree from 150 degree, and kept this temperature at least 1 hour; With
With set rate predetermined structure is heated to 650 degree from 350 degree, and kept this temperature at least 1 hour.
12. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure, it is characterized in that the cross-sectional area that the step of first structure of described drawing integration causes second glass structure of integration to have is littler at least 10 times than first glass structure of integration.
13. the method for manufacturing sub-micron as claimed in claim 1 and nano-scale glass tape gap structure is characterized in that, predetermined structure comprises a plurality of predetermined substructures, and these predetermined substructures were welded together before removing the step of binding agent.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14859108A | 2008-04-21 | 2008-04-21 | |
| US12/148,591 | 2008-04-21 | ||
| PCT/US2009/002445 WO2009131653A2 (en) | 2008-04-21 | 2009-04-20 | Glass structure having sub-micron and nano-size bandgap structures and method for producing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102015240A true CN102015240A (en) | 2011-04-13 |
Family
ID=41110541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801146879A Pending CN102015240A (en) | 2008-04-21 | 2009-04-20 | Glass structure having sub-micron and nano-size bandgap structures and method for producing same |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2288484A2 (en) |
| JP (1) | JP2011520746A (en) |
| CN (1) | CN102015240A (en) |
| WO (1) | WO2009131653A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113024126A (en) * | 2021-03-17 | 2021-06-25 | 山东海富光子科技股份有限公司 | Preparation method of glass microstructure with nanoscale holes |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8225900B2 (en) | 2008-04-26 | 2012-07-24 | Domes Timothy J | Pneumatic mechanical power source |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5738817A (en) * | 1996-02-08 | 1998-04-14 | Rutgers, The State University | Solid freeform fabrication methods |
| US5997795A (en) * | 1997-05-29 | 1999-12-07 | Rutgers, The State University | Processes for forming photonic bandgap structures |
| US6508979B1 (en) * | 2000-02-08 | 2003-01-21 | University Of Southern California | Layered nanofabrication |
| JP2002333531A (en) * | 2001-05-07 | 2002-11-22 | Mitsubishi Cable Ind Ltd | Large diameter fiber |
| JP3836698B2 (en) * | 2001-09-10 | 2006-10-25 | 三菱電線工業株式会社 | Photonic crystal fiber manufacturing method |
| JP2004191947A (en) * | 2002-11-25 | 2004-07-08 | Shin Etsu Chem Co Ltd | Holey fiber drawing method |
| US7153360B2 (en) * | 2003-12-16 | 2006-12-26 | Hewlett-Packard Development Company, Lp. | Template and methods for forming photonic crystals |
-
2009
- 2009-04-20 EP EP09733792A patent/EP2288484A2/en not_active Withdrawn
- 2009-04-20 JP JP2011506263A patent/JP2011520746A/en active Pending
- 2009-04-20 CN CN2009801146879A patent/CN102015240A/en active Pending
- 2009-04-20 WO PCT/US2009/002445 patent/WO2009131653A2/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113024126A (en) * | 2021-03-17 | 2021-06-25 | 山东海富光子科技股份有限公司 | Preparation method of glass microstructure with nanoscale holes |
| CN113024126B (en) * | 2021-03-17 | 2023-03-14 | 山东海富光子科技股份有限公司 | Preparation method of glass microstructure with nanoscale holes |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2288484A2 (en) | 2011-03-02 |
| WO2009131653A3 (en) | 2009-12-17 |
| JP2011520746A (en) | 2011-07-21 |
| WO2009131653A2 (en) | 2009-10-29 |
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Application publication date: 20110413 |