CN102013415A - Substrate structure applied to flexible electronic component and manufacture method thereof - Google Patents
Substrate structure applied to flexible electronic component and manufacture method thereof Download PDFInfo
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- CN102013415A CN102013415A CN2009101691082A CN200910169108A CN102013415A CN 102013415 A CN102013415 A CN 102013415A CN 2009101691082 A CN2009101691082 A CN 2009101691082A CN 200910169108 A CN200910169108 A CN 200910169108A CN 102013415 A CN102013415 A CN 102013415A
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- release layer
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Abstract
The present invention provides a substrate structure applied to a flexible electronic component, comprising: a support carrier; a flexible substrate arranged opposite to the support carrier; a demoulding layer formed on one side of the flexible substrate wherein the side is opposite to the support carrier; and an adhesive layer formed between the support carrier and demoulding layer, and between the support carrier and the flexible substrate, wherein the area of the adhesive layer is larger than the area of the demoulding layer, and the fitness of the adhesive layer to the flexible substrate is greater than the fitness of the demoulding layer to the flexible substrate. The present invention additionally provides a making method for the substrate.
Description
Technical field
The present invention relates to a kind of board structure, particularly a kind of board structure and manufacture method thereof that is applied to the flexible electronic element.
Background technology
Flexible display has become the development trend of new display of new generation, and develop active flexible display main flow trend especially, each big research and development company of the world strides into non-glass class and the lighter flexible plastic substrates material development of weight by existing thick and heavy and breakable glass substrate, and strides forward towards active full-color TFT display floater.At present, a-Si TFT, LPTS TFT and three kinds of selections of OTFT are arranged, comprise EPD, ECD, LCD and EL in the part of display medium at the technology of the active flexible display of exploitation.
In the selection of manufacture, can be divided into batch type (batch (-type)) and roll to roll (volume to volume formula) mode, carry out the manufacturing of TFT element if select batch type mode, can utilize existing TFT equipment to make, has suitable advantage, but must the so-called substrate of development shift or, flexible display is transferred on other plastic base or taken off from glass from membrane technology.Roll to roll mode then must utilize brand-new equipment to carry out, and must overcome rotation and contact the relevant issues that caused.
Make the TFT structure in batch type mode and mainly contain three kinds of modes, the one, SEC utilizes PES to change as substrate and invests on the silicon, utilize low temperature a-Si TFT technological development 7 " VGA (640 * 480) plastics LCD; and this method needs the high transparency carrier material of a kind of high temperature resistant, low thermal coefficient of expansion, low light retardance and chemical resistance excellence, and cooperate suitable adhesive layer and good ejection technique.The 2nd, Seiko Epson utilizes LPTS transfer (transfer) technology to carry out the exploitation of TFT backboard, carries out LPTS TFT backboard and make on glass substrate, and after finishing, Seiko Epson utilizes laser annealing (laserannealing) again.So-called transfer technology major advantage is the restriction that TFT element process temperatures is not subjected to plastic base, therefore, characteristic is preferably arranged, so general tool high light transmittance plastic base just can be used to use, but its transfer is machine-processed and change attached technology and seem more important.In addition, the third is on glass by polyimides (PI) is coated for Philips, carries out the exploitation of a-Si TFT-EPD display, and utilizes the transfer technology that the PI substrate is taken off from glass.Though this technology is utilized the traditional PI plastic base, because of it has resistant to elevated temperatures characteristic, directly coat on glassly, not only process temperatures can surpass 300 ℃, can save the step of changeing attached again, but still must utilize the laser ablation glass substrate.
Summary of the invention
One of embodiments of the present invention provide a kind of board structure that is applied to the flexible electronic element, comprising: prop carrier; Flexible base, board is oppositely arranged with this prop carrier; Release layer is formed on the one side of this flexible base, board with respect to this prop carrier; And adhesive phase, be formed between this prop carrier, this release layer and this flexible base, board, wherein the area of this adhesive phase is greater than the area of this release layer, and this adhesive phase to the adaptation of this flexible base, board greater than the adaptation of this release layer to this flexible base, board.
One of embodiments of the present invention provide a kind of manufacture method that is applied to the board structure of flexible electronic element, comprising: provide support carrier; Flexible base, board is provided, relative with this prop carrier; On the one side of this flexible base, board, form release layer with respect to this prop carrier; And utilize adhesive phase that this flexible base, board and this release layer are fixed on this prop carrier, wherein, the area of this adhesive phase is greater than the area of this release layer, and this adhesive phase to the adaptation of this flexible base, board greater than the adaptation of this release layer to this flexible base, board.
The above-mentioned step that this flexible base, board and this release layer are fixed on this prop carrier is included in this adhesive phase of coating on this prop carrier, and utilizes this adhesive phase bond this prop carrier, this release layer and this flexible base, board; Or this release layer and this flexible base, board with respect to the one side of this prop carrier on this adhesive phase of coating, and utilize this adhesive phase bond this flexible base, board, this release layer and this prop carrier.
The present invention mainly provides a kind of board structure that is applied on flexible electronic or the relevant flexible industry.This board structure comprises flexible base, board, release layer, adhesive phase and prop carrier, it utilizes release materials and flexible base, board adaptation bad, and the characteristic of adhesive phase and flexible base, board adaptation excellence, making changes flexible base, board unlikely the coming off in successive process that invests on the prop carrier, and after finishing all processing procedures, but delamination.The present invention can make in the process technique on the prop carrier and be transferred on the flexible base, board easily, and makes the pixel of high precision on flexible base, board.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below enumerate preferred embodiment, and conjunction with figs. is elaborated.
Description of drawings
Fig. 1 is one of according to the embodiment of the present invention--a kind of generalized section that is applied to the board structure of flexible electronic element.
Fig. 2 A～2C is one of embodiments of the present invention--a kind of generalized section that is applied to the board structure manufacture method of flexible electronic element.
Fig. 3 A～3C is one of embodiments of the present invention--a kind of generalized section that is applied to the board structure manufacture method of flexible electronic element.
Symbol description
10 board structures;
12 prop carriers;
14 flexible base, boards;
16 release layers;
18 adhesive phases;
A1 release layer area;
A2 adhesive phase area.
The embodiment of invention
With reference to Fig. 1, the board structure that the present invention is applied to the flexible electronic element is described according to execution mode.Board structure 10 comprises prop carrier 12, flexible base, board 14, release layer 16 and adhesive phase 18.Flexible base, board 14 is oppositely arranged with prop carrier 12.Release layer 16 is formed on the one side of flexible base, board 14 with respect to prop carrier 12 with first area A 1.Adhesive phase 18 is formed between prop carrier 12, release layer 16 and the flexible base, board 14 with second area A2.It should be noted that second area A2 greater than first area A 1, and the adaptation of 18 pairs of flexible base, boards 14 of adhesive phase is greater than the adaptation of 16 pairs of flexible base, boards 14 of release layer.
Flexible base, board 14 can be the flexible display substrate, for example active flexible display substrate, it can be by for example polyimides (polyimide, PI), Merlon (polycarbonate, PC), polyether sulfone (polyethersulfone, PES), polyacrylate (polyacrylate, PA), polynorbornene (polynorbornene, PNB), PETG (polyethylene terephthalate, PET), polyether-ether-ketone (polyetheretherketone, PEEK), PEN (polyethylene naphthalate, PEN) or Polyetherimide (polyetherimide, PEI) polymeric material or metal constitute.
As adhesive phase of the present invention, can select suitable adhesive phase according to the difference of employed flexible base, board, its heat resisting temperature that focuses on selected adhesive phase must be greater than glass transition temperature (the Glass Transition Temperature of flexible base, board, Tg), to avoid adhesive phase in follow-up high temperature process, to melt, cause board structure deformation.For instance,, then must select heat resisting temperature, and if use the PEN flexible base, board, then must select heat resisting temperature greater than 150 ℃ adhesive phase greater than 120 ℃ adhesive phase if use the PET flexible base, board.
Fig. 2 A～2C is one of embodiments of the present invention, a kind of manufacture method that is applied to the board structure of flexible electronic element.
Referring to Fig. 2 A, at first, provide flexible base, board 14.Afterwards, on the one side of flexible base, board 14, form release layer 16 in for example mode of coating or evaporation.The area of release layer 16 is A1.
Then,, provide support carrier 12, with respect to flexible base, board 14 and release layer 16 referring to Fig. 2 B.Afterwards, the mode with for example coating forms adhesive phase 18 on prop carrier 12.The area of adhesive phase 18 is A2.
Then,, utilize adhesive phase 18 bonding prop carriers 12 and the flexible base, board 14 that is formed with release layer 16 referring to Fig. 2 C, thus on prop carrier 12 fixing flexible substrate 14 and release layer 16.It should be noted that area A 2 greater than area A 1, and the adaptation of 18 pairs of flexible base, boards 14 of adhesive phase is greater than the adaptation of 16 pairs of flexible base, boards 14 of release layer.
Fig. 3 A～3C is one of embodiments of the present invention, a kind of manufacture method that is applied to the board structure of flexible electronic element.
Referring to Fig. 3 A, at first, provide flexible base, board 14.Afterwards, on the one side of flexible base, board 14, form release layer 16 flexibilities in for example mode of coating or evaporation.The area of release layer 16 is A1.
Then,, provide support carrier 12, with respect to flexible base, board 14 and release layer 16 referring to Fig. 3 B.Afterwards, form adhesive phase 18 at release layer 16 and flexible base, board 14 on respect to the one side of prop carrier 12 in the mode of for example coating.The area of adhesive phase 18 is A2.
Then,, utilize adhesive phase 18 bonding to be formed with the flexible base, board 14 and prop carrier 12 of release layer 16 referring to Fig. 3 C, thus on prop carrier 12 fixing flexible substrate 14 and release layer 16.It should be noted that area A 2 greater than area A 1, and the adaptation of 18 pairs of flexible base, boards 14 of adhesive phase is greater than the adaptation of 16 pairs of flexible base, boards 14 of release layer.
If it serves as that the excision point excises that the present invention continues with release layer 16 two ends or its inboard, but then delamination flexible base, board 14 (not having diagram) and prop carrier 12.
The invention provides a kind of board structure that can be applied to the flexible electronic element by existing semiconductor equipment making.The present invention utilizes release layer and the adhesive phase difference to the flexible base, board adaptation, earlier that adaptation is relatively poor release layer is to take shape on the flexible base, board than small size, again will with the flexible base, board adaptation preferably adhesive phase with cover than large tracts of land on the release layer with flexible base, board on, at last, Jie is adhered on the prop carrier by adhesive phase with said structure, promptly finishes the making of board structure of the present invention.The board structure of Zhi Zuoing can guarantee that flexible base, board does not come off in the TFT processing procedure in this way, and after finishing processing procedure, the part that the outside is not contained adaptation poor mold-release layer is excised, can delamination flexible base, board and prop carrier.
Embodiment
[embodiment 1]
The making of epoxy resin (epoxy) adhesive
At first, in 1 liter of reaction bulb, add and mix the EPON 828 (bisphenol A type epoxy resins of 185 grams, epoxide equivalent 185～210, Shell Chemical commodity), 79.99 the acrylic acid (Acrylicacid of gram, molecular weight 72.06, the TCI commodity), 0.34 the hot inhibitor (thermalinhibitor) (2 of gram, 2 '-methylenebis (4-methyl-6-tert-butylphenol) (2,2 '-di-2-ethylhexylphosphine oxide (4-methyl-6 tert-butyl phenol)), the SHOWA commodity) and 3.93 the gram catalyst (Triphenyl phosphine (triphenylphosphine), Lancaster commodity).Afterwards, reaction bulb is put into oil bath, mixing speed is 200rpm, and reaction temperature is 105 ℃ ± 5 ℃, and the condenser pipe temperature is 9 ℃, and total reaction time is 5～6 hours, thereby has prepared low polymer.
Then, mix the low polymer of above-mentioned 40 grams, epoxy resin ECN-1299 (the o-Hydroxytoluene formaldehyde epoxy resin of 60 grams, epoxide equivalent 217～244, Ciba Geigy commodity) the 1-Methoxy-2-propyl acetate solvent with 142.8 grams places in the reaction bulb, and mixes with mechanical agitation in 90 ℃ of oil baths.Then; after oil bath is cooled to 50 ℃; radical initiator IRGACURE 184 (the 1-hydroxycyclohexyl phenyl ketone (1-hydroxy-cyclohexyl phenyl ketone) that adds 1.25phr; the Ciba commodity) (bis (2 with the radical initiator IRGACURE 819 of 1.25phr; 4,6-trimethylbenzoyl)-phenylphosphineoxide (phenyl two (2,4; the 6-trimethylbenzoyl) Ciba commodity phosphine oxide)).Afterwards, treat that temperature is reduced to room temperature again after, add the dicyandiamide thermal curing agents (dicyandiamide, particle diameter 3 μ m) of the talcum powder filler (particle diameter 3～5 μ m) of 20phr and 5phr and evenly stir.Then, grind secondary, can finish the making of epoxy resin of the present invention (epoxy) adhesive with three roll grinding machines.
[embodiment 2]
The making of PEN (PEN)/parylene (Parylene)/epoxy resin/glass substrate structure reaches and tests from film
At first, on the PEN of 10cm * 10cm substrate, plate the parylene (300nm) of 8cm * 8cm.Afterwards, at the epobond epoxyn layer of the coating on glass 100 μ m of 10cm * 10cm.Then, with 80 ℃ of pre-roasting 20min, and the PEN base plate bonding that will plate parylene with the pressing machine is in scribbling the on glass of epobond epoxyn layer.Afterwards, put into baking oven,, promptly finish the making of present embodiment PEN (PEN)/parylene/ epoxy resin/glass substrate structure with 150 ℃ of hard baking (post bake) 60min.
Test from film: then, cut in the position of 7.5cm * 7.5cm with blade, this partly can separate the PEN substrate easily with glass, and other parts and glass driving fit are good, can not separate with glass, and the result is as shown in table 1.
[embodiment 3]
The making of PEN (PEN)/parylene/ epoxy resin/glass substrate structure reaches and tests from film
At first, on the PEN of 10cm * 10cm substrate, plate the parylene (300nm) of 8cm * 8cm.Afterwards, at the epobond epoxyn layer that is coated with coating 100 μ m on the PEN substrate of parylene.Then, with 80 ℃ of preliminary drying 20min, and the PEN base plate bonding that will scribble the epobond epoxyn layer and plate parylene with the pressing machine is on glass.Afterwards, put into baking oven,, promptly finish the making of present embodiment PEN (PEN)/parylene/ epoxy resin/glass substrate structure with 150 ℃ of hard baking 60min.
Test from film: then, cut in the position of 7.5cm * 7.5cm with blade, this partly can separate the PEN substrate easily with glass, and other parts and glass driving fit are good, can not separate with glass, and the result is as shown in table 1.
[embodiment 4]
PEN (PEN)/
Zeonor (trade name is available from Zeon Corporation)The making of/epoxy resin/glass substrate structure reaches and tests from film
At first, the Zeonor with 3wt% is dissolved in dimethylbenzene (xylene).Afterwards, utilize 50 μ m scrapers that the Zeonor of 8cm * 8cm is coated on the PEN substrate of 10cm * 10cm, and under 50 ℃ and 120 ℃, respectively dry by the fire 5min.Then, at the epobond epoxyn layer of the coating on glass 100 μ m of 10cm * 10cm.Afterwards, with 80 ℃ of preliminary drying 20min, and the PEN base plate bonding that will scribble Zeonor with the pressing machine is in scribbling the on glass of epobond epoxyn layer.Then, put into baking oven,, promptly finish the making of present embodiment PEN (PEN)/Zeonor/ epoxy resin/glass substrate structure with 150 ℃ of hard baking 60min.
Test from film: then, cut in the position of 7.5cm * 7.5cm with blade, this partly can separate the PEN substrate easily with glass, and other parts and glass driving fit are good, can not separate with glass, and the result is as shown in table 1.
[embodiment 5]
The making of PEN (PEN)/Zeonor/ epoxy resin/glass substrate structure reaches and tests from film
At first, the Zeonor with 3wt% is dissolved in dimethylbenzene (xylene).Afterwards, utilize 100 μ m scrapers on the PEN of 10cm * 10cm substrate, to be coated with the Zeonor of 8cm * 8cm, and under 50 ℃ and 120 ℃, respectively dry by the fire 5min.Then, at the epobond epoxyn layer that scribbles coating 100 μ m on the PEN substrate of Zeonor.Afterwards, with 80 ℃ of preliminary drying 20min, and will scribble the PEN base plate bonding of epobond epoxyn layer and Zeonor on glass with the pressing machine.Then, put into baking oven,, promptly finish the making of present embodiment PEN (PEN)/Zeonor/ epoxy resin/glass substrate structure with 150 ℃ of hard baking 60min.
Test from film: then, cut in the position of 7.5cm * 7.5cm with blade, this partly can separate the PEN substrate easily with glass, and other parts and glass driving fit are good, can not separate with glass, and the result is as shown in table 1.
[embodiment 6]
The making of polyethylene terephthalate (PET)/parylene/ epoxy resin/glass substrate structure reaches and tests from film
At first, on the pet substrate of 10cm * 10cm, plate the parylene (300nm) of 8cm * 8cm.Afterwards, at the epobond epoxyn layer of the coating on glass 100 μ m of 10cm * 10cm.Then, the pet substrate that will be coated with parylene with the pressing machine is bonded in and scribbles the on glass of epobond epoxyn layer.Afterwards, put into baking oven,, promptly finish the making of present embodiment polyethylene terephthalate (PET)/parylene/ epoxy resin/glass substrate structure with 100 ℃ of hard baking 60min.
Test from film: then, cut in the position of 7.5cm * 7.5cm with blade, this partly can separate pet substrate easily with glass, and other parts and glass driving fit are good, can not separate with glass, and the result is as shown in table 1.
[embodiment 7]
The making of polyethylene terephthalate (PET)/parylene/ epoxy resin/glass substrate structure reaches and tests from film
At first, on the pet substrate of 10cm * 10cm, plate the parylene (300nm) of 8cm * 8cm.Afterwards, at the epobond epoxyn layer that is coated with coating 100 μ m on the pet substrate of parylene.Then, the pet substrate that will scribble the epobond epoxyn layer with the pressing machine and be coated with parylene is bonded on glass.Afterwards, put into baking oven,, promptly finish the making of present embodiment polyethylene terephthalate (PET)/parylene/ epoxy resin/glass substrate structure with 100 ℃ of hard baking 60min.
Test from film: then, cut in the position of 7.5cm * 7.5cm with blade, this partly can separate pet substrate easily with glass, and other parts and glass driving fit are good, can not separate with glass, and the result is as shown in table 1.
[comparing embodiment 1]
The making of PEN (PEN)/epoxy resin/glass substrate structure reaches and tests from film
At first, on the PEN of 10cm * 10cm substrate, coat the epobond epoxyn layer of 100 μ m.Then, with 80 ℃ of preliminary drying 20min, and will scribble the PEN base plate bonding of epobond epoxyn layer on glass with the pressing machine.Afterwards, put into baking oven,, promptly finish the making of PEN (PEN)/epoxy resin/glass substrate structure with 150 ℃ of hard baking 60min.
Test from film: then, cut in the position of 7.5cm * 7.5cm with blade, found that the PEN substrate can't separate with glass, the result is as shown in table 1.
Table 1
Though the present invention embodiment preferably discloses as above; but these embodiment are used for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can do to change and retouching, so protection scope of the present invention should be as the criterion with the scope that appending claims was defined.
Claims (12)
1. board structure that is applied to the flexible electronic element comprises:
Prop carrier;
Flexible base, board is oppositely arranged with this prop carrier;
Release layer is formed on the one side of this flexible base, board with respect to this prop carrier; And
Adhesive phase is formed between this prop carrier, this release layer and this flexible base, board, and wherein the area of this adhesive phase is greater than the area of this release layer, and this adhesive phase to the adaptation of this flexible base, board greater than the adaptation of this release layer to this flexible base, board.
2. the board structure that is applied to the flexible electronic element as claimed in claim 1, wherein, this release layer is 0B to the adaptation of this flexible base, board.
3. the board structure that is applied to the flexible electronic element as claimed in claim 1, wherein, this adhesive phase is 1～5B to the adaptation of this flexible base, board.
4. the board structure that is applied to the flexible electronic element as claimed in claim 1, wherein, this prop carrier comprises glass or Silicon Wafer.
5. the board structure that is applied to the flexible electronic element as claimed in claim 1, wherein, this flexible base, board comprises polyimides (polyimide, PI), Merlon (polycarbonate, PC), polyether sulfone (polyethersulfone, PES), polyacrylate (polyacrylate, PA), polynorbornene (polynorbornene, PNB), PETG (polyethylene terephthalate, PET), polyether-ether-ketone (polyetheretherketone, PEEK), PEN (polyethylene naphthalate, PEN), Polyetherimide (polyetherimide, PEI) or metal.
6. the board structure that is applied to the flexible electronic element as claimed in claim 1, wherein, this release layer comprise Parylene (parylene) or cyclenes copolymer (cyclic olefin copolymers, COC).
7. the board structure that is applied to the flexible electronic element as claimed in claim 1, wherein, this adhesive phase comprises ultraviolet curing resin, thermohardening type resin or ultraviolet heat-curing type resin.
8. the board structure that is applied to the flexible electronic element as claimed in claim 7, wherein, this adhesive phase comprises acryl resin, epoxy resin, the epoxy resin through the acryl resin modification, polyurethane resin, silicone resin, polyamide, ketone resin, phenolic resins, furane resins, Lauxite or its mixture.
9. a manufacturing is applied to the method for the board structure of flexible electronic element, comprising:
Provide support carrier;
Provide flexible base, board, with respect to this prop carrier;
On the one side with respect to this prop carrier of this flexible base, board, form release layer; And
Utilize adhesive phase that this flexible base, board and this release layer are fixed on this prop carrier, wherein, the area of this adhesive phase is greater than the area of this release layer, and this adhesive phase to the adaptation of this flexible base, board greater than the adaptation of this release layer to this flexible base, board.
10. the manufacture method that is applied to the board structure of flexible electronic element as claimed in claim 9, wherein, this release layer is formed on the one side of this flexible base, board with respect to this prop carrier with coating or evaporation mode.
11. the manufacture method that is applied to the board structure of flexible electronic element as claimed in claim 9, wherein, the step that this flexible base, board and this release layer are fixed on this prop carrier is included in this adhesive phase of coating on this prop carrier, and utilizes this adhesive phase bond this prop carrier, this release layer and this flexible base, board.
12. the manufacture method that is applied to the board structure of flexible electronic element as claimed in claim 9, wherein, this flexible base, board and this release layer are fixed on step on this prop carrier are included in this release layer and this flexible base, board, and utilize this adhesive phase bond this flexible base, board, this release layer and this prop carrier with respect to this adhesive phase of coating on the one side of this prop carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910169108A CN102013415B (en) | 2009-09-07 | 2009-09-07 | Substrate structure applied to flexible electronic component and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910169108A CN102013415B (en) | 2009-09-07 | 2009-09-07 | Substrate structure applied to flexible electronic component and manufacture method thereof |
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| CN102013415A true CN102013415A (en) | 2011-04-13 |
| CN102013415B CN102013415B (en) | 2012-08-29 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355635A (en) * | 2011-11-25 | 2016-02-24 | 群康科技(深圳)有限公司 | Flexible substrate, display device provided with flexible substrate and manufacturing method thereof |
| TWI627064B (en) * | 2017-08-08 | 2018-06-21 | Southern Taiwan University Of Science And Technology | Laminated Sheet and Application of the same |
-
2009
- 2009-09-07 CN CN200910169108A patent/CN102013415B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355635A (en) * | 2011-11-25 | 2016-02-24 | 群康科技(深圳)有限公司 | Flexible substrate, display device provided with flexible substrate and manufacturing method thereof |
| TWI627064B (en) * | 2017-08-08 | 2018-06-21 | Southern Taiwan University Of Science And Technology | Laminated Sheet and Application of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102013415B (en) | 2012-08-29 |
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Granted publication date: 20120829 |