CN102012723A - Multi-expansion CPCI (compact peripheral component interconnect) core module - Google Patents
Multi-expansion CPCI (compact peripheral component interconnect) core module Download PDFInfo
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- CN102012723A CN102012723A CN 201010597794 CN201010597794A CN102012723A CN 102012723 A CN102012723 A CN 102012723A CN 201010597794 CN201010597794 CN 201010597794 CN 201010597794 A CN201010597794 A CN 201010597794A CN 102012723 A CN102012723 A CN 102012723A
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- 230000002093 peripheral effect Effects 0.000 title abstract 2
- 238000009423 ventilation Methods 0.000 claims description 20
- 238000010622 cold drawing Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 16
- 238000013016 damping Methods 0.000 claims description 15
- 102100029368 Cytochrome P450 2C18 Human genes 0.000 claims description 13
- 101000919360 Homo sapiens Cytochrome P450 2C18 Proteins 0.000 claims description 13
- 239000011324 bead Substances 0.000 claims description 8
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 230000005855 radiation Effects 0.000 abstract 2
- 230000035939 shock Effects 0.000 abstract 2
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000005728 strengthening Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a multi-expansion CPCI (compact peripheral component interconnect) core module. The technical scheme is as follows: the multi-expansion CPCI core module comprises a 3U component, a 6U component, a heat radiation component and a shock absorption supporting plate, wherein the 3U component, the 6U component and the heat radiation component are combined into a module with a rectangular framework structure, and the module is mounted on the shock absorption supporting plate. The multi-expansion CPCI core module is compact in whole, high in strengthening performance, good in heat radiation effect, strong in practicability, and wide in application range, and can be applicable to rapid promotion of performances of a computer, work under worse environmental conditions and further have greater practical application demands.
Description
Technical field
The present invention is a kind of many expansion CPCI nucleus modules.
Background technology
At present, the cpci bus mode relies on its high opening that has, high reliability, excellent properties such as hot-swappable, the application that be widely used in modularization such as communication, network, real time system control, industry robotization, real-time data acquisition, military system, intelligent transportation, Aero-Space, medicine equipment, water conservancy and high-reliability, can use for a long time.Shortcomings such as but cpci bus equipment also has, and extendability is poor, the production cycle long, expansion very flexible, particularly along with the quick raising of computing power, the heat dispersion of some specific installations also faces the challenge.
In the ruggedized computer field, CPCI integrated circuit board reinforcement performance commonly used now mainly guarantees by the performance of bus itself, when environmental suitability was had relatively high expectations, its consolidation effect was good not enough, and particularly the radiating effect of mainboard etc. is badly in need of further improving not influencing under the condition of cost.Therefore, research and develop that a kind of good integrity, expanded function are powerful flexibly, reinforcement performance is reliable, excellent in heat dissipation effect, CPCI module easy for installation, that cost is moderate, versatility is good are reinforced new method and had important practical significance.
Summary of the invention
The present invention be directed to the existing in prior technology shortcoming, and a kind of many expansion CPCI nucleus modules are provided, it adopts the flexible design technology, the reinforcement performance height, good heat dissipation effect, practical, range of application is wider, the fast lifting that can adapt to computing power can worked under the harsh environmental conditions more, thereby had very big practical application request.
The present invention realizes by following technical measures: a kind of many expansion CPCI nucleus modules, it comprises 3U assembly, 6U assembly, radiating subassembly and damping supporting plate, described 3U assembly, 6U assembly, radiating subassembly are combined into the module of rectangular frame structure, and described module is installed on the damping supporting plate.
Concrete characteristics of the present invention also have, above-mentioned 6U assembly comprises integrated circuit board supporting plate, left plate, right plate, 6U cover plate, 6U base plate, mainboard, wherein the integrated circuit board supporting plate is the bottom surface of described module and is installed in described damping splint upper surface, the 6U cover plate is the last end face of described module, left and right side plate is respectively the left and right side of described module, the 6U base plate is fixed on the trailing flank of described module, and mainboard is inserted on the groove position at top of described 6U base plate, and described 6U cover plate is provided with the mainboard louvre.
Above-mentioned 3U assembly comprises 3U side plate, 3U cover plate, 3U baffle plate, power supply base plate and 3U power supply, wherein the 3U side plate is fixed on the centre of left and right side plate on the integrated circuit board supporting plate, 3U baffle plate and 3U cover plate lay respectively at the front end and the top of described 3U side plate, and the power supply base plate is fixed on 3U side plate and the right plate or the power supply base plate is fixed on 3U side plate and the left plate.
Above-mentioned radiating subassembly comprises left ventilation cold drawing, right ventilation cold drawing, deep bead, 3U blend stop, 6U blend stop, and described left ventilation cold drawing is positioned at the outside of left plate; Described right ventilation cold drawing is positioned at the outside of right plate; Described deep bead is positioned at the trailing flank of described module, the below of 6U base plate and the left side or the right side of power supply base plate; Described 3U blend stop is in the place ahead of vacant 3U assembly expansion slot position and be fixed between 3U side plate and the right plate; Described 6U blend stop is in the place ahead of vacant 6U assembly expansion slot position and be fixed between the left and right side plate; Described left and right ventilation cold drawing is provided with the blower fan fixed bit.
When installing and using, at first integrated circuit board supporting plate, left plate, right plate, 6U cover plate, 3U side plate, 3U cover plate, 3U baffle plate are combined together to form a firm framework, framework all adopts Mould Machining, guarantee its high stability and high precision, and the height of all side plates is adjusted easily; Then hard connecting modes such as reinforcing member by separately of 6U base plate, power supply base plate, mainboard, 3U power supply, screw, electro-insulating rubber are fixed in the framework, have so just formed one and cooperated compact integral body; Afterwards deep bead, 3U blend stop, 6U blend stop are fixed on that module is temporary transient vacant carries out encapsulation process after on external position and the vacant expansion slot position, guarantee module whole and each local air channel; Then, the left and right ventilation cold drawing that installs blower fan or other ventilation heat abstractor is installed in the two ends, the left and right sides of module, realizes being parallel to the left and right Design of ventilation or the heat conduction design of integrated circuit board; Wherein on mainboard, install at CPU, hard disk equipotential on the 6U cover plate and be equipped with the mainboard louvre, can guarantee the radiating effect of mainboard fully; Module whole is placed on the damping supporting plate at last, nucleus module is connected with external unit by the damping supporting plate, nucleus module carries out damping as a solid integral body by the damping supporting plate like this, can cut down the external actions such as vibratory impulse that are subjected to greatly, the specification of damping supporting plate and structure are determined by indexs such as the concrete volume of nucleus module, weight, center of gravity, external environment conditions.
Beneficial effect of the present invention is: the one, realized the expansion flexible design, and make the scalability of nucleus module obtain great development; The 2nd, the heat dispersion that has further improved whole environmental suitability, particularly integrated circuit board has obtained greatly improving.
Description of drawings
Fig. 1 reinforces the forward sight structural representation of nucleus module for CPCI.
Fig. 2 reinforces the backsight structural representation of nucleus module for CPCI.
Among the figure, 1, left plate, 2,6U device extension stopper slot, 3, the 6U cover plate, 4,6U blend stop, 5, mainboard, 6, the blower fan fixed bit, 7, the damping supporting plate, 8, integrated circuit board supporting plate, 9, the 3U cover plate, 10, the 3U baffle plate, 11, the 3U side plate, 12,3U device extension stopper slot, 13, the 3U blend stop, 14, right plate, 15, right ventilation cold drawing, 16, power supply base plate, 17, the 6U base plate, 18, deep bead, 19, blower fan fixed bit, 20, left ventilation cold drawing, 21, the mainboard louvre.
Embodiment
For clearly demonstrating the technical characterstic of this programme,, this programme is set forth below by an embodiment.
As shown in Figure 1 and Figure 2, a kind of many expansion CPCI nucleus modules, it comprises 3U assembly, 6U assembly, radiating subassembly and damping supporting plate 7, and described 3U assembly, 6U assembly, radiating subassembly are combined into the module of rectangular frame structure, and described module is installed on the damping supporting plate 7.
Wherein, the 6U assembly comprises integrated circuit board supporting plate 8, left plate 1, right plate 6,6U cover plate 3,6U base plate 17, mainboard 5, wherein, described integrated circuit board supporting plate 8 is for the bottom surface of described module and be installed in described damping supporting plate 7 upper surfaces, 6U cover plate 3 is the last end face of described module, left and right side plate 1,14 is respectively the left and right side of described module, 6U base plate 17 is fixed on the trailing flank of described module, described mainboard 5 is inserted on the groove position at top of described 6U base plate 17, and described 6U cover plate 3 is provided with mainboard louvre 21.The 3U assembly comprises 3U side plate 11,3U cover plate 9,3U baffle plate 10, power supply base plate 16 and 3U power supply, wherein, described 3U side plate 11 is fixed on the centre of left and right side plate 1,14 on the integrated circuit board supporting plate 8, the 3U side plate is provided with 3U device extension stopper slot 12,3U baffle plate 10 and 3U cover plate 9 lay respectively at the front end and the top of described 3U side plate 11, and power supply base plate 16 is fixed on 3U side plate 11 and the right plate 14 or power supply base plate 16 is fixed on 3U side plate 11 and the left plate 1.Radiating subassembly comprises left ventilation cold drawing 20, right ventilation cold drawing 15, deep bead 18,3U blend stop 13,6U blend stop 4, described left ventilation cold drawing 20 is positioned at the outside of left plate 1, described right ventilation cold drawing 15 is positioned at the outside of right plate 14, described deep bead 18 is positioned at the trailing flank of described module, the below of 6U base plate 17 and the left side or the right side of power supply base plate 16, described 3U blend stop 13 the place ahead of vacant 3U assembly expansion slot position and be fixed on 3U side plate 11 and right plate 14 between; Described 6U blend stop 4 is in the place ahead of vacant 6U assembly expansion slot position and be fixed between the left and right side plate 1,14; Described left and right ventilation cold drawing 20,15 is provided with blower fan fixed bit 19,6.
After the 3U assembly among the present invention and the height control of 6U assembly, expansion in the time of applicable to polylith different size and groove position base plate.
The present invention can pass through or adopt existing techniques in realizing without the technical characterictic of describing; do not repeat them here; certainly; above-mentioned explanation is not to be limitation of the present invention; the present invention also is not limited in above-mentioned giving an example; variation, remodeling, interpolation or replacement that those skilled in the art are made in essential scope of the present invention also should belong to protection scope of the present invention.
Claims (4)
1. the CPCI nucleus module of expansion more than a kind is characterized in that it comprises 3U assembly, 6U assembly, radiating subassembly and damping supporting plate, state the module that 3U assembly, 6U assembly, radiating subassembly are combined into the rectangular frame structure, described module is installed on the damping supporting plate.
2. many expansion CPCI nucleus modules according to claim 1, it is characterized in that, described 6U assembly comprises integrated circuit board supporting plate, left plate, right plate, 6U cover plate, 6U base plate, mainboard, wherein, described integrated circuit board supporting plate is the bottom surface of described module and is installed in described damping splint upper surface, the 6U cover plate is the last end face of described module, left and right side plate is respectively the left and right side of described module, the 6U base plate is fixed on the trailing flank of described module, described mainboard is inserted on the groove position at top of described 6U base plate, and described 6U cover plate is provided with the mainboard louvre.
3. many expansion CPCI nucleus modules according to claim 1 and 2, it is characterized in that, described 3U assembly comprises 3U side plate, 3U cover plate, 3U baffle plate, power supply base plate and 3U power supply, wherein, described 3U side plate is fixed on the centre of left and right side plate on the integrated circuit board supporting plate, 3U baffle plate and 3U cover plate lay respectively at the front end and the top of described 3U side plate, and the power supply base plate is fixed on 3U side plate and the right plate or the power supply base plate is fixed on 3U side plate and the left plate.
4. many expansion CPCI nucleus modules according to claim 1 and 2 is characterized in that described radiating subassembly comprises left ventilation cold drawing, right ventilation cold drawing, deep bead, 3U blend stop, 6U blend stop, and described left ventilation cold drawing is positioned at the outside of left plate; Described right ventilation cold drawing is positioned at the outside of right plate; Described deep bead is positioned at the trailing flank of described module, the below of 6U base plate and the left side or the right side of power supply base plate; Described 3U blend stop is in the place ahead of vacant 3U assembly expansion slot position and be fixed between 3U side plate and the right plate; Described 6U blend stop is in the place ahead of vacant 6U assembly expansion slot position and be fixed between the left and right side plate; Described left and right ventilation cold drawing is provided with the blower fan fixed bit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010597794 CN102012723B (en) | 2010-12-21 | 2010-12-21 | Multi-expansion CPCI (compact peripheral component interconnect) core module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010597794 CN102012723B (en) | 2010-12-21 | 2010-12-21 | Multi-expansion CPCI (compact peripheral component interconnect) core module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102012723A true CN102012723A (en) | 2011-04-13 |
| CN102012723B CN102012723B (en) | 2013-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010597794 Expired - Fee Related CN102012723B (en) | 2010-12-21 | 2010-12-21 | Multi-expansion CPCI (compact peripheral component interconnect) core module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111338444A (en) * | 2020-05-15 | 2020-06-26 | 北京中航科电测控技术股份有限公司 | Encrypted computer CPCI board card convenient to maintain and replace |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101630297A (en) * | 2008-07-17 | 2010-01-20 | 株式会社东芝 | Converter and control system |
| CN201548883U (en) * | 2009-12-23 | 2010-08-11 | 山东超越数控电子有限公司 | Reinforced type portable CPCI computer |
| CN201903810U (en) * | 2010-12-21 | 2011-07-20 | 济南腾越电子有限公司 | Multi-extension CPCI (compact peripheral component interconnect) core module |
-
2010
- 2010-12-21 CN CN 201010597794 patent/CN102012723B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101630297A (en) * | 2008-07-17 | 2010-01-20 | 株式会社东芝 | Converter and control system |
| CN201548883U (en) * | 2009-12-23 | 2010-08-11 | 山东超越数控电子有限公司 | Reinforced type portable CPCI computer |
| CN201903810U (en) * | 2010-12-21 | 2011-07-20 | 济南腾越电子有限公司 | Multi-extension CPCI (compact peripheral component interconnect) core module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111338444A (en) * | 2020-05-15 | 2020-06-26 | 北京中航科电测控技术股份有限公司 | Encrypted computer CPCI board card convenient to maintain and replace |
| CN111338444B (en) * | 2020-05-15 | 2020-08-04 | 北京中航科电测控技术股份有限公司 | Encrypted computer CPCI board card convenient to maintain and replace |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102012723B (en) | 2013-03-27 |
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Granted publication date: 20130327 |