CN102011960B - Side incident backlight module - Google Patents

Side incident backlight module Download PDF

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Publication number
CN102011960B
CN102011960B CN2010105016898A CN201010501689A CN102011960B CN 102011960 B CN102011960 B CN 102011960B CN 2010105016898 A CN2010105016898 A CN 2010105016898A CN 201010501689 A CN201010501689 A CN 201010501689A CN 102011960 B CN102011960 B CN 102011960B
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China
Prior art keywords
backlight module
solid
element setting
light
carrier
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CN2010105016898A
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CN102011960A (en
Inventor
张继圣
林苏逸
陈政传
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AU Optronics Corp
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AU Optronics Corp
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Abstract

The invention relates to a side incident backlight module, which comprises a light guide plate and at least one linear light source, wherein the light guide plate has at least one incident side, the linear light source is parallel to the incident side substantially, and the linear light source comprises a load receptor and a plurality of solid light-emitting components. The load receptor is divided into five equal component arrangement areas along the extension direction of the load receptor, and the solid light-emitting components are arranged in the component arrangement areas of the load receptor and are electrically connected with the load receptor, wherein the arrangement intervals of the solid light-emitting components positioned on the fourth component arrangement area are greater than those of the solid light-emitting components in the other component arrangement areas.

Description

Side incident backlight module
Technical field
The present invention relates to a kind of side incident backlight module, and particularly relevant for a kind of with the side incident backlight module of solid-state light emitting element as light source.
Background technology
Because liquid crystal display (liquid crystal display, LCD) have conventional cathode ray tube (the cathode ray tube such as low voltage operating, radiationless line scattering, lightweight and volume be little, CRT) display of the manufacturing advantage that is beyond one's reach, therefore liquid crystal display has become the in recent years major subjects of display research, and constantly develops towards colorize.
Because liquid crystal display is non-self-luminous display, therefore need backlight module that required light is provided, can reach the function of demonstration.In recent years, along with the lifting of environmental consciousness, employed light-emitting component converts the light-emitting diode of more environmental protection gradually in the backlight module from cathode fluorescent tube (cold cathode fluorescent lamp, CCFL).When light-emitting diode is applied in the backlight module; take side incident backlight module as example; light-emitting diode is arranged on the printed circuit board (PCB) of a strip usually; to form light-emitting diode light bar (LED light bar); and light-emitting diode light bar can pass through a pliability circuit (flexible printed circuit, FPC) and control circuit board electric connection usually.
In the prior art, in the light-emitting diode light bar, the light-emitting diode that is arranged on diverse location can be under the different operating temperatures, and the difference of maximum allowable operating temperature (M.A.O.T.) and minimum operation temperature may be up to (take the display panels of 42 o'clock or 55 o'clock as example) more than 10 ℃.Because operating temperature can have a strong impact on brightness, colourity and the serviceable life of light-emitting diode, therefore after through long-time the use, part is in than the first fault of the meeting of the light-emitting diode under the High Operating Temperature, causes the rapid drawdown in serviceable life of backlight module.
Hold above-mentioned, because different operating temperatures can cause occurring obvious difference the serviceable life of light-emitting diode, the operating temperature difference of therefore how to dwindle the light-emitting diode of diverse location on the light-emitting diode light bar, real is those skilled in the art's problem demanding prompt solution.
Summary of the invention
The invention provides a kind of side incident backlight module, its solid-state light emitting element is difficult for descending because localized hyperthermia causes serviceable life.
The present invention proposes a kind of side incident backlight module, and it comprises a light guide plate and at least one linear light sorurce.Light guide plate has at least one light incident sides, and linear light sorurce is parallel in fact the light incident sides configuration, and linear light sorurce comprises a carrier and a plurality of solid-state light emitting element.Carrier is being divided into five element setting areas of sequentially arranging along its bearing of trend, and solid-state light emitting element is disposed on the element setting area of carrier, and be electrically connected with carrier, wherein be positioned at the arrangement pitches of the 4th solid-state light emitting element on the element setting area greater than the arrangement pitches of the solid-state light emitting element on all the other element setting areas.
The present invention provides a kind of side incident backlight module in addition, and it comprises a light guide plate and at least one linear light sorurce.Light guide plate has at least one light incident sides, and linear light sorurce is parallel in fact the light incident sides configuration, and linear light sorurce comprises a carrier and a plurality of solid-state light emitting element.Carrier is being divided into five element setting areas of sequentially arranging along its bearing of trend, and a plurality of solid-state light emitting elements are disposed on the element setting area of carrier, and be electrically connected with carrier, the specified forward voltage value (normal Vf bin) that wherein is positioned at the 4th solid-state light emitting element on the element setting area is lower than the specified forward voltage value of the solid-state light emitting element on all the other element setting areas.
The present invention provides a kind of side incident backlight module again, and it comprises a light guide plate and at least one linear light sorurce.Light guide plate has at least one light incident sides, and linear light sorurce is parallel in fact the light incident sides configuration, and linear light sorurce comprises a carrier and a plurality of solid-state light emitting element.Carrier is being divided into five element setting areas of sequentially arranging along its bearing of trend, and a plurality of solid-state light emitting elements are disposed on the element setting area of carrier, and be electrically connected with carrier, wherein in the fixing situation of drive current, the dutycycle (duty ratio) that is positioned at the pulse width modulating signal (pulse-widthmodulated signal) of the 4th solid-state light emitting element on the element setting area in order to driving is lower than the dutycycle of the pulse width modulating signal of the solid-state light emitting element on all the other element setting areas.
The present invention provides again a kind of side incident backlight module, and it comprises a light guide plate and at least one linear light sorurce.Light guide plate has at least one light incident sides, and linear light sorurce is parallel in fact the light incident sides configuration, and linear light sorurce comprises a carrier and a plurality of solid-state light emitting element.Carrier is being divided into five element setting areas of sequentially arranging along its bearing of trend, and a plurality of solid-state light emitting elements are disposed on the element setting area of carrier, and be electrically connected with carrier, the drive current that wherein is positioned at the 4th solid-state light emitting element on the element setting area in order to driving is lower than the drive current of the solid-state light emitting element on all the other element setting areas.
Arrangement pitches, the solid-state light emitting element of selecting different specified forward voltage values of the present invention by adjusting solid-state light emitting element, utilize the pulse width modulating signal of different duty or different drive currents to drive solid-state light emitting element, descend because localized hyperthermia causes serviceable life so that solid-state light emitting element is difficult, and then promote the serviceable life of side incident backlight module.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the graph of a relation between varying level position and the operating temperature in the traditional side incident backlight module;
Fig. 2 is the front view of the side incident backlight module of first embodiment of the invention;
Fig. 3 A is the diagrammatic cross-section of A-A ' section in Fig. 2;
Fig. 3 B is the diagrammatic cross-section of B-B ' section in Fig. 2;
Fig. 4 is the diagrammatic cross-section of the side incident backlight module of second embodiment of the invention;
Fig. 5 is the diagrammatic cross-section of the side incident backlight module of third embodiment of the invention;
Fig. 6 is the diagrammatic cross-section of the side incident backlight module of fourth embodiment of the invention;
Fig. 7 A is the graph of a relation between varying level position and the operating temperature in traditional side incident backlight module;
Fig. 7 B is the graph of a relation between varying level position and the operating temperature in the side incident backlight module of fourth embodiment of the invention.
Wherein, Reference numeral
100: side incident backlight module 110: light guide plate
112: light incident sides 120: linear light sorurce
210: light guide plate 212: light incident sides
220: linear light sorurce 222: carrier
222a~222e: element setting area 224,224 ': solid-state light emitting element
X, Y, Z: path I, I ': drive current
I 1: fixed current
200a, 200b, 200c, 200d: side incident backlight module
Embodiment
Fig. 1 is the graph of a relation between varying level position and the operating temperature in the traditional side incident backlight module.Please refer to Fig. 1, traditional side incident backlight module 100 comprises a light guide plate 110 and two linear light sorurces 120 respect to one another.Light guide plate 110 has two light incident sides 112 toward each other, and each linear light sorurce 120 is parallel in fact light incident sides 112 configurations, and linear light sorurce 120 comprises a carrier and a plurality of solid-state light emitting element (not illustrating).It should be noted that solid-state light emitting element is arranged on the carrier in equally spaced mode, and the specified forward voltage value (normal Vfbin) of all solid-state light emitting elements is all identical.In theory, when solid-state light emitting element is arranged on the carrier in equally spaced mode, and when the specified forward voltage value of all solid-state light emitting elements (normal Vf bin) is all identical, the operating temperature of the different parts of linear light sorurce 120 should be that difference is little, but after the temperature at actual measurement linear light sorurce 120 each position, the temperature difference of maximum allowable operating temperature (M.A.O.T.) and minimum operation temperature is unexpectedly up to (take the display panels of 42 o'clock or 55 o'clock as example) more than 10 ℃.As can be seen from Figure 1, if (direction opposite with gravity direction G) measures respectively the temperature at each position on the light guide plate 110 one by one along path X, Y, Z from lower to upper, can find that operating temperature can fall after rising, the highest operating temperature can't appear at top.Because path X approaches the linear light sorurce 120 in left side, therefore higher along the measured temperature of path X, the temperature measured along path Y, Z is then lower, but it is constant to measure one by one from lower to upper the trend that resulting temperature can fall after rising.
If the dual-side of light-entering type backlight module 100 (backboard place) (direction opposite with gravity direction G) temperature at measure linear light source 120 each position one by one from lower to upper from the side, can find that operating temperature can fall after rising equally, the thermograde of backboard is about 0.1 ℃/centimeter, and the highest operating temperature can't appear at top.In addition, if directly measure the temperature (such as the temperature of the lens of LED package) of solid-state light emitting element itself, then thermograde is about 0.2 ℃/centimeter, and at the different parts of linear light sorurce 120, the maximum temperature of lens and the difference of minimum temperature can be up to 13.6 ℃.
After present inventor's research, realize that the operating temperature difference of the different parts of linear light sorurce 120 can be subject to the impact of side incident backlight module 100 inner air convections.In detail, when the bearing of trend of linear light sorurce 120 is parallel to gravity direction G, because the heat energy that produces of solid-state light emitting element can be toward the direction transmission opposite with gravity direction G, so the operating temperature difference of the different parts of linear light sorurce 120 and gravity direction G have correlativity to a certain degree.
After considering above-mentioned phenomenon, the application proposes following a plurality of embodiment, with the homogeneity (uniformity) of the operating temperature of improving linear light sorurce 120, and then promotes serviceable life of side incident backlight module.
[the first embodiment]
Fig. 2 is the front view of the side incident backlight module of first embodiment of the invention, and Fig. 3 A is the diagrammatic cross-section of A-A ' section in Fig. 2, and Fig. 3 B is the diagrammatic cross-section of B-B ' section in Fig. 2.Please refer to Fig. 2, Fig. 3 A and Fig. 3 B, the side incident backlight module 200a of present embodiment comprises a light guide plate 210 and at least one linear light sorurce 220.Light guide plate 210 has at least one light incident sides 212, and linear light sorurce 220 is parallel in fact light incident sides 212 configurations, and linear light sorurce 220 comprises a carrier 222 and a plurality of solid-state light emitting element 224.As can be seen from Figure 2, light guide plate 210 has a pair of light incident sides parallel to each other 212, and the quantity of linear light sorurce 220 is 2, and these 2 linear light sorurces 220 are parallel in fact light incident sides.It should be noted that the present invention does not limit the light incident sides 212 of light guide plate 210 and the quantity of linear light sorurce 220, those of ordinary skills can moderately change according to the design requirement of product the design of light guide plate 210 and linear light sorurce 220.For example, in another embodiment of the present invention, side incident backlight module 200a can adopt the optical design of single-sided illumination, and in other words, light guide plate 210 only has single light incident sides 212 and a linear light sorurce 220 corresponding with light incident sides 212.
In the present embodiment, carrier 222 for example is the circuit board of a strip, and this circuit board can be general printed circuit board (PCB) or good metallic core printed circuit board (PCB) (the Metal Core PrintedCircuit Board of thermal conduction characteristic, MCPCB), in addition, solid-state light emitting element 224 for example is LED encapsulation body (LED package), and this LED encapsulation body can be surface adhesion type element (Surface MountDevice, SMD) or other suitable packaging bodies, the present invention is not limited.
Carrier 222 is being divided into five element setting areas (i.e. the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 4th element setting area 222d and the 5th element setting area 222e) of sequentially arranging along its bearing of trend, and solid-state light emitting element 224 is disposed on each element setting area of carrier 222, and is electrically connected with carrier 222.In the present embodiment, the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 4th element setting area 222d, the 5th element setting area 222e sequentially arrange along gravity direction G.
From Fig. 3 B as can be known, be positioned at the arrangement pitches P2 of the 4th solid-state light emitting element 224 on the 222d of element setting area greater than the arrangement pitches P1 of the solid-state light emitting element 224 on all the other element setting areas (the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e).In the present embodiment, it is for example mutually the same to be positioned at the arrangement pitches P1 of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e.Certainly, in other embodiments, the arrangement pitches P1 that is positioned at the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e can successively decrease toward both sides from the 4th element setting area 222d.
Because it is larger to be arranged on the arrangement pitches P2 of the solid-state light emitting element 224 on the 4th element setting area 222d, so present embodiment can change the localized design of light guide plate 210.In detail, present embodiment can be on the regional area corresponding to the light guide plate 210 of the 4th element setting area 222d, and density and the size of change site, V-shaped groove are so that the area source that light guide plate 210 provides can have uniform brightness.
[the second embodiment]
Fig. 4 is the diagrammatic cross-section of the side incident backlight module of second embodiment of the invention.Please refer to Fig. 4, the side incident backlight module 200b of present embodiment and the side incident backlight module 200a of the first embodiment are similar, but the two Main Differences part is: the specified forward voltage value (normal Vf bin) that is positioned at the 4th solid-state light emitting element 224 ' on the 222d of element setting area is lower than the specified forward voltage value of the solid-state light emitting element 224 on all the other element setting area 222a, 222b, 222c, the 222e.The arrangement pitches of the solid-state light emitting element 224 on the arrangement pitches that in addition, is positioned at the 4th solid-state light emitting element 224 ' on the 222d of element setting area and all the other element setting area 222a, 222b, 222c, the 222e is identical.
In the present embodiment, it is for example mutually the same to be positioned at the specified forward voltage value of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e.Certainly, in other embodiments, the specified forward voltage value that is positioned at the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e can increase progressively toward both sides from the 4th element setting area 222d.It should be noted that the manufacturing of side incident backlight module 200b can utilize the stock of two or more solid-state light emitting element simultaneously when the solid-state light emitting element 224 that uses two or more, 224 ' time.
Because it is less to be arranged on the specified forward voltage value of the solid-state light emitting element 224 on the 4th element setting area 222d, so present embodiment can change the localized design of light guide plate 210.In detail, present embodiment can be on the regional area corresponding to the light guide plate 210 of the 4th element setting area 222d, and density and the size of change site, V-shaped groove are so that the area source that light guide plate 210 provides can have uniform brightness.
[the 3rd embodiment]
Fig. 5 is the diagrammatic cross-section of the side incident backlight module of third embodiment of the invention.Please refer to Fig. 5, the side incident backlight module 200c of present embodiment and the side incident backlight module 200a of the first embodiment are similar, but the two Main Differences part is: in the fixing situation of drive current, the dutycycle (duty ratio) that is positioned at the pulse width modulating signal of the 4th solid-state light emitting element 224 on the 222d of element setting area in order to driving is lower than the dutycycle of the pulse width modulating signal of the solid-state light emitting element 224 on all the other element setting area 222a, 222b, 222c, the 222e.The arrangement pitches of the solid-state light emitting element 224 on the arrangement pitches that in addition, is positioned at the 4th solid-state light emitting element 224 on the 222d of element setting area and all the other element setting area 222a, 222b, 222c, the 222e is identical.
In the present embodiment, it is for example mutually the same to be positioned at the dutycycle of pulse width modulating signal of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e.Certainly, in other embodiments, the dutycycle that is positioned at the pulse width modulating signal of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e can increase progressively toward both sides from the 4th element setting area 222d.
Owing to the duty of the pulse width modulating signal that is arranged on the solid-state light emitting element 224 on the 4th element setting area 222d is smaller, so present embodiment can change the localized design of light guide plate 210.In detail, present embodiment can be on the regional area corresponding to the light guide plate 210 of the 4th element setting area 222d, and density and the size of change site, V-shaped groove are so that the area source that light guide plate 210 provides can have uniform brightness.
[the 4th embodiment]
Fig. 6 is the diagrammatic cross-section of the side incident backlight module of fourth embodiment of the invention.Please refer to Fig. 6, the side incident backlight module 200d of present embodiment and the side incident backlight module 200c of the 3rd embodiment are similar, and only the two Main Differences part is: the drive current I ' that is positioned at the 4th solid-state light emitting element 224 on the 222d of element setting area in order to driving is lower than the drive current I of the solid-state light emitting element 224 on all the other element setting area 222a, 222b, 222c, the 222e.
In the present embodiment, it is for example mutually the same to be positioned at the drive current I of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e in order to driving.Certainly, in other embodiments, the drive current I that is positioned at the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e in order to driving can increase progressively toward both sides from the 4th element setting area 222d.
Because be arranged on the drive current I of the solid-state light emitting element 224 on the 4th element setting area 222d in order to driving less, so present embodiment can change the localized design of light guide plate 210.In detail, present embodiment can be on the regional area corresponding to the light guide plate 210 of the 4th element setting area 222d, and density and the size of change site, V-shaped groove are so that the area source that light guide plate 210 provides can have uniform brightness.
Fig. 7 A is the graph of a relation between varying level position and the operating temperature in traditional side incident backlight module, and Fig. 7 B is the graph of a relation between varying level position and the operating temperature in the side incident backlight module of fourth embodiment of the invention.Please refer to Fig. 7 A and Fig. 7 B, the broken line among Fig. 7 A and Fig. 7 B is actual measurement data, then is the Trendline of temperature variations with the close curve of broken line, I 1Be fixed current.If with the solid-state light emitting element 224 on the fixed current driving element setting area 222a of 120 milliamperes, 222b, 222c, 222d, the 222e, the phenomenon of temperature contrast is comparatively obvious, shown in Fig. 7 A.If drive solid-state light emitting element 224 on driving element setting area 222a, 222b, 222c, 222d, the 222e with different driving electric current I, the I ' that is consistent with Trendline, the phenomenon of temperature contrast is comparatively slight, shown in Fig. 7 B.
In aforesaid a plurality of embodiment, arrangement pitches, the solid-state light emitting element of selecting different specified forward voltage values of the application by adjusting solid-state light emitting element, utilize the pulse width modulating signal of different duty or adopt different drive currents to drive solid-state light emitting element, descend because localized hyperthermia causes serviceable life so that solid-state light emitting element is difficult, and then promote the serviceable life of side incident backlight module.
Certainly; the present invention also can have other various embodiments; in the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.

Claims (26)

1. a side incident backlight module is characterized in that, comprising:
One light guide plate has at least one light incident sides;
At least one linear light sorurce be parallel in fact this light incident sides configuration, and this linear light sorurce comprises: a carrier, and this carrier is being divided into five element setting areas of sequentially arranging along its bearing of trend; And a plurality of solid-state light emitting elements, be disposed on these element setting areas of this carrier, and be electrically connected with this carrier, wherein be positioned at the arrangement pitches of the 4th these solid-state light emitting elements on the element setting area greater than the arrangement pitches of these solid-state light emitting elements on all the other element setting areas.
2. side incident backlight module according to claim 1 is characterized in that, this light incident sides is parallel in fact a gravity direction.
3. side incident backlight module according to claim 2 is characterized in that, sequentially arrange along this gravity direction first, second, third, fourth, the 5th element setting area.
4. side incident backlight module according to claim 1 is characterized in that, the arrangement pitches of these solid-state light emitting elements successively decreases from the 4th element setting area toward both sides.
5. side incident backlight module according to claim 1 is characterized in that, the arrangement pitches that is positioned at first, second, third, the 5th solid-state light emitting element on the element setting area is identical.
6. side incident backlight module according to claim 1 is characterized in that, this carrier comprises a circuit board.
7. side incident backlight module according to claim 1 is characterized in that, these solid-state light emitting elements comprise LED encapsulation body.
8. side incident backlight module according to claim 1 is characterized in that, this light guide plate has a pair of light incident sides parallel to each other, and this at least one linear light sorurce comprises two linear light sources, and these linear light sorurces are parallel in fact this to light incident sides.
9. a side incident backlight module is characterized in that, comprising:
One light guide plate has at least one light incident sides;
At least one linear light sorurce be parallel in fact this light incident sides configuration, and this linear light sorurce comprises: a carrier, and this carrier is being divided into five element setting areas of sequentially arranging along its bearing of trend; And a plurality of solid-state light emitting elements, be disposed on these element setting areas of this carrier, and be electrically connected with this carrier, the specified forward voltage value that wherein is positioned at the 4th these solid-state light emitting elements on the element setting area is lower than the specified forward voltage value of these solid-state light emitting elements on all the other element setting areas.
10. side incident backlight module according to claim 9 is characterized in that, this light incident sides is parallel in fact a gravity direction.
11. side incident backlight module according to claim 10 is characterized in that, sequentially arrange along this gravity direction first, second, third, fourth, the 5th element setting area.
12. side incident backlight module according to claim 9 is characterized in that, this carrier comprises a circuit board.
13. side incident backlight module according to claim 9 is characterized in that, these solid-state light emitting elements comprise LED encapsulation body.
14. side incident backlight module according to claim 9, it is characterized in that, this light guide plate has a pair of light incident sides parallel to each other, and this at least one linear light sorurce comprises two linear light sources, and these linear light sorurces are parallel in fact this to light incident sides.
15. a side incident backlight module is characterized in that, comprising:
One light guide plate has at least one light incident sides;
At least one linear light sorurce be parallel in fact this light incident sides configuration, and this linear light sorurce comprises: a carrier, and this carrier is being divided into five element setting areas of sequentially arranging along its bearing of trend; And a plurality of solid-state light emitting elements, be disposed on these element setting areas of this carrier, and be electrically connected with this carrier, wherein in the fixing situation of drive current, the dutycycle that is positioned at the pulse width modulating signal of the 4th these solid-state light emitting elements on the element setting area in order to driving is lower than the dutycycle of the pulse width modulating signal of these solid-state light emitting elements on all the other element setting areas.
16. side incident backlight module according to claim 15 is characterized in that, this light incident sides is parallel in fact a gravity direction.
17. side incident backlight module according to claim 16 is characterized in that, sequentially arrange along this gravity direction first, second, third, fourth, the 5th element setting area.
18. side incident backlight module according to claim 15 is characterized in that, this carrier comprises a circuit board.
19. side incident backlight module according to claim 15 is characterized in that, these solid-state light emitting elements comprise LED encapsulation body.
20. side incident backlight module according to claim 15, it is characterized in that, this light guide plate has a pair of light incident sides parallel to each other, and this at least one linear light sorurce comprises two linear light sources, and these linear light sorurces are parallel in fact this to light incident sides.
21. a side incident backlight module is characterized in that, comprising:
One light guide plate has at least one light incident sides;
At least one linear light sorurce be parallel in fact this light incident sides configuration, and this linear light sorurce comprises: a carrier, and this carrier is being divided into five element setting areas of sequentially arranging along its bearing of trend; And a plurality of solid-state light emitting elements, be disposed on these element setting areas of this carrier, and be electrically connected with this carrier, the drive current that wherein is positioned at the 4th these solid-state light emitting elements on the element setting area in order to driving is lower than the drive current of these solid-state light emitting elements on all the other element setting areas.
22. side incident backlight module according to claim 21 is characterized in that, this light incident sides is parallel in fact a gravity direction.
23. side incident backlight module according to claim 22 is characterized in that, sequentially arrange along this gravity direction first, second, third, fourth, the 5th element setting area.
24. side incident backlight module according to claim 21 is characterized in that, this carrier comprises a circuit board.
25. side incident backlight module according to claim 21 is characterized in that, these solid-state light emitting elements comprise LED encapsulation body.
26. side incident backlight module according to claim 21, it is characterized in that, this light guide plate has a pair of light incident sides parallel to each other, and this at least one linear light sorurce comprises two linear light sources, and these linear light sorurces are parallel in fact this to light incident sides.
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Families Citing this family (1)

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CN102705744B (en) * 2012-06-15 2014-10-15 深圳市华星光电技术有限公司 Light emitting diode (LED) lamp strip and lateral-entering type backlight module using same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101042501A (en) * 2006-09-14 2007-09-26 友达光电股份有限公司 Back light unit and light-emitting diode packaging structure
CN101368687A (en) * 2008-10-13 2009-02-18 友达光电股份有限公司 Side light type backlight module and its operation method
CN101526693A (en) * 2008-03-06 2009-09-09 株式会社日立显示器 Liquid crystal display device
CN101546755A (en) * 2008-03-25 2009-09-30 宏齐科技股份有限公司 LED package structure with different arrangement pitches and package method thereof
CN201373337Y (en) * 2009-03-24 2009-12-30 台湾奈普光电科技股份有限公司 Light source device of backlight module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101042501A (en) * 2006-09-14 2007-09-26 友达光电股份有限公司 Back light unit and light-emitting diode packaging structure
CN101526693A (en) * 2008-03-06 2009-09-09 株式会社日立显示器 Liquid crystal display device
CN101546755A (en) * 2008-03-25 2009-09-30 宏齐科技股份有限公司 LED package structure with different arrangement pitches and package method thereof
CN101368687A (en) * 2008-10-13 2009-02-18 友达光电股份有限公司 Side light type backlight module and its operation method
CN201373337Y (en) * 2009-03-24 2009-12-30 台湾奈普光电科技股份有限公司 Light source device of backlight module

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