CN102011960A - Side incident backlight module - Google Patents
Side incident backlight module Download PDFInfo
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- CN102011960A CN102011960A CN2010105016898A CN201010501689A CN102011960A CN 102011960 A CN102011960 A CN 102011960A CN 2010105016898 A CN2010105016898 A CN 2010105016898A CN 201010501689 A CN201010501689 A CN 201010501689A CN 102011960 A CN102011960 A CN 102011960A
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Abstract
The invention relates to a side incident backlight module, which comprises a light guide plate and at least one linear light source, wherein the light guide plate has at least one incident side, the linear light source is parallel to the incident side substantially, and the linear light source comprises a load receptor and a plurality of solid light-emitting components. The load receptor is divided into five equal component arrangement areas along the extension direction of the load receptor, and the solid light-emitting components are arranged in the component arrangement areas of the load receptor and are electrically connected with the load receptor, wherein the arrangement intervals of the solid light-emitting components positioned on the fourth component arrangement area are greater than those of the solid light-emitting components in the other component arrangement areas.
Description
Technical field
The present invention relates to a kind of lateral incident type backlight module, and particularly relevant for a kind of with the lateral incident type backlight module of solid-state light emitting element as light source.
Background technology
Because LCD (liquid crystal display, LCD) have conventional cathode ray tube (cathode ray tube such as low voltage operating, radiationless line scattering, in light weight and volume be little, CRT) display of the manufacturing advantage that is beyond one's reach, therefore LCD has become the major subjects of display research in recent years, and constantly develops towards colorize.
Because LCD is non-self-luminous display, therefore need backlight module that required light is provided, can reach the function of demonstration.In recent years, along with the lifting of environmental consciousness, (cold cathode fluorescent lamp CCFL) converts the light-emitting diode of more environmental protection to employed light-emitting component from cathode fluorescent tube gradually in the backlight module.When light-emitting diode is applied in the backlight module; with the lateral incident type backlight module is example; light-emitting diode is arranged on the printed circuit board (PCB) of a strip usually; to form light-emitting diode light bar (LED light bar); (flexible printed circuit FPC) electrically connects with a control circuit board and light-emitting diode light bar can pass through a pliability circuit usually.
In the prior art, in the light-emitting diode light bar, the light-emitting diode that is arranged on diverse location can be under the different operating temperatures, and the difference of maximum allowable operating temperature (M.A.O.T.) and minimum operation temperature may be up to (display panels with 42 o'clock or 55 o'clock be an example) more than 10 ℃.Because operating temperature can have a strong impact on brightness, colourity and the service life of light-emitting diode, therefore after through long-time the use, part is in than the first fault of the meeting of the light-emitting diode under the High Operating Temperature, causes the rapid drawdown in service life of backlight module.
Hold above-mentioned, because different operating temperatures can cause occurring the service life of light-emitting diode evident difference, therefore the operating temperature difference of how to dwindle the light-emitting diode of diverse location on the light-emitting diode light bar is those skilled in the art's problem demanding prompt solution in fact.
Summary of the invention
The invention provides a kind of lateral incident type backlight module, its solid-state light emitting element is difficult for descending because of localized hyperthermia causes service life.
The present invention proposes a kind of lateral incident type backlight module, and it comprises a LGP and at least one linear light sorurce.LGP has at least one light incident sides, and linear light sorurce is parallel to the light incident sides configuration in fact, and linear light sorurce comprises a carrier and a plurality of solid-state light emitting element.Carrier is being divided into five element setting areas of arranging in regular turn on its bearing of trend, and solid-state light emitting element is disposed on the element setting area of carrier, and electrically connect with carrier, wherein be positioned at the arrangement pitches of the arrangement pitches of the 4th solid-state light emitting element on the element setting area greater than the solid-state light emitting element on all the other element setting areas.
The present invention provides a kind of lateral incident type backlight module in addition, and it comprises a LGP and at least one linear light sorurce.LGP has at least one light incident sides, and linear light sorurce is parallel to the light incident sides configuration in fact, and linear light sorurce comprises a carrier and a plurality of solid-state light emitting element.Carrier is being divided into five element setting areas of arranging in regular turn on its bearing of trend, and a plurality of solid-state light emitting elements are disposed on the element setting area of carrier, and electrically connect with carrier, the specified forward voltage value (normal Vf bin) that wherein is positioned at the 4th solid-state light emitting element on the element setting area is lower than the specified forward voltage value of the solid-state light emitting element on all the other element setting areas.
The present invention provides a kind of lateral incident type backlight module again, and it comprises a LGP and at least one linear light sorurce.LGP has at least one light incident sides, and linear light sorurce is parallel to the light incident sides configuration in fact, and linear light sorurce comprises a carrier and a plurality of solid-state light emitting element.Carrier is being divided into five element setting areas of arranging in regular turn on its bearing of trend, and a plurality of solid-state light emitting elements are disposed on the element setting area of carrier, and electrically connect with carrier, wherein under the fixing situation of drive current, the dutycycle (duty ratio) that is positioned at the pulse width modulating signal (pulse-widthmodulated signal) of the 4th solid-state light emitting element on the element setting area in order to driving is lower than the dutycycle of the pulse width modulating signal of the solid-state light emitting element on all the other element setting areas.
The present invention provides a kind of lateral incident type backlight module again, and it comprises a LGP and at least one linear light sorurce.LGP has at least one light incident sides, and linear light sorurce is parallel to the light incident sides configuration in fact, and linear light sorurce comprises a carrier and a plurality of solid-state light emitting element.Carrier is being divided into five element setting areas of arranging in regular turn on its bearing of trend, and a plurality of solid-state light emitting elements are disposed on the element setting area of carrier, and electrically connect with carrier, wherein the drive current that is positioned at the 4th solid-state light emitting element on the element setting area in order to driving is lower than the drive current of the solid-state light emitting element on all the other element setting areas.
Arrangement pitches, the solid-state light emitting element of selecting different specified forward voltage values of the present invention by adjusting solid-state light emitting element, utilize the pulse width modulating signal of different duty or different drive currents to drive solid-state light emitting element, descend because of localized hyperthermia causes service life so that solid-state light emitting element is difficult, and then promote the service life of lateral incident type backlight module.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the graph of a relation between varying level position and the operating temperature in the traditional lateral incident type backlight module;
Fig. 2 is the front view of the lateral incident type backlight module of first embodiment of the invention;
Fig. 3 A is the generalized section of A-A ' section in Fig. 2;
Fig. 3 B is the generalized section of B-B ' section in Fig. 2;
Fig. 4 is the generalized section of the lateral incident type backlight module of second embodiment of the invention;
Fig. 5 is the generalized section of the lateral incident type backlight module of third embodiment of the invention;
Fig. 6 is the generalized section of the lateral incident type backlight module of fourth embodiment of the invention;
Fig. 7 A is the graph of a relation between varying level position and the operating temperature in traditional lateral incident type backlight module;
Fig. 7 B is the graph of a relation between varying level position and the operating temperature in the lateral incident type backlight module of fourth embodiment of the invention.
Wherein, Reference numeral
100: lateral incident type backlight module 110: LGP
112: light incident sides 120: linear light sorurce
210: LGP 212: light incident sides
220: linear light sorurce 222: carrier
222a～222e: element setting area 224,224 ': solid-state light emitting element
X, Y, Z: path I, I ': drive current
I
1: fixed current
200a, 200b, 200c, 200d: lateral incident type backlight module
The specific embodiment
Fig. 1 is the graph of a relation between varying level position and the operating temperature in the traditional lateral incident type backlight module.Please refer to Fig. 1, traditional lateral incident type backlight module 100 comprises a LGP 110 and two linear light sorurces 120 respect to one another.LGP 110 has two light incident sides 112 toward each other, and each linear light sorurce 120 is parallel to light incident sides 112 configurations in fact, and linear light sorurce 120 comprises a carrier and a plurality of solid-state light emitting element (not illustrating).It should be noted that solid-state light emitting element is arranged on the carrier in equally spaced mode, and the specified forward voltage value (normal Vfbin) of all solid-state light emitting elements is all identical.In theory, when solid-state light emitting element is arranged on the carrier in equally spaced mode, and when the specified forward voltage value of all solid-state light emitting elements (normal Vf bin) is all identical, the operating temperature of the different parts of linear light sorurce 120 should be that difference is little, but after the temperature at actual measurement linear light sorurce 120 each position, the temperature difference of maximum allowable operating temperature (M.A.O.T.) and minimum operation temperature is unexpectedly up to (display panels with 42 o'clock or 55 o'clock is an example) more than 10 ℃.As can be seen from Figure 1, if (direction opposite with gravity direction G) measures the temperature at each position on the LGP 110 respectively one by one along path X, Y, Z from lower to upper, can find that operating temperature can fall after rising, the highest operating temperature can't appear at top.Because near the linear light sorurce 120 in left side, therefore higher along the measured temperature of path X, the temperature measured along path Y, Z is then lower for path X, but it is constant to measure the trend that resulting temperature can fall after rising from lower to upper one by one.
If the dual-side of incident type backlight module 100 (backboard place) (direction opposite) temperature at measure linear light source 120 each position one by one from lower to upper from the side with gravity direction G, can find that operating temperature can fall after rising equally, the thermograde of backboard is about 0.1 ℃/centimeter, and the highest operating temperature can't appear at top.In addition, if the direct temperature of measurement solid-state light emitting element (as the temperature of the lens of LED package) itself, then thermograde is about 0.2 ℃/centimeter, and at the different parts of linear light sorurce 120, the maximum temperature of lens and the difference of minimum temperature can be up to 13.6 ℃.
After present inventor's research, realize that the operating temperature difference of the different parts of linear light sorurce 120 can be subjected to the influence of lateral incident type backlight module 100 inner air convections.In detail, when the bearing of trend of linear light sorurce 120 is parallel to gravity direction G, because heat energy that solid-state light emitting element produced can be toward the direction transmission opposite with gravity direction G, so the operating temperature difference of the different parts of linear light sorurce 120 and gravity direction G have correlation to a certain degree.
After considering above-mentioned phenomenon, the application proposes following a plurality of embodiment, with the uniformity (uniformity) of the operating temperature of improving linear light sorurce 120, and then promotes service life of lateral incident type backlight module.
[first embodiment]
Fig. 2 is the front view of the lateral incident type backlight module of first embodiment of the invention, and Fig. 3 A is the generalized section of A-A ' section in Fig. 2, and Fig. 3 B is the generalized section of B-B ' section in Fig. 2.Please refer to Fig. 2, Fig. 3 A and Fig. 3 B, the lateral incident type backlight module 200a of present embodiment comprises a LGP 210 and at least one linear light sorurce 220.LGP 210 has at least one light incident sides 212, and linear light sorurce 220 is parallel to light incident sides 212 configurations in fact, and linear light sorurce 220 comprises a carrier 222 and a plurality of solid-state light emitting element 224.As can be seen from Figure 2, LGP 210 has a pair of light incident sides parallel to each other 212, and the quantity of linear light sorurce 220 is 2, and these 2 linear light sorurces 220 are parallel to light incident sides in fact.It should be noted that the present invention does not limit the light incident sides 212 of LGP 210 and the quantity of linear light sorurce 220, those of ordinary skills can moderately change the design of LGP 210 and linear light sorurce 220 according to the design requirement of product.For example, in another embodiment of the present invention, lateral incident type backlight module 200a can adopt the optical design of one-sided light inlet, and in other words, LGP 210 only has single light incident sides 212 and a linear light sorurce 220 corresponding with light incident sides 212.
In the present embodiment, carrier 222 for example is the circuit board of a strip, and this circuit board can be general printed circuit board (PCB) or thermal conduction characteristic good metal core printed circuit board (PCB) (Metal Core PrintedCircuit Board, MCPCB), in addition, solid-state light emitting element 224 for example is LED encapsulation body (LED package), and this LED encapsulation body can be surface adhesion type element (Surface MountDevice, SMD) or other suitable packaging bodies, the present invention is not limited.
From Fig. 3 B as can be known, be positioned at the arrangement pitches P1 of the arrangement pitches P2 of the 4th solid-state light emitting element 224 on the 222d of element setting area greater than the solid-state light emitting element 224 on all the other element setting areas (the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e).In the present embodiment, it is for example mutually the same to be positioned at the arrangement pitches P1 of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e.Certainly, in other embodiments, the arrangement pitches P1 that is positioned at the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e can successively decrease toward both sides from the 4th element setting area 222d.
Because it is bigger to be arranged on the arrangement pitches P2 of the solid-state light emitting element 224 on the quaternary part setting area 222d, so present embodiment can change the localized design of LGP 210.In detail, present embodiment can be on the regional area corresponding to the LGP 210 of quaternary part setting area 222d, and the density and the size of change site, V-shaped groove are so that the area source that LGP 210 is provided can have uniform brightness.
[second embodiment]
Fig. 4 is the generalized section of the lateral incident type backlight module of second embodiment of the invention.Please refer to Fig. 4, the lateral incident type backlight module 200a of the lateral incident type backlight module 200b of present embodiment and first embodiment is similar, but the two main difference part is: the specified forward voltage value (normal Vf bin) that is positioned at the 4th solid-state light emitting element 224 ' on the 222d of element setting area is lower than the specified forward voltage value of the solid-state light emitting element 224 on all the other element setting area 222a, 222b, 222c, the 222e.In addition, the arrangement pitches of the solid-state light emitting element 224 on the arrangement pitches that is positioned at the 4th solid-state light emitting element 224 ' on the 222d of element setting area and all the other element setting area 222a, 222b, 222c, the 222e is identical.
In the present embodiment, it is for example mutually the same to be positioned at the specified forward voltage value of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e.Certainly, in other embodiments, the specified forward voltage value that is positioned at the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e can increase progressively toward both sides from the 4th element setting area 222d.It should be noted that the manufacturing of lateral incident type backlight module 200b can utilize the stock of two or more solid-state light emitting element simultaneously when the solid-state light emitting element 224 that uses two or more, 224 ' time.
Because it is less to be arranged on the specified forward voltage value of the solid-state light emitting element 224 on the quaternary part setting area 222d, so present embodiment can change the localized design of LGP 210.In detail, present embodiment can be on the regional area corresponding to the LGP 210 of quaternary part setting area 222d, and the density and the size of change site, V-shaped groove are so that the area source that LGP 210 is provided can have uniform brightness.
[the 3rd embodiment]
Fig. 5 is the generalized section of the lateral incident type backlight module of third embodiment of the invention.Please refer to Fig. 5, the lateral incident type backlight module 200a of the lateral incident type backlight module 200c of present embodiment and first embodiment is similar, but the two main difference part is: under the fixing situation of drive current, the dutycycle (duty ratio) that is positioned at the pulse width modulating signal of the 4th solid-state light emitting element 224 on the 222d of element setting area in order to driving is lower than the dutycycle of the pulse width modulating signal of the solid-state light emitting element 224 on all the other element setting area 222a, 222b, 222c, the 222e.In addition, the arrangement pitches of the solid-state light emitting element 224 on the arrangement pitches that is positioned at the 4th solid-state light emitting element 224 on the 222d of element setting area and all the other element setting area 222a, 222b, 222c, the 222e is identical.
In the present embodiment, it is for example mutually the same to be positioned at the dutycycle of pulse width modulating signal of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e.Certainly, in other embodiments, the dutycycle that is positioned at the pulse width modulating signal of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e can increase progressively toward both sides from the 4th element setting area 222d.
Owing to the dutycycle of the pulse width modulating signal that is arranged on the solid-state light emitting element 224 on the quaternary part setting area 222d is less, so present embodiment can change the localized design of LGP 210.In detail, present embodiment can be on the regional area corresponding to the LGP 210 of quaternary part setting area 222d, and the density and the size of change site, V-shaped groove are so that the area source that LGP 210 is provided can have uniform brightness.
[the 4th embodiment]
Fig. 6 is the generalized section of the lateral incident type backlight module of fourth embodiment of the invention.Please refer to Fig. 6, the lateral incident type backlight module 200c of the lateral incident type backlight module 200d of present embodiment and the 3rd embodiment is similar, and only the two main difference part is: the drive current I ' that is positioned at the 4th solid-state light emitting element 224 on the 222d of element setting area in order to driving is lower than the drive current I of the solid-state light emitting element 224 on all the other element setting area 222a, 222b, 222c, the 222e.
In the present embodiment, it is for example mutually the same to be positioned at the drive current I of the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e in order to driving.Certainly, in other embodiments, the drive current I that is positioned at the solid-state light emitting element 224 on the first element setting area 222a, the second element setting area 222b, three element setting area 222c, the 5th element setting area 222e in order to driving can increase progressively toward both sides from the 4th element setting area 222d.
Because be arranged on the drive current I of the solid-state light emitting element 224 on the quaternary part setting area 222d in order to driving less, so present embodiment can change the localized design of LGP 210.In detail, present embodiment can be on the regional area corresponding to the LGP 210 of quaternary part setting area 222d, and the density and the size of change site, V-shaped groove are so that the area source that LGP 210 is provided can have uniform brightness.
Fig. 7 A is the graph of a relation between varying level position and the operating temperature in traditional lateral incident type backlight module, and Fig. 7 B is the graph of a relation between varying level position and the operating temperature in the lateral incident type backlight module of fourth embodiment of the invention.Please refer to Fig. 7 A and Fig. 7 B, the broken line among Fig. 7 A and Fig. 7 B is actual measurement data, then is the Trendline of temperature variations with the close curve of broken line, I
1Be fixed current.If with the solid-state light emitting element 224 on the fixed current driving element setting area 222a of 120 milliamperes, 222b, 222c, 222d, the 222e, the phenomenon of temperature contrast is comparatively obvious, shown in Fig. 7 A.As if the solid-state light emitting element 224 that drives with different driving electric current I, the I ' that is consistent with Trendline on driving element setting area 222a, 222b, 222c, 222d, the 222e, the phenomenon of temperature contrast is comparatively slight, shown in Fig. 7 B.
In aforesaid a plurality of embodiment, arrangement pitches, the solid-state light emitting element of selecting different specified forward voltage values of the application by adjusting solid-state light emitting element, utilize the pulse width modulating signal of different duty or adopt different drive currents to drive solid-state light emitting element, descend because of localized hyperthermia causes service life so that solid-state light emitting element is difficult, and then promote the service life of lateral incident type backlight module.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (26)
1. a lateral incident type backlight module is characterized in that, comprising:
One LGP has at least one light incident sides;
At least one linear light sorurce be parallel to this light incident sides configuration in fact, and this linear light sorurce comprises: a carrier, and this carrier is being divided into five element setting areas of arranging in regular turn on its bearing of trend; And a plurality of solid-state light emitting elements, be disposed on these element setting areas of this carrier, and electrically connect with this carrier, wherein be positioned at the arrangement pitches of the arrangement pitches of the 4th these solid-state light emitting elements on the element setting area greater than these solid-state light emitting elements on all the other element setting areas.
2. lateral incident type backlight module according to claim 1 is characterized in that, this light incident sides limit is parallel to a gravity direction in fact.
3. lateral incident type backlight module according to claim 2 is characterized in that, arrange in regular turn along this gravity direction first, second, third, fourth, the 5th element setting area.
4. lateral incident type backlight module according to claim 1 is characterized in that, the arrangement pitches of these solid-state light emitting elements successively decreases from the 4th element setting area toward both sides.
5. lateral incident type backlight module according to claim 1 is characterized in that, the arrangement pitches that is positioned at first, second, third, the 5th solid-state light emitting element on the element setting area is identical.
6. lateral incident type backlight module according to claim 1 is characterized in that this carrier comprises a circuit board.
7. lateral incident type backlight module according to claim 1 is characterized in that these solid-state light emitting elements comprise LED encapsulation body.
8. lateral incident type backlight module according to claim 1 is characterized in that, this LGP has a pair of light incident sides parallel to each other, and this at least one linear light sorurce comprises two linear light sources, and these linear light sorurces are parallel to this in fact to light incident sides.
9. a lateral incident type backlight module is characterized in that, comprising:
One LGP has at least one light incident sides;
At least one linear light sorurce be parallel to this light incident sides configuration in fact, and this linear light sorurce comprises: a carrier, and this carrier is being divided into five element setting areas of arranging in regular turn on its bearing of trend; And a plurality of solid-state light emitting elements, be disposed on these element setting areas of this carrier, and electrically connect with this carrier, the specified forward voltage value that wherein is positioned at the 4th these solid-state light emitting elements on the element setting area is lower than the specified forward voltage value of these solid-state light emitting elements on all the other element setting areas.
10. lateral incident type backlight module according to claim 9 is characterized in that, this light incident sides limit is parallel to a gravity direction in fact.
11. lateral incident type backlight module according to claim 10 is characterized in that, arrange in regular turn along this gravity direction first, second, third, fourth, the 5th element setting area.
12. lateral incident type backlight module according to claim 9 is characterized in that this carrier comprises a circuit board.
13. lateral incident type backlight module according to claim 9 is characterized in that these solid-state light emitting elements comprise LED encapsulation body.
14. lateral incident type backlight module according to claim 9, it is characterized in that, this LGP has a pair of light incident sides parallel to each other, and this at least one linear light sorurce comprises two linear light sources, and these linear light sorurces are parallel to this in fact to light incident sides.
15. a lateral incident type backlight module is characterized in that, comprising:
One LGP has at least one light incident sides;
At least one linear light sorurce be parallel to this light incident sides configuration in fact, and this linear light sorurce comprises: a carrier, and this carrier is being divided into five element setting areas of arranging in regular turn on its bearing of trend; And a plurality of solid-state light emitting elements, be disposed on these element setting areas of this carrier, and electrically connect with this carrier, wherein under the fixing situation of drive current, the dutycycle that is positioned at the pulse width modulating signal of the 4th these solid-state light emitting elements on the element setting area in order to driving is lower than the dutycycle of the pulse width modulating signal of these solid-state light emitting elements on all the other element setting areas.
16. lateral incident type backlight module according to claim 15 is characterized in that this is parallel to a gravity direction in fact to the light incident sides limit.
17. lateral incident type backlight module according to claim 16 is characterized in that, arrange in regular turn along this gravity direction first, second, third, fourth, the 5th element setting area.
18. lateral incident type backlight module according to claim 15 is characterized in that this carrier comprises a circuit board.
19. lateral incident type backlight module according to claim 15 is characterized in that these solid-state light emitting elements comprise LED encapsulation body.
20. lateral incident type backlight module according to claim 15, it is characterized in that, this LGP has a pair of light incident sides parallel to each other, and this at least one linear light sorurce comprises two linear light sources, and these linear light sorurces are parallel to this in fact to light incident sides.
21. a lateral incident type backlight module is characterized in that, comprising:
One LGP has at least one light incident sides;
At least one linear light sorurce be parallel to this light incident sides configuration in fact, and this linear light sorurce comprises: a carrier, and this carrier is being divided into five element setting areas of arranging in regular turn on its bearing of trend; And a plurality of solid-state light emitting elements, be disposed on these element setting areas of this carrier, and electrically connect with this carrier, wherein the drive current that is positioned at the 4th these solid-state light emitting elements on the element setting area in order to driving is lower than the drive current of these solid-state light emitting elements on all the other element setting areas.
22. lateral incident type backlight module according to claim 21 is characterized in that this is parallel to a gravity direction in fact to the light incident sides limit.
23. lateral incident type backlight module according to claim 22 is characterized in that, arrange in regular turn along this gravity direction first, second, third, fourth, the 5th element setting area.
24. lateral incident type backlight module according to claim 21 is characterized in that this carrier comprises a circuit board.
25. lateral incident type backlight module according to claim 21 is characterized in that these solid-state light emitting elements comprise LED encapsulation body.
26. lateral incident type backlight module according to claim 21, it is characterized in that, this LGP has a pair of light incident sides parallel to each other, and this at least one linear light sorurce comprises two linear light sources, and these linear light sorurces are parallel to this in fact to light incident sides.
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| CN2010105016898A CN102011960B (en) | 2010-09-29 | 2010-09-29 | Side incident backlight module |
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| CN2010105016898A CN102011960B (en) | 2010-09-29 | 2010-09-29 | Side incident backlight module |
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| CN102011960A true CN102011960A (en) | 2011-04-13 |
| CN102011960B CN102011960B (en) | 2013-04-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013185395A1 (en) * | 2012-06-15 | 2013-12-19 | 深圳市华星光电技术有限公司 | Led light strip and side-type backlight module using same |
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| CN102011960B (en) | 2013-04-17 |
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