CN102010673A - High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed - Google Patents
High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed Download PDFInfo
- Publication number
- CN102010673A CN102010673A CN2009100639298A CN200910063929A CN102010673A CN 102010673 A CN102010673 A CN 102010673A CN 2009100639298 A CN2009100639298 A CN 2009100639298A CN 200910063929 A CN200910063929 A CN 200910063929A CN 102010673 A CN102010673 A CN 102010673A
- Authority
- CN
- China
- Prior art keywords
- acrylic ester
- fpc
- benzoxazine
- adhesive
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a high-performance modified acrylate adhesive used in the FPC (Flexible Printed Circuit) filed, relating to a modified acrylate adhesive and application of the adhesive on a FPC base material. The invention mainly aims at solving the problems of poor weather resistance, low temperature resistance and high moisture absorption rate of the known modified acrylate. The high-performance modified acrylate adhesive comprises the following components in parts by weight: 90-100 parts of acrylate copolymerization water emulsion, 0-10 parts of organic silicon monomer with allyl, 0-10 parts of inorganic filler, 10-20 parts of modified benzoxazinyl with allyl, 1-5 parts of antioxidant and catalyst and 80-120 parts of water. The adhesive has high performance index, ensures that the copper foil, aluminum foil, polyimide film and polyester film can be firmly adhered, can resist a high temperature of 300 degrees for 30 seconds, the folding of more than 3,000 times, soaking in 2NaOH and 2NHC for 130 minutes without foaming, layering, adhering and colour varying, and the low-high-temperature impact from 100 DEF C below zero to 300 DEG C and has the adhesive overflow quality of less than 0.1mm, the flame resistance at 94-V0 level and the water absorption rate of lower than 2%.
Description
Technical field
The present invention relates to a kind of tackiness agent, a kind of specifically modified acrylic ester adhesion agent that is used for flexible printed circuit board (FPC), and the application of this tackiness agent on the FPC base material.
Background technology
Since flexible printed circuit board (FPC) have can deflection characteristic, can reduced volume, can realize the requirement that electronic product is short, little, thin, light, on products such as automotive electronics, digital camera and Kamera, communication equipment, liquid crystal image demonstration, be used widely; Be applied in the business-like tackiness agent in FPC field at present and mainly contain modified acrylic ester adhesion agent and epoxy binder modified.The advantage of modification acrylate contrast modified epoxy is that environmental protection, cost are lower, the glue amount of overflowing is little.To be that weathering resistance is relatively poor (just scrapped with interior curing inferior position in six months substantially, placement flavescence more than two months), lower (more than 300 ℃ of modified epoxy of contrast of temperature tolerance, have only about 270 ℃, especially the mandatory use of Pb-free solder causes not reaching basically the requirement of soldering resistance), higher, the poor dimensional stability of moisture absorption ratio, produce bubble etc. in the after fixing stage easily; At the acrylic ester adhesive shortcoming, E.I.Du Pont Company has used phenolic aldehyde to improve its thermotolerance as cure-crosslinking agent, but because phenolic aldehyde exists and emit small molecules easily in solidification process, the stable on heating restriction of phenolic aldehyde itself, and shortcoming such as the residual excessive phenol of emulsion system or the environmentally harmful material of formaldehyde, make its use range and market share be restricted in the FPC field, patent of invention CN1827726A adopts the aldehyde amine hardener, and the thermotolerance that obtains has only the modified acrylic ester adhesion agent about 260 ℃.Also have and adopt urethane, organosilicon, modification butyronitrile etc. to be used as some trials of its cure-crosslinking agent and heat-resistant agent, but also do not have the acrylic ester adhesive thermotolerance of bibliographical information modification above 300 ℃ at present.
Summary of the invention
The objective of the invention is at above-mentioned deficiency, and the thermotolerance of a kind of tackiness agent that provides surpasses 300 ℃, and its weathering resistance height, moisture absorption ratio is low, and dimensional stability is good, and cure stage does not produce the modified acrylic ester adhesion agent of bubble.
Technical solution of the present invention is: the FPC field with the prescription of high-performance modified acrylic ester adhesive is by mass:
Acrylic acid copolymer whey liquid water described in the technology of the present invention solution carries out mixed preparing for 122.2 parts by 67 parts of butyl acrylates, 29 parts of vinyl cyanide, 3 parts in vinylformic acid, 0.5 part of sodium lauryl sulphate, 0.51 part of Sodium Persulfate, distilled water.Reaction is 3-4 hour in 80-85 ℃ of reactor, be cooled to room temperature after, with ammoniacal liquor and water viscosity is regulated, viscosity controller is 15-20 second (being coated with-4 glasss records), the filtration of 400 order filtering nets obtains stable acrylic ester copolymer water miscible liquid.
The allylic organosilane monomer that has described in the technology of the present invention solution comprises: one or more mixtures of r-propyl methacrylate trimethoxy silane, r-Jia Jibingxisuanyizhi trimethoxy silane, r-Jia Jibingxisuanyizhi three ethoxy silane, r-propyl methacrylate triethoxyl silane, preferably r-propyl methacrylate trimethoxy silane and r-propyl methacrylate triethoxyl silane.
The allylic modified benzoxazine that has described in the technology of the present invention solution comprises: one or more mixtures of the benzoxazine of benzoxazine, band clothing health imide and the propenyl of benzoxazine, band maleimide and the propenyl of benzoxazine, band clothing health imide and the propylene ether of diallyl Er benzoxazine, band maleimide and propylene ether, and preferably with the benzoxazine of benzoxazine, band clothing health imide and the propylene ether of maleimide and propylene ether.
Mineral filler described in the technology of the present invention solution comprises: one or more mixtures of silicon-dioxide, aluminum oxide, talcum, mica powder, silicon nitride, boron nitride, aluminium hydroxide, preferably silicon nitride and aluminium hydroxide.
Antioxidant described in the technology of the present invention solution comprises: 2,2, and 4-trimethylammonium-1, a kind of or both mixtures of 2-dihyaroquinoline polymer and sulfuration dipropionic acid two lauryls.
Catalyzer described in the technology of the present invention solution comprises: imidazoles, Methylimidazole, Witco 1298 Soft Acid etc., preferred imidazoles.
FPC field described in the technology of the present invention solution with the preparation method of high-performance modified acrylic ester adhesive is:
1. prepare stable acrylic ester copolymer water miscible liquid as response composite 1;
2. will have allylic organosilane monomer under the normal temperature and have allylic modified benzoxazine and mineral filler, oxidation inhibitor, catalyzer, distilled water mixes as response composite 2;
3. under the normal temperature response composite 1 and 2 is mixed in colloidal mill, the solution combination treatment of gained 2-3 time, each about 10 minutes, leave standstill froth breaking at last, obtaining viscosity is the stable emulsion of 14-18 about second.
FPC field described in the technology of the present invention solution with the preparation method of high-performance modified acrylic ester adhesive is:
1. will have the organosilane monomer of propyl group and have allylic modified benzoxazine and acrylic ester monomer and be prepared into the copolymerization water miscible liquid earlier as response composite 3 by the requirement of filling a prescription;
2. under the normal temperature, with mineral filler, oxidation inhibitor and catalyzer, distilled water mix as response composite 4;
3. under the normal temperature, in colloidal mill with the solution combination treatment of composition 3 and composition 4 gained 2-3 time, each about 10 minutes, leave standstill froth breaking at last, obtaining viscosity is the stable emulsion of 14-18 about second.
The high-performance modified acrylic ester adhesive in FPC field described in the technology of the present invention solution, sticking with glue the method that agent prepares the FPC base material is: the one side that tackiness agent is evenly coated in polyimide or polyester film, the thick 0.2-0.4mm of glue, in 110 ℃ baking oven, handled 20-30 minute, obtain the prepreg film (thickness 10-40um) of tackiness agent; Plastic packaging machine by 110 ℃ will carry out tentatively compound with the adhesive faec of the polyimide of prepreg film or polyester film and Copper Foil or aluminium foil again; Be 180-200 ℃ with the temperature with it in the pressure compounding machine then, pressure is 20-60Kgf/cm
2, the time is to handle in 20-60 minute, makes the FPC base material; Described Copper Foil is rolled copper foil or electrolytic copper foil, and its thickness is in the 12-38um scope, and rolled copper foil is preferably 18um.
Because adopting to have, the present invention heat-resistingly surpasses 400 ℃ with the cure-crosslinking agent of allylic benzoxazine as acrylic ester adhesive, utilize the allyl group and the acrylate at initial stage to pass through free-radical polymerized, utilize the ring-opening polymerization of benzoxazine in the after fixing stage, make cured glue stick system form inierpeneirating network structure, therefore improved the thermotolerance of tackiness agent greatly, its thermotolerance surpasses 300 ℃, and the allylic organosilicon of combined belt has improved the weathering resistance of acrylate greatly; And tackiness agent moisture absorption ratio of the present invention is lower, and dimensional stability is good, can not produce bubble in the after fixing stage; Tackiness agent of the present invention also has very high performance index value: can the good bond Copper Foil, aluminium foil, Kapton, polyester film, and can high temperature resistant 300 ℃ of 30s; Folding is greater than 3000 times; Anti-2NNaOH, 2NHCl30 minute immersion does not have foaming, layering, is clamminess and colour-change, and the stripping strength conservation rate reaches 85%; Tolerate-100 ℃ to 300 ℃ low high temperature impacts; Solidify the back dimensional stability less than 0.2%; The glue amount of overflowing is less than 0.1mm; Flame retardant resistance is by the 94-V0 level; Water-intake rate is lower than 2%; Solidification process does not have small molecules emits, and tackiness agent is the water-based emulsion system simultaneously, and eco-friendly characteristics are arranged.
The tackiness agent that uses the present invention to make, bonding Copper Foil, aluminium foil and Kapton, polyester film are made flexible circuit board (FPC) base material, and its characteristics are:
(1) tackiness agent prepreg preparation temperature＜130 ℃, time＜30 minute;
(2) adhesive solidification temperature＜200 ℃, pressure 2.5-3.0Kgf, time＜60 minute;
(3) solidify with the pressing of 18um rolled copper foil after, stripping strength (peeling off Copper Foil for 90 °)＞0.8Kgf/cm;
(4) 300 ℃ of 30S of immersed solder property testing do not have and bubble layering;
(5) excessive glue measures examination＜0.1mm;
(6) the dimensional stability test＜0.2%;
(7) insulation resistance: Rs1 * 10
12Ω, Rv1 * 10
14Ω;
(8) volatile content＜1.0%;
(9) flame resistivity is by the 94-V0 level;
(10) chemical resistant properties: 2NNaOH, 2NHCl30 minute immersion does not have foaming, layering, is clamminess and colour-change, and the stripping strength conservation rate reaches 85%;
(11) water-intake rate＜2.0%.
Embodiment
The invention will be further described with following example.
Embodiment 1
Under the normal temperature, in the 300ml three-necked bottle, add sodium lauryl sulphate 0.5g successively, distilled water 122.2g, middling speed stirs and forms uniformly emulsify liquid; Again in whipping process with butyl acrylate 67g, vinyl cyanide 29g, vinylformic acid 3g, Sodium Persulfate 0.4g, add the back and continue to stir 20-30 minute, form not stratified pre-emulsion.Contain out about 2/3 pre-emulsion with beaker, set up reflux condensing tube, constant pressure funnel, water-bath, make remaining about 1/3 pre-emulsion stirring reaction 0.5 hour under 78-80 ℃ condition, be warming up to 80-85 ℃ then, utilize constant pressure funnel that the pre-emulsion of about 2/3 in the beaker was continued to add uniformly three-necked bottle participation reaction at 2.5 hours, add Sodium Persulfate 0.1g after dripping off, insulation reaction 1-1.5 hour again, be cooled to room temperature at last, available suitable ammoniacal liquor and water are regulated viscosity, general viscosity controller is 15-20 second (being coated with-4 glasss records), 400 order filtering nets filter and obtain stable acrylate copolymer emulsion, obtain response composite 1.
Under the normal temperature, in the 100ml flask, add r-propyl methacrylate trimethoxy silane 5g successively, the benzoxazine 15g of band maleimide and propylene ether, silicon nitride 2g, sulfuration dipropionic acid two lauryl 0.5g, imidazoles 1g, distilled water 35g, high-speed stirring was disperseed 1 hour.Obtain response composite 2.
Under the normal temperature, with response composite 1 and 2 in colloidal mill, combination treatment 3 times, each 10 minutes, about 3 minutes at interval, leave standstill froth breaking at last, obtain viscosity and be 14-18 and stablize high-performance modified acrylic ester adhesive emulsion about second.
Tackiness agent is evenly coated in the one side of polyimide or polyester film, and the thick 0.2-0.4mm of glue handled 20-30 minute in 110 ℃ baking oven, obtained the prepreg film (thickness 10-40um) of tackiness agent; Plastic packaging machine by 110 ℃ will carry out tentatively compound with the adhesive faec of the polyimide of prepreg film or polyester film and Copper Foil or aluminium foil again; Be 180 ℃ with temperature with it in the pressure compounding machine then, pressure is 40Kgf/cm
2, the time is to handle in 40 minutes, makes the FPC base material.
Embodiment 2
Under the normal temperature, add sodium lauryl sulphate 0.5g, distilled water 152.2g successively in the 300ml three-necked bottle, middling speed stirs and forms uniformly emulsify liquid; Again in whipping process with butyl acrylate 67g, vinyl cyanide 29g, vinylformic acid 3g, Sodium Persulfate 0.4g, r-propyl methacrylate trimethoxy silane 5g, the benzoxazine 15g of band maleimide and propylene ether adds the back and continues to stir 20-30 minute, forms not stratified pre-emulsion.Contain out about 2/3 pre-emulsion with beaker, set up reflux condensing tube, constant pressure funnel, water-bath, make remaining about 1/3 pre-emulsion stirring reaction 0.5 hour under 78-80 ℃ condition, be warming up to 80-85 ℃ then, utilize constant pressure funnel that the pre-emulsion of about 2/3 in the beaker was continued to add uniformly three-necked bottle participation reaction at 2.5 hours.Add Sodium Persulfate 0.1g after dripping off, insulation reaction 1-1.5 hour again, be cooled to room temperature at last, available suitable ammoniacal liquor and water are regulated viscosity, general viscosity controller is 15-20 second (being coated with-4 glasss records), 400 order filtering nets filter and obtain stable acrylate copolymer emulsion, obtain response composite 3.
Under the normal temperature, in the 50ml flask, add silicon nitride 2g successively, sulfuration dipropionic acid two lauryl 0.5g, imidazoles 1g, distilled water 10g, high-speed stirring was disperseed 1 hour, obtained response composite 4.
Under the normal temperature, with response composite 3 and 4 in colloidal mill, combination treatment 3 times, each 10 minutes, about 3 minutes at interval, leave standstill froth breaking at last, obtain viscosity and be 14-18 and stablize high-performance modified acrylic ester adhesive emulsion about second.
Tackiness agent is evenly coated in the one side of polyimide or polyester film, and the thick 0.2-0.4mm of glue handled 20-30 minute in 110 ℃ baking oven, obtained the prepreg film (thickness 10-40um) of tackiness agent; Plastic packaging machine by 110 ℃ will carry out tentatively compound with the adhesive faec of the polyimide of prepreg film or polyester film and Copper Foil or aluminium foil again; Be 180 ℃ with temperature with it in the pressure compounding machine then, pressure is 40Kgf/cm
2, the time is to handle in 40 minutes, makes the FPC base material.
Embodiment 3
Prepare response composite 3 by embodiment 2, under the normal temperature with composition 3 and sulfuration dipropionic acid two lauryl 0.5g, imidazoles 1g, distilled water 4g is in colloidal mill, combination treatment 3 times, each 10 minutes, about 3 minutes at interval, leave standstill froth breaking at last, obtain viscosity and be 14-18 and stablize high-performance modified acrylic ester adhesive emulsion about second.
Tackiness agent is evenly coated in the one side of polyimide or polyester film, and the thick 0.2-0.4mm of glue handled 20-30 minute in 110 ℃ baking oven, obtained the prepreg film (thickness 10-40um) of tackiness agent; Plastic packaging machine by 110 ℃ will carry out tentatively compound with the adhesive faec of the polyimide of prepreg film or polyester film and Copper Foil or aluminium foil again; Be 180 ℃ with temperature with it in the pressure compounding machine then, pressure is 40Kgf/cm
2, the time is to handle in 40 minutes, makes the FPC base material.
Claims (10)
1. high-performance modified acrylic ester adhesive in FPC field, its prescription is by mass:
2. the high-performance modified acrylic ester adhesive in a kind of FPC according to claim 1 field, it is characterized in that described acrylic acid copolymer water miscible liquid carries out mixed preparing for 122.2 parts by 67 parts of butyl acrylates, 29 parts of vinyl cyanide, 3 parts in vinylformic acid, 0.5 part of sodium lauryl sulphate, 0.51 part of Sodium Persulfate, distilled water, reaction is 3-4 hour in 80-85 ℃ of reactor, after being cooled to room temperature, with ammoniacal liquor and water viscosity is regulated, viscosity controller is 15-20 second (being coated with-4 glasss records), and 400 order filtering nets filter and obtain stable acrylic ester copolymer water miscible liquid.
3. the high-performance modified acrylic ester adhesive in a kind of FPC according to claim 1 field, its feature also is describedly to have allylic organosilane monomer and comprise: one or more mixtures of r-propyl methacrylate trimethoxy silane, r-Jia Jibingxisuanyizhi trimethoxy silane, r-Jia Jibingxisuanyizhi three ethoxy silane, r-propyl methacrylate triethoxyl silane, preferably r-propyl methacrylate trimethoxy silane and r-propyl methacrylate triethoxyl silane.
4. the high-performance modified acrylic ester adhesive in a kind of FPC according to claim 1 field, its feature also is describedly to have allylic modified benzoxazine and comprise: one or more mixtures of the benzoxazine of the benzoxazine of the benzoxazine of the benzoxazine of diallyl Er benzoxazine, band maleimide and propylene ether, band clothing health imide and propylene ether, band maleimide and propenyl, band clothing health imide and propenyl, and preferably with the benzoxazine of benzoxazine, band clothing health imide and the propylene ether of maleimide and propylene ether.
5. the high-performance modified acrylic ester adhesive in a kind of FPC according to claim 1 field, it is characterized in that described mineral filler comprises: one or more mixtures of silicon-dioxide, aluminum oxide, talcum, mica powder, silicon nitride, boron nitride, aluminium hydroxide, preferably silicon nitride and aluminium hydroxide.
6. the high-performance modified acrylic ester adhesive in a kind of FPC according to claim 1 field, it is characterized in that described antioxidant comprises: 2,2,4-trimethylammonium-1, a kind of or both mixtures of 2-dihyaroquinoline polymer and sulfuration dipropionic acid two lauryls.
7. the high-performance modified acrylic ester adhesive in a kind of FPC according to claim 1 field is characterized in that described catalyzer comprises: imidazoles, Methylimidazole, Witco 1298 Soft Acid etc., preferred imidazoles.
8. the high-performance modified acrylic ester adhesive in a kind of FPC according to claim 1 and 2 field is characterized in that the preparation method of modified acrylic ester adhesion agent is:
1. prepare stable acrylic ester copolymer water miscible liquid as response composite 1;
2. will have allylic organosilane monomer under the normal temperature and have allylic modified benzoxazine and mineral filler, oxidation inhibitor, catalyzer, distilled water mixes as response composite 2;
3. under the normal temperature response composite 1 and 2 is mixed in colloidal mill, the solution combination treatment of gained 2-3 time, each about 10 minutes, leave standstill froth breaking at last, obtaining viscosity is the stable emulsion of 14-18 about second.
9. the high-performance modified acrylic ester adhesive in a kind of FPC according to claim 1 and 2 field is characterized in that the preparation method of modified acrylic ester adhesion agent is:
1. will have the organosilane monomer of propyl group and have allylic modified benzoxazine and acrylic ester monomer and be prepared into the copolymerization water miscible liquid earlier as response composite 3 by the requirement of filling a prescription;
2. under the normal temperature, with mineral filler, oxidation inhibitor and catalyzer, distilled water mix as response composite 4;
3. under the normal temperature, in colloidal mill with the solution combination treatment of composition 3 and composition 4 gained 2-3 time, each about 10 minutes, leave standstill froth breaking at last, obtaining viscosity is the stable emulsion of 14-18 about second.
10. according to claim 1, the high-performance modified acrylic ester adhesive in 8 or 9 described a kind of FPC fields, it is characterized in that sticking with glue the method that agent prepares the FPC base material is: the one side that tackiness agent is evenly coated in polyimide or polyester film, the thick 0.2-0.4mm of glue, in 110 ℃ baking oven, handled 20-30 minute, obtain the prepreg film (thickness 10-40um) of tackiness agent; Plastic packaging machine by 110 ℃ will carry out tentatively compound with the adhesive faec of the polyimide of prepreg film or polyester film and Copper Foil or aluminium foil again; Be 180-200 ℃ with the temperature with it in the pressure compounding machine then, pressure is 20-60Kgf/cm
2, the time is to handle in 20-60 minute, makes the FPC base material; Described Copper Foil is rolled copper foil or electrolytic copper foil, and its thickness is in the 12-38um scope, and rolled copper foil thickness is preferably 18um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910063929 CN102010673B (en) | 2009-09-07 | 2009-09-07 | High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910063929 CN102010673B (en) | 2009-09-07 | 2009-09-07 | High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102010673A true CN102010673A (en) | 2011-04-13 |
| CN102010673B CN102010673B (en) | 2013-02-06 |
Family
ID=43841010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910063929 Expired - Fee Related CN102010673B (en) | 2009-09-07 | 2009-09-07 | High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102010673B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102936474A (en) * | 2012-10-17 | 2013-02-20 | 烟台德邦科技有限公司 | Heating curing type modified acrylate pressure sensitive adhesive and preparation method thereof |
| CN105315903A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant acrylate pressure-sensitive adhesive and preparing method thereof |
| CN106686898A (en) * | 2017-01-06 | 2017-05-17 | 安徽鹏展电子科技有限公司 | Manufacturing method of flexible printed circuit board for LED light |
| CN110769618A (en) * | 2019-11-05 | 2020-02-07 | 东莞市科佳电路有限公司 | Method for plating copper in PCB hole |
| CN113597088A (en) * | 2021-07-22 | 2021-11-02 | 深圳市华鼎星科技有限公司 | Circuit material, preparation method and circuit board thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070129509A1 (en) * | 2005-12-02 | 2007-06-07 | Henkel Corporation | Curable compositions |
| CN101465409A (en) * | 2008-12-31 | 2009-06-24 | 电子科技大学 | Substrate for flexible organic optoelectronic device and preparation method thereof |
-
2009
- 2009-09-07 CN CN 200910063929 patent/CN102010673B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070129509A1 (en) * | 2005-12-02 | 2007-06-07 | Henkel Corporation | Curable compositions |
| CN101465409A (en) * | 2008-12-31 | 2009-06-24 | 电子科技大学 | Substrate for flexible organic optoelectronic device and preparation method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102936474A (en) * | 2012-10-17 | 2013-02-20 | 烟台德邦科技有限公司 | Heating curing type modified acrylate pressure sensitive adhesive and preparation method thereof |
| CN102936474B (en) * | 2012-10-17 | 2014-08-27 | 烟台德邦科技有限公司 | Heating curing type modified acrylate pressure sensitive adhesive and preparation method thereof |
| CN105315903A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant acrylate pressure-sensitive adhesive and preparing method thereof |
| CN105315903B (en) * | 2015-11-24 | 2018-01-16 | 徐昌虎 | A kind of high temperature resistant acrylate pressure-sensitive adhesive and preparation method thereof |
| CN106686898A (en) * | 2017-01-06 | 2017-05-17 | 安徽鹏展电子科技有限公司 | Manufacturing method of flexible printed circuit board for LED light |
| CN110769618A (en) * | 2019-11-05 | 2020-02-07 | 东莞市科佳电路有限公司 | Method for plating copper in PCB hole |
| CN113597088A (en) * | 2021-07-22 | 2021-11-02 | 深圳市华鼎星科技有限公司 | Circuit material, preparation method and circuit board thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102010673B (en) | 2013-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102010673B (en) | High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed | |
| CN1206259C (en) | Adhesive polyimide resin and adhesive laminate | |
| CN101724354A (en) | Resin composition and semiconductor devices made by using the same | |
| CN102311612B (en) | Resin composition and resin coated copper foil made of same | |
| CN103897346B (en) | A kind of compositions of thermosetting resin | |
| KR20120088530A (en) | Adhesive composition | |
| CN102311614A (en) | Resin composition and prepreg prepared by using same | |
| CN102639589A (en) | Chain curing resin composition and fiber-reinforced composite material | |
| CN101585905B (en) | Organic silicon modified phenolic epoxy curing agent for copper-clad board of printed circuit and preparation method thereof | |
| CN110328914A (en) | A kind of copper-clad plate and preparation method thereof suitable for PCB processing procedure with good flame-retardance | |
| CN112662132B (en) | Modified resin composition and preparation method and application thereof | |
| JP7083474B2 (en) | Recyclable LED packaging conductive adhesive composition and its manufacturing method | |
| CN112341965A (en) | Halogen-free flame-retardant water-based acrylic adhesive and flexible cover film prepared from same | |
| JP2011181525A (en) | Anisotropic conductive material | |
| CN112724598B (en) | Resin composition, prepreg and preparation method and application thereof | |
| CN103781860B (en) | liquid ink | |
| JP3708423B2 (en) | Phenolic curing agent for epoxy resin and epoxy resin composition using the same | |
| TW201219526A (en) | Adhesive composition | |
| CN101845143B (en) | Modified bismaleimide resin as well as preparation method and application thereof | |
| CN101440266B (en) | Novel paster glue for surface mounting technology and preparation thereof | |
| CN100589972C (en) | Epoxide woven glass fabric copper-clad laminates for leadless process and method for preparing same | |
| KR101289369B1 (en) | Epoxy resin composition, prepreg, laminate board and multilayer board | |
| CN101597466B (en) | Bonding sheet of rigid-flex combined board and method for manufacturing same | |
| CN203449677U (en) | Low-dielectric-loss copper-clad plate | |
| JPH08183835A (en) | Thermosetting resin composition, adhesive sheet, and adhesive-backed metal foil |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130206 Termination date: 20150907 |
|
| EXPY | Termination of patent right or utility model |