CN102003363B

CN102003363B - Square telescopic shape memory alloy actuator for adding activation force

Info

Publication number: CN102003363B
Application number: CN2010105516916A
Authority: CN
Inventors: 邓宗全; 郭宏伟; 赵浩江; 刘荣强
Original assignee: Harbin Institute of Technology
Current assignee: Harbin Institute of Technology
Priority date: 2010-11-19
Filing date: 2010-11-19
Publication date: 2012-01-25
Anticipated expiration: 2030-11-19
Also published as: CN102003363A

Abstract

The invention discloses a square telescopic shape memory alloy actuator for adding activation force, relates to an actuator and aims at the problems that the structure has overlarge size because a cooling or heating device of the traditional shape memory alloy actuator is separated from the actuator and the work space is limited due to an incompact structure. A first end head of an outer cylinder and a second end head of the outer cylinder are respectively arranged at two ends of the square outer cylinder; a first end head of an inner cylinder and a second end head of the inner cylinder are respectively arranged at two ends of the square inner cylinder; a shaft memory alloy wire in an intermediate layer is arranged between b surfaces of two semiconductor refrigerating pieces; one end of each first shape memory alloy wire is fixedly connected to the second end head of the inner cylinder; the other end of each first shape memory alloy wire penetrates through the first end head of the inner cylinder and then is fixedly connected to the first end head of the outer cylinder; one end of each second shape memory alloy wire is fixedly connected to the first end head of the inner cylinder; and the other end of each second shape memory alloy wire sequentially penetrates through the second head of the inner cylinder and a cover plate at the second end head of the inner cylinder and then is fixedly connected to the second end head of the outer cylinder. The invention is used for outputting the linear displacement and force.

Description

Increase the square sleeve cartridge type marmem actuator that is used as power

Technical field

The present invention relates to a kind of actuator.

Background technique

Marmem has shape memory effect; When material be in below the martensite end temp under external force certain deformation takes place after, heating-up temperature surpasses the phase transformation conversion temperature of material, martensite will take place to austenitic transformation; This moment material contracts; Attempt to return to the preceding shape of distortion, if there is constraint at the material two ends, material internal can produce very big restoring force.Marmem with double process shape-memory effect is realized shrinking repeatedly through the heating cooling.Utilize these characteristics can process the marmem actuator.Use marmem actuator external refrigeration device or the heating equipments that add that adopt at present, structure is not compact, is not suitable for the restricted environment of working space more.

Summary of the invention

The purpose of this invention is to provide the square sleeve cartridge type marmem actuator that a kind of increase is used as power, separate with actuator with the cooling that solves present marmem actuator or heating equipment and cause that the shared volume of structure is excessive, the not compact restricted problem of working space that causes of structure.

The present invention solves the problems of the technologies described above the technological scheme of taking to be: said actuator comprises urceolus first termination, first damping spring, inner core first termination, mesosphere shape-memory alloy wire, square inner core, the inner core second termination cover plate, urceolus second termination, inner core second termination, two chip semiconductor refrigerating sheets, two outer layers shape-memory alloy wire, cylinder and square urceolus; Urceolus first termination and urceolus second termination respectively are equipped with in the two ends of square urceolus; Inner core first termination, the inner core second termination cover plate, inner core second termination and square inner core are located in the square urceolus; Inner core first termination and inner core second termination respectively are equipped with in the two ends of square inner core; Each is connected the two ends of first damping spring with inner core first termination with urceolus first termination; One side and inner core second termination of the inner core second termination cover plate removably connect; The opposite side of the inner core second termination cover plate and an end of cylinder are affixed; The other end of cylinder passes the outside that urceolus second termination is arranged on urceolus second termination, and two chip semiconductor refrigerating sheets are contained in the square inner core side by side, and the mesosphere shape-memory alloy wire is made up of at least two first shape-memory alloy wires; Each semiconductor refrigerating sheet is provided with a face and b face; The mesosphere shape-memory alloy wire is located between the b face of two chip semiconductor refrigerating sheets, and an end of every first shape-memory alloy wire is secured on inner core second termination, and the other end of every first shape-memory alloy wire is secured on urceolus first termination after passing inner core first termination; Two outer shape-memory alloy wires respectively are located at the outside of each semiconductor refrigerating sheet; Every layer of outer shape-memory alloy wire is made up of at least two second shape-memory alloy wires, and an end of every second shape-memory alloy wire is fixed on inner core first termination, and the other end is secured on urceolus second termination after passing inner core second termination and the inner core second termination cover plate successively.

The present invention has following beneficial effect: 1. the present invention utilizes semiconductor refrigerating sheet thermal source that the memory alloy wire start is required and low-temperature receiver to be integrated in the actuator structure dexterously; Outside additional cooling or heating equipment have been saved; Make simple and compact for structure, the light weight of actuator; And obtain desirable being used as power and the start scope, and promptly can be used as actuator, can be used as the vibration active damper again; On structural type, can replace the isostructural strut of truss, play the function of support and start simultaneously; 2. the present invention has made full use of the characteristics that two chip semiconductor refrigerating sheets simultaneously heat the one side refrigeration; Realization to heating of two outer layers shape-memory alloy wire or refrigeration, produces the movement characteristic of the deformation effect combined sleeve formula actuator of mesosphere shape-memory alloy wire and two outer layers shape-memory alloy wire to mesosphere shape-memory alloy wire refrigeration or heating the time thus; 3, because the present invention adopts the form of many memory alloy wire parallel connections,, the present invention is used as power so can increasing under limited physical dimension condition.

Description of drawings

Fig. 1 is an overall appearance schematic representation of the present invention; Fig. 2 is the explosive view of Fig. 1; Fig. 3 is an overall structure plan view of the present invention; Fig. 4 is the view of shape-memory alloy wire.

Embodiment

Embodiment one: combine Fig. 1-Fig. 3 that this mode of execution is described; The said actuator of this mode of execution comprises urceolus first termination 1, first damping spring 2, inner core first termination 3, mesosphere shape-memory alloy wire 4, square inner core 5, the inner core second termination cover plate 6, urceolus second termination 8, inner core second termination 9, two chip semiconductor refrigerating sheets 10, two outer layers shape-memory alloy wire 11, cylinder 12 and square urceolus 13; Urceolus first termination 1 and urceolus second termination 8 respectively is equipped with at the two ends of square urceolus 13; Inner core first termination 3, the inner core second termination cover plate 6, inner core second termination 9 and square inner core 7 are located in the square urceolus 13; Inner core first termination 3 and inner core second termination 11 respectively is equipped with at the two ends of square inner core 7; Each is connected the two ends of first damping spring 2 with inner core first termination 3 with urceolus first termination 1; One side of the inner core second termination cover plate 6 and inner core second termination 9 removably connect; The opposite side of the inner core second termination cover plate 6 and an end of cylinder 12 are affixed; The other end of cylinder 12 passes the outside that urceolus second termination 8 is arranged on urceolus second termination 8, and two chip semiconductor refrigerating sheets 10 are contained in the square inner core 5 side by side, and mesosphere shape-memory alloy wire 4 is made up of at least two first shape-memory alloy wire 4-1; Each semiconductor refrigerating sheet 4 is provided with a face and b face; Mesosphere shape-memory alloy wire 4 is located between the b face of two chip semiconductor refrigerating sheets 10, and the end of every first shape-memory alloy wire 4-1 is secured on inner core second termination 9, and the other end of every first shape-memory alloy wire 4-1 is secured on urceolus first termination 1 after passing inner core first termination 3; Two outer shape-memory alloy wires 12 respectively are located at the outside of each semiconductor refrigerating sheet 14; Every layer of outer shape-memory alloy wire 11 is made up of at least two second shape-memory alloy wire 11-1, and the end of every second shape-memory alloy wire 11-1 is fixed on inner core first termination 3, and the other end is secured on urceolus second termination 8 after passing inner core second termination 9 and the inner core second termination cover plate 6 successively.

Embodiment two: combine Fig. 3 that this mode of execution is described, the actuator of this mode of execution also comprises one group of screw 7, and the inner core second termination cover plate 6 removably connects this structure convenient disassembly with inner core second termination 9 through one group of screw 7.Other compositions and annexation are identical with embodiment one.

Working principle: at first be that memory alloy wire is carried out pretreatment, be in contracted state,, make the memory alloy wire elongation through applying pulling force when being cooled to Martensite temperature following time like Fig. 4 memory alloy wire under austenitic temperature.The memory alloy wire of the present invention when not working is in the intermediateness under the ambient temperature among Fig. 4, and square inner core 5 is positioned at the intermediate portion of square urceolus 13.Be used as basis weight controller and go out control signal two chip semiconductor refrigerating sheets 10 are switched on, can realize the conversion of semiconductor refrigerating sheet heating surface and chill surface through the commutating circuit of designing semiconductor refrigerating sheet.

When giving two chip semiconductor refrigerating sheets 10 energisings; The b face that makes semiconductor refrigerating sheet 10 is a heating surface, and a face is a heat-absorbent surface, and then mesosphere shape-memory alloy wire 4 receives thermal shrinkage; And the 11 cooling elongations of two outer layers shape-memory alloy wire; Mesosphere shape-memory alloy wire 4 drives square inner core 5 and inwardly moves, and this motion has been complied with in the elongation of two outer layers shape-memory alloy wire 11, and therefore whole actuator is shunk; Give two chip semiconductor refrigerating sheets 10 energisings when changing current direction; The a face that makes two chip semiconductor refrigerating sheets is a heating surface, and the b face is a heat-absorbent surface, then mesosphere shape-memory alloy wire 4 cooling elongations; And two outer layers shape-memory alloy wire 11 heat shrink; The second shape-memory alloy wire 11-1 drives square inner core and outwards moves, and this motion has been complied with in the elongation of the first shape-memory alloy wire 4-1, and therefore whole actuator is outwards moved.Change the back and forth start continuously that the electrical current direction can realize actuator repeatedly.

Claims

1. square sleeve cartridge type marmem actuator that increase is used as power; It is characterized in that said actuator comprises urceolus first termination (1), first damping spring (2), inner core first termination (3), mesosphere shape-memory alloy wire (4), square inner core (5), the inner core second termination cover plate (6), urceolus second termination (8), inner core second termination (9), two chip semiconductor refrigerating sheets (10), two outer layers shape-memory alloy wire (11), cylinder (12) and square urceolus (13); Urceolus first termination (1) and urceolus second termination (8) respectively are equipped with in the two ends of square urceolus (13); Inner core first termination (3), the inner core second termination cover plate (6), inner core second termination (9) and square inner core (5) are located in the square urceolus (13); Inner core first termination (3) and inner core second termination (9) respectively are equipped with in the two ends of square inner core (5); Each is connected the two ends of first damping spring (2) with inner core first termination (3) with urceolus first termination (1); One side and inner core second termination (9) of the inner core second termination cover plate (6) removably connect; The opposite side of the inner core second termination cover plate (6) and an end of cylinder (12) are affixed; The other end of cylinder (12) passes the outside that urceolus second termination (8) is arranged on urceolus second termination (8); Two chip semiconductor refrigerating sheets (10) are contained in the square inner core (5) side by side; Mesosphere shape-memory alloy wire (4) is made up of at least two first shape-memory alloy wires (4-1); Each semiconductor refrigerating sheet (10) is provided with a face and b face; Mesosphere shape-memory alloy wire (4) is located between the b face of two chip semiconductor refrigerating sheets (10), and an end of every first shape-memory alloy wire (4-1) is secured on inner core second termination (9), and the other end of every first shape-memory alloy wire (4-1) is secured on urceolus first termination (1) after passing inner core first termination (3); Two outer shape-memory alloy wires (12) respectively are located at the outside of each semiconductor refrigerating sheet (10); Every layer of outer shape-memory alloy wire (11) is made up of at least two second shape-memory alloy wires (11-1), and an end of every second shape-memory alloy wire (11-1) is fixed on inner core first termination (3), and the other end is secured on urceolus second termination (8) after passing inner core second termination (9) and the inner core second termination cover plate (6) successively.

2. the square sleeve cartridge type marmem actuator that said increase is used as power according to claim 1; It is characterized in that said actuator also comprises one group of screw (7), the inner core second termination cover plate (6) removably connects through one group of screw (7) with inner core second termination (9).