CN101998764B - Matrix MOV circuit board structure and manufacturing method thereof - Google Patents
Matrix MOV circuit board structure and manufacturing method thereof Download PDFInfo
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- CN101998764B CN101998764B CN2009100567660A CN200910056766A CN101998764B CN 101998764 B CN101998764 B CN 101998764B CN 2009100567660 A CN2009100567660 A CN 2009100567660A CN 200910056766 A CN200910056766 A CN 200910056766A CN 101998764 B CN101998764 B CN 101998764B
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- resistance
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Abstract
The invention discloses a matrix metal oxide varistor circuit board structure and a manufacturing method thereof. The structure comprises a printed circuit board (PCB), a copper conductive busbar, and a plastic module comprising the metal oxide varistor, a thermal fuse body and a sampling resistor, wherein the copper conductive busbar is attached to a copper foil of the PCB; the copper conductive busbar is integrated with an electrode used for connecting a dual-port wiring terminal into a whole and is provided with an element pin welding hole which is synchronous with the PCB; and the plastic module comprising the metal oxide varistor, the thermal fuse body and the sampling resisto is directly welded on the conductive busbar. In the circuit board structure, the integrally punched copper conductive busbar is adopted and attached to the copper foil of the PCB, the sectional area of a lead of the circuit board is increased, and the contact resistance is reduced. Therefore, the capacity of the circuit board of bearing heavy current is improved, and the equalized current between the matrix distribution metal oxide varistor, and the plastic module comprising the thermal fuse body and the sampling resistor is realized.
Description
Technical field
The PCB Copper Foil that the present invention relates in the lightning protection field expands stream technology and matrix form metal oxide piezo-resistance flow equalize technology, relates in particular to a kind of board structure of circuit and manufacturing approach thereof of matrix form metal oxide piezo-resistance.
Background technology
The design of PCB printed circuit board (PCB) in lightning-protected product at home and abroad is widely used; But the copper thickness that is limited to pcb board; Make lightning-protected product through bigger impulse current, when above, the Copper Foil of pcb board can be melted by instantaneous large-current such as 100kA; Cause the Copper Foil vaporization, make SPD lose efficacy.
Industry also has the employing remedial measure, welds (soldering) copper conductor in the hope of enlarging the electric current ability to bear at copper foil surface.But; In fact this method can not the perfect impact that solves big electric current, because the copper conductor that increases is welded on the Copper Foil with scolding tin, scolding tin itself has served as the carrier that transmits big electric current; Such carrier; Under the impact of big electric current, still can be vaporized by impulse current, form open-circuit condition and cause product bug.
In addition, the suppression element in the surge protector (SPD) (piezo-resistance metal oxide piezo-resistance) normally adopts in the time of the ground earial drainage, and also the mode with the own loss heating absorbs the lightning current impact.For the impact of big electric current, single suppression element is breakdown probably.If but with the impulse current mean allocation to the element arrays that is connected in parallel; The impulse current of sharing each suppression element so will reduce significantly, and we control the optimum working zone that each metal-oxide varistor spare is operated in the V-A characteristic in design.Yet; When matrix form metal oxide piezo-resistance is applied to lightning-protected product central; How to solve the creepage clearance issues of matrix distribution metal oxide piezo-resistance; How to make shunting between the metal-oxide varistor spare reach balanced better, in time lightning current being impacted the problems such as heat diffusion that the metal oxide piezo-resistance produced has also become the technical problem that needs to be resolved hurrily in the industry.
Given this, the present invention provides a kind of board structure of circuit and manufacturing approach thereof of matrix form metal oxide piezo-resistance for solving the problems of the technologies described above.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of board structure of circuit and manufacturing approach thereof of matrix form metal oxide piezo-resistance; The ability that makes circuit board bear heavy current impact is improved, the current-sharing between the realization matrix distribution metal-oxide varistor spare.Wherein the metal oxide piezo-resistance refers to piezo-resistance.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of matrix form metal oxide piezo-resistance board structure of circuit, this structure comprise PCB printed circuit board (PCB), copper conductive bus-bar and by the module of metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination;
Said copper conductive bus-bar is attached on the Copper Foil of PCB printed circuit board (PCB);
The module of said metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination directly is welded on the copper conductive bus-bar.
Further, said copper conductive bus-bar is an integral type with the electrode that is used to be connected the dual-port binding post, and is provided with the element legs welding hole.
Further, said PCB printed circuit board (PCB) is provided with the element legs welding hole, and the position of the element legs welding hole on the element legs welding hole on the said copper conductive bus-bar and the said PCB printed circuit board (PCB) is corresponding.
Further; After said copper conductive bus-bar and said PCB printed circuit board (PCB) were pasted through conducting resinl, the module of said metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination was welded with this copper conductive bus-bar by the pin of metal oxide piezo-resistance and the pin of thermal fuse-link.
Preferably, the module of said metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination is the plastic module of metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination.
Further, said copper conductive bus-bar adopts whole punching process manufacturing.
Further, the thickness of said copper conductive bus-bar is 0.2mm-1.5mm, is preferably 1mm.
The manufacturing approach of above-mentioned matrix form metal oxide piezo-resistance board structure of circuit comprises the steps:
Step 4 gets into PCB plug-in unit streamline and welding streamline, and metal oxide piezo-resistance and the plastic module that thermal fuse-link and sampling resistor make up directly are welded on the copper conductive bus-bar.
Matrix form metal oxide piezo-resistance board structure of circuit of the present invention is applied to be compared to prior art in the lightning-protected product that matrix form metal oxide piezo-resistance deploys to ensure effective monitoring and control of illegal activities, and its beneficial effect is:
The present invention has adopted copper current-sharing, bus-bar, and this bus-bar is attached on the PCB Copper Foil, has increased the circuit board sectional area of wire, has reduced contact resistance, thereby has thoroughly solved the problem that the PCB Copper Foil is difficult to bear heavy current impact.In addition; Copper bus-bar has adopted the integral structure of whole stamping-out; Make the physical attribute of confluence copper bar approaching as much as possible, can realize the current-sharing between the metal-oxide varistor spare better, simultaneously effectively diffuse metal oxide voltage-sensitive resistance through heat that lightning impulse produced.
Present technique reaches the top standard in the same industry at home and abroad, has improved the ability that circuit board bears heavy current impact widely, has broken through the bottleneck of the shock-resistant electric current of PCB Copper Foil.
Description of drawings
Fig. 1 is the sketch map of conductive bus-bar described in the embodiment.
Description of symbols among the figure:
1 is used to connect copper row's bar of the electrode 2 whole stamping-outs of dual-port binding post
3 element legs welding holes
Embodiment
Below in conjunction with accompanying drawing further explain specific embodiment of the present invention:
A kind of board structure of circuit of matrix form metal oxide piezo-resistance, this structure comprise the plastic module of PCB printed circuit board (PCB), copper conductive bus-bar and metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination; Said copper conductive bus-bar is attached on the Copper Foil of PCB printed circuit board (PCB); The plastic module of said metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination directly is welded on the conductive bus-bar.
Please referring to Fig. 1, said copper conductive bus-bar comprises: copper bar bar 2 and the electrode 1 that is used to be connected the dual-port binding post, and be provided with element legs welding hole 3.Said PCB printed circuit board (PCB) is provided with the element legs welding hole; The position of the element legs welding hole on the element legs welding hole 3 on the said copper conductive bus-bar and the said PCB printed circuit board (PCB) is corresponding, makes said copper conductive bus-bar and PCB printed circuit board (PCB) synchronous.
Further; After said copper conductive bus-bar and said PCB printed circuit board (PCB) were pasted through conducting resinl, the plastic module of said metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination was by the pin and the welding of copper conductive bus-bar of the pin and the thermal fuse-link of metal oxide piezo-resistance.
Further, said copper conductive bus-bar adopts the whole punching process manufacturing of copper plate.
Further, the thickness of said copper conductive bus-bar is 0.2-1.5mm, and present embodiment is preferably 1mm.
Wherein, it is as a whole to be used to connect the electrode and the copper conductive bus-bar of dual-port binding post.Said copper conductive bus-bar directly is connected with the dual-port binding post, has formed function that increases the circuit board sectional area of wire and the function that reduces contact resistance.
The manufacturing approach of above-mentioned matrix form metal oxide piezo-resistance board structure of circuit comprises the steps:
For example, the sectional area of required copper conductive bus-bar is 7mm
2, the copper plate thickness of employing is 1mm, and then row's bar width of confluence copper bar is 7mm, and concrete shape and structure are as shown in Figure 1, and the position of element legs welding hole is corresponding on the element legs welding hole on it and the PCB printed circuit board (PCB).
Step 4; Get into PCB plug-in unit streamline and welding streamline, metal oxide piezo-resistance and the plastic module that thermal fuse-link and sampling resistor make up are welded by the pin of metal oxide piezo-resistance and the pin and the copper conductive bus-bar of thermal fuse-link.During use, the dual-port binding post directly is connected with bolt with said confluence copper bar.
Adopt the board structure of circuit of matrix form metal oxide piezo-resistance of the present invention; After introducing copper bus-bar technology; The matrix form lightning-protected product of assembling is through national laboratory tests; Maximum impact electric current 8/20 μ s waveform reaches >=re-set target of 150kA, and 10/350 μ s waveform reaches >=the breakthrough index of 30kA.Reach the technological precedence level at home and abroad in the same industry, broken through the bottleneck of the shock-resistant electric current of PCB Copper Foil.
Description of the invention and application are illustrative, are not to want with scope restriction of the present invention in the above-described embodiments.Here the distortion of the embodiment that is disclosed and change are possible, and the replacement of embodiment is known with the various parts of equivalence for those those of ordinary skill in the art.Those skilled in the art are noted that under the situation that does not break away from spirit of the present invention or substantive characteristics the present invention can realize with other forms.Under the situation that does not break away from the scope of the invention and spirit, can carry out other distortion and change here to the embodiment that is disclosed.
Claims (9)
1. matrix form metal oxide piezo-resistance board structure of circuit is characterized in that this structure comprises: PCB printed circuit board (PCB), copper conductive bus-bar and by the module of metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination;
Said copper conductive bus-bar is attached on the Copper Foil of PCB printed circuit board (PCB);
The module of said metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination directly is welded on this copper conductive bus-bar.
2. a kind of matrix form metal oxide piezo-resistance board structure of circuit according to claim 1 is characterized in that: said copper conductive bus-bar is an integral type with the electrode that is used to be connected the dual-port binding post (1), and is provided with element legs welding hole (3).
3. a kind of matrix form metal oxide piezo-resistance board structure of circuit according to claim 1 and 2, it is characterized in that: said PCB printed circuit board (PCB) is provided with the element legs welding hole; The position of the element legs welding hole on the element legs welding hole (3) on the said copper conductive bus-bar and the said PCB printed circuit board (PCB) is corresponding.
4. a kind of matrix form metal oxide piezo-resistance board structure of circuit according to claim 1; It is characterized in that: after said copper conductive bus-bar and said PCB printed circuit board (PCB) were pasted through conducting resinl, the module of said metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination was welded with this copper conductive bus-bar by the pin of metal oxide piezo-resistance and the pin of thermal fuse-link.
5. a kind of matrix form metal oxide piezo-resistance board structure of circuit according to claim 1 is characterized in that: the module of said metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination is the plastic module of metal oxide piezo-resistance and thermal fuse-link and sampling resistor combination.
6. a kind of matrix form metal oxide piezo-resistance board structure of circuit according to claim 1, it is characterized in that: said copper conductive bus-bar adopts whole punching process manufacturing.
7. a kind of matrix form metal oxide piezo-resistance board structure of circuit according to claim 1, it is characterized in that: the thickness of said copper conductive bus-bar is 0.2mm-1.5mm.
8. a kind of matrix form metal oxide piezo-resistance board structure of circuit according to claim 7, it is characterized in that: the thickness of said copper conductive bus-bar is 1mm.
9. the manufacturing approach of a matrix form metal oxide piezo-resistance board structure of circuit is characterized in that, comprises the steps:
Step 1; Thickness and the structure of PCB printed circuit board (PCB) and the position of element legs welding hole according to the sectional area of required copper conductive bus-bar, used copper coin; Design the shape and the structure of this copper conductive bus-bar, make the position of the element legs welding hole on element legs welding hole and the said PCB printed circuit board (PCB) on the copper conductive bus-bar corresponding;
Step 2 adopts copper plate according to the whole stamping-out of the design of step 1, obtains required copper conductive bus-bar;
Step 3 adopts conducting resinl that the copper conductive bus-bar of gained is attached on the Copper Foil of PCB printed circuit board (PCB);
Step 4 gets into PCB plug-in unit streamline and welding streamline, and metal oxide piezo-resistance and the plastic module that thermal fuse-link and sampling resistor make up directly are welded on the copper conductive bus-bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100567660A CN101998764B (en) | 2009-08-20 | 2009-08-20 | Matrix MOV circuit board structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100567660A CN101998764B (en) | 2009-08-20 | 2009-08-20 | Matrix MOV circuit board structure and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN101998764A CN101998764A (en) | 2011-03-30 |
| CN101998764B true CN101998764B (en) | 2012-08-08 |
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| CN2009100567660A Expired - Fee Related CN101998764B (en) | 2009-08-20 | 2009-08-20 | Matrix MOV circuit board structure and manufacturing method thereof |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548246A (en) * | 2012-01-20 | 2012-07-04 | 深圳麦格米特电气股份有限公司 | Bus bar, printed circuit board (PCB) and surface mounting method of bus bar |
| JP5944188B2 (en) * | 2012-03-12 | 2016-07-05 | 矢崎総業株式会社 | Manufacturing method of electronic component substrate |
| JP5647194B2 (en) * | 2012-08-09 | 2014-12-24 | 日本メクトロン株式会社 | Flexible printed circuit board and manufacturing method thereof |
| CN104853517A (en) * | 2014-02-19 | 2015-08-19 | 江苏天楹之光光电科技有限公司 | Circuit board structure |
| CN105228369B (en) * | 2015-11-04 | 2018-05-29 | 上海欣丰电子有限公司 | The deposited copper welding procedure of lightning-protected product |
| CN112616252B (en) * | 2020-12-09 | 2022-07-19 | 深圳市国鑫恒运信息安全有限公司 | Method and device applied to power supply of high-power-consumption PCBA of general server |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6636403B2 (en) * | 2000-04-26 | 2003-10-21 | Littlefuse Ireland Development Company Limited | Thermally protected metal oxide varistor |
| CN101479898A (en) * | 2006-07-06 | 2009-07-08 | 奥宝贝特曼股份有限两合公司 | Device for protecting electrical equipment against overvoltages |
-
2009
- 2009-08-20 CN CN2009100567660A patent/CN101998764B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6636403B2 (en) * | 2000-04-26 | 2003-10-21 | Littlefuse Ireland Development Company Limited | Thermally protected metal oxide varistor |
| CN101479898A (en) * | 2006-07-06 | 2009-07-08 | 奥宝贝特曼股份有限两合公司 | Device for protecting electrical equipment against overvoltages |
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| CN101998764A (en) | 2011-03-30 |
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Granted publication date: 20120808 Termination date: 20190820 |