CN101995603A - Photoelectric hybrid loaded substrate and electronic machine - Google Patents
Photoelectric hybrid loaded substrate and electronic machine Download PDFInfo
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- CN101995603A CN101995603A CN2009101638451A CN200910163845A CN101995603A CN 101995603 A CN101995603 A CN 101995603A CN 2009101638451 A CN2009101638451 A CN 2009101638451A CN 200910163845 A CN200910163845 A CN 200910163845A CN 101995603 A CN101995603 A CN 101995603A
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Abstract
The invention provides a flexible photoelectric hybrid loaded substrate and an electronic machine using the same. The photoelectric hybrid loaded substrate is formed by jointing a flexible electric wiring substrate and an optical waveguide film with a core and a cladding. The photoelectric hybrid loaded substrate is characterized in that: at least one part of the optical waveguide film of the bent part is provided with a reinforcing material. The invention can provide the photoelectric hybrid loaded substrate which does not crack or break even bending or folding and is formed by jointing the optical waveguide film and the flexible electric wiring substrate and the electronic machine using the same.
Description
Technical field
The present invention relates to a kind of optical/electrical mixed mounting substrate with flexual light wiring and electrical wiring and e-machine that uses this substrate of having made up.
Background technology
In recent years, during the high-speed and high-density signal between electronic component or between circuit board transmitted, in by electrical wiring transmission in the past, the phase mutual interference or the decay of signal became obstacle, begin to see the limit of high-speed and high-densityization.In order to break this limit, discussion connects between electronic component or the technology between circuit board, i.e. optical interconnection with light.From the degree of freedom height of handling ease degree, low cost, wiring and angle that can densification, polymer optical wave guide receives publicity as the transmission approach of light.
Inquire into especially in mobile phone or notebook computer etc. and to use optical waveguide, because corresponding with save space, slimming, the optical/electrical mixed mounting substrate that has made up light wiring and electrical wiring receive publicity (with reference to patent documentation 1, Fig. 2).
Here, in e-machines such as mobile phone as one of optical/electrical mixed mounting substrate purposes, use flexible optical/electrical mixed mounting substrate during the signal of anticipation between can two structural portion of switch transmits, may be thought of as this flexible optical/electrical mixed mounting substrate and cross over the connecting portion (hinge) of two structural portion.Usually crooked this optical/electrical mixed mounting substrate makes flexible electrical circuit board side contact with hinge, still, because bending partly produces slight crack or fracture in optical waveguide sometimes.Particularly from the requirement of e-machine miniaturization in recent years, require with R to hinge and be small-bend radius bending about 1.5～2mm, therefore, the slight crack of hinge or the significantly such problem that becomes of fracture arranged.
For above-mentioned problem, proposed to have the flexible photoelectricity circuit board of following feature: partly engage optical waveguide film and flexible electrical wiring plate, do not engage in the real estate knee at least (with reference to patent documentation 2, claim).
Patent documentation 1: No. 3193500 communique of Jap.P.
Patent documentation 2: TOHKEMY 2006-284925 communique
Summary of the invention
But, the following problem of discoveries such as the inventor: if optical waveguide film and flexible electrical wiring plate are the part separated structures, when in fact producing crooked situation by hinge, particularly e-machine has slide construction, it is being under the state of center curvature with the bend that optical/electrical mixed mounting substrate has, during the bend structure mobile along with slip, optical waveguide with the bonding plane transverse direction of flexible electrical wiring plate on be easy to generate skew, because such lateral excursion, when optical waveguide is slided, will move while being out of shape, therefore be easy to generate such problem of breaking.When particularly optical/electrical mixed mounting substrate was the situation of length, this tendency significantly.In addition,, also the side guide frame can be set in order to prevent such a skew to the optical waveguide transverse direction, but very miscellaneous, totally unfavorable for the e-machine that requires miniaturization.
That is, for the optical/electrical mixed mounting substrate with picture patent documentation 2 disclosed isolating constructions, its result is, produces stress in the optical waveguide part, can not solve slight crack or the such problem that ruptures of producing.
Here, the present invention is the invention of finishing in order to solve such problem, though its purpose be to provide a kind of crooked or bending do not produce yet slight crack or fracture, engage optical/electrical mixed mounting substrate that optical waveguide film and flexible electrical circuit board form and the e-machine that uses this optical/electrical mixed mounting substrate to form.
The inventor etc. are conceived to following aspect: in the optical/electrical mixed mounting substrate, produce the part of stress when hinge is crooked, the electrical wirings such as copper cash that constitute electrical wiring substrate are subjected to very big influence, concentrate on the core segment of optical waveguide.That is, be speculated as: because the elastic modulus of employed metal material is compared highly in the electrical wiring with other material, the Center of Pressure is displaced to the electrical wiring part, and therefore, stress concentrates on the core segment of optical waveguide, and optical waveguide is broken easily.Further investigate repeatedly, found that, the core by optical waveguide in the bend and the electrical wiring of flexible electrical circuit board are set to not overlapping on the projecting plane, can solve above-mentioned problem.The invention of the present invention for finishing based on described opinion.
Promptly, a kind of optical/electrical mixed mounting substrate is provided and has the e-machine that this optical/electrical mixed mounting substrate forms, this optical/electrical mixed mounting substrate is to engage to have the optical waveguide film of core and covering and the optical/electrical mixed mounting substrate that the flexible electrical circuit board forms, it is characterized in that the electrical wiring of the core of optical waveguide and flexible electrical circuit board is set to not overlapping on the projecting plane in the bend.
Optical/electrical mixed mounting substrate of the present invention and the e-machine that uses this optical/electrical mixed mounting substrate to form even through long-time alternating bending, also do not produce slight crack or fracture on optical/electrical mixed mounting substrate, have very good crooked permanance, keep the good communication function.
Description of drawings
Fig. 1 is the mode chart of expression optical/electrical mixed mounting substrate.
Fig. 2 is for representing the mode chart of the state that optical/electrical mixed mounting substrate is bent.
The mode chart of an example of the optical/electrical mixed mounting substrate when Fig. 3 has slide construction for the expression e-machine.
Fig. 4 is the enlarged drawing of hinge fraction among Fig. 2.
Fig. 5 is the oblique view of an example of expression optical/electrical mixed mounting substrate of the present invention.
Fig. 6 is a perspective view of seeing the optical/electrical mixed mounting substrate of the present invention shown in Fig. 5 from a direction.
Fig. 7 is the perspective view of other example of expression optical/electrical mixed mounting substrate of the present invention.
Fig. 8 is the perspective view of other example of expression optical/electrical mixed mounting substrate of the present invention.
Symbol description
1 optical/electrical mixed mounting substrate
2 optical waveguide films
3 flexible electrical circuit boards
4 hinges
6 bends
7 bending axis
21 cores
31 electrical wirings
Embodiment
Optical/electrical mixed mounting substrate of the present invention is characterised in that, engages optical waveguide film and flexible electrical circuit board with core and covering and forms, and the electrical wiring of the core of optical waveguide and flexible electrical circuit board is set to not overlapping on the projecting plane in the bend.Among the present invention, as long as in bend, core and electrical wiring are not overlapping just passable on the projecting plane, bend part in addition, for example the end can be overlapping can be not overlapping yet.But, angle from the e-machine miniaturization of using optical/electrical mixed mounting substrate of the present invention, because the end electrical pickoff is than have a lot of social connections several times thereby need obtain in conjunction with nargin of wiring, in addition because optical communication is different with electrical wiring with the layer of core, so preferably at least one side end, more preferably both ends (at least a portion beyond the bend), core and electrical wiring are overlapping on the projecting plane.
Below, with reference to accompanying drawing, detailed explanation.
Optical/electrical mixed mounting substrate 1 of the present invention as shown in Figure 1, engages optical waveguide film 2 and flexible electrical circuit board 3 with core and covering and forms, if consider the cementability of optical waveguide film 2 and flexible electrical circuit board 3, preferably carries out whole bonding.Here, the bonding or driving fit of bonding expression, not cementability, the adaptation of extent of exfoliation when having crooked optical/electrical mixed mounting substrate.
Optical/electrical mixed mounting substrate of the present invention as illustrated in fig. 2, is applicable to that having with hinge 4 is the e-machine of a center optical/electrical mixed mounting substrate part movable structure on sense of rotation, or as illustrated in fig. 3, is applicable to the e-machine with slide construction.
Here, bend of the present invention is meant the part of carrying out bending in general sense or the part that is bent, that is, and and from bending away initial point to crooked terminating point.For example, when using hinge to make optical/electrical mixed mounting substrate crooked, bend of the present invention is meant under the state of crooked optical/electrical mixed mounting substrate, the part that contacts with hinge and its outer edge.The further concrete part 6 of finger shown in the hinge portion enlarged drawing of Fig. 4, this part 6 are to bend away initial point X with the beginning bending of joining with hinge
1, finish crooked crooked terminating point X
2, and with respect to X
1And X
2Optical waveguide film side Y
1And Y
2The part of being surrounded, add further from this part expand laterally with part that a, b, c and d were enclosed.Here, by the a-X of expansion
1Between distance so long as in the scope that can produce effect of the present invention, just there is no particular limitation, is X
1-X
2Between distance about 1～10%.
In addition, in e-machine as shown in Figure 3 with slide construction, even do not use the situation of hinge, with above-mentioned situation with hinge similarly, when making optical/electrical mixed mounting substrate crooked with respect to the flexural center, bend is meant under the state that optical/electrical mixed mounting substrate is bent, the imagination one be equivalent to hinge 4 the axle 7 (below, be called " bending axis ") time, with part and the outer edge thereof that this bending axis joins, this definition is replaced as bending axis 7 with the hinge 4 in the above-mentioned bend explanation and obtains.With regard to this bending axis, can physical presence, by rotating this bending axis 7 or not rotating and move in the horizontal direction, constitute slide construction, also can not have bending axis 7, with lid etc. from clamping optical/electrical mixed mounting substrate 1 up and down, by moving of this lid, make the end X of optical/electrical mixed mounting substrate 1
0Move in the horizontal direction, constitute slide construction.In addition, the end side of optical/electrical mixed mounting substrate is fixed usually, but also can be with end X
0The structure that moves on the reverse direction.
The present invention is specially adapted in as shown in Figure 3 the e-machine with slide construction.That is, optical/electrical mixed mounting substrate 1 is being under the state of center curvature with the bend, and for example, the line part that is positioned at flexible electrical circuit board up and down has the structure of being arranged to mutual almost parallel.So have following structure: keeping under this case of bending optical/electrical mixed mounting substrate 1 at least one side end X
0Have when (right among Fig. 3) is mobile in the horizontal direction, be accompanied by this and move and bend moves.That is, along with end X
0Motion, bend away initial point and move.Even such situation, by at bend, the electrical wiring of the core of optical waveguide and flexible electrical circuit board is set to not overlapping on the projecting plane, realizes effect of the present invention.
Optical/electrical mixed mounting substrate 1 of the present invention is characterized in that as mentioned above at bend, the electrical wiring of the core of optical waveguide and flexible electrical circuit board is set to not overlapping on the projecting plane.
Fig. 5 and Fig. 6 are the figure of an example of expression optical/electrical mixed mounting substrate mode of the present invention.Fig. 5 is an oblique view, and Fig. 6 is the perspective view that a direction is seen from Fig. 5.In Fig. 5 and the mode shown in Figure 6, two arranged outside electrical wirings 31 at optical/electrical mixed mounting substrate 1 are provided with core 21 at central portion, so that mutual nonoverlapping mode is provided with on the projecting plane.
Then, Fig. 7 is the perspective view of expression optical/electrical mixed mounting substrate alternate manner of the present invention.Electrical wiring 31 is depicted curve in two lateral direction, and core 21 is linearity between two ends.At bend, electrical wiring 31 and core 21 are not overlapping, and are overlapping mode in the end.
In addition, Fig. 8 is the perspective view that further shows optical/electrical mixed mounting substrate alternate manner of the present invention, and electrical wiring 31 is depicted curve in two lateral direction, and core 21 is depicted curve on interior side direction.At bend, electrical wiring 31 and core 21 are not overlapping, and are both partly overlapping modes in the end.
Below, optical waveguide film and the flexible electrical wiring plate that uses among the present invention described.
[optical waveguide film]
Optical waveguide film of the present invention is the film with core and covering, can utilize the film that in the past used as optical waveguide film.For example, can use by contain (A) raw polymer, (B) optical polymerism compound and (C) optical waveguide that forms of the resin combination of Photoepolymerizationinitiater initiater form and use resin film.
(A) raw polymer is the material that is used to guarantee its intensity when forming the solidfied material of film etc., just there is no particular limitation so long as can reach the material of this purpose, can enumerate phenoxy resin, epoxy resin, (methyl) acryl resin, polycarbonate resin, polyarylate resin, polyetheramides, polyetherimide, polyethersulfone etc., or their derivant etc.These raw polymers can use independent a kind, also can mix more than 2 kinds and use.
(B) the optical polymerism compound just has no particular limits so long as carry out polymeric compounds by rayed such as ultraviolet rays, and the reactive angle to light is preferably the compound that has the ethene unsaturated group in molecule.Specifically can enumerate (methyl) acrylate, vinylidene halide, vinyl ether, vinylpyridine, vinyl phenol etc., among these, from the transparency and stable on heating viewpoint, preferred (methyl) acrylate.As (methyl) acrylate, any all can use of 1 functionality (methyl) acrylate, 2 functionalities (methyl) acrylate, 3 functional group's property (methyl) acrylate.
In addition, said here (methyl) acrylate is meant acrylate and methacrylate.
Photoepolymerizationinitiater initiater as (C) composition; have no particular limits; for example can enumerate; benzophenone; N; N '-tetramethyl-4; 4 '-diaminobenzophenone (Michler's keton); N; N '-tetraethyl-4; 4 '-diaminobenzophenone; 4-methoxyl-4 '-dimethylamino benzophenone; 2-benzyl-2-dimethylamino-1-(4-morpholino phenyl)-butane-1-ketone; 2; 2-dimethoxy-1; 2-diphenylethane-1-ketone; the 1-hydroxycyclohexylphenylketone; 2-hydroxy-2-methyl-1-phenyl-propane-1-ketone; 1-[4-(2-hydroxyl-oxethyl) phenyl]-2-hydroxy-2-methyl-1-propane-1-ketone; 1; 2-dimethyl-1-[4-(methyl sulfo-) phenyl]-2-morpholino propane-aromatic ketones such as 1-ketone; the 2-EAQ; phenanthrenequione; 2-tert-butyl group anthraquinone; the prestox anthraquinone; 1; 2-benzo anthraquinone; 2; 3-benzo anthraquinone; 2-phenyl anthraquinone; 2; 3-diphenyl anthraquinone; the 1-chloroanthraquinone; 2-methylanthraquinone; 1; the 4-naphthoquinones; 9; the 10-phenanthrenequione; the 2-methyl isophthalic acid; the 4-naphthoquinones; 2; quinones such as 3-dimethyl anthraquinone; benzoin methylether; benzoin ethyl ether; benzoin ether compounds such as benzoin phenyl ether; benzoin; the methylbenzene acyloin; benzoin compounds such as ethylbenzene acyloin; benzil derivants such as benzil dimethyl ketal; 2-(Chloro-O-Phenyl)-4; 5-diphenyl-imidazole dimer; 2-(Chloro-O-Phenyl)-4; 5-two (methoxyphenyl) imidazoles dimer; 2-(adjacent fluorophenyl)-4; 5-diphenyl-imidazole dimer; 2-(o-methoxyphenyl)-4; 5-diphenyl-imidazole dimer; 2-(p-methoxyphenyl)-4; 5-diphenyl-imidazole dimer etc. 2; 4; 5-triarylimidazoles dimer; two (2; 4; the 6-trimethylbenzoyl) phenylphosphine oxide; two (2; 6-dimethoxy benzoyl)-2; 4; 4-tri-methyl-amyl phosphine oxide; 2; 4; phosphine oxide classes such as the two phenylphosphine oxide of 6-trimethylbenzoyl; the 9-phenylacridine; 1; 7-two (9; 9 '-acridinyl) acridine derivatives such as heptane, N-phenylglycine; the N-phenylglycine derivant; coumarin series compounds etc.
With respect to (A) composition and (B) total amount of composition, (A) combined amount of raw polymer is preferably 10～80 quality %.This combined amount is if more than the 10 quality %, when forming film, even the above thick film film of thickness 50 μ m also can easily be made, and on the other hand, if below the 80 quality %, then carry out photocuring reaction fully.From above viewpoint, (A) combined amount of raw polymer is preferably 20～70 quality %.
With respect to (A) composition and (B) total amount of composition, (B) combined amount of optical polymerism compound is preferably 20～90 quality %.This combined amount then can be readily incorporated and make its curing in the raw polymer, and on the other hand, if below the 90 quality %, then can easily form the film of thick film if more than the 20 quality %.From above viewpoint, (B) combined amount of optical polymerism compound is preferably 30～80 quality %.
With respect to (A) composition and (B) total amount of composition, (C) combined amount of Photoepolymerizationinitiater initiater is preferably 0.1～10 mass parts.If this combined amount more than 0.1 mass parts, photo sensitivity abundance then, and on the other hand, if below 10 mass parts, then when exposure, the absorption in the photosensitive polymer combination top layer can not increase, inner photocuring becomes abundant.Further, the transmission loss that is caused by the influence of the light absorption of polymerization initiator itself can not increase, thereby preferred.From above viewpoint, (C) combined amount of Photoepolymerizationinitiater initiater is preferably 0.2～5 mass parts.
Optical waveguide film of the present invention can be dissolved in the solvent by the resin combination that will contain (A)～(C) composition, coats on the base material, removes then and desolvates, and easily make.As the solvent that here uses, just there is no particular limitation so long as can dissolve the solvent of this resin combination, for example can use acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, dinethylformamide, N,N-dimethylacetamide, propylene glycol monomethyl ether equal solvent or their mixed solvent.Solid component concentration in the resin solution is preferably about 30～60 quality % usually.
There is no particular limitation for the thickness of optical waveguide film among the present invention, in dried thickness, is generally 10～250 μ m.If more than the 10 μ m, then have can enlarge with accept light-emitting component or optical fiber combine the such advantage of tolerance, if below the 250 μ m, then have and accept light-emitting component or the optical fiber joint efficiency improves such advantage.From above angle, the thickness of this film is the scope of 40～90 μ m more preferably.
The base material that uses in the manufacture process of optical waveguide formation of the present invention with resin film is to support optical waveguide to form the support with film, there is no particular limitation for this material, but from after peel off optical waveguide easily and form with film and have thermotolerance and the angle of solvent resistance, what can suit enumerates polyethylene terephthalate, polypropylene, tygon etc.The thickness of this base material is preferably the scope of 5～50 μ m.If more than the 5 μ m, then have to obtain easily as the such advantage of the intensity of support, if below the 50 μ m, when then having figure to form and the gap smaller of mask, can form the such advantage of trickleer figure.From above viewpoint, the thickness of this base material is the scope of 10～40 μ m more preferably, is preferably 20～30 μ m especially.
The optical waveguide that is provided with on the base material that obtains like this forms uses film, for example can store easily by being wrapped on the roller.In addition, as required, also can on optical waveguide forms with film, protective film be set.About above-mentioned base material and protective film, use film in order to peel off afterwards optical waveguide formation easily, can implement electrostatic prevention processing etc.
Below, describe for using the optical waveguide formation that as above-mentioned, obtains to form method for manufacturing optical waveguide with resin film.As this method, for example can enumerate after existing under the situation of protective film, removing protective film, while, come stacked method from the bottom clad film that base material is peeled off etc. by on substrate, heating crimping.From the angle of adaptation and tracing ability, preferably under reduced pressure carry out stacked here.The heating-up temperature of this resin film is preferably 50～130 ℃, and crimping pressure is preferably (1～10kgf/cm about 0.1～1.0MPa
2About), but have no particular limits for these conditions.
There is no particular limitation for the thickness of bottom clad film, is preferably 2～50 μ m.If more than the 2 μ m, then will transmit light easily and be enclosed in in-core portion, if below the 50 μ m, then the thickness of optical waveguide integral body can be not excessive.Among the present invention, particularly from the angle of the crooked permanance that satisfies small-bend radius, the thickness of bottom clad film is the scope of 2～20 μ m more preferably, is preferably the scope of 5～15 μ m especially.
In addition, the thickness of bottom clad film be from the border of core and following wrap to descend wrap below till value.
Then, solidify the bottom clad film by light or heating, stacked core film with refractive index higher than bottom clad film uses the same method.Stacked like this resin film becomes the portrait shape by the plus or minus mask graph irradiation active ray that is called as former figure.Light source as active ray for example can be enumerated, and carbon arc lamp, mercury vapour arc lamp, extra-high-pressure mercury vapour lamp, high-pressure mercury-vapor lamp, xenon lamp etc. are the ultraviolet known luminaire of radiation effectively.In addition, other can also use the effectively light source of radiation visible light such as photoflood lamp, sunlamp.
Height for core 31 has no particular limits, and is preferably 10～150 μ m.If the height of core is more than the 10 μ m, then after optical waveguide forms with accept the combining of light-emitting component or optical fiber, the tolerance of aligned in position can not diminish, if below the 150 μ m, then after optical waveguide forms with accept the combining of light-emitting component or optical fiber, joint efficiency can not diminish.Among the present invention, particularly from the angle of the crooked permanance that satisfies small-bend radius, the height of core is the scope of 30～120 μ m more preferably, is preferably the scope of 50～90 μ m especially.
Then, after the exposure, remove unexposed portion with wet developing, dry process development etc. and develop, make the core figure.Here, make the core figure after not overlapping with electrical wiring in bend when engaging with the flexible electrical circuit board be important.
About developing, wet developing is to use organic solvent, alkaline aqueous solution, water system developer solution etc. and the corresponding developer solution of the composition of aforementioned resin film, develops by for example spraying, shake known method such as dipping, brushing, blade coating.
As developer solution, preferred with an organic solvent, safety and stability and the good developer solution of operability such as alkaline aqueous solution.As aforementioned organic solvent is developer solution, for example can enumerate 1,1,1-trichloroethanes, N-Methyl pyrrolidone, N, dinethylformamide, N,N-dimethylacetamide, cyclohexanone, methyl isobutyl ketone, gamma-butyrolacton etc.In order to prevent to ignite, these organic solvents can add water in the scope of 1～20 quality %.
Alkali as above-mentioned alkaline aqueous solution, for example can use the alkali metal hydroxides such as oxyhydroxide of lithium, sodium or potassium, carbonic acid alkali metal salts such as the carbonate of lithium, sodium, potassium or ammonium or supercarbonate, alkali metal phosphate such as potassium phosphate, sodium phosphate, alkali metal pyrophosphates such as sodium pyrophosphate, potassium pyrophosphate etc.In addition, as the alkaline aqueous solution that in development, uses, can enumerate preference as 0.1～5 quality % sodium carbonate lean solution, 0.1～5 quality % sal tartari lean solution, 0.1～5 quality % dilute solution of sodium hydroxide, 0.1～5 quality % sodium tetraborate lean solution etc.The pH of the alkaline aqueous solution that uses in development is preferably 9～14 scope, its temperature can according to photosensitive polymer combination the layer development regulate.In addition, also can in alkaline aqueous solution, sneak into surfactant, defoamer or be used to promote a small amount of organic solvent that develops etc.
As above-mentioned water system developer solution, form by water or alkaline aqueous solution and more than one organic solvent.Here, as alkaline matter, except aforementioned substances, for example can enumerate borax, sodium metasilicate, Tetramethylammonium hydroxide, monoethanolamine, ethylenediamine, Diethylenetriamine, 2-amino-2-methylol-1, ammediol, 1,3-diamino-propanol-2, morpholine etc.About the pH of developer solution, in the scope that resist can fully develop, that preferably tries one's best is little, is preferably pH8～12, more preferably pH9～10.As above-mentioned organic solvent, for example can enumerate tri acetylacetonate alcohol, acetone, ethyl acetate, have alkoxyl alcohol that carbon number is 1～4 alkoxy, ethanol, isopropyl alcohol, butanols, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether etc.These may be used singly or in combination of two or m.The concentration of organic solvent is preferably 2～90 quality % usually, and its temperature can be regulated according to development.In addition, in the water system developer solution, also can sneak into surfactant, defoamer etc. slightly.
In addition, as required can be also with two or more developing methods.Can enumerate spray regime, brushing, blade coatings etc. such as impregnation method, alr mode, high-pressure injection mode as the mode of developing
As the processing after developing, can be as required, by carrying out heating or the 0.1～1000mJ/cm about 60～250 ℃
2About exposure, the core figure further solidified uses.
Then, the stacked upper clad layer film with refractive index lower than core film that uses the same method is made optical waveguide.The thickness of upper clad layer film is so long as in the scope that core can be imbedded, just have no particular limits, in dried thickness, be preferably 2～50 μ m, angle from the crooked permanance that satisfies small-bend radius, its thickness is the scope of 2～20 μ m more preferably, is preferably the scope of 5～15 μ m especially.The thickness of upper clad layer film can be identical with the thickness of the bottom clad film of initial formation, also can be inequality.In addition, the thickness of the upper clad layer film shown in here is border from core and the upper clad layer value till above upper clad layer.
The flexible electrical circuit board
As the flexible electrical circuit board, can use FPC (Flexible Printed Circuit) substrate aptly.As the baseplate material of FPC substrate, can use polyimide, polyamide, polyetherimide, polyethylene terephthalate, liquid crystal polymer etc., usually,, use polyimide from thermotolerance or the easy angle of buying.As commercially available product, can enumerate the FPC substrate that has used Du Pont's film (KAPTON) (Dong Li Dupont Kabushiki Kaisha system).
Here, have no particular limits for the substrate thickness that constitutes the flexible electrical circuit board, from the desired thickness of optical/electrical mixed mounting substrate self, the thickness of this substrate can determine aptly, specifically, is preferably the scope of 5～50 μ m.
In addition, it is important making electrical wiring in the flexible electrical circuit board not overlapping with core in bend when engaging with optical waveguide.
Optical/electrical mixed mounting substrate
Engage above-mentioned optical waveguide film and flexible electrical circuit board, make optical/electrical mixed mounting substrate of the present invention.
When engaging optical waveguide film and flexible electrical circuit board, as required, can use bonding agent.As the kind of bonding agent, can suitably determine according to the material of optical waveguide film and flexible electrical circuit board.
In order to make optical/electrical mixed mounting substrate have pliability, preferred bonding agent has flexibility after curing, and particularly, the elastic modulus after the preferred consolidation is below the 700MPa, more preferably below the 600MPa, is preferably below the 500MPa especially.In addition, the angle from as the intensity of bonding agent is preferably more than the 1MPa, more preferably more than the 5MPa.
Kind about bonding agent, as acrylic rubber class bonding agent or commercially available product, can enumerate the high heat-resisting bonding insulation material KS7003 (elastic modulus is 700MPa) of Hitachi Chemical Co., Ltd.'s system, flexible printed circuit board that Hitachi changes into polymkeric substance Co., Ltd. system aptly with bonding agent Hi-Bon 808 (elastic modulus is 50MPa) etc.
Joint method for optical waveguide film and flexible electrical circuit board is not particularly limited, but from adaptation, prevent the angle that bubble is involved in, preferably uses the method for roll laminating machine or plate laminating machine.The laminating temperature of roll laminating machine is preferably the scope of room temperature (25 ℃)～100 ℃.If more than the room temperature (25 ℃), then the adaptation with optical waveguide improves, if below 100 ℃, then bond layer does not flow, and can obtain the thickness that needs.From above angle, 40～100 ℃ scope more preferably.Pressure is preferably 0.2～1.0MPa (1～10kgf/cm
2), laminate speed is preferably 0.1～3m/min, but is not limited to especially in these conditions.
In addition, plate laminating machine is meant holding sheet laminate materials between pair of plates, by adding the laminating machine that locating back makes its crimping, for example, can use the vacuum pressure type laminating machine aptly.The heating-up temperature here is preferably 50～100 ℃, and crimping pressure is preferably 0.1～1.0MPa (1～10kgf/cm
2), but be not limited to these conditions especially.
Embodiment
Below, further specify embodiments of the invention, still, the present invention is not subjected to any restriction of these embodiment.
Evaluation method
1. tensile modulus of elasticity and pulling strengrth
From the film of determination object obtain wide for 10mm, longly be the sample of 70mm, use cupping machine (Co., Ltd.'s sea special machine of instrumentation (ORIENTEC) system " RTM-100 "), be benchmark with JIS-K7127, by following condition mensuration.
Condition: the distance between anchor clamps is 50mm, and temperature is 25 ℃, and draw speed is 50mm/min.
Tensile modulus of elasticity uses the initial straight line portion of tensile stress-strain curve, is calculated by following formula.In addition, in drawing stress-deformation curve, the maximum intensity till break is as pulling strengrth.
Stress difference (N) ÷ optical waveguide film on tensile modulus of elasticity (MPa)=straight line between 2 average cross-section (mm originally
2) strain differential between identical 2 of ÷
2. endurance bending test
For the optical/electrical mixed mounting substrate of making in each embodiment and the comparative example, use the endurance bending test machine of the form that makes the optical/electrical mixed mounting substrate slip as shown in Figure 3, carry out endurance bending test.Test is the optical/electrical mixed mounting substrate of making in each embodiment and the comparative example, and inboard situation carries out at optical waveguide film is arranged on respect to bending axis 7.In addition, for bending radius, also be to carry out at the condition of 1.5mm and these two kinds of conditions of condition of 1.0mm, be 80mm/ second, X in sliding speed
1～X
2Between distance for testing under the condition of 20mm.About estimating, be per 10,000 times for embodiment 1, comparative example 1 and reference example 1, be per 1000 times for comparative example 2, observing has crack-free, obtains non-cracked maximum times.
(1-1) manufacturing of optical waveguide film
[covering forms the manufacturing with resin film]
Weighing is as the phenoxy resin of (A) binder polymer (trade name: the Fei Nuotuo (YP-70 of Off エ ノ ト-ト) in the plastic bottle of wide-mouth, Toto Kasei KK's system) 48 mass parts, alicyclic diepoxy carboxylate (trade name: KRM-2100 as (B) optical polymerism compound, molecular weight: 252, Asahi Denka Kogyo K. K's system) 49.6 mass parts, triphenyl hexafluoro-antimonic acid sulfosalt (trade name: SP-170 as (C) Photoepolymerizationinitiater initiater, Asahi Denka Kogyo K. K's system) 2 mass parts, SP-100 (trade name: Asahi Denka Kogyo K. K's system) 0.4 mass parts as sensitizer, propylene glycol monomethyl ether acetate 40 mass parts as organic solvent, use machine mixer, turning axle and blade, in temperature is 25 ℃, revolution is under the condition of 400rpm, stirred 6 hours, and be modulated into covering formation resin varnish A.Then, using the aperture is the polyflon film (trade name: PF020, ADVANTEC Toyo Co., Ltd. system) of 2 μ m, in temperature is that 25 ℃, pressure are under the condition of 0.4MPa, carry out pressure filtration, further use vacuum pump and bell-jar, at the decompression degree is under the condition of 50mmHg, carries out 15 minutes vacuum deaerator.
Use coating machine (multi-functional coating machine TM-MC, Co., Ltd.'s open country metallic) that the above-mentioned covering that obtains is formed and be coated on polyamide film (trade name: mictron with resin varnish A; Dongli Ltd.'s system; thickness: on the corona treatment face 12 μ m); 80 ℃ of dryings after 10 minutes; 100 ℃ of dryings 10 minutes; then; will be as the demoulding PET film (trade name: Purex A31 of protective film; Supreme Being people Dupont Kabushiki Kaisha system; thickness: be that the mode of resin side is pasted 25 μ m), obtain covering and form and use resin film according to making stripping surface.At this moment resin layer thickness can at random be adjusted by the slit of regulating coating machine, and it is 20 μ m that the thickness after solidifying in the present embodiment is adjusted to down wrap, and upper clad layer is 70 μ m.
[sandwich layer forms the manufacturing with resin film]
Use the phenoxy resin (trade name: Fei Nuotuo YP-70 of 26 mass parts; Toto Kasei KK's system) as (A) binder polymer; 9 of 36 mass parts; 9-two [4-(2-acryloyl-oxy base oxethyl) phenyl] fluorenes (trade name: A-BPEF; Xin Zhong village chemical industry Co., Ltd. system) and the bisphenol-a epoxy acrylate (trade name: EA-1020 of 36 mass parts; Xin Zhong village chemical industry Co., Ltd. system) as (B) optical polymerism compound; two (2 of 1 mass parts; 4; the 6-trimethylbenzoyl) phenyl phosphine oxide (trade name: Irgacure 819; the different chemical company system of vapour Bart) and the 1-[4-of 1 mass parts (2-hydroxyl-oxethyl) phenyl]-2-hydroxy-2-methyl-1-propane-1-ketone (trade name: Irgacure2959; the different chemical company system of vapour Bart) as (C) Photoepolymerizationinitiater initiater; the propylene glycol monomethyl ether acetate of 40 mass parts is as organic solvent; in addition; with above-mentioned Production Example same method and condition under, be modulated into sandwich layer and form and to use resin varnish B.Then, with above-mentioned Production Example same method and condition under, pressure filtration, and then carry out vacuum deaerator.
Be coated on PET film (trade name: Ke Simoxin (コ ス モ シ ヤ イ Application), Toyo Boseki K.K's system, thick: on the non-treated side 16 μ m) with the above-mentioned sandwich layer that obtains being formed with resin varnish B with the same method of above-mentioned Production Example; then; to be that the mode of resin side is pasted according to making stripping surface as the demoulding PET film (trade name: PurexA31, Supreme Being people Dupont Kabushiki Kaisha system, thick 25 μ m) of protective film, and obtain sandwich layer and form and use resin film.It is 50 μ m that the slit of adjusting coating machine in the present embodiment makes the thickness after the curing.
[manufacturing of optical waveguide film]
Peeling off the protective film that the above-mentioned following wrap that obtains forms with resin film is demoulding PET film (Purex A31), shines 1J/cm with ultraviolet exposure machine (ORC Mfg. Co., Ltd.'s system, EXM-1172) from resin side (opposition side of base film)
2Ultraviolet ray (wavelength 365nm), then,, thereby form wrap down 80 ℃ of heat treated 10 minutes.
Then, with roll laminating machine (forming technology Co., Ltd. of Hitachi system, HLM-1500), under the condition of pressure 0.4MPa, 50 ℃ of temperature, laminate speed 0.2m/min, press on this time wrap upper strata and to state sandwich layer and form and use resin film, then, use is as the vacuum pressure type laminating machine (Co., Ltd. Mingji Koito's system, MVLP-500) of plate laminating machine, after being vacuum-drawn against below the 500Pa, under pressure 0.4MPa, 50 ℃ of temperature, the condition of 30 seconds pressing times, add thermo-compressed, form sandwich layer.
Then, using wide is that the minus photomask of 50 μ m shines 0.6J/cm with ultraviolet exposure machine
2Ultraviolet ray (wavelength 365nm), then, heat after 5 minutes, so that core forms shape as shown in Figure 7 80 ℃ of exposures.
Peel off as the PET film of supporting film, use developer solution (propylene glycol monomethyl ether acetate/N,N-dimethylacetamide=8/2, mass ratio), development core figure.Then, use cleaning fluid (isopropyl alcohol) to clean, carry out 10 minutes heat dryings at 100 ℃.
Then, with above-mentioned same lamination, lamination forms as the above-mentioned covering of upper clad layer and uses resin film.Further by irradiation adds up to 25J/cm on the two sides
2Ultraviolet ray (wavelength 365nm) after, 160 ℃ of heat treated of carrying out 1 hour, make and be formed with the flexible optical waveguides that upper clad layer and substrate film are arranged on the outside.Further for the peeling off of polyamide film, under 85 ℃/85% hot and humid condition, handled this flexible optical waveguides in 24 hours, make the flexible optical waveguides of having removed base film.
In addition, with the refractive index of Metricon society system prism coupler (Model 2010) mensuration sandwich layer and covering, its result is under wavelength 830nm, and sandwich layer is 1.584, and covering is 1.550.In addition, light source uses the surface-emitting laser (EXFO society system, FLS-300-01-VCL) of 850nm, the Q82214 that is subjected to optical sensor to use Advantest Corp. (ADVANTEST CORPORATION) to make, ( measure guide wavelength 10,5,3,2cm by intercept method, incident fiber: GI-50/125 multimode fibre (NA=0.20), outgoing fiber: SI-114/125 (NA=0.22)) measure the transmission loss of the optical waveguide make, its result is 0.05dB/cm.
Measure the tensile modulus of elasticity and the pulling strengrth of the optical waveguide film make by said method, its result is 2 for tensile modulus of elasticity, 000MPa, and pulling strengrth is 70MPa.
(1-2) manufacturing of the sticking solid of film like
Add HTR-860P-3 (Teikoku Chemical Industries Co., Ltd's system of 100 mass parts, trade name: the acrylic rubber that contains glycidyl, molecular weight 1,000,000, Tg-7 ℃), 5.4 the YDCN-703 of mass parts (Toto Kasei KK's system, trade name, o-cresol phenolic resin varnish, epoxide equivalent 210), 16.2 the YDCN-8170C of mass parts (Toto Kasei KK's system, trade name, bisphenol f type epoxy resin, epoxide equivalent 157), 15.3 plain LEO's branch of mass parts (プ ラ イ オ one Off エ Application) LF2882 (Dainippon Ink. ﹠ Chemicals Inc's system, trade name, the bisphenol-A phenolic varnish gum), 0.1 the NUCA-189 of mass parts (Nippon Unicar Co. Ltd.'s system, trade name, γ-Qiu Jibingjisanjiayangjiguiwan), 0.3 the NUCA-1160 of mass parts (Nippon Unicar Co. Ltd.'s system, trade name, γ-uride base propyl-triethoxysilicane), the A-DPH of 30 mass parts (Xin Zhong village chemical industry Co., Ltd. system, trade name, dipentaerythritol acrylate), 1.5 the Irgacure 369 of mass parts (the different chemical company system of vapour Bart, trade name, 2-benzyl-2-dimethylamino-1-(4-morpholino phenyl)-butanone-1-ketone: I-369) and cyclohexanone, after mixing, carry out vacuum outgas.It is that the surperficial demoulding of 75 μ m is handled polyethylene terephthalate (Teijin Ltd's system, Supreme Being people's base of a fruit support roller film: A-31), 80 ℃ of heat dryings are after 30 minutes, make bonding film that this bonding agent varnish is coated on thickness.With this bonding film and thickness is that the photopermeability of 80 μ m is supported base material (Sa Mo (サ one モ) Co., Ltd.'s system, low-density polyethylene terephthalate/vinyl acetate/low-density polyethylene terephthalate three-layer thin-film: FHF-100) lump together, make the sticking solid of film like of supporting base material to constitute by protective film (surperficial demoulding processing polyethylene terephthalate), sticking adhesion agent layer and photopermeability by lamination.The thickness of sticking adhesion agent layer is 10 μ m.
The sticking adhesion agent layer of the film like of making like this being glued solid was solidified 1 hour at 160 ℃, U-3310 ultraviolet-visible pectrophotometer with Hitachi Ltd.'s corporate system is measured light transmission rate, its result is, under wavelength 850nm, have the high permeability more than 98%, following suitable the seeing through of 0.1dB lost.
Measure refractive index with Metricon society system prism coupler (Model 2010), its result is is 1.505 under wavelength 830nm.
Measure the tensile modulus of elasticity of the film like bonding agent obtain with said method, its result is 350MPa for tensile modulus of elasticity.
(1-3) manufacturing of optical/electrical mixed mounting substrate
(forming technology Co., Ltd. of Hitachi system, HLM-1500), under the condition of pressure 0.4MPa, 50 ℃ of temperature, laminate speed 0.2m/min, lamination has been peeled off the sticking solid of film like of protective film on flexible optical waveguides to use the roll laminating machine.Then, (this mouthful of Co., Ltd.'s enlightening (DISCO International, Inc.) system, DAD-341) is processed into short rectangular strip (long 120mm, wide 2mm) with guided wave, from supporting base material side irradiation 250mJ/cm to use cast-cutting saw
2Ultraviolet ray (365nm), reduce sticking adhesion agent layer and support the closing force of substrate interface, peel the support base material, make the optical waveguide that has bonding agent.
Then, has the flexible electrical circuit board of electrical wiring (the long 120mm of being, wide is 2mm, base material: Du Pont's film (KAPTON) 100EN (pulling strengrth of being measured by said method is 370MPa), substrate thickness: 25 μ m, copper circuit thickness: regulation place 12 μ m), utilize ultraviolet exposure machine (Dainippon Screen Manufacturing Co Manufacturing Co., Ltd of Co., Ltd. system, MAP-1200-L) Fu Sui mask aligner mechanism determines the position of band bond layer optical waveguide, use same roll laminating machine, at pressure 0.4MPa, 80 ℃ of temperature, under the condition of laminate speed 0.2m/min after the interim crimping, in Clean Ovens, heated 1 hour in 160 ℃, bonding flexible optical waveguides and electrical wiring substrate obtain the such optical/electrical mixed mounting substrate of perspective view as shown in Figure 7.
Here, be the light penetration of Du Pont's film (KAPTON) EN with the base material of the U-3310 spectrophotometric determination flexible electrical wiring plate of Hitachi Ltd.'s corporate system, its result is for being 86% under the wavelength 850nm.This is equivalent to the loss that sees through of 0.7dB, even worthwhilely aforementioned bonding agent layer, the light loss when seeing through the electrical wiring plate also is low loss less than 1dB, and therefore, present embodiment is not for being provided with the structure of light transmission with through hole.With the results are shown in the table 1 of said method evaluation.
Comparative example 1
Among the embodiment 1, core 21 and electrical wiring 31 are linearity all, and core 21 and electrical wiring 31 in the bend are overlapping on the projecting plane, and in addition, the operation according to similarly to Example 1 obtains optical/electrical mixed mounting substrate.
Comparative example 2
In the comparative example 1, only in the flexible optical waveguides end with membranaceous bonding the agent of condition laminated thin similarly to Example 1, do not engage middle body, in addition,, make optical/electrical mixed mounting substrate according to the operation same with comparative example 1.With the results are shown in the table 1 that embodiment 1 estimates equally.
Reference example 1
The optical waveguide monomer that use is made in embodiment 1 carries out the endurance bending test same with the optical/electrical mixed mounting substrate of embodiment 1.The results are shown in the table 1.
Table 1
The 1st table
As can be known, the core by making the optical waveguide in the bend and the electrical wiring of flexible electrical circuit board are not overlapping on the projecting plane shown in the 1st table, can improve the crooked permanance of optical/electrical mixed mounting substrate tremendously.
Industrial application
Even optical/electrical mixed mounting substrate of the present invention through long-time alternating bending, does not produce slight crack or fracture in the optical waveguide film part yet, has extremely good crooked durability. Therefore, optical/electrical mixed mounting substrate of the present invention can be aptly be used for the e-machine of mobile phone etc., when the small-bend radius about even hinge fraction requires take R to 1.5～2mm is crooked, also good communication function can be kept for a long time, high reliability and the durability of e-machine itself can be reached.
Claims (5)
1. optical/electrical mixed mounting substrate, it has the optical waveguide film of core and covering and the optical/electrical mixed mounting substrate that the flexible electrical circuit board forms for engaging, it is characterized in that the electrical wiring of the core of the optical waveguide in the bend and flexible electrical circuit board is not overlapping on the projecting plane.
2. according to the optical/electrical mixed mounting substrate described in the claim 1, wherein, carry out the joint of optical waveguide film and flexible electrical circuit board at whole face.
3. according to the optical/electrical mixed mounting substrate described in claim 1 or 2, wherein, at least a portion beyond the bend, the electrical wiring of the core of optical waveguide and flexible electrical circuit board is overlapping on the projecting plane.
4. e-machine, it is the e-machine that has each described optical/electrical mixed mounting substrate in the claim 1～3 and be used for the hinge of crooked this optical/electrical mixed mounting substrate, it is characterized in that having with this hinge is the part of this optical/electrical mixed mounting substrate of center structure movably on sense of rotation.
5. e-machine, it is characterized in that, has each described optical/electrical mixed mounting substrate in the claim 1～3, this optical/electrical mixed mounting substrate has following structure: keeping with the bend is that carry out under the crooked state at the center, move in the horizontal direction the end of at least one side of optical/electrical mixed mounting substrate, follow this to move, bend moves.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101638451A CN101995603A (en) | 2009-08-12 | 2009-08-12 | Photoelectric hybrid loaded substrate and electronic machine |
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| CN2009101638451A CN101995603A (en) | 2009-08-12 | 2009-08-12 | Photoelectric hybrid loaded substrate and electronic machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103809237A (en) * | 2012-11-08 | 2014-05-21 | 日东电工株式会社 | Opto-electric hybrid board |
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2009
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103809237A (en) * | 2012-11-08 | 2014-05-21 | 日东电工株式会社 | Opto-electric hybrid board |
| CN103809237B (en) * | 2012-11-08 | 2018-04-20 | 日东电工株式会社 | Optical/electrical mixed mounting substrate |
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Application publication date: 20110330 |