CN101987896B - Polyethylene heat conducting film, as well as preparation method and heat conducting floor mat thereof - Google Patents
Polyethylene heat conducting film, as well as preparation method and heat conducting floor mat thereof Download PDFInfo
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Abstract
The invention relates to a polyethylene heat conducting film and a heating conducting floor mat, belonging to the technical field of a waterproof heat conducting film, wherein the heat conducting efficacy of the polyethylene heat conducting film is 20 to 50 DEG C/h. The preparation method of the polyethylene heat conducting film comprises the following steps: 1) heat conducting stuffing is added to polyethylene to be uniformly mixed and granulated after plasticizing; and 2) the prepared granules in the step 1) is added to polyethylene to be prepared into the heat conducting film through a film blowing machine. The heat conducting floor mat is prepared by gluing the polyethylene heat conducting film on a film layer. The polyethylene heat conducting film disclosed by the invention has the advantages of good waterproofness and heat conducting property, plays a role in resisting moisture, enhances the heat conductivity of a floor heating system, reduces the heat energy loss of the floor heating system and saves the heat energy. The polyethylene heat conducting film disclosed by the invention has good physical and mechanical properties. The heat conducting floor mat disclosed by the invention has the advantages of good heat conductivity and good waterproof property, and has the function of appropriate shock attenuation.
Description
Technical field
The present invention relates to Vilaterm heat conducting film and heat conduction ground cushion, belong to waterproof heat conducting film technical field.
Background technology
Floor heating ground cushion commonly used in the prior art comprises following several kinds: 1. foam material, cork directly mat formation or the composite polyethylene film after mat formation; 2. after punching on foam material, the cork, mat formation and perhaps mat formation behind the composite polyethylene film; 3. polyethylene film is directly mated formation.All there is self inherent defective in these three kinds of floor heating ground cushions: 1. foam material is a lagging material, has function of heat insulation, directly mats formation, and heat energy is difficult to see through said material and is delivered to the floor, and heat energy loss is big; 2. foam material, cork itself are the relatively poor materials of thermal conductivity; Behind the composite polyethylene film, though humidity resistance has been arranged, the problem of poor heat conduction does not improve again; So this series products only has damping and waterproof action; Do not have heat conductivility, be suitable for common installation, be not suitable for floor heating and install; 3. polyethylene film is directly mated formation and is only had waterproof action, does not have heat conductivility.
Summary of the invention
The objective of the invention is for solving the problems of the technologies described above, a kind of Vilaterm heat conducting film is provided, it has, and thermal conductivity is good, the characteristics of good waterproof performance.
Above-mentioned technical purpose of the present invention is achieved through following technical scheme:
The Vilaterm heat conducting film is characterized in that: its heat conduction efficiency is 20～50 ℃/h.
Another object of the present invention provides a kind of preparation method of above-mentioned Vilaterm heat conducting film, and this method may further comprise the steps:
1. in Vilaterm, be added into heat conductive filler, mixing, granulation after plastics processing again;
2. in the particle that 1. step makes, sneak into Vilaterm, handle through inflation film manufacturing machine and process heat conducting film.
Technique scheme of the present invention can make a kind of film with waterproof and heat conduction function after implementing.
Application number is the Chinese invention patent of 200910194390.X, discloses a kind of composite heat-conducting insulated film.This composite heat-conducting insulated film is composited by 30～60 parts modified epoxy glue and 40～70 parts heat conductive filler, and described heat conductive filler is an aluminium sesquioxide, the mixture of one or more in silit, silicon nitride and the SP 1.This product has good insulation performance effect and heat conductivility.But in Vilaterm, add aluminium sesquioxide, behind one or more in silit, silicon nitride and the SP 1, the thermal conductivity of the film that the conventional filming technology of process obtains is limited, and heat conduction efficiency is about 12 ℃/h.Through the Vilaterm heat conducting film that the inventive method makes, its heat conduction efficiency is 20～50 ℃/h, and the heat conduction efficiency of common polyethylene film 12 ℃/below the h.Heat conduction efficiency records through following method, carries out with reference to LY/T 1700-2007 regulation, and wherein test specimen is made to adopt and placed the metal sheet that a thickness is about 8mm between the two-layer heat conducting film, as holistic test specimen.
Preferred as technique scheme, said heat conductive filler is metal simple-substance powder or metal nitride powder.
Preferred as technique scheme, said Vilaterm is one or more in high-density low pressure polyethylene, low-density high-pressure polyethylene or the linear low density polyethylene.
The high-density low pressure polyethylene, it is the waxy solid particle that a kind of oyster white is translucent, density is at 0.9165～0.9300 g/cm
3Between, particle diameter is at 120 μ m～150 μ m, i.e. 100～120 mesh sieves; Melt temperature has superior dielectric properties, resistance to chemical attack and resistance to low temperature about in the of 108 ℃, and toughness is strong, and is shock-resistant, and is non-hygroscopic and have good steam-preventing property, and fabulous thermoplasticity is arranged, and is easy to moulding.
Low-density high-pressure polyethylene, it is the waxy solid resin that a kind of oyster white is translucent, and side chain is arranged on the molecular chain, density is at 0.910g/cm
3Below, particle diameter is at 180 μ m～380 μ m, i.e. 40～80 mesh sieves; Soft, melt temperature is about in the of 108 ℃, and thermally melting, forming process property, toughness, lower temperature resistance are good, and flexibility is good; Burning is differentiated: Huang Xialan on the combustion flame, and smokeless during burning, the smell of paraffin is arranged.
Linear low density polyethylene, it is mainly used in the manufacturing film, and hardness and abrasion resistance are high, and heat sealer and thermal viscosity are good; Density: 0.908～0.920 g/cm
3; Be with low-density high-pressure polyethylene hot-melt adhesive powder difference; There is not long-chain branch on the molecular chain; Its linear lag comes from different process of manufacture with the low-density high-pressure polyethylene hot-melt adhesive powder, is generated by ethene and high alpha-olefin (like butylene, hexene or octene) copolymerization; Have the MWD narrower, have linear structure simultaneously and make it that different rheological characteristicss arranged than low-density high-pressure polyethylene hot-melt adhesive powder; Higher anti-intensity, penetration-resistant, tear strength and the elongation stretched makes it be specially adapted to made membrane.
Preferred as technique scheme, step 1. in, also be added with lime carbonate when being added into heat conductive filler in the Vilaterm.
Preferred as technique scheme, step 1. in, also be added with macromolecule wax and dispersion agent when being added into heat conductive filler in the Vilaterm.
A further object of the present invention provides a kind of heat conduction ground cushion, and it is glued on the film layer by above-mentioned Vilaterm heat conducting film and makes.
Preferred as technique scheme, said film layer has the aperture of a plurality of perforations self upper and lower surfaces.
Preferred as technique scheme, said film layer is made through foaming by high molecular polymer.
Preferred as technique scheme, the thickness of said heat conducting film is 5～100 μ m.
Crucial part of the present invention is to adopt the technology of two-step approach, earlier Vilaterm and heat conductive filler is processed particle, then particle is sneaked in the Vilaterm, makes heat conducting film again; If directly make film, the homogeneity of the film of processing is not fine, local poor thermal conductivity, and local water-repellancy is poor, and tensile strength, the angle tear strength of film integral body are not high yet; And whole tensile strength and the angle tear strength of the Vilaterm heat conducting film that technical scheme of the present invention makes after implementing is gratifying, and has heat conduction, all good characteristics of water resistance; This technology not only makes the heat conductivility of product and water resistance give full play to, and compares the technology of directly producing and make the mechanical and physical performance of product also be improved, like tensile strength, angle tear strength and elongation at break.
In sum, the present invention has following beneficial effect:
1, the disclosed a kind of Vilaterm heat conducting film of the present invention has water-repellancy and all good advantages of thermal conductivity, can play moisture-proof role, can improve the thermal conduction of ground heating system again, reduces the floor heating heat energy loss, practices thrift heat energy;
2, the disclosed a kind of Vilaterm heat conducting film of the present invention also has good physical and mechanical properties, and tensile strength is high, angle tear strength is high and elongation at break is big;
3, a kind of spacer with heat conduction disclosed by the invention has that thermal conductivity is good, the advantage of good waterproof performance, also has the shock-absorbing function of appropriateness.
Embodiment
This specific embodiment only is to explanation of the present invention; It is not a limitation of the present invention; Those skilled in the art can make the modification that does not have creative contribution to present embodiment as required after reading this specification sheets, but as long as in claim scope of the present invention, all receive the protection of patent law.
Embodiment one
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: silver powder 50wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, high-density low pressure polyethylene 10wt%;
2. in the particle that 1. step makes, sneak into the high-density low pressure polyethylene with said particle equal in quality, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 5 μ m through the blown film mode.
The heat conduction ground cushion is glued on the epe foam material by the above-mentioned heat conducting film that makes and makes, and said epe foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the epe foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment two
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: copper powder 40wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, low-density high-pressure polyethylene 20wt%;
2. in the particle that 1. step makes, sneak into the low-density high-pressure polyethylene with said particle equal in quality, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 10 μ m through the blown film mode.
The heat conduction ground cushion is glued on the eva foam material by the above-mentioned heat conducting film that makes and makes, and said eva foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment three
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: aluminium powder 30wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, linear low density polyethylene 30wt%;
2. in the particle that 1. step makes, sneak into the linear low density polyethylene with said particle equal in quality, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 30 μ m through the blown film mode.
The heat conduction ground cushion is glued on the ixpe foam material by the above-mentioned heat conducting film that makes and makes, and said ixpe foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the ixpe foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment four
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture of iron powder 20wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, low-density high-pressure polyethylene and high-density low pressure polyethylene is 40wt% altogether;
2. in the particle that 1. step makes, sneak into and the low-density high-pressure polyethylene of said particle equal in quality and the mixture of high-density low pressure polyethylene; After mixing; Use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 50 μ m through the blown film mode.
The heat conduction ground cushion is glued on the xpe foam material by the above-mentioned heat conducting film that makes and makes, and said eva foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment five
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture 50wt% of aluminum nitride powder 10wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, high-density low pressure polyethylene and linear low density polyethylene;
2. in the particle that 1. step makes, sneak into and the high-density low pressure polyethylene of said particle equal in quality and the mixture of linear low density polyethylene; After mixing; Use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 100 μ m through the blown film mode.
The heat conduction ground cushion is glued on the pvc foam material by the above-mentioned heat conducting film that makes and makes, and said pvc foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the pvc foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment six
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: silver powder 50wt%, macromolecule wax 15wt%, lime carbonate 8wt%, dispersion agent 2wt%, high-density low pressure polyethylene 25wt%;
2. in the particle that 1. step makes, sneak into the twice quality in said particulate high-density low pressure polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 5 μ m through the blown film mode.
The heat conduction ground cushion is glued on the epe foam material by the above-mentioned heat conducting film that makes and makes, and said epe foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the epe foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment seven
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: copper powder 40wt%, macromolecule wax 15wt%, lime carbonate 8wt%, dispersion agent 2wt%, low-density high-pressure polyethylene 35wt%;
2. in the particle that 1. step makes, sneak into the twice quality in said particulate low-density high-pressure polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 10 μ m through the blown film mode.
The heat conduction ground cushion is glued on the eva foam material by the above-mentioned heat conducting film that makes and makes, and said eva foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment eight
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: aluminium powder 30wt%, macromolecule wax 15wt%, lime carbonate 8wt%, dispersion agent 2wt%, linear low density polyethylene 45wt%;
2. in the particle that 1. step makes, sneak into the twice quality in said particulate linear low density polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 30 μ m through the blown film mode.
The heat conduction ground cushion is glued on the ixpe foam material by the above-mentioned heat conducting film that makes and makes, and said ixpe foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the ixpe foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment nine
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture of iron powder 20wt%, macromolecule wax 15wt%, lime carbonate 8wt%, dispersion agent 2wt%, low-density high-pressure polyethylene and high-density low pressure polyethylene is 55wt% altogether;
2. in the particle that 1. step makes, sneak into the mixture of twice quality in said particulate low-density high-pressure polyethylene and high-density low pressure polyethylene; After mixing; Use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 50 μ m through the blown film mode.
The heat conduction ground cushion is glued on the xpe foam material by the above-mentioned heat conducting film that makes and makes, and said eva foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment ten
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture 65wt% of aluminum nitride powder 10wt%, macromolecule wax 15wt%, lime carbonate 10wt%, dispersion agent 2wt%, high-density low pressure polyethylene and linear low density polyethylene;
2. in the particle that 1. step makes, sneak into the mixture of twice quality in said particulate high-density low pressure polyethylene and linear low density polyethylene; After mixing; Use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 100 μ m through the blown film mode.
The heat conduction ground cushion is glued on the pvc foam material by the above-mentioned heat conducting film that makes and makes, and said pvc foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the pvc foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 11
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: silver powder 50wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, high-density low pressure polyethylene 39.5wt%;
2. in the particle that 1. step makes, sneak into three times of quality in said particulate high-density low pressure polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 5 μ m through the blown film mode.
The heat conduction ground cushion is glued on the epe foam material by the above-mentioned heat conducting film that makes and makes, and said epe foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the epe foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 12
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: copper powder 40wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, low-density high-pressure polyethylene 49.5wt%;
2. in the particle that 1. step makes, sneak into three times of quality in said particulate low-density high-pressure polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 10 μ m through the blown film mode.
The heat conduction ground cushion is glued on the eva foam material by the above-mentioned heat conducting film that makes and makes, and said eva foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 13
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: aluminium powder 30wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, linear low density polyethylene 59.5wt%;
2. in the particle that 1. step makes, sneak into three times of quality in said particulate linear low density polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 30 μ m through the blown film mode.
The heat conduction ground cushion is glued on the ixpe foam material by the above-mentioned heat conducting film that makes and makes, and said ixpe foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the ixpe foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 14
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture of iron powder 20wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, low-density high-pressure polyethylene and high-density low pressure polyethylene is 69.5wt% altogether;
2. in the particle that 1. step makes, sneak into the mixture of three times of quality in said particulate low-density high-pressure polyethylene and high-density low pressure polyethylene; After mixing; Use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 50 μ m through the blown film mode.
The heat conduction ground cushion is glued on the xpe foam material by the above-mentioned heat conducting film that makes and makes, and said eva foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 15
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture 79.5wt% of aluminum nitride powder 10wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, high-density low pressure polyethylene and linear low density polyethylene;
2. in the particle that 1. step makes, sneak into the mixture of three times of quality in said particulate high-density low pressure polyethylene and linear low density polyethylene; After mixing; Use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 100 μ m through the blown film mode.
The heat conduction ground cushion is glued on the pvc foam material by the above-mentioned heat conducting film that makes and makes, and said pvc foam material has the aperture of a plurality of perforations self upper and lower surfaces, and these apertures are evenly arranged.Heat conducting film is glued on the pvc foam material and can realizes through the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Comparative Examples one
Heat conducting film after mixing, uses inflation film manufacturing machine by 25wt% aluminum oxide powder and 75% high-density low pressure polyethylene, and design temperature is 250 ℃, makes the heat conducting film that thickness is 5 μ m through the blown film mode then.
Comparative Examples two
Heat conducting film after mixing, uses inflation film manufacturing machine by 10% silit and 90% linear low density polyethylene, and design temperature is 200 ℃, makes the heat conducting film that thickness is 30 μ m through the blown film mode then.
Comparative Examples three
Heat conducting film after mixing, uses inflation film manufacturing machine by the mixture of 2.5% silicon nitride and 97.5% high-density low pressure polyethylene and linear low density polyethylene, and design temperature is 200 ℃, makes the heat conducting film that thickness is 100 μ m through the blown film mode then.
The parameter of embodiment one to five is following:
The parameter of embodiment six to ten is following:
The parameter of embodiment 11 to 15 is following:
The performance parameters of the heat conducting film that embodiment and Comparative Examples make is following:
| Project | Water pressure resistance (mH 2O） | Heat conduction efficiency (℃/h) |
| Embodiment one | 17.5 | 50 |
| Embodiment two | 19 | 39 |
| Embodiment three | 20 | 28 |
| Embodiment four | 21.5 | 25 |
| Embodiment five | 23 | 21 |
| Embodiment six | 18 | 47 |
| Embodiment seven | 19.5 | 36 |
| Embodiment eight | 21 | 26 |
| Embodiment nine | 22 | 23 |
| Embodiment ten | 23 | 20 |
| Embodiment 11 | 18.5 | 45 |
| Embodiment 12 | 19.5 | 33 |
| Embodiment 13 | 20.5 | 25 |
| Embodiment 14 | 21.5 | 22 |
| Embodiment 15 | 23 | 20 |
| Comparative Examples one | 7.5 | 13 |
| Comparative Examples two | 12 | 11 |
| Comparative Examples three | 15.5 | 9 |
In the last table, what water pressure resistance was represented is the water-repellancy of heat conducting film, according to the GB4744-84 standard test.
Claims (10)
1. Vilaterm heat conducting film, its heat conduction efficiency is 20～50 ℃/h, it makes through following method:
1. in Vilaterm, be added into heat conductive filler, mixing, granulation after plastics processing again;
2. in the particle that 1. step makes, sneak into Vilaterm, handle through inflation film manufacturing machine and process heat conducting film;
Said heat conductive filler is a kind of in iron powder, aluminium powder, copper powder or the silver powder, and addition is 20 wt%, 30 wt%, 40wt% or the 50wt% of granulation total mass successively;
Said Vilaterm is one or more in high-density low pressure polyethylene, low-density high-pressure polyethylene or the linear low density polyethylene; Said poly mixed volume be step 1. make 1 times, 2 times of the particulate quality or 3 times;
Heat conduction efficiency records through following method, carries out with reference to LY/T 1700-2007, and wherein, test specimen is made to adopt and placed the metal sheet that thickness is 8mm between the two-layer heat conducting film, as holistic test specimen.
2. Vilaterm heat conducting film, its heat conduction efficiency is 20～50 ℃/h, it makes through following method:
1. in Vilaterm, be added into heat conductive filler, mixing, granulation after plastics processing again;
2. in the particle that 1. step makes, sneak into Vilaterm, handle through inflation film manufacturing machine and process heat conducting film;
Said heat conductive filler is an aluminum nitride powder, and addition is the 10wt% of granulation total mass;
Said Vilaterm is one or more in high-density low pressure polyethylene, low-density high-pressure polyethylene or the linear low density polyethylene; Said poly mixed volume be step 1. make 1 times, 2 times of granular mass or 3 times;
Heat conduction efficiency records through following method, carries out with reference to LY/T 1700-2007, and wherein, test specimen is made to adopt and placed the metal sheet that thickness is 8mm between the two-layer heat conducting film, as holistic test specimen.
3.
According to claim 1 and 2The preparation method of Vilaterm heat conducting film may further comprise the steps:
1. in Vilaterm, be added into heat conductive filler, mixing, granulation after plastics processing again;
2. in the particle that 1. step makes, sneak into Vilaterm, handle through inflation film manufacturing machine and process heat conducting film.
4. the preparation method of Vilaterm heat conducting film according to claim 3 is characterized in that: step 1. in, also be added with lime carbonate when being added into heat conductive filler in the Vilaterm.
5. the preparation method of Vilaterm heat conducting film according to claim 4 is characterized in that: step 1. in, also be added with macromolecule wax and dispersion agent when being added into heat conductive filler in the Vilaterm.
6. heat conduction ground cushion is characterized in that: be glued on the film layer by claim 1 or 2 described Vilaterm heat conducting films and make.
7. heat conduction ground cushion according to claim 6 is characterized in that: said film layer has the aperture of a plurality of perforations self upper and lower surfaces.
8. according to claim 6 or 7 described heat conduction ground cushions, it is characterized in that: said film layer is made through foaming by high molecular polymer.
9. heat conduction ground cushion according to claim 7 is characterized in that: the thickness of said heat conducting film is 5～100 μ m.
10. heat conduction ground cushion according to claim 8 is characterized in that: the thickness of said heat conducting film is 5～100 μ m.
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| CN115960410A (en) * | 2022-12-30 | 2023-04-14 | 广东创阳新材料科技有限公司 | Modified master batch and polyethylene protective film prepared from same |
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