CN101987896A - Polyethylene heat conducting film, as well as preparation method and heat conducting floor mat thereof - Google Patents
Polyethylene heat conducting film, as well as preparation method and heat conducting floor mat thereof Download PDFInfo
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Abstract
The invention relates to a polyethylene heat conducting film and a heating conducting floor mat, belonging to the technical field of a waterproof heat conducting film, wherein the heat conducting efficacy of the polyethylene heat conducting film is 20 to 50 DEG C/h. The preparation method of the polyethylene heat conducting film comprises the following steps: 1) heat conducting stuffing is added to polyethylene to be uniformly mixed and granulated after plasticizing; and 2) the prepared granules in the step 1) is added to polyethylene to be prepared into the heat conducting film through a film blowing machine. The heat conducting floor mat is prepared by gluing the polyethylene heat conducting film on a film layer. The polyethylene heat conducting film disclosed by the invention has the advantages of good waterproofness and heat conducting property, plays a role in resisting moisture, enhances the heat conductivity of a floor heating system, reduces the heat energy loss of the floor heating system and saves the heat energy. The polyethylene heat conducting film disclosed by the invention has good physical and mechanical properties. The heat conducting floor mat disclosed by the invention has the advantages of good heat conductivity and good waterproof property, and has the function of appropriate shock attenuation.
Description
Technical field
The present invention relates to polyethylene heat conducting film and heat conduction ground cushion, belong to waterproof heat conducting film technical field.
Background technology
Floor heating ground cushion commonly used in the prior art comprises following several: 1. foam material, cork directly mat formation or the composite polyethylene film after mat formation; 2. on foam material, the cork punching after mat formation or the composite polyethylene film after mat formation; 3. polyethylene film is directly mated formation.All there is self inherent defective in these three kinds of floor heating ground cushions: 1. foam material is a lagging material, has function of heat insulation, directly mats formation, and heat energy is difficult to see through such material transfer to the floor, and heat energy loss is big; 2. foam material, cork itself are the relatively poor materials of thermal conductivity, again behind the composite polyethylene film, though humidity resistance has been arranged, but the problem of poor heat conduction does not improve, so this series products only has damping and waterproof action, do not have heat conductivility, be suitable for common installation, be not suitable for floor heating and install; 3. polyethylene film is directly mated formation and is only had waterproof action, does not have heat conductivility.
Summary of the invention
The objective of the invention is for solving the problems of the technologies described above, a kind of polyethylene heat conducting film is provided, it has, and thermal conductivity is good, the characteristics of good waterproof performance.
Above-mentioned technical purpose of the present invention is achieved by the following technical programs:
The polyethylene heat conducting film is characterized in that: its heat conduction efficiency is 20～50 ℃/h.
Another object of the present invention provides a kind of preparation method of above-mentioned polyethylene heat conducting film, and this method may further comprise the steps:
1. in polyethylene, be added into heat conductive filler, mixing, granulation after plastics processing again;
2. in the particle that 1. step makes, sneak into polyethylene, handle through inflation film manufacturing machine and make heat conducting film.
Technique scheme of the present invention can make a kind of film with waterproof and heat conduction function after implementing.
Application number is the Chinese invention patent of 200910194390.X, discloses a kind of composite heat-conducting insulated film.This composite heat-conducting insulated film is composited by 30～60 parts modified epoxy glue and 40～70 parts heat conductive filler, and described heat conductive filler is an aluminium sesquioxide, the mixture of one or more in silicon carbide, silicon nitride and the boron nitride.This product has good insulation performance effect and heat conductivility.But add aluminium sesquioxide in polyethylene, behind one or more in silicon carbide, silicon nitride and the boron nitride, the thermal conductivity of the film that the conventional filming technology of process obtains is limited, and heat conduction efficiency is about 12 ℃/h.By the polyethylene heat conducting film that the inventive method makes, its heat conduction efficiency is 20～50 ℃/h, and the heat conduction efficiency of common polyethylene film 12 ℃/below the h.Heat conduction efficiency records by the following method, carries out with reference to LY/T 1700-2007 regulation, and wherein test specimen is made to adopt and placed the metal sheet that a thickness is about 8mm between the two-layer heat conducting film, as holistic test specimen.
Preferred as technique scheme, described heat conductive filler is metal simple-substance powder or metal nitride powder.
Preferred as technique scheme, described polyethylene is one or more in high-density low pressure polyethylene, low-density high-pressure polyethylene or the linear low density polyethylene.
The high-density low pressure polyethylene, it is the waxy solid particle that a kind of oyster white is translucent, density is at 0.9165～0.9300 g/cm
3Between, particle diameter is at 120 μ m～150 μ m, i.e. 100～120 mesh sieves; Melt temperature has superior dielectric properties, resistance to chemical attack and resistance to low temperature about in the of 108 ℃, and toughness is strong, and is shock-resistant, and is non-hygroscopic and have good steam-preventing, and fabulous thermoplasticity is arranged, and is easy to moulding.
Low-density high-pressure polyethylene, it is the waxy solid resin that a kind of oyster white is translucent, and side chain is arranged on the molecular chain, density is at 0.910g/cm
3Below, particle diameter is at 180 μ m～380 μ m, i.e. 40～80 mesh sieves; Soft, melt temperature is about in the of 108 ℃, and thermally melting, forming process, toughness, lower temperature resistance are good, and flexibility is good; Burning is differentiated: Huang Xialan on the combustion flame, and smokeless during burning, the smell of paraffin is arranged.
Linear low density polyethylene, it is mainly used in the manufacturing film, hardness and abrasion resistance height, heat sealer and thermal viscosity are good; Density: 0.908～0.920 g/cm
3; Be with low-density high-pressure polyethylene hot-melt adhesive powder difference, there is not long-chain branch on the molecular chain, its linear lag comes from different process of manufacture with the low-density high-pressure polyethylene hot-melt adhesive powder, is generated by ethene and high alpha-olefin (as butylene, hexene or octene) copolymerization; Have the molecular weight distribution narrower, have linear structure simultaneously and make it that different rheological characteristicss be arranged than low-density high-pressure polyethylene hot-melt adhesive powder; Higher anti-intensity, penetration-resistant, tear strength and the elongation stretched makes it be specially adapted to made membrane.
Preferred as technique scheme, step 1. in, also be added with lime carbonate when being added into heat conductive filler in the polyethylene.
Preferred as technique scheme, step 1. in, also be added with macromolecule wax and dispersion agent when being added into heat conductive filler in the polyethylene.
A further object of the present invention provides a kind of heat conduction ground cushion, and it is glued on the film layer by above-mentioned polyethylene heat conducting film and makes.
Preferred as technique scheme, described film layer has the aperture of a plurality of perforations self upper and lower surface.
Preferred as technique scheme, described film layer is made through foaming by high molecular polymer.
Preferred as technique scheme, the thickness of described heat conducting film is 5～100 μ m.
Crucial part of the present invention is to adopt the technology of two-step approach, earlier polyethylene and heat conductive filler is made particle, then particle is sneaked in the polyethylene, makes heat conducting film again; If directly make film, the homogeneity of the film of making is not fine, local poor thermal conductivity, and local water-repellancy is poor, and the tensile strength of film integral body, angle tear strength are not high yet; And the tensile strength and the angle tear strength of the polyethylene heat conducting film integral body that technical solution of the present invention makes after implementing are gratifying, and have heat conduction, all good characteristics of water resistance; This technology not only makes the heat conductivility of product and water resistance give full play to, and compares the technology of directly producing and make the mechanical and physical performance of product also be improved, as tensile strength, angle tear strength and elongation at break.
In sum, the present invention has following beneficial effect:
1, a kind of polyethylene heat conducting film disclosed in this invention has water-repellancy and all good advantages of thermal conductivity, can play moisture-proof role, can improve the thermal conduction of ground heating system again, reduces the floor heating heat energy loss, saves heat energy;
2, a kind of polyethylene heat conducting film disclosed in this invention also has good physical and mechanical properties, and tensile strength height, angle tear strength height and elongation at break are big;
3, a kind of spacer with heat conduction disclosed by the invention has that thermal conductivity is good, the advantage of good waterproof performance, also has the shock-absorbing function of appropriateness.
Embodiment
This specific embodiment only is an explanation of the invention; it is not a limitation of the present invention; those skilled in the art can make the modification that does not have creative contribution to present embodiment as required after reading this specification sheets, but as long as all are subjected to the protection of patent law in claim scope of the present invention.
Embodiment one
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: silver powder 50wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, high-density low pressure polyethylene 10wt%;
2. sneak into the high-density low pressure polyethylene with described particle equal in quality in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 5 μ m by the blown film mode.
The heat conduction ground cushion is glued on the epe foam material by the above-mentioned heat conducting film that makes and makes, and described epe foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the epe foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment two
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: copper powder 40wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, low-density high-pressure polyethylene 20wt%;
2. sneak into the low-density high-pressure polyethylene with described particle equal in quality in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 10 μ m by the blown film mode.
The heat conduction ground cushion is glued on the eva foam material by the above-mentioned heat conducting film that makes and makes, and described eva foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment three
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: aluminium powder 30wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, linear low density polyethylene 30wt%;
2. sneak into the linear low density polyethylene with described particle equal in quality in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 30 μ m by the blown film mode.
The heat conduction ground cushion is glued on the ixpe foam material by the above-mentioned heat conducting film that makes and makes, and described ixpe foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the ixpe foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment four
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture of iron powder 20wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, low-density high-pressure polyethylene and high-density low pressure polyethylene is 40wt% altogether;
2. in the particle that 1. step makes, sneak into and the low-density high-pressure polyethylene of described particle equal in quality and the mixture of high-density low pressure polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 50 μ m by the blown film mode.
The heat conduction ground cushion is glued on the xpe foam material by the above-mentioned heat conducting film that makes and makes, and described eva foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment five
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture 50wt% of aluminum nitride powder 10wt%, macromolecule wax 25wt%, lime carbonate 10wt%, dispersion agent 5wt%, high-density low pressure polyethylene and linear low density polyethylene;
2. in the particle that 1. step makes, sneak into and the high-density low pressure polyethylene of described particle equal in quality and the mixture of linear low density polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 100 μ m by the blown film mode.
The heat conduction ground cushion is glued on the pvc foam material by the above-mentioned heat conducting film that makes and makes, and described pvc foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the pvc foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment six
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: silver powder 50wt%, macromolecule wax 15wt%, lime carbonate 8wt%, dispersion agent 2wt%, high-density low pressure polyethylene 25wt%;
2. sneak into the twice quality in described particulate high-density low pressure polyethylene in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 5 μ m by the blown film mode.
The heat conduction ground cushion is glued on the epe foam material by the above-mentioned heat conducting film that makes and makes, and described epe foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the epe foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment seven
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: copper powder 40wt%, macromolecule wax 15wt%, lime carbonate 8wt%, dispersion agent 2wt%, low-density high-pressure polyethylene 35wt%;
2. sneak into the twice quality in described particulate low-density high-pressure polyethylene in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 10 μ m by the blown film mode.
The heat conduction ground cushion is glued on the eva foam material by the above-mentioned heat conducting film that makes and makes, and described eva foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment eight
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: aluminium powder 30wt%, macromolecule wax 15wt%, lime carbonate 8wt%, dispersion agent 2wt%, linear low density polyethylene 45wt%;
2. sneak into the twice quality in described particulate linear low density polyethylene in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 30 μ m by the blown film mode.
The heat conduction ground cushion is glued on the ixpe foam material by the above-mentioned heat conducting film that makes and makes, and described ixpe foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the ixpe foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment nine
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture of iron powder 20wt%, macromolecule wax 15wt%, lime carbonate 8wt%, dispersion agent 2wt%, low-density high-pressure polyethylene and high-density low pressure polyethylene is 55wt% altogether;
2. in the particle that 1. step makes, sneak into the mixture of twice quality in described particulate low-density high-pressure polyethylene and high-density low pressure polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 50 μ m by the blown film mode.
The heat conduction ground cushion is glued on the xpe foam material by the above-mentioned heat conducting film that makes and makes, and described eva foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment ten
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture 65wt% of aluminum nitride powder 10wt%, macromolecule wax 15wt%, lime carbonate 10wt%, dispersion agent 2wt%, high-density low pressure polyethylene and linear low density polyethylene;
2. in the particle that 1. step makes, sneak into the mixture of twice quality in described particulate high-density low pressure polyethylene and linear low density polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 100 μ m by the blown film mode.
The heat conduction ground cushion is glued on the pvc foam material by the above-mentioned heat conducting film that makes and makes, and described pvc foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the pvc foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 11
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: silver powder 50wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, high-density low pressure polyethylene 39.5wt%;
2. sneak into three times of quality in described particulate high-density low pressure polyethylene in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 5 μ m by the blown film mode.
The heat conduction ground cushion is glued on the epe foam material by the above-mentioned heat conducting film that makes and makes, and described epe foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the epe foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 12
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: copper powder 40wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, low-density high-pressure polyethylene 49.5wt%;
2. sneak into three times of quality in described particulate low-density high-pressure polyethylene in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 10 μ m by the blown film mode.
The heat conduction ground cushion is glued on the eva foam material by the above-mentioned heat conducting film that makes and makes, and described eva foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 13
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: aluminium powder 30wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, linear low density polyethylene 59.5wt%;
2. sneak into three times of quality in described particulate linear low density polyethylene in the particle that 1. step makes, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 30 μ m by the blown film mode.
The heat conduction ground cushion is glued on the ixpe foam material by the above-mentioned heat conducting film that makes and makes, and described ixpe foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the ixpe foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 14
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture of iron powder 20wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, low-density high-pressure polyethylene and high-density low pressure polyethylene is 69.5wt% altogether;
2. in the particle that 1. step makes, sneak into the mixture of three times of quality in described particulate low-density high-pressure polyethylene and high-density low pressure polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 50 μ m by the blown film mode.
The heat conduction ground cushion is glued on the xpe foam material by the above-mentioned heat conducting film that makes and makes, and described eva foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the eva foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Embodiment 15
Heat conducting film is made by following method:
1. by extruding pelletization after the plastics processing of following raw material process: the mixture 79.5wt% of aluminum nitride powder 10wt%, macromolecule wax 5wt%, lime carbonate 5wt%, dispersion agent 0.5wt%, high-density low pressure polyethylene and linear low density polyethylene;
2. in the particle that 1. step makes, sneak into the mixture of three times of quality in described particulate high-density low pressure polyethylene and linear low density polyethylene, after mixing, use inflation film manufacturing machine, design temperature is 250 ℃, makes the heat conducting film that thickness is 100 μ m by the blown film mode.
The heat conduction ground cushion is glued on the pvc foam material by the above-mentioned heat conducting film that makes and makes, and described pvc foam material has the aperture of a plurality of perforations self upper and lower surface, and these apertures are evenly arranged.Heat conducting film is glued on the pvc foam material and can realizes by the compounding machine pressing, belongs to prior art, does not give unnecessary details at this.
Comparative Examples one
Heat conducting film after mixing, uses inflation film manufacturing machine by 25wt% aluminum oxide powder and 75% high-density low pressure polyethylene, and design temperature is 250 ℃, makes the heat conducting film that thickness is 5 μ m by the blown film mode then.
Comparative Examples two
Heat conducting film after mixing, uses inflation film manufacturing machine by 10% silicon carbide and 90% linear low density polyethylene, and design temperature is 200 ℃, makes the heat conducting film that thickness is 30 μ m by the blown film mode then.
Comparative Examples three
Heat conducting film after mixing, uses inflation film manufacturing machine by the mixture of 2.5% silicon nitride and 97.5% high-density low pressure polyethylene and linear low density polyethylene, and design temperature is 200 ℃, makes the heat conducting film that thickness is 100 μ m by the blown film mode then.
The parameter of embodiment one to five is as follows:
The parameter of embodiment six to ten is as follows:
The parameter of embodiment 11 to 15 is as follows:
The performance parameters of the heat conducting film that embodiment and Comparative Examples make is as follows:
| Project | Water pressure resistance (mH 2O） | Heat conduction efficiency (℃/h) |
| Embodiment one | 17.5 | 50 |
| Embodiment two | 19 | 39 |
| Embodiment three | 20 | 28 |
| Embodiment four | 21.5 | 25 |
| Embodiment five | 23 | 21 |
| Embodiment six | 18 | 47 |
| Embodiment seven | 19.5 | 36 |
| Embodiment eight | 21 | 26 |
| Embodiment nine | 22 | 23 |
| Embodiment ten | 23 | 20 |
| Embodiment 11 | 18.5 | 45 |
| Embodiment 12 | 19.5 | 33 |
| Embodiment 13 | 20.5 | 25 |
| Embodiment 14 | 21.5 | 22 |
| Embodiment 15 | 23 | 20 |
| Comparative Examples one | 7.5 | 13 |
| Comparative Examples two | 12 | 11 |
| Comparative Examples three | 15.5 | 9 |
In the last table, what water pressure resistance was represented is the water-repellancy of heat conducting film, according to the GB4744-84 standard test.
Claims (10)
1. polyethylene heat conducting film, it is characterized in that: its heat conduction efficiency is 20～50 ℃/h.
2. the preparation method of the described polyethylene heat conducting film of claim 1 may further comprise the steps:
1. in polyethylene, be added into heat conductive filler, mixing, granulation after plastics processing again;
2. in the particle that 1. step makes, sneak into polyethylene, handle through inflation film manufacturing machine and make heat conducting film.
3. the preparation method of polyethylene heat conducting film according to claim 2 is characterized in that: described heat conductive filler is metal simple-substance powder or metal nitride powder.
4. the preparation method of polyethylene heat conducting film according to claim 2 is characterized in that: described polyethylene is one or more in high-density low pressure polyethylene, low-density high-pressure polyethylene or the linear low density polyethylene.
5. according to the preparation method of claim 2 or 3 or 4 described polyethylene heat conducting films, it is characterized in that: step 1. in, also be added with lime carbonate when being added into heat conductive filler in the polyethylene.
6. the preparation method of polyethylene heat conducting film according to claim 5 is characterized in that: step 1. in, also be added with macromolecule wax and dispersion agent when being added into heat conductive filler in the polyethylene.
7. heat conduction ground cushion is characterized in that: be glued on the film layer by the described polyethylene heat conducting film of claim 1 and make.
8. heat conduction ground cushion according to claim 7 is characterized in that: described film layer has the aperture of a plurality of perforations self upper and lower surface.
9. according to claim 7 or 8 described heat conduction ground cushions, it is characterized in that: described film layer is made through foaming by high molecular polymer.
10. according to claim 7 or 8 described heat conduction ground cushions, it is characterized in that: the thickness of described heat conducting film is 5～100 μ m.
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| CN103804761A (en) * | 2014-02-28 | 2014-05-21 | 浙江润阳新材料科技有限公司 | Heat-conducting water-proof gasket |
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| CN108084669A (en) * | 2017-11-22 | 2018-05-29 | 纳琳威纳米科技南通有限公司 | A kind of preparation method and its usage for the high heat conduction plastic pellet that insulate |
| CN108102305A (en) * | 2017-11-22 | 2018-06-01 | 纳琳威纳米科技南通有限公司 | A kind of preparation method and its usage for the high heat conduction plastics that insulate |
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| CN104641478A (en) * | 2012-09-24 | 2015-05-20 | 奥斯兰姆奥普托半导体有限责任公司 | Optoelectronic component and method for producing an optoelectronic component |
| US9722159B2 (en) | 2012-09-24 | 2017-08-01 | Osram Opto Semiconductors Gmbh | Optoelectronic component with a pre-oriented molecule configuration and method for producing an optoelectronic component with a pre-oriented molecule configuration |
| CN104641478B (en) * | 2012-09-24 | 2017-08-18 | 奥斯兰姆奥普托半导体有限责任公司 | Opto-electronic device and the method for manufacturing opto-electronic device |
| CN103804761A (en) * | 2014-02-28 | 2014-05-21 | 浙江润阳新材料科技有限公司 | Heat-conducting water-proof gasket |
| CN108084669A (en) * | 2017-11-22 | 2018-05-29 | 纳琳威纳米科技南通有限公司 | A kind of preparation method and its usage for the high heat conduction plastic pellet that insulate |
| CN108102305A (en) * | 2017-11-22 | 2018-06-01 | 纳琳威纳米科技南通有限公司 | A kind of preparation method and its usage for the high heat conduction plastics that insulate |
| CN108102304A (en) * | 2017-11-22 | 2018-06-01 | 纳琳威纳米科技南通有限公司 | A kind of preparation method and its usage of step biaxial tension insulation high heat conduction film |
| CN110283430A (en) * | 2019-07-25 | 2019-09-27 | 中国科学院合肥物质科学研究院 | A kind of high-heat-conductive composite material and preparation method thereof |
| CN111593860A (en) * | 2020-06-12 | 2020-08-28 | 李朝晖 | Plastic foaming double-sided metal connection heat conduction damp-proof shock pad |
| CN115960410A (en) * | 2022-12-30 | 2023-04-14 | 广东创阳新材料科技有限公司 | Modified master batch and polyethylene protective film prepared from same |
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