CN101954759A - Lightweight dot-matrix coreboard and method for manufacturing same by electrospark perforation - Google Patents
Lightweight dot-matrix coreboard and method for manufacturing same by electrospark perforation Download PDFInfo
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- CN101954759A CN101954759A CN 201010280811 CN201010280811A CN101954759A CN 101954759 A CN101954759 A CN 101954759A CN 201010280811 CN201010280811 CN 201010280811 CN 201010280811 A CN201010280811 A CN 201010280811A CN 101954759 A CN101954759 A CN 101954759A
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Abstract
The invention relates to a lightweight dot-matrix coreboard and a method for manufacturing the same by electrospark perforation, and belongs to the field of machining. The lightweight dot-matrix coreboard and the method for manufacturing the same by the electrospark perforation solve the problems that the coreboard formed by the traditional method has poor structural performance and is not suitable for batch production due to the technical problems of the coreboard. In the lightweight dot-matrix coreboard, the upper top surface of a perforated corrugated plate and an upper panel are fixed together; the lower bottom surface of the perforated corrugated plate and a lower panel are fixed together; and a row of through holes are formed on each inclined side of the perforated corrugated plate. The method for manufacturing the lightweight dot-matrix coreboard through the electrospark perforation comprises the following steps of: I, fixing the corrugated plate with the upper panel and the lower panel; II, fixing on a clamp clamped on an electrospark operating platform and connecting a pulse power supply; III, soaking into a liquid medium, switching on the pulse power supply and an automatic feeding adjustment device and perforating on the inclined sides of the corrugated plate; and IV, after finishing perforating according to the preset program, taking out of the liquid medium to obtain the lightweight dot-matrix coreboard.
Description
Technical field
The present invention relates to a kind of light dot matrix battenboard and adopt electric spark-erosion perforation to prepare the method for this plate, belong to field of machining.
Background technology
Preparation light dot matrix battenboard mainly contains following several at present: the dot-matrix sandwich panel for metal material mainly contains two kinds of rolling, investment castings; Dot-matrix sandwich panel for the fibre reinforced composites material mainly contains mold hot platen press, assembly jig method, fibrage method, mechanical construction from part.Analyze the problem that exists below respectively
Rolling: because metal material is in rolling process, have certain elastic deformation, the node that causes the dot matrix fuse is not often not in one plane, and is and smaller by the lattice structure node area of rolling preparation.
Investment casting: because metal flow is not very good, tend to the quality after the shaping structures influentially, and the investment casting cost is higher.
The mold hot platen press: fuse part is not a global formation, and rod member can not apply enough pressure, and rod member is embedded in the panel, and counter plate causes initial damage easily.
The assembly jig method: the node bond area is too little.
The fibrage method: counter plate has damage on the one hand, and the fiber rod member is thinner on the other hand, can not give full play to fibre-reinforced characteristics.
The machinery construction from part: there is error in rod member easily in working angles, brings rigging error to structure easily during interlocking like this.
The battenboard structural behaviour of above several method moulding is poor, and is unsuitable for producing in batches because of its technological problems.
Summary of the invention
It is poor to the present invention seeks to for the battenboard structural behaviour that solves the conventional method moulding, and the problem that is unsuitable for producing in batches because of its technological problems provides a kind of light dot matrix battenboard and adopted electric spark-erosion perforation to prepare the method for this plate.
Light dot matrix battenboard of the present invention comprises corrugated plating with holes, top panel and lower panel, the last end face and the top panel of corrugated plating with holes are fixed together, the bottom surface and the lower panel of corrugated plating with holes are fixed together, and are distributed with an exhausting hole on each prism of corrugated plating with holes.
The first method that adopts electric spark-erosion perforation to prepare above-mentioned light dot matrix battenboard may further comprise the steps:
Step 3, to be processed is immersed in the liquid medium, start spark pulse power and auto-feed adjusting device, punch on the prism of corrugated plating, the shape in hole is by the shape decision of electrode,
Technological parameter is:
Pulsewidth is 2 μ s～12 μ s, is 10 μ s～30 μ s between arteries and veins, and peak point current is 2A～15A, and machining voltage is 80V～200V, positive polarity processing, and the feed speed of auto-feed adjusting device was 1 μ m/ second～8 μ m/ second, the cutter lifting height is 0.5mm～9mm,
Step 4, by setup program after beaten the hole on to be processed, from liquid medium, it is taken out, finish the preparation of light dot matrix battenboard.
The second method that adopts electric spark-erosion perforation to prepare above-mentioned light dot matrix battenboard may further comprise the steps:
Technological parameter is: pulsewidth is to be 10 μ s～30 μ s between 2 μ s～12 μ s arteries and veins, and peak point current is 2A～15A, and machining voltage is 80V～200V, positive polarity processing, the feed speed of auto-feed adjusting device was 1 μ m/ second～8 μ m/ second, and the cutter lifting height is 0.5mm～9mm
Step 3, by setup program after having beaten the hole on the corrugated plating, described corrugated plating is taken out from liquid medium, described corrugated plating and upper and lower panel are fixed together, finish the preparation of light dot matrix battenboard.
Advantage of the present invention:
1. technology realizes simply, does not need a step to be prepared into complicated dot-matrix sandwich panel, prepares the corrugated plating of simple configuration earlier, immediately corrugated plating is gone to the hole, can reach the weight reduction purpose.
2. can significantly improve structural behaviour, this moulding process at first is to prepare corrugated plating, and the corrugated plating forming technique is very ripe, corrugated plating can be in fine moulding under the sufficient pressure and temperature, and the rod member that punching prepares on corrugated plating is better than the rod member performance of straight forming.
3. realization mass, Zhi Bei light dot matrix battenboard in the past, because node is not in one plane, perhaps, cause to realize mass, and this technology is at first to prepare simple corrugated plating class formation because mould is too big, process again, and corrugated plating has realized that the large tracts of land mass generates, and can realize mass like this, promotes the engineering practice.
Description of drawings
Fig. 1 is the corrugated plating perspective view;
Fig. 2 is the A direction view of Fig. 1;
Fig. 3 is the B direction view of Fig. 1;
Fig. 4 is the C direction view of Fig. 1;
Fig. 5 is the structural representation of electrode;
Fig. 6 is the punching process schematic diagram of embodiment nine described methods;
Fig. 7 is the corrugated board structures schematic diagram after the embodiment nine described method punchings;
Fig. 8 is the structural representation of light dot matrix battenboard of the present invention;
Fig. 9 is the side view of Fig. 8;
Figure 10 is the vertical view of Fig. 7;
Figure 11 is the side view of hole when circular of battenboard shown in Figure 8;
Figure 12 is the side view of the hole of battenboard shown in Figure 8 when being triangle;
Figure 13 is the side view of the hole of battenboard shown in Figure 8 when being rectangle;
Figure 14 structural representation that to be embodiment two be fixed together corrugated plating and upper and lower panel;
Figure 15 is the punching process schematic diagram of embodiment two described methods.
The specific embodiment
The specific embodiment one: present embodiment is described below in conjunction with Fig. 8, a kind of light dot matrix battenboard of present embodiment, it comprises corrugated plating with holes 1, top panel 2 and lower panel 3, the last end face and the top panel 2 of corrugated plating 1 with holes are fixed together, the bottom surface and the lower panel 3 of corrugated plating 1 with holes are fixed together, and are distributed with an exhausting hole on each prism of corrugated plating 1 with holes.Described through hole can be even distribution on prism, also can be uneven distribution, determines according to actual needs.
The specific embodiment two: below in conjunction with Fig. 1 to Fig. 5, Fig. 8, Fig. 9, Figure 11 to Figure 15 present embodiment is described,
Present embodiment adopts electric spark-erosion perforation to prepare the method for embodiment one described light dot matrix battenboard, and it may further comprise the steps:
Step 3, to be processed is immersed in the liquid medium, start spark pulse power and auto-feed adjusting device, punch on the prism of corrugated plating, the shape in hole is by the shape decision of electrode,
Technological parameter is:
Pulsewidth is 2 μ s～12 μ s, is 10 μ s～30 μ s between arteries and veins, and peak point current is 2A～15A, and machining voltage is 80V～200V, positive polarity processing, and the feed speed of auto-feed adjusting device was 1 μ m/ second～8 μ m/ second, the cutter lifting height is 0.5mm～9mm,
Step 4, by setup program after beaten the hole on to be processed, from liquid medium, it is taken out, finish the preparation of light dot matrix battenboard.
The stereogram of corrugated plating as shown in Figure 1, its A, B, C direction view such as Fig. 2, Fig. 3, shown in Figure 4, execution in step one is fixed together corrugated plating and upper and lower panel, forms as shown in figure 14.
The material of corrugated plating is fibre reinforced composites or metal material, and material is that the corrugated plating of fibre reinforced composites prepares by hot pressing die, and material is that the corrugated plating of metal material prepares by rolling mould, and electrode adopts red copper electrode or copper electrode.
Fixed form in the step 1 is welding or bonding, is specially:
Corrugated plating is a metal material, and upper and lower panel is a metal material, and fixed form is welding;
Corrugated plating is a metal material, and upper and lower panel is fibre reinforced composites, and fixed form is bonding;
Corrugated plating is fibre reinforced composites, and upper and lower panel is a metal material, and fixed form is bonding;
Corrugated plating is fibre reinforced composites, and upper and lower panel is fibre reinforced composites, and fixed form is bonding.
Execution in step two, and definite electrode direction of feed is a C direction shown in Figure 14.
Execution in step three, all immerse the device shown in Figure 14 that is fixed on the electric spark operating desk in the liquid medium, one selects aviation kerosine for use liquid medium, begin by punching, detailed process as shown in figure 15, the shape in hole is by the decision of the shape of electrode, when electrode be shaped as circle the time, punching back battenboard side view is as shown in figure 11; When electrode be shaped as triangle the time, punching back battenboard side view is as shown in figure 12; When electrode be shaped as rectangle the time, punching back battenboard side view is as shown in figure 13; When being shaped as of electrode is trapezoidal, punch back battenboard side view as shown in Figure 9, the concrete shape of using determines according to actual conditions, does not enumerate one by one here.
Execution in step four, the final light dot matrix battenboard of formation as shown in Figure 8.
The specific embodiment three: the difference of present embodiment and embodiment two is, pulsewidth is 6 μ s～10 μ s, between arteries and veins 15 μ s～25 μ s, peak point current is 3A～8A, machining voltage is 100V～160V, the feed speed of auto-feed adjusting device was 2 μ m/ second～5 μ m/ seconds, and the cutter lifting height is 1mm～5mm, and other structure is identical with embodiment two with connected mode.
The specific embodiment four: the difference of present embodiment and embodiment two is, pulsewidth is 8 μ s, between arteries and veins 25 μ s, peak point current is 6A, machining voltage is 160V, the feed speed of auto-feed adjusting device was 2 μ m/ seconds, and the cutter lifting height is 2mm, and other structure is identical with embodiment two with connected mode.
The specific embodiment five: the difference of present embodiment and embodiment two is, pulsewidth is 2 μ s, between arteries and veins 10 μ s, peak point current is 2A, machining voltage is 80V, positive polarity processing, and the feed speed of auto-feed adjusting device was 1 μ m/ second, the cutter lifting height is 0.5mm, and other structure is identical with embodiment two with connected mode.
The specific embodiment six: the difference of present embodiment and embodiment two is, pulsewidth is 12 μ s, between arteries and veins 30 μ s, peak point current is 15A, machining voltage is 200V, positive polarity processing, and the feed speed of auto-feed adjusting device was 8 μ m/ seconds, the cutter lifting height is 9mm, and other structure is identical with embodiment two with connected mode.
The specific embodiment seven: the difference of present embodiment and embodiment two is, pulsewidth is 6 μ s, between arteries and veins 15 μ s, peak point current is 3A, machining voltage is 100V, the feed speed of auto-feed adjusting device was 2 μ m/ seconds, and the cutter lifting height is 1mm, and other structure is identical with embodiment two with connected mode.
The specific embodiment eight: the difference of present embodiment and embodiment two is, pulsewidth is 10 μ s, between arteries and veins 25 μ s, peak point current is 8A, machining voltage is 160V, the feed speed of auto-feed adjusting device was 5 μ m/ seconds, and the cutter lifting height is 5mm, and other structure is identical with embodiment two with connected mode.
The specific embodiment nine: below in conjunction with Fig. 1 to Figure 13 present embodiment is described, present embodiment adopts electric spark-erosion perforation to prepare the method for embodiment one described light dot matrix battenboard, and it may further comprise the steps:
Technological parameter is: pulsewidth is to be 10 μ s～30 μ s between 2 μ s～12 μ s arteries and veins, and peak point current is 2A～15A, and machining voltage is 80V～200V, positive polarity processing, the feed speed of auto-feed adjusting device was 1 μ m/ second～8 μ m/ second, and the cutter lifting height is 0.5mm～9mm
Step 3, by setup program after having beaten the hole on the corrugated plating, described corrugated plating is taken out from liquid medium, described corrugated plating and upper and lower panel are fixed together, finish the preparation of light dot matrix battenboard.
The stereogram of corrugated plating as shown in Figure 1, its A, B, C direction view such as Fig. 2, Fig. 3, shown in Figure 4.
Execution in step one, and definite electrode direction of feed is a C direction shown in Figure 1.
Execution in step two, all immerse the battenboard shown in Figure 1 that is fixed on the electric spark operating desk in the liquid medium, one selects aviation kerosine for use liquid medium, begin by punching, detailed process as shown in Figure 6, the shape in hole is by the decision of the shape of electrode, when electrode be shaped as circle the time, punching back battenboard side view is as shown in figure 11; When electrode be shaped as triangle the time, punching back battenboard side view is as shown in figure 12; When electrode be shaped as rectangle the time, punching back battenboard side view is as shown in figure 13; When being shaped as of electrode is trapezoidal, punch back battenboard side view as shown in Figure 9, the concrete shape of using determines according to actual conditions, does not enumerate one by one here.
Beaten behind the hole corrugated plating as shown in Figure 7.
Execution in step three is fixed together the corrugated plating as shown in Figure 7 and the upper and lower panel of beating via hole, forms light dot matrix battenboard as shown in Figure 8.
The material of corrugated plating is fibre reinforced composites or metal material, and material is that the corrugated plating of fibre reinforced composites prepares by hot pressing die, and material is that the corrugated plating of metal material prepares by rolling mould, and electrode adopts red copper electrode or copper electrode.
Fixed form in the step 3 is welding or bonding, is specially:
Corrugated plating is a metal material, and upper and lower panel is a metal material, and fixed form is welding;
Corrugated plating is a metal material, and upper and lower panel is fibre reinforced composites, and fixed form is bonding;
Corrugated plating is fibre reinforced composites, and upper and lower panel is a metal material, and fixed form is bonding;
Corrugated plating is fibre reinforced composites, and upper and lower panel is fibre reinforced composites, and fixed form is bonding.
The specific embodiment ten: the difference of present embodiment and embodiment nine is, pulsewidth is 6 μ s～10 μ s, between arteries and veins 15 μ s～25 μ s, peak point current is 3A～8A, machining voltage is 100V～160V, the feed speed of auto-feed adjusting device was 2 μ m/ second～5 μ m/ seconds, and the cutter lifting height is 1mm～5mm, and other structure is identical with embodiment nine with connected mode.
The specific embodiment 11: the difference of present embodiment and embodiment nine is, pulsewidth is 8 μ s, between arteries and veins 25 μ s, peak point current is 6A, machining voltage is 160V, the feed speed of auto-feed adjusting device was 2 μ m/ seconds, and the cutter lifting height is 2mm, and other structure is identical with embodiment nine with connected mode.
The specific embodiment 12: the difference of present embodiment and embodiment nine is, pulsewidth is 2 μ s, between arteries and veins 10 μ s, peak point current is 2A, machining voltage is 80V, positive polarity processing, and the feed speed of auto-feed adjusting device was 1 μ m/ second, the cutter lifting height is 0.5mm, and other structure is identical with embodiment nine with connected mode.
The specific embodiment 13: the difference of present embodiment and embodiment nine is, pulsewidth is 12 μ s, between arteries and veins 30 μ s, peak point current is 15A, machining voltage is 200V, positive polarity processing, and the feed speed of auto-feed adjusting device was 8 μ m/ seconds, the cutter lifting height is 9mm, and other structure is identical with embodiment nine with connected mode.
The specific embodiment 14: the difference of present embodiment and embodiment nine is, pulsewidth is 6 μ s, between arteries and veins 15 μ s, peak point current is 3A, machining voltage is 100V, the feed speed of auto-feed adjusting device was 2 μ m/ seconds, and the cutter lifting height is 1mm, and other structure is identical with embodiment nine with connected mode.
The specific embodiment 15: the difference of present embodiment and embodiment nine is, pulsewidth is 10 μ s, between arteries and veins 25 μ s, peak point current is 8A, machining voltage is 160V, the feed speed of auto-feed adjusting device was 5 μ m/ seconds, and the cutter lifting height is 5mm, and other structure is identical with embodiment nine with connected mode.
Claims (9)
1. light dot matrix battenboard, it is characterized in that, it comprises corrugated plating with holes (1), top panel (2) and lower panel (3), the last end face of corrugated plating with holes (1) and top panel (2) are fixed together, the bottom surface of corrugated plating with holes (1) and lower panel (3) are fixed together, and are distributed with an exhausting hole on each prism of corrugated plating with holes (1).
2. adopt electric spark-erosion perforation to prepare the method for the described light dot matrix battenboard of claim 1, it is characterized in that it may further comprise the steps:
Step 1, corrugated plating and upper and lower panel are fixed together, as to be processed;
Step 2, with fixing on described to be processed the jig that is clamped in the electric spark operating desk, electrode is installed on the auto-feed adjusting device, the electrode direction of feed is parallel with top panel, and the stupefied line of vertical moire plate, electrode connects a power output end of spark pulse power, corrugated plating connects another power output end of spark pulse power, and with electric-conductor corrugated plating and top panel or lower panel is linked together;
Step 3, to be processed is immersed in the liquid medium, start spark pulse power and auto-feed adjusting device, punch on the prism of corrugated plating, the shape in hole is by the shape decision of electrode,
Technological parameter is:
Pulsewidth is 2 μ s～12 μ s, is 10 μ s～30 μ s between arteries and veins, and peak point current is 2A～15A, and machining voltage is 80V～200V, positive polarity processing, and the feed speed of auto-feed adjusting device was 1 μ m/ second～8 μ m/ second, the cutter lifting height is 0.5mm～9mm,
Step 4, by setup program after beaten the hole on to be processed, from liquid medium, it is taken out, finish the preparation of light dot matrix battenboard.
3. a kind of method that adopts electric spark-erosion perforation to prepare the light dot matrix battenboard according to claim 2, it is characterized in that, the material of corrugated plating is fibre reinforced composites or metal material, material is that the corrugated plating of fibre reinforced composites prepares by hot pressing die, material is that the corrugated plating of metal material prepares by rolling mould, and electrode adopts red copper electrode or copper electrode.
4. a kind of method that adopts electric spark-erosion perforation to prepare the light dot matrix battenboard according to claim 2, it is characterized in that, pulsewidth is 6 μ s～10 μ s, between arteries and veins 15 μ s～25 μ s, peak point current is 3A～8A, machining voltage is 100V～160V, and the feed speed of auto-feed adjusting device was 2 μ m/ second～5 μ m/ seconds, and the cutter lifting height is 1mm～5mm.
5. a kind of method that adopts electric spark-erosion perforation to prepare the light dot matrix battenboard according to claim 2 is characterized in that, pulsewidth is 8 μ s, be 25 μ s between arteries and veins, peak point current is 6A, and machining voltage is 160V, the feed speed of auto-feed adjusting device was 2 μ m/ seconds, and the cutter lifting height is 2mm.
6. adopt electric spark-erosion perforation to prepare the method for the described light dot matrix battenboard of claim 1, it is characterized in that it may further comprise the steps:
Step 1, corrugated plating is clamped on the jig of electric spark operating desk fixing, electrode is installed on the auto-feed adjusting device, the electrode direction of feed is parallel with top panel, and the stupefied line of vertical moire plate, electrode connects a power output end of spark pulse power, and corrugated plating connects another power output end of spark pulse power;
Step 2, corrugated plating to be processed is immersed in the liquid medium, start spark pulse power and auto-feed adjusting device, punch on the prism of corrugated plating, the shape in hole is by the shape decision of electrode,
Technological parameter is: pulsewidth is to be 10 μ s～30 μ s between 2 μ s～12 μ s arteries and veins, and peak point current is 2A～15A, and machining voltage is 80V～200V, positive polarity processing, the feed speed of auto-feed adjusting device was 1 μ m/ second～8 μ m/ second, and the cutter lifting height is 0.5mm～9mm
Step 3, by setup program after having beaten the hole on the corrugated plating, described corrugated plating is taken out from liquid medium, described corrugated plating and upper and lower panel are fixed together, finish the preparation of light dot matrix battenboard.
7. a kind of method that adopts electric spark-erosion perforation to prepare the light dot matrix battenboard according to claim 6, it is characterized in that, the material of corrugated plating is fibre reinforced composites or metal material, material is that the corrugated plating of fibre reinforced composites prepares by hot pressing die, material is that the corrugated plating of metal material prepares by rolling mould, and electrode adopts red copper electrode or copper electrode.
8. a kind of method that adopts electric spark-erosion perforation to prepare the light dot matrix battenboard according to claim 6, it is characterized in that, pulsewidth is 6 μ s～10 μ s, between arteries and veins 15 μ s～25 μ s, peak point current is 3A～8A, machining voltage is 100V～160V, and the feed speed of auto-feed adjusting device was 2 μ m/ second～5 μ m/ seconds, and the cutter lifting height is 1mm～5mm.
9. a kind of method that adopts electric spark-erosion perforation to prepare the light dot matrix battenboard according to claim 6 is characterized in that, pulsewidth is 8 μ s, be 25 μ s between arteries and veins, peak point current is 6A, and machining voltage is 160V, the feed speed of auto-feed adjusting device was 2 μ m/ seconds, and the cutter lifting height is 2mm.
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| CN 201010280811 CN101954759B (en) | 2010-09-14 | 2010-09-14 | Method for manufacturing lightweight dot-matrix coreboard by electrospark perforation |
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| CN 201010280811 CN101954759B (en) | 2010-09-14 | 2010-09-14 | Method for manufacturing lightweight dot-matrix coreboard by electrospark perforation |
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| CN101966764A (en) * | 2010-09-14 | 2011-02-09 | 哈尔滨工业大学 | Light dot matrix sandwich board and method for preparing same by laser drilling |
| CN101968159A (en) * | 2010-09-14 | 2011-02-09 | 哈尔滨工业大学 | Light-weight lattice laminboard and method for preparing laminboard by punching adopting wire-electrode cutting |
| CN102371707A (en) * | 2011-08-25 | 2012-03-14 | 哈尔滨工业大学 | Dot matrix sandwich board based on stacked composite materials and preparation method thereof |
| CN102407618A (en) * | 2011-08-12 | 2012-04-11 | 哈尔滨工业大学 | Dot matrix coreboard made from composite material |
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| CN102371707A (en) * | 2011-08-25 | 2012-03-14 | 哈尔滨工业大学 | Dot matrix sandwich board based on stacked composite materials and preparation method thereof |
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