CN101944357A - Multi-module impedance compound sound insulation plate and manufacturing method thereof - Google Patents
Multi-module impedance compound sound insulation plate and manufacturing method thereof Download PDFInfo
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Abstract
The invention discloses a multi-module impedance compound sound insulation plate and a manufacturing method thereof. The method adopts a principle based on a Helmholtz resonator, and is characterized in that a shell is a panels made a rigid sound insulation material, and edges at one side are rolled to form a groove; the inner side of a damp sound insulation plate module groove is provided with a bilayer plate sound insulation structural plate or a bilayer plate sound insulation module protective layer, a sound sucking material, a protective fabric and a perforating plate. The manufacturing method comprises the following steps: according to different requirements of the sound insulation volume, respectively calculating a damp sound insulation plate module, a bilayer sound insulation structural module and a perforating plate resonant sound sucking structural module; adjusting the thickness and the density of each material in each layer structure; adjusting the dimension of each acoustic structure, thus ensuring that each layer structure of the product conforms to the quality standard of design requirements. The invention improves the environment adaptability of the sound insulation plate, can effectively ensure the service life in the moist environment, can improve the sound insulation volume to at least 10-15dB compared with like products, and simultaneously can carry out intensified design aiming at different noise frequency band through adjusting each material and acoustic structures, thus improving the noise decreasing effect.
Description
Technical field
The present invention is applicable to the noise control of various industry, civilian strong noise environment.Reduce noise source by the energy of fluid media (medium) to place environment for use radiation, the reducing noise sound pressure level is improved the environmental acoustics environment.
Background technology
Plant equipment comprises power-equipment, rotating machinery or the like, is playing the part of crucial role at modern industry, in civilian, brings a lot of convenience for people's work, life, has improved production efficiency.Yet all things invariably divide into two, and no matter how niceness also stays some is unavoidably regretted, and these plant equipment are no exception, and it also brings some worries to people when offering convenience to the mankind, and noise is exactly one of them.
A large amount of plant equipment produces strong noise in the running, because this noise belongs to non-fault mostly, fundamentally difficulty of governance is quite big, even in the country of technology prosperity, solve noise and also remain headachy problem.In order to reduce noise, many researchists have paid hard effort, have passed through research and the practice of decades, work out the theory and the successful experience of many reduction plant equipment noises, have obtained many useful achievements in research.This research work has not only attracted numerous acousticians, and under the guide effect in market, and many device designs manufacturing sector has also opened up the frontier of noise research, develops many low noise engineering goods, gives its bigger market competitiveness.Yet be subjected to the restriction of prior art level, noise problem also is far from fundamentally being resolved, and make this world recover original quiet, and researchers still shoulder heavy responsibilities.
Sound insulationg board is a product commonly used in the noise control engineering, but there is more drawback in present sound insulationg board, can not well solve noise control problem.The existing ubiquitous defective following points of sound insulationg board:
(1) adopt double plate structure mostly, both inside and outside two-layer sound insulating material, the centre adds the way of acoustic absorbant, and version is single.
(2) the multilayer material sound insulationg board is than the sound insulationg board of double plate structure, and sound insulation efficient improves, but the multilayer material sound insulationg board adopts plasterboard as the sound insulation main material more at present, and this makes sound insulationg board structure under wet environment easily produce destruction.This sound insulationg board can only be applicable to dry indoor environment.
(3) existing sound insulationg board adopts the method raising oise insulation factor that 2～3 kinds of acoustical materials superpose repeatedly, and acoustic construction is not optimized, and material use efficient is low.
(4) installation of existing sound insulationg board adopts the bolt penetration to install, and the back is installed produces overhead speaker, reduces sound insulation property.
Summary of the invention
The purpose of this invention is to provide a kind of multimode impedance complex sound insulationg board, adaptability is strong, and selection is flexible, has overcome the defective of existing sound insulationg board.
Multimode impedance complex sound insulationg board of the present invention, employing is based on the perforation board resonance sound absorption structure and the doubling plate sound insulating structure of Hai Muhuozhi resonator principle, it is characterized in that compound sound insulationg board is divided into three acoustic module: damping sound insulationg board module, doubling plate sound insulating structure module and perforation board resonance sound absorption structure module, its structural level is: each edge break volume that shell adopts the double rigid material of doing sound insulationg board to make a sound insulationg board and a side forms cell body, is docile and obedient preface and places damping sheet, doubling plate sound insulating structure, sound-absorbing material layer, armored fabric layer and perforated plate in groove; Resilient materials is filled in the space between doubling plate sound insulating structure side and the shell cell body inwall; In multimode impedance complex sound insulationg board shell side or the inboard brace of reserving, be used for installing.
Method for making: according to the requirement of different oise insulation factors, damping sound insulationg board module, doubling plate sound insulating structure module and perforation board resonance sound absorption structure module are calculated respectively, adjust the thickness of every kind of material in each layer structure, density, adjust the size of each acoustic construction, the quality standard that adheres to specification with each layer structure that guarantees product.
The present invention adopts acoustic constructions such as perforation board resonance sound absorption structure, doubling plate sound insulating structure, has optimized the combination of acoustical material, has improved the service efficiency of acoustical material.This sound insulationg board adds doubling plate sound insulating structure module, has improved the adaptive capacity to environment of sound insulationg board to a great extent, can effectively ensure serviceable life in wet environment.When processing conditions meets the demands, double-deck sound insulationg board structure fabrication can be become vacuum doubling plate sound insulating structure, the more efficiently oise insulation factor that improves sound insulationg board.Sound insulationg board does not adopt the drift bolt formula to install when mounted, avoid the appearance of overhead speaker, has avoided in the installation process destruction to the sound insulationg board sound insulation property.Compare with the sound insulationg board of existing condition of equivalent thickness, oise insulation factor improves 10～15dB at least.Can strengthen design at different noise bands by adjustment simultaneously, improve noise reduction each material and acoustic construction.
Description of drawings
Fig. 1 multimode impedance complex sound insulationg board structural drawing;
Fig. 2 is Fig. 1 partial enlarged drawing;
Fig. 3 is sound insulationg board 1 a cell body diagrammatic cross-section.
Embodiment
The design and calculation method of making in the multimode impedance complex sound insulationg board method is as follows;
1, damping sound insulationg board module
Damping sound insulationg board module is formed integrative-structure by sound insulationg board and two kinds of materials of damping sheet;
The sheet material of sound insulationg board need be selected the harder material of quality (as metal, timber, plastics etc.) for use, and plate thickness should be greater than 0.5mm, and oise insulation factor should be greater than 5dB.The double product mask shell of doing of sound insulationg board.
Damping sheet can be selected damping material sheet material or damping structure plate for use.When selecting damping material sheet material, the damping sheet sheet metal thickness should be greater than 5 times of protection slab thickness, and the damping sheet spillage of material factor should be greater than 0.1; The damping structure plate is meant the sheet material that adopts the measure that changes the sheet material physical form to strengthen the outer rigidity of board plane.The normal measure of adopting has ribbing or die mould on sheet material.When selecting the damping structure plate for use, need to guarantee that damping structure plate coincidence frequency departs from environment for use noise major control frequency of the present invention.
When calculating damping sound insulationg board module oise insulation factor, only consider the oise insulation factor of sound insulationg board.Damping sheet is only considered its catabiotic effect, weakens the vibration of sound insulationg board, prevents that sound insulationg board from externally producing the secondary noise radiation.
2, doubling plate sound insulating structure module
Compare with the individual layer sound insulationg board, doubling plate sound insulating structure module can obtain higher oise insulation factor under the situation of using identical sound insulating material, therefore, and by reaching identical oise insulation factor requirement, in sound insulationg board, use doubling plate sound insulating structure module, can effectively reduce the integral thickness of sound insulationg board.
In doubling plate sound insulating structure module, can be by the surface density of two plates inside and outside changing and the resonant frequency f of the adjusting of the spacing between two plates double panel structure
0, prevent that the identical low ebb of sound insulating structure from appearing at the frequency band that needs control, guarantee defening effect.Resonant frequency f
0Computing formula is as follows:
M in the formula
1, M
2Be the surface density of inside and outside laminate, ρ is an atmospheric density, and normal temperature is 1.18kg/m down
3, d is the air layer thickness between two plates, c is the velocity of sound.
3, perforation board resonance sound absorption structure module
The perforation board resonance sound absorption structure module is made up of rigid layer, perforated plate and the acoustic absorbant that is filled between the two.Among the present invention, the double rigid layer of doing in this module of doubling plate sound insulating structure module.
Perforated plate adopts rigid material, and material thickness should be greater than 0.5mm, and percentage of open area should be greater than 4%.The thickness of perforated plate, aperture, percentage of open area and the plate rear chamber degree of depth need according to this routine environment for use noise major control frequency computation part, must guarantee that perforated plate resonant frequency and this patent environment for use noise major control frequency match.Resonant frequency f
0Computing formula is as follows:
L is the plate rear chamber degree of depth in the formula, and t is a perforated plate thickness, and d is the aperture, and c is the velocity of sound, and P is a percentage of perforation.
Acoustic absorbant should be selected the acoustic absorbant of unit weight greater than 15kg for use, and acoustic absorbant need be full of the perforated plate rear chamber.
4, other materials
Armored fabric is selected according to the acoustic absorbant fineness, and fabric is knitted line density and do not splashed with acoustic absorbant and be as the criterion.
5, the overall oise insulation factor of multimode impedance complex sound insulationg board is calculated
The overall oise insulation factor R of multimode impedance complex sound insulationg board is mainly based on damping sound insulationg board module oise insulation factor R1, doubling plate sound insulating structure module oise insulation factor R2;
R1＝16lgM+8 M≥200kg/m
2
R1＝13.5lgM+14 M＜200kg/m
2
Wherein M is the protection slab surface density.
R2＝16lg[(M
1+M
2)f
0]-30+ΔR
M wherein
1, M
2Be inside and outside two-layer rigid plate surface density, f
0Be doubling plate sound insulating structure resonant frequency.
Consider the co-ordination of three of damping sound insulationg board, doubling plate sound insulating structure and perforation board resonance sound absorption structure modules etc.The oise insulation factor R=R1+R2+2dB of multimode impedance complex sound insulationg board.
6, the selection of each module making material:
Select suitable material according to the environmental aspect of multimode impedance complex sound insulationg board, appearance requirement, installation site load limiting or the like condition.For example, in being arranged, the environment of fire protection requirement can not select combustible material; When the sound insulationg board outward appearance is had ornamental the requirement, can select for use timber, aluminium-plastic panel etc. as the protection slab material.Behind the material according to selected composite demand, design other parameter of each module according to material behavior.
7, multimode impedance complex sound insulationg board method for making
(1) select the sound insulation plate, and materials processing is become cell body, job operation is not limit.For example: steel plate can adopt methods such as punching press, welding, flap, and plank can adopt methods such as glue bond.
(2) making of damping sound insulationg board module:, constitute damping sound insulationg board module with sound insulationg board at the inboard sticking damping sheet of cell body.Bonding agent needs to select according to the damping sheet material character, guarantees that cell body firmly is connected with damping sheet.
(3) making of doubling plate sound insulating structure module: the different-thickness of inside and outside two-layer rigid plate and array configuration require to adjust according to calculating and noise reduction.Through calculating, behind the thickness and distance between plates of rigid plate, two plates are combined into doubling plate sound insulating structure module inside and outside determining.
Doubling plate sound insulation module is divided into two kinds:
A. adopt air layer between the inside and outside rigid plate: the inside and outside rigid plate edge of the manner does not need to seal.The double-deck sound insulationg board module of the manner can be made into finished product and reinstall in the protection slab cell body, also inside and outside rigid plate can be put into cell body in order respectively, and fixing;
B. adopt vacuum layer between the inside and outside rigid plate: the inside and outside rigid plate edge of the manner need carry out encapsulation process, and the gas between the inside and outside rigid plate is extracted out, forms vacuum layer.The double-deck sound insulationg board module of the manner need be made moulding before putting into cell body.
Need to place an amount of elastic cushion block between the inside and outside rigid plate, reach calculation requirement to guarantee inside and outside rigid plate spacing.Elastic cushion block reliably is connected with inside and outside rigid plate, can adopt bonding or the nail connection.The quantity of elastic cushion block is few as far as possible, places with doubling plate sound insulation module level, and top plate does not subside and is as the criterion.
(4) doubling plate the is insulated against sound module cell body of packing into.Doubling plate sound insulating structure module length and width size need be slightly less than and cell body inwall length and width clear distance size.Both are not more than 10mm at difference.Doubling plate is insulated against sound after module puts into cell body, in the gap of doubling plate sound insulation module and cell body, add the elastic vibration isolation pad fix or use coagulation forming after rubber-like glue bond fixing.
What select for use as the rigid plate in the doubling plate sound insulation module is suitable crushing material, as glass, can add protective material on the insulate against sound two sides of module of doubling plate.
(5) making of perforation board resonance sound absorption structure module: calculate definite perforation board resonance sound absorption structure module size parameter according to multimode impedance complex sound insulationg board environment for use noise frequency.After cell body is packed doubling plate sound insulation module into, pack into successively acoustic absorbant, armored fabric and perforated plate.The connected mode of perforated plate and cell body needs to decide according to both materials.As select for use steel to be, and adopt rivet to connect or welding, as select for use timber to be, adopt glue bond.
8, the installation of multimode impedance complex sound insulationg board
The installation of multimode impedance complex sound insulationg board can not adopt traditional drift bolt mode to be installed in use location (as steel structure framework etc.).Need according to installation environment to install by brace in multimode impedance complex sound insulationg board shell side or the inboard brace of reserving, mounting means needs decide according to both materials.As select for use steel to be, and adopt rivet to connect or welding, as select for use timber to be, adopt glue bond.
9, multimode impedance complex sound insulationg board quality control standards (QCS)
(1) multimode impedance complex sound insulationg board physical dimension will meet on-the-spot mounting condition requirement.
(2) multimode impedance complex sound insulationg board each several part material must meet calculation requirement, and material all reaches the industry standard requirement, has the outgoing verification of conformity.
(3) layers of material is installed firmly in the multimode impedance complex sound insulationg board, guarantees not become flexible in carrying and use.
10, multimode impedance complex sound insulationg board design example
Example 1.
Environment for use original acoustic condition: noise sound 106dB, the high sound pressure level frequency band appears at more than the 600Hz, and the 1KHz sound pressure level is outstanding in each frequency band, is 112dB.By noise reduction process, neighbourhood noise need reach below the 65dB.Sound insulationg board environment for use non-corrosiveness does not have specific (special) requirements to the sound insulationg board outward appearance.Multimode impedance complex sound insulationg board determines that according to the acoustic hood size multimode impedance complex sound insulationg board is square as the cover body shell of equipment acoustic hood in this example, and length and width are of a size of 1200mm * 600mm.
Can obtain according to design conditions, the noise sound difference is 106-65=41dB before and after the noise reduction, and multimode impedance complex sound insulationg board oise insulation factor design load needs greater than 41dB.Have the sound pressure level peak value at the 1KHz place, the perforation board resonance sound absorption structure resonant frequency need be controlled at 1KHz.
Multimode impedance complex sound insulationg board material is defined as: see Fig. 1; sound insulationg board 1 adopts steel plate; damping sheet 2 adopts rubber slab; doubling plate sound insulating structure module 3 adopts glass; because double-deck sound insulating structure module adopts frangible glass material, double-deck sound insulating structure module rear portion need be provided with protective seam 3a, and protective seam 3a adopts the thick benzene plate of 10mm; acoustic absorbant 5 adopts centrifugally glass-wool, and armored fabric 6 adopts glass wool cloth.
Perforated plate 7 thicknesss of slab are chosen to be 0.5mm, aperture 6mm.As calculated, percentage of open area 9%, when the thickness of slab air layer thickness was 50mm, the perforation board resonance sound absorption structure resonant frequency was 1KHz.
Doubling plate sound insulating structure module 3 adopts glass material, and inside and outside thickness of slab is respectively 3mm and 5mm, at interval 10mm.Through calculating its resonant frequency f
0=224Hz is lower than 600Hz.Its oise insulation factor is 32.4dB.
The overall oise insulation factor of multimode impedance complex sound insulationg board is 21.9dB+32.4dB+2dB=56.3dB＞41dB.Meet the noise reduction requirement.
Can determine that according to result of calculation multimode impedance complex sound insulationg board is of a size of 1200mm * 600mm * 75mm.
Each module connects material:
In the damping sound insulationg board module, sound insulationg board 1 adopts the pitch bonding with damping sheet 2.
Adopt the thick rubber cushion blocks 4 of 10mm between doubling plate sound insulating structure module 3 internal and external layers of glass, use glass cement that rubber cushion blocks is connected with glass.Should use rigid plate as the ectonexine in the doubling plate sound insulating structure module 3.
Double-deck sound insulating structure module 3 adopts the building glue bond to fix with protective seam 3a.
The cell body of sound insulationg board 1 and doubling plate sound insulating structure module 3 adopt the glass cement bonding fixing, and perforated plate 7 adopts rivet to be connected with sound insulationg board 1 cell body.
Example 2
Environment for use original acoustic condition: noise sound 102dB, the high sound pressure level frequency band appears at more than the 300Hz, and the 400Hz sound pressure level is outstanding in each frequency band, is 110dB.By noise reduction process, neighbourhood noise need reach below the 70dB.Environment for use requires to adopt wood decorations protection slab.Multimode impedance complex sound insulationg board is as the partition wall wallboard in this example, and according to the partition wall modeling requirement, multimode impedance complex sound insulationg board is square, and length and width are of a size of 1000mm * 1000mm.
Can obtain according to design conditions, the noise sound difference is 102-70=32dB before and after the noise reduction, so multimode impedance complex sound insulationg board oise insulation factor design load needs greater than 32dB.Have the sound pressure level peak value at third-octave 400KHz place, the perforation board resonance sound absorption structure resonant frequency need be controlled at 400KHz.
Multimode impedance complex sound insulationg board material is defined as: sound insulationg board 1 adopts plank, and the 2mm groove is established in the plank inboard, forms the damping structure plate, and doubling plate sound insulating structure module 3 adopts plasterboard, and acoustic absorbant 5 adopts centrifugally glass-wool, and armored fabric 6 adopts glass wool cloth.
Perforated plate 7 thicknesss of slab are chosen to be the 8mm plank, aperture 6mm.As calculated, percentage of open area 6%, when the thickness of slab air layer thickness was 80mm, the perforation board resonance sound absorption structure resonant frequency was 400Hz.
Doubling plate sound insulating structure module 3 adopts plasterboard, and inside and outside thickness of slab is respectively 8mm and 10mm, at interval 30mm.Through calculating its resonant frequency f
0=182Hz is lower than 300Hz, and its oise insulation factor is 30.6dB.
Each module connects material:
In the damping sound insulationg board module,, form the damping structure plate because of adding the 2mm groove behind the plank.
Adopt the thick rubber cushion blocks of 30mm between the doubling plate sound insulating structure module 3 ectonexine gypsum, use carpenter's nail that rubber cushion blocks is connected with plasterboard.
The overall oise insulation factor of multimode impedance complex sound insulationg board is 15.1dB+30.6dB+2dB=47.7dB＞41dB.Meet the noise reduction requirement.
Can determine that according to result of calculation multimode impedance complex sound insulationg board is of a size of 1000mm * 1000mm * 145mm.
Claims (8)
1. multimode impedance complex sound insulationg board; employing is based on the perforation board resonance sound absorption structure and the doubling plate sound insulating structure of Hai Muhuozhi resonator principle; it is characterized in that comprising damping sound insulationg board module, doubling plate sound insulating structure module and perforation board resonance sound absorption structure modular structure: each edge break volume that shell adopts rigidity sound insulating material sheet material to make a sound insulationg board and a side forms cell body, places doubling plate sound insulating structure plate or doubling plate sound insulating structure module, protective seam, module protection layer, acoustic absorbant, armored fabric and perforated plate successively inboard the rising of damping sound insulationg board module slot.
2. multimode impedance complex sound insulationg board according to claim 1 is characterized in that the performance requirement of above-mentioned each laminate:
(a) damping sound insulationg board module
Damping sound insulationg board module is formed integrative-structure by sound insulationg board and two kinds of materials of damping sheet; Sound insulationg board and damping sheet adopt bonding;
Need select the harder material of quality for use as the sound insulationg board sheet material of shell, plate thickness should be greater than 0.5mm, and oise insulation factor should be greater than 5dB;
Damping sheet has damping material sheet material or damping structure plate: when selecting damping material sheet material, the damping sheet sheet metal thickness should be greater than 5 times of protection slab thickness, and the damping sheet spillage of material factor should be greater than 0.1; The damping structure plate is ribbing or a die mould on sheet material, changes the sheet material physical form to strengthen the outer rigidity of board plane, and damping structure plate coincidence frequency departs from this product environment for use noise major control frequency;
(b) doubling plate sound insulating structure module
Double-deck sound insulation module is made of air layer or vacuum layer in the middle of two-layer rigid material plate and the two-layer rigidity sheet material; Doubling plate sound insulating structure modular design oise insulation factor is greater than 25dB;
When two-layer rigid material plate was selected different materials for use, two-layer rigid material plate thickness can be identical;
When two-layer rigid material plate selected the identical or density of material of material identical, two-layer rigid material plate thickness can not be identical, and slab should be controlled at 1.2～2 with the gauge of sheet ratio;
(c) perforation board resonance sound absorption structure module
The perforation board resonance sound absorption structure module is made up of rigid layer, perforated plate and the acoustic absorbant that is filled between the two.In this patent, the double rigid layer of doing in this module of doubling plate sound insulating structure module.
Perforated plate adopts rigid material, and material thickness should be greater than 0.5mm, and percentage of open area should be greater than 4%;
Acoustic absorbant should be selected the acoustic absorbant of unit weight greater than 15kg for use in the perforated plate, and acoustic absorbant need be full of the perforated plate rear chamber;
(d) other acoustic absorbants
Armored fabric is selected according to the acoustic absorbant fineness, and fabric is knitted line density and do not splashed with acoustic absorbant and be as the criterion;
(e) bonding agent needs to select according to the damping sheet material character, guarantees that cell body firmly is connected with damping sheet.
3. the manufacture method of a multimode impedance complex sound insulationg board, it is characterized in that requirement according to different oise insulation factors, damping sound insulationg board module, doubling plate sound insulating structure module and perforation board resonance sound absorption structure module are calculated respectively, adjust the thickness of every kind of material in each layer structure, density, adjust the size of each acoustic construction, the quality standard that adheres to specification with each layer structure that guarantees product.
4. the manufacture method of multimode impedance complex sound insulationg board according to claim 3 is characterized in that:
Guarantee doubling plate sound insulating structure module defening effect, can be by the surface density of two plates inside and outside changing and the resonant frequency f of the adjusting of the spacing between two plates double panel structure
0, prevent that the identical low ebb of sound insulating structure from appearing at the frequency band that needs control, resonant frequency f
0Computing formula is as follows:
M in the formula
1, M
2Be the surface density of inside and outside laminate, ρ is an atmospheric density, and normal temperature is 1.18kg/m down
3, d is the air layer thickness between two plates, c is the velocity of sound.
5. the manufacture method of multimode impedance complex sound insulationg board according to claim 3, it is characterized in that guaranteeing that perforated plate resonant frequency and environment for use noise major control frequency match, the thickness of perforated plate, aperture, percentage of open area and the plate rear chamber degree of depth need according to environment for use noise major control frequency computation part, resonant frequency f
0Computing formula is as follows:
L is the plate rear chamber degree of depth in the formula, and t is a perforated plate thickness, and d is the aperture, and c is the velocity of sound, and P is a percentage of perforation.
6. the manufacture method of multimode impedance complex sound insulationg board according to claim 3 is characterized in that the overall oise insulation factor R of multimode impedance complex sound insulationg board is based on damping sound insulationg board module oise insulation factor R1 and doubling plate sound insulating structure module oise insulation factor R2 sum; When calculating damping sound insulationg board module oise insulation factor, only consider the oise insulation factor of sound insulationg board, damping sheet is only considered its catabiotic effect, weakens the vibration of protection slab, prevents that protection slab from externally producing the secondary noise radiation;
R1＝16lgM+8 M≥200kg/m
2
R1＝13.5lgM+14 M＜200kg/m
2
Wherein M is the sound insulationg board surface density;
R2＝16lg[(M
1+M
2)f
0]-30+ΔR
M wherein
1, M
2Be inside and outside two-layer rigid plate surface density, f
0Be doubling plate sound insulating structure resonant frequency;
The coordinative role of damping sound insulationg board, doubling plate sound insulating structure and perforation board resonance sound absorption structure module, the oise insulation factor R=R1+R2+2dB of multimode impedance complex sound insulationg board;
Doubling plate sound insulating structure module length and width size need be slightly less than cell body inwall length and width clear distance size, and both are not more than 10mm at difference.
7. the manufacture method of multimode impedance complex sound insulationg board according to claim 3, it is as follows to it is characterized in that making flow process:
(a) select the sound insulationg board material, and the cell body that collapses and form to a side is processed on each bar limit of sound insulationg board (1);
(b) making of damping sound insulationg board module: each module connects material:
In the damping sound insulationg board module, sound insulationg board (1) adopts the pitch bonding with damping sheet (2);
Doubling plate sound insulating structure module (3) is to be bonded by adding the thick rubber cushion blocks of 10mm (4) between the internal and external layers of glass, uses glass cement that rubber cushion blocks is connected with glass;
Double-deck sound insulating structure module (3) adopts the building glue bond to fix with protective seam (3a);
The cell body of sound insulationg board (1) and doubling plate sound insulating structure module (3) adopt the glass cement bonding fixing, and perforated plate (7) adopts rivet to be connected with sound insulationg board (1) cell body;
At the inboard sticking damping sheet (2) of sound insulationg board (1) cell body, constitute damping sound insulationg board module with sound insulationg board (1);
(c) making of doubling plate sound insulating structure module: the different-thickness of the inside and outside two-layer rigid plate of double-deck sound insulating structure module (3) and array configuration require to adjust according to calculating and noise reduction, through calculating, after determining the thickness and distance between plates of inside and outside rigid plate, two plates are combined into doubling plate sound insulating structure module;
Doubling plate sound insulation module is divided into two kinds:
(aa) adopt air layer between the inside and outside rigid plate: the inside and outside rigid plate edge of the manner does not need to seal; The double-deck sound insulationg board module of the manner can be made into finished product and reinstall in the sound insulationg board cell body, perhaps inside and outside rigid plate is put into cell body in order respectively, and fixing;
(ab) adopt vacuum layer between the inside and outside rigid plate: the inside and outside rigid plate edge of the manner need carry out encapsulation process, and the gas between the inside and outside rigid plate is extracted out, forms vacuum layer; The double-deck sound insulationg board module of the manner need be made before putting into cell body and is shaped to finished product;
Place an amount of elastic cushion block between the inside and outside rigid plate, reach calculation requirement to guarantee inside and outside rigid plate spacing, the quantity of elastic cushion block is few as far as possible, places with doubling plate sound insulation module level, and top plate does not subside and is as the criterion;
(d) doubling plate the is insulated against sound module sound insulationg board cell body of packing into: doubling plate is insulated against sound after module puts into the sound insulationg board cell body, in the gap of doubling plate sound insulation module and cell body, add the elastic vibration isolation pad fix or use coagulation forming after the rubber-like glue bond fix;
What (e) select for use as the rigid plate in the doubling plate sound insulation module is suitable broken glass material, can add protective material on the insulate against sound two sides of module of doubling plate;
(f) making of perforation board resonance sound absorption structure module: calculate definite perforation board resonance sound absorption structure module size parameter according to multimode impedance complex sound insulationg board environment for use noise frequency, comprise the perforated plate rear chamber degree of depth, perforated plate thickness, aperture, percentage of perforation; After sound insulationg board (1) cell body is packed doubling plate sound insulation module into, the acoustic absorbant (5) of packing into successively again, armored fabric (6) and perforated plate (7).
8. the manufacture method of multimode impedance complex sound insulationg board according to claim 3, it is characterized in that the installation of multimode impedance complex sound insulationg board: according to installation environment in multimode impedance complex sound insulationg board shell side or the inboard brace of reserving, fix by brace and use location structure member, mounting means needs to decide according to both materials, when sound insulationg board is steel, adopt rivet to connect or welding; When sound insulationg board is timber, adopt glue bond.
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| CN102723075A (en) * | 2011-03-29 | 2012-10-10 | 上海市电力公司 | Anti-noise structure for flexible direct current converter station |
| CN103106899A (en) * | 2011-11-11 | 2013-05-15 | 中国科学院声学研究所 | Multi-functional layered composite materials for high-speed train |
| CN103669767A (en) * | 2012-12-20 | 2014-03-26 | 厦门嘉达声学技术有限公司 | Decorative composite sound absorption structure |
| CN103700366A (en) * | 2013-12-24 | 2014-04-02 | 江苏大学 | Wideband sound absorption structure combing mechanical impedance of composite resonance cavities with micropunch plates |
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| CN108615520A (en) * | 2016-12-13 | 2018-10-02 | 航天特种材料及工艺技术研究所 | A kind of sound-absorbing material and preparation method thereof based on more hierarchical structures |
| CN108775091A (en) * | 2018-08-06 | 2018-11-09 | 深圳市航天新材科技有限公司 | A kind of compound locally resonant metamaterial sound panel |
| CN111341291A (en) * | 2020-03-04 | 2020-06-26 | 云南电网有限责任公司电力科学研究院 | Noise reduction device and preparation method |
| CN111691805A (en) * | 2020-04-30 | 2020-09-22 | 中国辐射防护研究院 | Method and system for manufacturing radiation protection door |
| CN112289293A (en) * | 2019-07-22 | 2021-01-29 | 青岛海尔智能技术研发有限公司 | Embedded noise reduction device and refrigerator |
| CN113997655A (en) * | 2021-11-09 | 2022-02-01 | 江苏科技大学 | Frequency-adjustable sound absorption and insulation light composite board and manufacturing method thereof |
| CN114030247A (en) * | 2021-11-09 | 2022-02-11 | 江苏科技大学 | Sound absorption and insulation light composite board based on acoustic black hole |
| CN115790832A (en) * | 2023-02-07 | 2023-03-14 | 山东世卓泽坤节能环保科技有限公司 | Noise management system and method based on sound absorption and insulation module |
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| CN102723075A (en) * | 2011-03-29 | 2012-10-10 | 上海市电力公司 | Anti-noise structure for flexible direct current converter station |
| CN103106899A (en) * | 2011-11-11 | 2013-05-15 | 中国科学院声学研究所 | Multi-functional layered composite materials for high-speed train |
| CN103669767A (en) * | 2012-12-20 | 2014-03-26 | 厦门嘉达声学技术有限公司 | Decorative composite sound absorption structure |
| CN103669767B (en) * | 2012-12-20 | 2015-11-04 | 厦门嘉达声学技术有限公司 | Decorative composite sound absorption structure |
| CN103700366A (en) * | 2013-12-24 | 2014-04-02 | 江苏大学 | Wideband sound absorption structure combing mechanical impedance of composite resonance cavities with micropunch plates |
| CN103700366B (en) * | 2013-12-24 | 2016-06-15 | 江苏大学 | The broad band sound absorption structure that the mechanical impedance of combinative resonator is combined with microperforated panel |
| CN104464709A (en) * | 2014-11-03 | 2015-03-25 | 江苏大学 | Variable-damping mechanical impedance combined sound absorption structure |
| CN104464709B (en) * | 2014-11-03 | 2017-11-17 | 江苏大学 | A kind of adaptive damping mechanical impedance compound sound-absorption structural |
| CN105161089B (en) * | 2015-06-17 | 2019-10-15 | 成都斯铂润音响设备有限公司 | A kind of sound absorber |
| CN105161089A (en) * | 2015-06-17 | 2015-12-16 | 成都斯铂润音响设备有限公司 | Sound absorbing device |
| CN108615520A (en) * | 2016-12-13 | 2018-10-02 | 航天特种材料及工艺技术研究所 | A kind of sound-absorbing material and preparation method thereof based on more hierarchical structures |
| CN108775091A (en) * | 2018-08-06 | 2018-11-09 | 深圳市航天新材科技有限公司 | A kind of compound locally resonant metamaterial sound panel |
| CN112289293A (en) * | 2019-07-22 | 2021-01-29 | 青岛海尔智能技术研发有限公司 | Embedded noise reduction device and refrigerator |
| CN112289293B (en) * | 2019-07-22 | 2023-08-22 | 青岛海尔智能技术研发有限公司 | Embedded noise reduction device and refrigerator |
| CN111341291A (en) * | 2020-03-04 | 2020-06-26 | 云南电网有限责任公司电力科学研究院 | Noise reduction device and preparation method |
| CN111341291B (en) * | 2020-03-04 | 2023-06-16 | 云南电网有限责任公司电力科学研究院 | Noise reduction device and preparation method |
| CN111691805A (en) * | 2020-04-30 | 2020-09-22 | 中国辐射防护研究院 | Method and system for manufacturing radiation protection door |
| CN113997655A (en) * | 2021-11-09 | 2022-02-01 | 江苏科技大学 | Frequency-adjustable sound absorption and insulation light composite board and manufacturing method thereof |
| CN114030247A (en) * | 2021-11-09 | 2022-02-11 | 江苏科技大学 | Sound absorption and insulation light composite board based on acoustic black hole |
| CN113997655B (en) * | 2021-11-09 | 2023-09-29 | 江苏科技大学 | Frequency-adjustable sound absorption and insulation light composite board and manufacturing method thereof |
| CN114030247B (en) * | 2021-11-09 | 2023-09-29 | 江苏科技大学 | Sound absorption and insulation light composite board based on acoustic black hole |
| CN115790832A (en) * | 2023-02-07 | 2023-03-14 | 山东世卓泽坤节能环保科技有限公司 | Noise management system and method based on sound absorption and insulation module |
| CN115790832B (en) * | 2023-02-07 | 2023-04-21 | 山东世卓泽坤节能环保科技有限公司 | Noise management system and method based on sound absorption and insulation module |
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