CN101942260B - High-temperature resistant insulated thermally conductive paint with low expansion coefficient - Google Patents
High-temperature resistant insulated thermally conductive paint with low expansion coefficient Download PDFInfo
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- CN101942260B CN101942260B CN201010181416XA CN201010181416A CN101942260B CN 101942260 B CN101942260 B CN 101942260B CN 201010181416X A CN201010181416X A CN 201010181416XA CN 201010181416 A CN201010181416 A CN 201010181416A CN 101942260 B CN101942260 B CN 101942260B
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- thermally conductive
- temperature resistant
- paint
- thermal conductivity
- conductive paint
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Abstract
The invention relates to a high-temperature resistant insulated thermally conductive paint with a low expansion coefficient. The paint is characterized in that shell powder is used to provide the high-temperature resistance and the insulating property, cubic boron nitride is used to provide the thermal conductivity and the insulating property, molybdenum disulfide is used to fill in the gas holes, high-temperature resistant resin is used to provide the high-temperature resistance and the binding property; and the thermally conductive paint comprises the following components by weight percent: 25-45% of shell powder, 30-50% of high-temperature resistant resin, 1-10% of cubic boron nitride, 1-5% of molybdenum disulfide, 0-5% of curing agent and 1-5% of diluent. The raw material shell powder of the insulated thermally conductive paint has wide resources and low price, thus reducing the cost of the insulated thermally conductive paint; the product has good thermal conductivity, the coefficient of thermal conduction is more than 8W/m.K, the expansion coefficient is less than 5*10<-6>/K; the paint can be sprayed, coated or soaked on the surface of an electronic circuit substrate; and the paint can satisfy the high-temperature resistant, insulating and thermally conductive demands of the electronic circuit substrate.
Description
Technical field
The present invention relates to a kind of low-expansion high-temperature insulation heat conduction lacquer, relate in particular to a kind of low-expansion high-temperature insulation heat conduction lacquer that is applied on the electronic circuit base board.
Background technology
The continuous development of the miniaturized of electronic devices and components, microminiaturization and integrated technology; The components and parts number that each unicircuit is comprised has surpassed 250000; Because the continuous development of VLSI (VLSIC), special unicircuit (ASIC), very high speed integrated circuit microelectronicss such as (VHSIC), the assembling of microelectronic device and equipment can cause heat to be difficult to spread and produce extreme relatively temperature.
Research shows that the heat flow density of chip-scale is up to 100W/cm
2It only hangs down two one magnitude than the heat flow density on sun surface; The temperature on sun surface can reach 6000 ℃, and the junction temperature of semiconductor integrated circuit chip should be lower than 100 ℃, so high heat flow density; If do not take rational thermal control technology, will have a strong impact on the thermal reliability of electronic devices and components and equipment.These heats all are the arch-criminals who causes product life to shorten even can't use.
The electronic component function has produced great amount of heat when improving day by day, if these heats can not in time be discharged, too high temperature rise meeting causes the shortening in electronic system fault and electronic product life-span.For electronic system and components and parts can be worked continually and steadily, carrying out effectively reliably to it, heat radiation is crucial.
Traditional electronic circuit board is difficult to provide its heat radiation for the hot assembly of height.(thermal conductivity is approximately 0.5～12W/mk) to the metal-based electronic circuit board, electrical insulation properties and machining property and more and more be used widely owing to have good thermal conductivity.The metal-based electronic circuit board mainly is made up of for three layers conductive metal film (like gold and silver, copper, aluminium, platinum etc.), heat conductive insulating layer and metal substrate; Conductive metal film is a pcb layer; Metal substrate adopts thermally conductive materials (thermal conductivity of aluminium: 270W/mk, the thermal conductivity 380W/mk of copper) such as aluminium or copper more, and the heat conductive insulating layer adopts import ceramic-base material more; Thermal conductivity 2.2W/mk; Can anti-reflow temperature 7～8 times non-foaming, homemade ceramics polymer material thermal conductivity 1.5W/mk, can anti-reflow temperature 1～2 time non-foaming.
Electronic product becomes inevitable to the feasible thermal conductivity that improves the heat conductive insulating layer of an urgent demand of heat sink material, the present invention provides a kind of high-temperature insulating paint with good heat-conducting that is used on the electronic circuit board.
Summary of the invention
The object of the invention provides the high-temperature insulation heat conduction lacquer of a kind of low bulk system, and this heat conduction lacquer is used for electronic circuit board, can promote the heat conductivility of substrate.
The present invention proposes a kind of low-expansion high-temperature insulation heat conduction lacquer that is used on the electronic circuit board; It is characterized in that; Adopt oyster shell whiting to provide high temperature resistant and insulativity; Cubic boron nitride provides heat conduction and insulativity, and molybdenumdisulphide is used for filling pore, and fire resistant resin provides high temperature resistant and adhesive effect.Its component and weight percent are: oyster shell whiting 25-45%, fire resistant resin 30-50%, cubic boron nitride 1-10%, molybdenumdisulphide 1-5%, solidifying agent 0-5%, thinner 1-5%.
Described oyster shell whiting is a raw material with shellfish shell such as oysters, through impurities removing, cleaning, 300 ℃ of fine powders that toast or calcine, pulverize, grind to form the 0.01-10 micron.
Described fire resistant resin is one or more a mixture of epoxy resin, resol, silicone resin etc.
Described cubic boron nitride specific volume resistance is 1.7 * 10 in the time of 20 ℃
5M is 2.3 * 10 in the time of 500 ℃
12M; Thermal conductivity is 12.3-28.9W/mK.
Described molybdenumdisulphide granularity is the 0.01-10 micron, and specific surface area is greater than 40m
2/ g.
The used raw material oyster shell whiting wide material sources of heat conductive insulating lacquer of the present invention, cheap, reduced the cost that heat conductive insulating coats with lacquer; The product heat conductivility is good, and thermal conductivity is greater than 8W/mK, and the coefficient of expansion is less than 5 * 10
-6/ K; The mode of can adopt spray, be coated with, soaking is coated on the surface of electronic circuit board; Can satisfy high temperature resistant, the insulation and the thermal conductivity of electronic circuit board work.
Embodiment
Embodiment one:
Choose 40g oyster shell whiting, 40g epoxy resin, 5g cubic boron nitride, 5g molybdenumdisulphide, the 5g anhydride curing agent, the agent of 5g acetone diluted makes the heat conduction lacquer, and its thermal conductivity is 8.2W/mK, and the coefficient of expansion is 4.6 * 10
-6/ K.
Embodiment two:
Choose 35g oyster shell whiting, 50g silicone resin, 8g cubic boron nitride, 5g molybdenumdisulphide, the agent of 2g acetone diluted, make the heat conduction lacquer, its thermal conductivity is 8.6W/mK, and the coefficient of expansion is 4.8 * 10
-6/ K.
Embodiment three:
Choose 35g oyster shell whiting, 45g resol, 10g cubic boron nitride, 5g molybdenumdisulphide, the agent of 5g acetone diluted, make the heat conduction lacquer, its thermal conductivity is 8.8W/mK, and the coefficient of expansion is 4.7 * 10
-6/ K.
Embodiment four:
Choose 40g oyster shell whiting, 30g resol, 10g epoxy resin, 10g cubic boron nitride, 6g molybdenumdisulphide, the agent of 4g acetone diluted, make the heat conduction lacquer, its thermal conductivity is 8.9W/mK, and the coefficient of expansion is 4.8 * 10
-6/ K.
Claims (3)
1. a low-expansion high-temperature insulation heat conduction lacquer is characterized in that its component and weight percent are: oyster shell whiting 25-45%; Fire resistant resin 30-50%, cubic boron nitride 1-10%, molybdenumdisulphide 1-5%; Solidifying agent 0-5%, thinner 1-5%, described oyster shell whiting are raw material with the shellfish shell; Through impurities removing, cleaning, 300 ℃ of fine powders that toast or calcine, pulverize, grind to form the 0.01-10 micron; Described cubic boron nitride thermal conductivity is 12.3-28.9W/mK, and described molybdenumdisulphide granularity is the 0.01-10 micron, and specific surface area is greater than 40m
2/ g.
2. a kind of low-expansion high-temperature insulation heat conduction lacquer as claimed in claim 1 is characterized in that, described fire resistant resin is one or more a mixture of epoxy resin, resol, silicone resin etc.。
3. a kind of low-expansion high-temperature insulation heat conduction lacquer as claimed in claim 1 is characterized in that its thermal conductivity is greater than 8W/mK, and the coefficient of expansion is less than 5 * 10
-6/ K.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010181416XA CN101942260B (en) | 2010-05-25 | 2010-05-25 | High-temperature resistant insulated thermally conductive paint with low expansion coefficient |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010181416XA CN101942260B (en) | 2010-05-25 | 2010-05-25 | High-temperature resistant insulated thermally conductive paint with low expansion coefficient |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101942260A CN101942260A (en) | 2011-01-12 |
| CN101942260B true CN101942260B (en) | 2012-09-05 |
Family
ID=43434471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010181416XA Expired - Fee Related CN101942260B (en) | 2010-05-25 | 2010-05-25 | High-temperature resistant insulated thermally conductive paint with low expansion coefficient |
Country Status (1)
| Country | Link |
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| CN (1) | CN101942260B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102850931A (en) * | 2012-09-05 | 2013-01-02 | 南通博宇机电有限公司 | Insulation paint for electric machinery electric appliances |
| CN103387792B (en) * | 2013-08-22 | 2015-08-19 | 苏州羽帆新材料科技有限公司 | A kind of insulation pigment |
| CN103555123A (en) * | 2013-09-25 | 2014-02-05 | 天长市天泰光电科技有限公司 | High temperature resistant heat radiation paint for LED lamp and preparation method thereof |
| CN104356861B (en) * | 2014-11-10 | 2017-12-19 | 兴化市兴成铜业有限公司 | The method of overlay film in composition and radome for covering dielectric film in radome |
| CN104726016A (en) * | 2015-03-30 | 2015-06-24 | 佛山市新战略知识产权文化有限公司 | High-temperature-resistant insulating paint and preparation method thereof |
| CN105038511A (en) * | 2015-08-21 | 2015-11-11 | 国网山东省电力公司临沂供电公司 | High-performance heat-conducting insulating varnish and preparation method thereof |
| TWI660006B (en) * | 2018-05-23 | 2019-05-21 | 興勤電子工業股份有限公司 | Silicone resin composition and silicone resin coating |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0430722A2 (en) * | 1989-12-01 | 1991-06-05 | Dainippon Ink And Chemicals, Inc. | Curable insulating material |
| CN101302392A (en) * | 2008-06-05 | 2008-11-12 | 吴江市太湖绝缘材料厂 | Insulating paint for high-temperature motor |
| CN101333314A (en) * | 2007-06-25 | 2008-12-31 | 晟茂（青岛）先进材料有限公司 | Heat conducting insulating film material and method for manufacturing same |
| CN101580626A (en) * | 2009-01-24 | 2009-11-18 | 南亚塑胶工业股份有限公司 | Resin composition with high thermal conductivity, no halogen and difficult fire retardance and pre-impregnated body and coating material thereof |
-
2010
- 2010-05-25 CN CN201010181416XA patent/CN101942260B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0430722A2 (en) * | 1989-12-01 | 1991-06-05 | Dainippon Ink And Chemicals, Inc. | Curable insulating material |
| CN101333314A (en) * | 2007-06-25 | 2008-12-31 | 晟茂（青岛）先进材料有限公司 | Heat conducting insulating film material and method for manufacturing same |
| CN101302392A (en) * | 2008-06-05 | 2008-11-12 | 吴江市太湖绝缘材料厂 | Insulating paint for high-temperature motor |
| CN101580626A (en) * | 2009-01-24 | 2009-11-18 | 南亚塑胶工业股份有限公司 | Resin composition with high thermal conductivity, no halogen and difficult fire retardance and pre-impregnated body and coating material thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101942260A (en) | 2011-01-12 |
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