CN101937729A - Method and device for electron beam irradiation processing - Google Patents

Method and device for electron beam irradiation processing Download PDF

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CN101937729A
CN101937729A CN 200910088626 CN200910088626A CN101937729A CN 101937729 A CN101937729 A CN 101937729A CN 200910088626 CN200910088626 CN 200910088626 CN 200910088626 A CN200910088626 A CN 200910088626A CN 101937729 A CN101937729 A CN 101937729A
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electron beam
beam irradiation
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CN101937729B (en
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刘耀红
唐华平
张化一
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Tongwei Xinda Technology Jiangsu Co ltd
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Nuctech Co Ltd
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Abstract

本发明公开了一种电子束辐照加工的方法,包括:(a)提供辐射透视检测装置(300);(b)利用辐射透视检测装置进行检测获得关于受辐照加工对象(10)的质量厚度(dρ)的信息的检测步骤;(c)提供电子束辐照加工装置(200);以及(d)通过控制装置(5)调节电子束辐照加工装置的电子束的能量(E),以使电子束的能量(E)与辐照加工对象的质量厚度(dρ)相匹配的调节步骤;以及(e)利用调节后的电子束辐照加工装置执行电子束辐照加工的加工步骤。通过采用上述技术方案,控制装置根据利用辐射透视检测装置获得有关质量厚度和物品长度的测量结果,对电子加速器进行相应的能量调整和/或扫描宽度进行实时调整,从而提高电子束的利用效率和加工效果。

Figure 200910088626

The invention discloses a method for electron beam irradiation processing, comprising: (a) providing a radiation perspective detection device (300); (b) using the radiation perspective detection device to detect and obtain the quality of an irradiated processing object (10) The detection step of the information of the thickness (dρ); (c) providing the electron beam irradiation processing device (200); and (d) adjusting the energy (E) of the electron beam of the electron beam irradiation processing device by the control device (5), an adjustment step of matching the energy (E) of the electron beam to the mass thickness (dρ) of the irradiated processing object; and (e) a processing step of performing electron beam irradiation processing using the adjusted electron beam irradiation processing device. By adopting the above technical solution, the control device adjusts the corresponding energy of the electron accelerator and/or adjusts the scanning width in real time according to the measurement results of the mass thickness and the length of the object obtained by the radiation perspective detection device, so as to improve the utilization efficiency of the electron beam and Processing effect.

Figure 200910088626

Description

电子束辐照加工的方法和装置 Method and device for electron beam irradiation processing

技术领域technical field

本发明涉及辐照加工领域,特别是使用电子加速器进行辐照加工的领域。更具体地说,本发明涉及一种新型的电子束辐照加工的方法和装置,其提高了电子束辐照加工的效率。The invention relates to the field of radiation processing, especially the field of radiation processing using electron accelerators. More specifically, the present invention relates to a novel method and device for electron beam irradiation processing, which improves the efficiency of electron beam irradiation processing.

背景技术Background technique

电子加速器是一种用于在真空中利用电磁场将带电粒子加速到很高能量的装置,其核心部件为使电子获得加速的加速管。电子加速器作为可控的射线源装置,在辐照加工中具有能量高、功率大、效率高、处理速度快、安全性能好等优点。目前,电子加速器已广泛应用于高分子材料制备、食品贮藏保鲜、医疗用品辐射消毒、药品辐射灭菌、商品辐照养护、水晶及珍珠等辐照着色以及环境污染物辐射处理等各个领域。An electron accelerator is a device used to accelerate charged particles to very high energies by using an electromagnetic field in a vacuum. Its core component is an accelerating tube that accelerates electrons. As a controllable ray source device, the electron accelerator has the advantages of high energy, high power, high efficiency, fast processing speed, and good safety performance in irradiation processing. At present, electron accelerators have been widely used in various fields such as preparation of polymer materials, food storage and preservation, radiation disinfection of medical supplies, radiation sterilization of drugs, radiation maintenance of commodities, radiation coloring of crystals and pearls, and radiation treatment of environmental pollutants.

现有的辐照加工系统,通常包括电子加速器、物品传输装置、辐射防护装置和控制电子加速器和物品传输装置等的操作的控制装置。具体地,电子加速器用于产生一定能量、一定扫描宽度的电子束;物品传输装置承载受辐照对象以一定的速度通过电子束辐射区域,使受辐照对象受到电子束辐照达到预定的加工目的;辐射防护装置对电子束辐射区域进行辐射屏蔽;以及控制装置控制电子加速器与物品传输装置等各个部分的运行。Existing irradiation processing systems generally include an electron accelerator, an object conveying device, a radiation protection device, and a control device for controlling the operation of the electron accelerator and the object conveying device. Specifically, the electron accelerator is used to generate an electron beam with a certain energy and a certain scanning width; the object conveying device carries the irradiated object through the electron beam radiation area at a certain speed, so that the irradiated object is irradiated by the electron beam to achieve the predetermined processing Purpose: the radiation protection device performs radiation shielding on the electron beam radiation area; and the control device controls the operation of various parts such as the electron accelerator and the item transmission device.

现有的辐照加工中,电子束的利用效率最高可以到接近80%,还有相当一部分不能利用,其关键原因是受辐照对象的质量厚度dρ(沿厚度方向物品平均密度ρ与厚度dρ的乘积)不能与加速器输出能量不能最佳化匹配的制约。对于每个辐照加工系统,其最佳的质量厚度与其加速器的能量对应,是一个确定的数。如果受辐照对象的质量厚度dρ大了,则电子束照不透,辐照不均匀,达不到辐照处理效果;如果受辐照对象的质量厚度dρ过小,则电子束大部分穿透了受辐照对象,电子束的利用效率不高。In the existing irradiation processing, the utilization efficiency of the electron beam can be up to nearly 80%, and a considerable part cannot be used. The key reason is that the mass thickness dρ of the irradiated object (the average density ρ of the object along the thickness direction and the thickness dρ The product of ) cannot be optimally matched with the accelerator output energy. For each irradiation processing system, its optimal mass thickness corresponds to the energy of its accelerator, which is a definite number. If the mass thickness dρ of the irradiated object is too large, the electron beam will not be able to penetrate, the irradiation will be uneven, and the irradiation treatment effect will not be achieved; if the mass thickness dρ of the irradiated object is too small, most of the electron beam will pass through Through the irradiated object, the utilization efficiency of the electron beam is not high.

现有技术中,受辐照对象通常都是具有一定包装的整包产品,其包装内部物品的质量厚度dρ通常只能简单地进行平均估算,而缺乏精确的测量手段,由于必须保证辐照加工效果,通常受辐照对象的厚度控制在其质量厚度dρ比最佳质量厚度保守地小10%~15%,故较大地影响了电子束的利用效率。In the prior art, the irradiated objects are usually packaged products with a certain package, and the mass thickness dρ of the items inside the package can only be estimated simply on the average, and there is a lack of accurate measurement methods. As a result, the thickness of the object to be irradiated is usually controlled so that its mass thickness dρ is conservatively smaller than the optimal mass thickness by 10% to 15%, so the utilization efficiency of the electron beam is greatly affected.

另外,由于对具有一定包装的受辐照对象,其包装内部物品的质量厚度dρ通常只能简单地进行平均估算,而缺乏精确的测量手段,从而不能鉴别被检测物品的组成和结构。由此,也不能准确地判断被检测物品是否适合符合电子束辐照安全。In addition, for irradiated objects with a certain package, the mass thickness dρ of the items inside the package can only be estimated simply on average, and there is a lack of accurate measurement means, so that the composition and structure of the tested items cannot be identified. Therefore, it is also impossible to accurately determine whether the inspected item is suitable for complying with electron beam irradiation safety.

此外,除了被检测物品在厚度方向上的质量厚度dρ通常只能简单地进行平均估算之外,在被检测物品的长度方向上,即沿物品传输装置的输送方向上,也存在受辐照对象的长度不能与加速器的扫描宽度不能最佳化匹配的问题。同样地,为了保证辐照加工效果,加速器的扫描宽度将较大地大于估计的受辐照对象的长度,故同样地较大地影响了电子束的利用效率。In addition, in addition to the mass thickness dρ of the inspected article in the thickness direction, which can only be estimated simply by average, there are also irradiated objects in the length direction of the inspected article, that is, along the conveying direction of the article conveying device The problem that the length of the sensor cannot be optimally matched to the scan width of the accelerator. Similarly, in order to ensure the irradiation processing effect, the scanning width of the accelerator will be larger than the estimated length of the irradiated object, so the utilization efficiency of the electron beam is also greatly affected.

发明内容Contents of the invention

鉴于此,本发明的目的旨在解决现有技术中存在的上述问题和缺陷的至少一个方面。In view of this, the purpose of the present invention is to solve at least one aspect of the above-mentioned problems and deficiencies in the prior art.

本发明的目的之一在于提供一种提高效率的电子束辐照加工方法和装置,其通过获取有关受辐照加工对象的质量厚度的信息,并基于该质量厚度的信息,使受辐照对象的质量厚度与加速器输出能量最佳化匹配,从而提高了电子束的利用效率。One of the objects of the present invention is to provide an electron beam irradiation processing method and device with improved efficiency, which obtains information about the mass thickness of the irradiated processing object, and based on the information of the mass thickness, makes the irradiated object The thickness of the mass is optimally matched with the output energy of the accelerator, thereby improving the utilization efficiency of the electron beam.

本发明的另一目的在于提供一种提高效率的电子束辐照加工方法和装置,其通过获取有关受辐照加工对象的长度的信息,并基于该长度信息,使受辐照对象的长度与加速器的扫描宽度最佳化匹配,从而提高了电子束的利用效率。Another object of the present invention is to provide an electron beam irradiation processing method and device with improved efficiency, which obtains information about the length of the irradiated processing object, and based on the length information, makes the length of the irradiated object and The scan width of the accelerator is optimally matched, thereby improving the utilization efficiency of the electron beam.

根据本发明的一个方面,其提供一种电子束辐照加工的方法,包括:According to one aspect of the present invention, it provides a method for electron beam irradiation processing, comprising:

(a)提供辐射透视检测装置;(a) provide radiographic detection devices;

(b)利用辐射透视检测装置进行检测获得关于受辐照加工对象的质量厚度(dρ)的信息的检测步骤;(b) The detection step of obtaining information about the mass thickness (dρ) of the irradiated processed object through detection by means of a radioscopic detection device;

(c)提供电子束辐照加工装置;以及(c) provide electron beam irradiation processing equipment; and

(d)通过控制装置调节电子束辐照加工装置的电子束的能量(E),以使电子束的能量(E)与辐照加工对象的质量厚度(dρ)相匹配的调节步骤;以及(d) adjusting the energy (E) of the electron beam of the electron beam irradiation processing device by the control device, so that the energy (E) of the electron beam matches the mass thickness (dρ) of the irradiated processing object; and

(e)利用调节后的电子束辐照加工装置执行电子束辐照加工的加工步骤。(e) A processing step of performing electron beam irradiation processing using the adjusted electron beam irradiation processing apparatus.

进一步地,所述检测步骤(b)还包括利用辐射透视检测装置获得关于受辐照加工对象的长度(L)的信息的步骤;所述调节步骤(d)还包括通过控制装置调节电子束辐照加工装置的电子束的扫描宽度(W),以使电子束的扫描宽度(W)与辐照加工对象的长度(L)的相匹配的步骤。Further, the detection step (b) also includes the step of obtaining information about the length (L) of the irradiated processing object by using a radioscopic detection device; the adjustment step (d) also includes a step of adjusting the electron beam radiation Irradiate the scanning width (W) of the electron beam of the processing device, so that the scanning width (W) of the electron beam matches the length (L) of the irradiated processing object.

具体地,在所述调节步骤(d)中,通过调节所述电子束的能量(E),以使所述电子束的能量(E)与辐照加工对象的质量厚度(dρ)满足一定的函数关系(f),即E=f(dρ)。Specifically, in the adjusting step (d), the energy (E) of the electron beam is adjusted so that the energy (E) of the electron beam and the mass thickness (dρ) of the irradiated processing object meet a certain Functional relationship (f), ie E=f(dρ).

更具体地,对于能量高于1MeV的电子束辐照加工装置,如果受辐照对象是单面辐照,则函数关系(f)为:E=2.63dρ+0.32;如果受辐照对象是双面辐照,则函数关系(f)为:E=1.19dρ+0.32,其中式中,电子束能量E的单位为MeV,物品质量厚度dρ的单位是g/cm2。More specifically, for an electron beam irradiation processing device with an energy higher than 1 MeV, if the irradiated object is irradiated on one side, the functional relationship (f) is: E=2.63dρ+0.32; if the irradiated object is double-sided For surface irradiation, the functional relationship (f) is: E=1.19dρ+0.32, where the unit of electron beam energy E is MeV, and the unit of item mass thickness dρ is g/cm2.

在一种具体实施方式中,所述电子束辐照加工的电子束的能量(E)具有最小值Emin和最大值Emax,如果所述调节步骤(d)中调节后的电子束的能量(E)不满足Emin≤E≤Emax,则进一步包括通过控制装置给出报警的步骤。In a specific embodiment, the energy (E) of the electron beam processed by the electron beam irradiation has a minimum value Emin and a maximum value Emax, if the energy (E) of the electron beam adjusted in the adjusting step (d) ) does not satisfy Emin≤E≤Emax, it further includes the step of giving an alarm through the control device.

在上述技术方案中,如需要调整的电子束的能量(E)大于Emax,则控制装置给出受辐照对象质量厚度过大,并且要求将受辐照对象的厚度降低到可接受的范围的提示信息。In the above-mentioned technical scheme, if the energy (E) of the electron beam to be adjusted is greater than Emax, the control device gives that the mass thickness of the irradiated object is too large, and requires the thickness of the irradiated object to be reduced to an acceptable range. Prompt information.

在上述技术方案中,如果需要调整的电子束的能量(E)小于Emin,则控制装置控制电子束辐照加工装置将其输出电子束能量调整到Emin,并且给出要求将对受辐照对象的厚度增加到适当范围的提示信息。In the above technical scheme, if the energy (E) of the electron beam that needs to be adjusted is less than Emin, the control device controls the electron beam irradiation processing device to adjust the output electron beam energy to Emin, and gives the requirement that the irradiated object The prompt message for increasing the thickness to the appropriate range.

在一种具体实施方式中,所述检测步骤(b)还包括:利用辐射透射检测装置获得有关受辐照加工对象的透视图像的步骤。In a specific implementation manner, the detection step (b) further includes: using a radiation transmission detection device to obtain a perspective image of the irradiated processing object.

根据本发明的另一方面,其提供一种电子束辐照加工系统,包括:电子束辐照加工装置,其包括电子加速器,以提供电子束对受辐照加工对象进行扫描;辐射透视检测装置,其包括辐射源;探测器阵列;信号分析处理装置,用于获得关于受辐照加工对象的质量厚度和/或长度的信息;以及控制装置,其用于控制所述电子束辐照加工装置和所述辐射透视检测装置的操作,并且对所述电子加速器的电子束的能量和/或扫描宽度进行调节,以使所述电子加速器的电子束的能量和/或扫描宽度与受辐照加工对象的质量厚度和/或长度相匹配。According to another aspect of the present invention, it provides an electron beam irradiation processing system, comprising: an electron beam irradiation processing device, which includes an electron accelerator, to provide electron beams to scan an irradiated processing object; a radiation perspective detection device , which includes a radiation source; a detector array; a signal analysis and processing device for obtaining information about the mass thickness and/or length of an irradiated processing object; and a control device for controlling said electron beam irradiation processing device and the operation of the radiation perspective detection device, and adjust the energy and/or scan width of the electron beam of the electron accelerator, so that the energy and/or scan width of the electron beam of the electron accelerator are consistent with the irradiated processing Object mass thickness and/or length match.

具体地,上述电子束辐照加工系统还包括:传输装置,其用于输送受辐照加工对象沿第一方向先后经过辐射透视检测装置和电子束辐照加工装置,以进行辐射透视检测和电子束辐照加工操作。Specifically, the above-mentioned electron beam irradiation processing system further includes: a conveying device, which is used to transport the irradiated processing object successively through the radiation perspective detection device and the electron beam irradiation processing device along the first direction, so as to perform radiation perspective detection and electron beam irradiation processing. Beam irradiation processing operations.

在一种实施方式中,所述电子束辐照加工装置和辐射透视检测装置分别由辐射防护装置围绕,以防止其相互之间产生信号干扰。In one embodiment, the electron beam irradiation processing device and the radiation perspective detection device are respectively surrounded by radiation protection devices to prevent signal interference between them.

在一种具体实施方式中,所述电子束辐照加工装置和辐射透视检测装置的中心出束方向沿第二方向延伸并且大体平行,所述第二方向与所述传输装置输送受辐照加工对象的第一方向大体垂直。In a specific embodiment, the central beam output direction of the electron beam irradiation processing device and the radiation fluoroscopy detection device extends along a second direction and is substantially parallel, and the second direction is the same as the transmission device transporting the irradiated processing The first direction of the object is substantially vertical.

本发明中上述技术方案中的不特定一个方面至少具有下述优点和有益效果:An unspecified aspect of the above-mentioned technical solutions in the present invention has at least the following advantages and beneficial effects:

本发明提供了一种提高效率的电子束辐照加工方法和装置,其中根据本发明的电子束辐照加工系统可以包括由作为电子辐照加工装置的电子加速器、作为辐射透视检测装置的低能X射线装置、探测器阵列、信号分析处理装置、控制装置等组成,其中低能X射线装置与电子加速器可以先后安装在同一物品传输装置上,低能X射线装置等对受辐照对象先进行质量厚度和/或物品长度的测量,控制装置根据有关质量厚度和物品长度的测量结果,对电子加速器进行相应的能量调整和/或扫描宽度进行实时调整,从而提高电子束的利用效率并保障辐照加工效果,进而提高了辐照加工处理系统的经济效益。The present invention provides an electron beam irradiation processing method and device with improved efficiency, wherein the electron beam irradiation processing system according to the present invention may include an electron accelerator as an electron irradiation processing device, and a low-energy X-ray as a radiation perspective detection device. X-ray device, detector array, signal analysis and processing device, control device, etc., in which the low-energy X-ray device and the electron accelerator can be installed on the same item transmission device successively, and the low-energy X-ray device first performs the mass thickness measurement of the irradiated object. /or the measurement of the length of the item, the control device adjusts the corresponding energy of the electron accelerator and/or adjusts the scanning width in real time according to the measurement results of the relevant mass thickness and the length of the item, so as to improve the utilization efficiency of the electron beam and ensure the irradiation processing effect , thus improving the economic benefits of the irradiation processing system.

相对现有技术的方法和装置,根据本发明的方法和装置成本增加不多,使受辐照对象厚度和长度尽可能接近电子加速器的最佳质量厚度和/或最佳长度,提高了电子束的利用效率并保障辐照加工效果,从而辐照加工处理系统的经济效益得到改善。Compared with the methods and devices of the prior art, the cost of the method and device of the present invention is not much increased, the thickness and length of the irradiated object are as close as possible to the optimum quality thickness and/or optimum length of the electron accelerator, and the electron beam is improved. The utilization efficiency of the radiation processing system can be improved and the radiation processing effect can be guaranteed, so that the economic benefits of the radiation processing system can be improved.

进一步地,当根据有关质量厚度和物品长度的测量结果,对电子加速器进行相应的能量调整和扫描宽度进行的实时调整超出了电子加速器的能量调整和扫描宽度的限值时,可以提示工作人员对受辐照对象的堆码方式进行调整来达到最佳的质量厚度和扫描宽度,从而最大化电子束的利用效率并保障辐照加工效果。Further, when the corresponding energy adjustment and real-time adjustment of the scanning width of the electron accelerator according to the measurement results of the mass thickness and the length of the article exceed the limits of the energy adjustment and scanning width of the electron accelerator, the staff can be prompted to correct The stacking method of the irradiated objects is adjusted to achieve the best mass thickness and scanning width, so as to maximize the utilization efficiency of the electron beam and ensure the irradiation processing effect.

另外,通过采用本发明中的用于提高效率的电子束辐照加工方法和装置,其中辐射装置,例如低能X射线装置在进行质量厚度和长度测量的同时,信号分析处理装置对探测器阵列获取信号的进一步分析处理可以给出受辐照对象的透视图像,从而使得工作人员可以辨别包装箱内物品是否与标识相符,进而判断待辐射加工的物品是否符合电子束辐照安全。此外,还可以将辐射成像系统获取的图像进行存档,以作为辐照加工系统加工处理记录的补充资料。In addition, by adopting the electron beam irradiation processing method and device for improving efficiency in the present invention, wherein the radiation device, such as a low-energy X-ray device, is measuring the mass thickness and length, the signal analysis and processing device acquires the detector array Further analysis and processing of the signal can give a perspective image of the irradiated object, so that the staff can identify whether the items in the packing box are consistent with the logo, and then judge whether the items to be irradiated are safe for electron beam irradiation. In addition, the images acquired by the radiation imaging system can also be archived as supplementary information for the processing records of the radiation processing system.

附图说明Description of drawings

下面参照附图对根据本发明实施方式的提高效率的电子束辐照加工方法和装置进行说明,其中:The electron beam irradiation processing method and device for improving efficiency according to the embodiments of the present invention will be described below with reference to the accompanying drawings, wherein:

图1是根据本发明的改进的电子束辐照加工系统的结构的截面示意图;Fig. 1 is a schematic cross-sectional view of the structure of an improved electron beam irradiation processing system according to the present invention;

图2是显示利用辐射装置对受辐照对象进行辐射成像检测的结构示意图;Fig. 2 is a structural schematic diagram showing the radiation imaging detection of the irradiated object by using the radiation device;

图3是显示利用根据辐射成像装置获得的信息调整后的电子加速器对受辐照对象进行加工的结构示意图;以及Fig. 3 is a schematic diagram showing the structure of processing an irradiated object by using an electron accelerator adjusted according to information obtained by a radiation imaging device; and

图4是显示如何调整电子加速器的能量范围和扫描宽度的示意图。Fig. 4 is a schematic diagram showing how to adjust the energy range and scan width of the electron accelerator.

具体实施方式Detailed ways

下面通过实施例,并结合附图,对本发明的技术方案作进一步具体的说明。在说明书中,相同或相似的附图标号指示相同或相似的部件。下述参照附图对本发明实施方式的说明旨在对本发明的总体发明构思进行解释,而不应当理解为对本发明的一种限制。The technical solutions of the present invention will be further specifically described below through the embodiments and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals designate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention, but should not be construed as a limitation of the present invention.

附图1表示了一种提高效率的电子束辐照加工方法和装置的具体布置方案。参见图1,根据本发明一种实施方式的电子束辐照加工系统100,包括:电子束辐照加工装置200,其包括电子加速器1,以提供电子束8对受辐照加工对象10进行扫描;辐射透视检测装置300,其包括辐射源2;探测器阵列3;信号分析处理装置4,用于获得关于受辐照加工对象10的质量厚度dρ和/或长度L的信息;以及控制装置5,其用于控制所述电子束辐照加工装置200和所述辐射透视检测装置300的操作,并且对所述电子加速器1的电子束的能量E和/或扫描宽度W进行调节,以使所述电子加速器1的电子束的能量E和/或扫描宽度W与受辐照加工对象的质量厚度dρ和/或长度L相匹配。Accompanying drawing 1 has shown a kind of electron beam irradiation processing method and the specific arrangement scheme of device of improving efficiency. Referring to FIG. 1 , an electron beam irradiation processing system 100 according to an embodiment of the present invention includes: an electron beam irradiation processing device 200 including an electron accelerator 1 to provide an electron beam 8 to scan an irradiated processing object 10 Radiation perspective detection device 300, which includes radiation source 2; Detector array 3; Signal analysis and processing device 4, used to obtain information about the mass thickness dp and/or length L of the irradiated processing object 10; and control device 5 , which is used to control the operation of the electron beam irradiation processing device 200 and the radiation perspective detection device 300, and adjust the energy E and/or scan width W of the electron beam of the electron accelerator 1, so that all The energy E and/or scan width W of the electron beam of the electron accelerator 1 is matched with the mass thickness dρ and/or length L of the irradiated processing object.

进一步地,参见图1,该电子束辐照加工系统100还包括:传输装置6,其用于输送受辐照加工对象10沿预定方向,例如图1中的水平方向,先后经过辐射透视检测装置300和电子束辐照加工装置200,以进行辐射透视检测和电子束辐照加工操作。Further, referring to FIG. 1, the electron beam irradiation processing system 100 also includes: a transport device 6, which is used to transport the irradiated processing object 10 along a predetermined direction, such as the horizontal direction in FIG. 300 and electron beam irradiation processing device 200 to perform radiographic inspection and electron beam irradiation processing operations.

在本发明中的具体实施方式中,辐射源2为低能X射线辐射源,但是本发明并不仅限于此,例如也可以是γ射线源或同位素源。参见图1,低能X射线装置300和电子加速器1按照受辐照对象10的传输方向11,例如图1所示的水平方向先后安装在同一物品传输装置6上方,探测器阵列3安装在传输装置6下方与低能X射线装置300对应的位置。具体地,如图2所示,探测器阵列3由一系列小型探测器单元31组成,例如每一个探测器均通过信号连线32与信号分析处理装置4相连。In a specific embodiment of the present invention, the radiation source 2 is a low-energy X-ray radiation source, but the present invention is not limited thereto, for example, it may also be a γ-ray source or an isotope source. Referring to Fig. 1, the low-energy X-ray device 300 and the electron accelerator 1 are successively installed above the same object conveying device 6 according to the conveying direction 11 of the irradiated object 10, for example, the horizontal direction shown in Fig. 1 , and the detector array 3 is installed on the conveying device The position below 6 corresponds to the low-energy X-ray device 300. Specifically, as shown in FIG. 2 , the detector array 3 is composed of a series of small detector units 31 , for example, each detector is connected to the signal analysis and processing device 4 through a signal connection line 32 .

参见图1,在一种实施方式中,电子束辐照加工装置200和辐射透视检测装置300分别由辐射防护装置7围绕,以防止其相互之间产生信号干扰。具体地,如图1所示,辐射防护装置7安装在传输装置6、电子加速器1、低能X射线装置300、探测器阵列3的外侧,用于分别屏蔽电子加速器1产生的电子束8辐射和低能X射线装置300产生的X射线9辐射,并防止电子加速器1产生的电子束8和X射线直接到达探测器阵列3。Referring to FIG. 1 , in one embodiment, the electron beam irradiation processing device 200 and the radiation perspective detection device 300 are respectively surrounded by radiation protection devices 7 to prevent signal interference between them. Specifically, as shown in Figure 1, the radiation protection device 7 is installed on the outside of the transmission device 6, the electron accelerator 1, the low-energy X-ray device 300, and the detector array 3, and is used to shield the electron beam 8 radiation and The X-ray 9 generated by the low-energy X-ray device 300 radiates and prevents the electron beam 8 and X-ray generated by the electron accelerator 1 from directly reaching the detector array 3 .

进一步地,信号分析处理装置4安装在辐射防护装置7外侧,分别与探测器阵列3和控制装置5相连,它从探测器阵列3获得有关透射过被检测对象10的X射线衰减量的信号,经过分析处理后传送给控制装置5,控制装置5控制整个电子束辐照加工系统100的工作和运行。电子束辐照加工装置200和辐射透视检测装置300的中心出束方向大体沿图1中垂直方向延伸并且大体平行,该出束方向与所述传输装置6输送受辐照加工对象10的输送方向11大体垂直。Further, the signal analysis and processing device 4 is installed on the outside of the radiation protection device 7 and is respectively connected to the detector array 3 and the control device 5, and it obtains signals about the attenuation of X-rays transmitted through the detected object 10 from the detector array 3, After analysis and processing, it is sent to the control device 5, and the control device 5 controls the work and operation of the entire electron beam irradiation processing system 100. The central beam output direction of the electron beam irradiation processing device 200 and the radiation perspective detection device 300 generally extends along the vertical direction in FIG. 11 is roughly vertical.

低能X射线透视成像在现有技术中主要是获取物品的透视图像为目的,其基本原理如下:X射线源发射的X射线穿透被检查物品时,不同物质对X射线的吸收率不一致,未被吸收的X射线被探测器采集后,会转换成强弱不同的电信号,对该电信号进行采集和处理,可以转换成数字信号以获得有关被检测物品的精确图像。本发明是利用这种技术的原理,以输出物品的质量厚度信息及宽度数据为主要目的,图像信息作为辅助存档功能。下面结合图2对根据本发明的实施方式中的低能X射线透视检测装置300的操作进行说明。In the prior art, low-energy X-ray fluoroscopic imaging is mainly for the purpose of obtaining the fluoroscopic image of the object. The basic principle is as follows: when the X-ray emitted by the X-ray source penetrates the object to be inspected, the absorption rate of X-ray by different substances is inconsistent, and there is no After the absorbed X-rays are collected by the detector, they will be converted into electrical signals with different strengths. The electrical signals are collected and processed, and can be converted into digital signals to obtain accurate images of the detected items. The present invention utilizes the principle of this technology to output the mass thickness information and width data of the article as the main purpose, and the image information as the auxiliary archiving function. The operation of the low-energy X-ray fluoroscopy detection device 300 according to the embodiment of the present invention will be described below with reference to FIG. 2 .

参见图2,低能X射线装置300产生一定强度的低能X射线9,低能X射线9穿透受辐照对象10并到达探测器阵列3。低能X射线9在穿透受辐照对象10时其强度受到削弱而衰减,其衰减的程度与受辐照对象10的质量厚度dρ相关即:受辐照对象的质量厚度dρ越大,则低能X射线衰减越多,到达受辐照对象10下方的探测器阵列3中对应探测器单元31的X射线就越少,探测器输出的信号也越低;相反,如果受辐照对象10的质量厚度dρ越小,则对应探测器31输出的信号越大,在没有受辐照对象10遮挡的边缘区域,对应探测器31输出的信号最大。探测器阵列3的每个探测器31信号送到信号分析处理装置4,经过分析和处理可以得到反映受辐照对象10精细结构的信息和数据,包括每个探测器31上方位置的物品的质量厚度dρ、物品的宽度L等,进一步处理可以获得受辐照对象的精细透视图像。Referring to FIG. 2 , the low-energy X-ray device 300 generates low-energy X-rays 9 of a certain intensity, and the low-energy X-rays 9 penetrate the irradiated object 10 and reach the detector array 3 . When the low-energy X-ray 9 penetrates the irradiated object 10, its intensity is weakened and attenuated, and the degree of attenuation is related to the mass thickness dρ of the irradiated object 10. The more X-rays are attenuated, the less X-rays that reach the corresponding detector unit 31 in the detector array 3 below the irradiated object 10, and the lower the output signal of the detector; on the contrary, if the quality of the irradiated object 10 The smaller the thickness dρ is, the larger the signal output by the detector 31 is, and the signal output by the detector 31 is the largest in the edge area not shielded by the irradiated object 10 . The signal of each detector 31 of the detector array 3 is sent to the signal analysis and processing device 4, and after analysis and processing, information and data reflecting the fine structure of the irradiated object 10 can be obtained, including the quality of the items above each detector 31 Thickness dρ, width L of the item, etc., further processing can obtain a fine perspective image of the irradiated object.

下面结合附图3对根据本发明具体实施方式中的电子束辐照加工装置200的操作进行具体说明。参见图3,电子加速器1是电子束辐照加工装置200的主体设备,其用于产生辐照加工的电子束8,输出电子束8的能量E及扫描宽度W通常可以在一定范围内调整,其工作受控于控制装置5。在该实施方式中,控制装置5既控制电子束辐照加工装置200,同时也控制辐射透视检测装置300的操作。只要控制装置5从功能上能够实现上述两个方面的操作,其具体形式,例如采用单个或多个组合的或分立的控制单元的形式不受限制。The operation of the electron beam irradiation processing device 200 according to the specific embodiment of the present invention will be described in detail below with reference to FIG. 3 . Referring to Fig. 3, the electron accelerator 1 is the main equipment of the electron beam irradiation processing device 200, which is used to generate the electron beam 8 for irradiation processing, and the energy E and scanning width W of the output electron beam 8 can usually be adjusted within a certain range, Its work is controlled by the control device 5 . In this embodiment, the control device 5 not only controls the electron beam irradiation processing device 200 , but also controls the operation of the radiation fluoroscopy detection device 300 . As long as the control device 5 can functionally realize the operations of the above two aspects, its specific form, such as the form of single or multiple combined or separate control units, is not limited.

为了使电子加速器1产生的电子束8得到最大的利用,通常其能量E与受辐照对象10的质量厚度dρ形成一定的匹配关系,使受辐照对象10的各个深度都受到了辐照,而电子束又不会大量穿透形成浪费。如果电子束的能量过高,则有大量电子束8穿透受辐照对象10,形成浪费;如果电子束8的能量过低,则电子束8不能穿透到物品深度较大的位置,物品不能得到均匀辐照,辐照加工效果达不到要求。电子加速器的能量E要与受辐照对象的质量厚度dρ匹配,但是他通常只能在一定的范围内调整,具有最大可调能量Emax,及最小可调能量Emin的限制,即电子加速器产生的电子束符合下述要求:In order to maximize the utilization of the electron beam 8 produced by the electron accelerator 1, usually its energy E forms a certain matching relationship with the mass thickness dρ of the irradiated object 10, so that each depth of the irradiated object 10 is irradiated, And the electron beam will not penetrate a large amount to form waste. If the energy of the electron beam is too high, a large amount of electron beams 8 will penetrate the irradiated object 10, which will cause waste; Uniform irradiation cannot be obtained, and the irradiation processing effect cannot meet the requirements. The energy E of the electron accelerator should match the mass thickness dρ of the irradiated object, but it can usually only be adjusted within a certain range, with the limitation of the maximum adjustable energy Emax and the minimum adjustable energy Emin, that is, the electron accelerator produces Electron beams meet the following requirements:

EE. == ff (( dρdρ )) EE. minmin ≤≤ EE. ≤≤ EE. maxmax

其中E=f(dρ)表示电子束能量E与受辐照对象质量厚度dρ的函数关系。具体地,对于能量高于1MeV的电子束辐照系统,如果受辐照对象如果是单面辐照,则:Where E=f(dρ) represents the functional relationship between the electron beam energy E and the mass thickness dρ of the irradiated object. Specifically, for an electron beam irradiation system with an energy higher than 1MeV, if the irradiated object is irradiated on one side, then:

E=2.63dρ+0.32;E=2.63dρ+0.32;

受辐照对象如果是双面辐照,则:If the irradiated object is irradiated on both sides, then:

E=1.19dρ+0.32;E=1.19dρ+0.32;

式中,电子束能量E的单位为MeV,物品质量厚度dρ的单位是g/cm2。In the formula, the unit of electron beam energy E is MeV, and the unit of item mass thickness dρ is g/cm2.

为使电子加速器1产生的电子束8获得最大的利用,需要电子束8的扫描宽度W通常与受辐照对象的实际宽度L一致,这样即不会因为电子束扫描宽度W过窄而存在辐照不到的区域,也不会因为电子束扫描宽度W过大而产生电子束8的浪费。In order to obtain the maximum utilization of the electron beam 8 produced by the electron accelerator 1, the scan width W of the electron beam 8 is generally consistent with the actual width L of the irradiated object, so that there will be no radiation due to the too narrow scan width W of the electron beam. In areas that cannot be irradiated, the electron beam 8 will not be wasted because the electron beam scanning width W is too large.

下面结合附图4,对根据本发明具体实施方式中实现根据受辐照对象10的信息进行电子束能量E及扫描宽度W自动调整的结构和操作进行说明。参见图4,电子加速器1由加速器控制装置12、电子枪电源13、电子枪14、脉冲功率源15、微波功率源16、加速管17、扫描电源18、扫描磁铁19和扫描盒20等组成。其工作原理如下:电子枪14在电子枪电源13的作用下产生电子束流8进入加速管17。与此同时,脉冲功率源15产生的脉冲功率驱动微波功率源16产生微波功率,微波功率进入加速管17,在加速管17中电子束受到微波功率作用形成高能电子束流8并进入扫描盒20。电子束流8在扫描盒20中受到扫描磁铁19的作用被扫描成扇形分布并最终引出。The structure and operation of realizing the automatic adjustment of electron beam energy E and scan width W according to the information of the irradiated object 10 according to the specific embodiment of the present invention will be described below with reference to FIG. 4 . 4, the electron accelerator 1 is composed of an accelerator control device 12, an electron gun power supply 13, an electron gun 14, a pulse power source 15, a microwave power source 16, an accelerating tube 17, a scanning power supply 18, a scanning magnet 19, and a scanning box 20. Its working principle is as follows: the electron gun 14 generates an electron beam 8 under the action of the electron gun power supply 13 and enters the accelerating tube 17 . At the same time, the pulse power generated by the pulse power source 15 drives the microwave power source 16 to generate microwave power, and the microwave power enters the accelerating tube 17, and the electron beam in the accelerating tube 17 is subjected to the microwave power to form a high-energy electron beam 8 and enters the scanning box 20 . The electron beam 8 is scanned in a fan-shaped distribution under the action of the scanning magnet 19 in the scanning box 20 and finally drawn out.

根据辐射透视检测装置300进行检测获得关于受辐照加工对象10的质量厚度dρ的信息,当需要对电子束8的能量进行调整时,控制装置5将能量调整的指令发送给加速器控制装置12,加速器控制装置12控制脉冲功率源15的输出功率。当脉冲功率发生变化时,微波功率也相应的变化,在加速管17中,由于微波功率的变化,电子束流8受微波功率的作用效果也发生变化,最终表现为电子束的能量E发生变化。The information about the mass thickness dρ of the irradiated processing object 10 is obtained through detection by the radiation perspective detection device 300. When the energy of the electron beam 8 needs to be adjusted, the control device 5 sends an energy adjustment instruction to the accelerator control device 12, The accelerator control device 12 controls the output power of the pulse power source 15 . When the pulse power changes, the microwave power also changes accordingly. In the accelerating tube 17, due to the change of the microwave power, the effect of the microwave power on the electron beam 8 also changes, and finally the energy E of the electron beam changes. .

根据辐射透视检测装置300进行检测获得关于受辐照加工对象10的长度L的信息,当需要对电子束8的扫描宽度W进行调整时,控制装置5将扫描宽度调整指令发送给加速器控制装置12,加速器控制装置12控制扫描电源18,扫描电源18的输出电流供给扫描磁铁(图中未示出)。当扫描电源18输出电流发生变化时,扫描磁铁产生的扫描磁场也相应变化,从而调整了电子束的扫描宽度W,通常扫描宽度W与扫描电源18的输出电流成正比。Information about the length L of the irradiated processing object 10 is obtained through detection by the radiation perspective detection device 300. When the scanning width W of the electron beam 8 needs to be adjusted, the control device 5 sends a scanning width adjustment command to the accelerator control device 12 , the accelerator control device 12 controls the scanning power supply 18, and the output current of the scanning power supply 18 is supplied to the scanning magnet (not shown in the figure). When the output current of the scanning power supply 18 changes, the scanning magnetic field generated by the scanning magnet also changes accordingly, thereby adjusting the scanning width W of the electron beam. Usually, the scanning width W is proportional to the output current of the scanning power supply 18 .

更进一步地,物品传输装置6主要是承载受辐照对象10以一定的速度通过透射检测区域和辐照加工区域,其运行受控制装置5控制,控制装置5根据受辐照对象10的类型和需要辐照的剂量要求等条件可以对传输装置6在辐照加工区域的传输速度进行调整。Furthermore, the article conveying device 6 mainly carries the irradiated object 10 through the transmission detection area and the irradiation processing area at a certain speed, and its operation is controlled by the control device 5. The control device 5 according to the type of the irradiated object 10 and the Conditions such as radiation dose requirements can adjust the transmission speed of the transmission device 6 in the irradiation processing area.

参见图1,辐射防护装置7主要是对电子束辐照区域的电子束8、透射检测区域的X射线9进行辐射防护,除保障辐射防护装置外侧工作人员的安全外,还能有效的防止电子加速器1产生的电子束8及附带产生的X射线直接照射到探测器阵列3,从而消除了电子加速器1产生的辐射对低能X射线检测装置300的影响。Referring to Fig. 1, the radiation protection device 7 mainly protects the electron beam 8 in the electron beam irradiation area and the X-ray 9 in the transmission detection area. In addition to ensuring the safety of the staff outside the radiation protection device, it can also effectively prevent the electron beam The electron beam 8 generated by the accelerator 1 and the accompanying X-rays directly irradiate the detector array 3 , thereby eliminating the influence of the radiation generated by the electron accelerator 1 on the low-energy X-ray detection device 300 .

下面结合附图1-4对根据本发明具体实施方式中的电子束辐照加工方法进行说明。参见图1,根据本发明电子束辐照加工的方法,包括步骤:提供辐射透视检测装置300;利用辐射透视检测装置300进行检测获得关于受辐照加工对象10的质量厚度dρ的信息;提供电子束辐照加工装置200;以及通过控制装置5调节电子束辐照加工装置200的电子束8的能量E,以使电子束的能量E与辐照加工对象10的质量厚度dρ相匹配;以及利用调节后的电子束辐照加工装置200执行电子束辐照加工。The electron beam irradiation processing method according to the specific embodiment of the present invention will be described below with reference to the accompanying drawings 1-4. Referring to FIG. 1 , the method for electron beam irradiation processing according to the present invention includes the steps of: providing a radiation perspective detection device 300; using the radiation perspective detection device 300 to perform detection to obtain information about the mass thickness dρ of an irradiated processing object 10; providing electronic The beam irradiation processing device 200; and the energy E of the electron beam 8 of the electron beam irradiation processing device 200 is adjusted by the control device 5, so that the energy E of the electron beam matches the mass thickness dp of the irradiated processing object 10; and using The adjusted electron beam irradiation processing apparatus 200 performs electron beam irradiation processing.

具体地,工作人员通过控制装置5启动整个系统后,受辐照对象10由传输装置6承载以进入辐射防护装置7内部,以一定的速度通过透视检测区域,期间控制装置5控制低能X射线装置300产生低能X射线,低能X射线穿透受辐照对象10到达探测器阵列3,探测器阵列3根据各个探测器31吸收X射线的多少产生强弱不同的信号传送给信号分析处理装置4,信号分析处理装置4对信号经过分析处理后将受辐照对象10的质量厚度dρ传送给控制装置5。附加地,利用辐射透视检测装置300,该系统还获得关于受辐照加工对象10的长度L的信息。更进一步地,利用辐射透视检测装置300,该系统还获得关于受辐照加工对象10的精细透视图像信息。控制装置5根据受辐照对象10的精细透视图像信息,向工作人员给出受辐照对象10的透视图像,便于工作人员辨别包装箱内物品是否与标识相符,是否符合电子束辐照安全,并可以将图像存档作为辐照加工系统加工处理记录的补充。Specifically, after the staff starts the whole system through the control device 5, the irradiated object 10 is carried by the transmission device 6 to enter the radiation protection device 7, and passes through the perspective detection area at a certain speed, during which the control device 5 controls the low-energy X-ray device 300 generates low-energy X-rays, and the low-energy X-rays penetrate the irradiated object 10 to reach the detector array 3, and the detector array 3 generates signals with different strengths according to the amount of X-rays absorbed by each detector 31 and sends them to the signal analysis and processing device 4, The signal analysis and processing device 4 transmits the mass thickness dρ of the irradiated object 10 to the control device 5 after analyzing and processing the signal. Additionally, the system also obtains information on the length L of the irradiated processing object 10 using the radioscopic detection device 300 . Furthermore, by using the radiation perspective detection device 300 , the system also obtains fine perspective image information about the irradiated processing object 10 . According to the fine perspective image information of the irradiated object 10, the control device 5 provides the staff with the perspective image of the irradiated object 10, so that the staff can identify whether the items in the packing box are consistent with the logo and whether they are safe for electron beam irradiation. And the image archive can be used as a supplement to the processing records of the irradiation processing system.

进一步地,控制装置5根据受辐照对象10的质量厚度dρ和/或宽度L实时控制电子加速器1,让其输出电子束8的能量E与dρ相匹配,输出电子束的宽度W与物品宽度L相匹配,即以使所述电子束的能量E与辐照加工对象的质量厚度dρ满足前述的函数关系f,即E=f(dρ)。Further, the control device 5 controls the electron accelerator 1 in real time according to the mass thickness dρ and/or width L of the irradiated object 10, so that the energy E of the output electron beam 8 matches dρ, and the width W of the output electron beam is equal to the width of the object. Matching L means that the energy E of the electron beam and the mass thickness dρ of the irradiated processing object satisfy the aforementioned functional relationship f, that is, E=f(dρ).

在上述操作过程中,控制装置5通过对电子加速器1的输出电子束能量E和扫描宽度W的实时调整控制,实现了电子束8效率的最佳利用。如前所述,所述电子束辐照加工的电子束的能量E具有最小值Emin和最大值Emax,如果受辐照对象10的厚度不合适,使电子束能量E调整超出了范围,即调节后的电子束的能量E不满足Emin≤E≤Emax,控制装置5还会如前面所述给出警报信号和提示信号,以提高辐照加工系统的处理效率并保障辐照加工效果。During the above operation process, the control device 5 realizes the optimal utilization of the efficiency of the electron beam 8 through the real-time adjustment and control of the output electron beam energy E and scan width W of the electron accelerator 1 . As mentioned above, the electron beam energy E of the electron beam irradiation process has a minimum value Emin and a maximum value Emax. If the thickness of the irradiated object 10 is not suitable, the adjustment of the electron beam energy E exceeds the range, that is, the adjustment If the energy E of the final electron beam does not satisfy Emin≤E≤Emax, the control device 5 will also give an alarm signal and a prompt signal as mentioned above, so as to improve the processing efficiency of the irradiation processing system and ensure the irradiation processing effect.

具体地,如需要调整的电子束8的能量E大于Emax,则控制装置5给出受辐照对象10质量厚度dρ过大,并且要求将受辐照对象10的厚度降低到可接受的范围的提示信息。如果需要调整的电子束8的能量(E)小于Emin,则控制装置5控制电子束辐照加工装置200将其输出电子束8能量调整到Emin,并且给出要求将对受辐照对象10的厚度增加到适当范围以满足上述函数关系f的提示信息。具体地,控制装置5向工作人员给出目前电子束8的能量E有富余,可对受辐照对象10进行适当叠放,以提高电子束8利用效率的提示信号。Specifically, if the energy E of the electron beam 8 that needs to be adjusted is greater than Emax, the control device 5 gives that the mass thickness dρ of the irradiated object 10 is too large, and requires reducing the thickness of the irradiated object 10 to an acceptable range. Prompt information. If the energy (E) of the electron beam 8 that needs to be adjusted is less than Emin, then the control device 5 controls the electron beam irradiation processing device 200 to adjust the energy of its output electron beam 8 to Emin, and provides a requirement to control the energy of the irradiated object 10 Thickness is increased to an appropriate range to meet the above functional relationship f hint information. Specifically, the control device 5 gives the worker a prompt signal that the energy E of the electron beam 8 is surplus, and that the irradiated objects 10 can be properly stacked to improve the utilization efficiency of the electron beam 8 .

类似地,当基于辐射透视检测装置300获得的受辐照对象10的长度L对电子加速器1的扫描宽度W进行调节时,如果需要调节的扫描宽度W大于电子加速器1扫描宽度W的限值时,给出相应的报警信号,并且可以提示工作工作人员进行适当的堆码,以使受辐照对象10的长度L落入到加速器1扫描宽度W的限值范围内。Similarly, when the scan width W of the electron accelerator 1 is adjusted based on the length L of the irradiated object 10 obtained by the radiation perspective detection device 300, if the adjusted scan width W is greater than the limit value of the scan width W of the electron accelerator 1 , give a corresponding alarm signal, and prompt the staff to perform proper stacking, so that the length L of the irradiated object 10 falls within the limit range of the scanning width W of the accelerator 1 .

在上述操作过程中,控制装置5根据受辐照对象10的类型和需要辐照的剂量要求控制传输装置6,让其承载受辐照对象10以一定的速度通过电子束辐照区域,使受辐照对象10完成既定要求的辐照加工。During the above-mentioned operation process, the control device 5 controls the transport device 6 according to the type of the irradiated object 10 and the required irradiation dose, so that it carries the irradiated object 10 through the electron beam irradiation area at a certain speed, so that the irradiated object 10 passes through the electron beam irradiation area. The irradiation object 10 completes the prescribed irradiation processing.

从本发明的上述技术方案可以看出,通过低能X射线装置300等对受辐照对象10先进行质量厚度dρ和/或物品长度L的测量,控制装置5根据有关质量厚度dρ和物品长度L的测量结果,对电子加速器1进行相应的能量调整E和/或扫描宽度W进行实时调整,从而提高电子束8的利用效率并保障辐照加工效果,进而提高了辐照加工处理系统的经济效益。It can be seen from the above-mentioned technical solutions of the present invention that the irradiated object 10 is first measured with the mass thickness dρ and/or the item length L by the low-energy X-ray device 300, etc., and the control device 5 is based on the relevant mass thickness dρ and item length L According to the measurement results of the electron accelerator 1, the corresponding energy adjustment E and/or the scan width W are adjusted in real time, thereby improving the utilization efficiency of the electron beam 8 and ensuring the irradiation processing effect, thereby improving the economic benefits of the irradiation processing system .

相对现有技术的方法和装置,根据本发明的方法和装置成本增加不多,使受辐照对象10质量厚度dρ和长度L尽可能接近电子加速器1的最佳质量厚度和/或最佳长度,提高了电子束8的利用效率并保障辐照加工效果,从而辐照加工处理系统的经济效益得到改善。Compared with the methods and devices in the prior art, the cost of the method and device according to the present invention does not increase much, so that the mass thickness dp and length L of the irradiated object 10 are as close as possible to the optimum mass thickness and/or optimum length of the electron accelerator 1 , improving the utilization efficiency of the electron beam 8 and ensuring the radiation processing effect, thereby improving the economic benefits of the radiation processing system.

进一步地,当根据有关质量厚度dρ和物品长度L的测量结果,对电子加速器1进行相应的能量调整E和扫描宽度W进行的实时调整超出了电子加速器1的能量E和扫描宽度W的限值时,可以提示工作人员对受辐照对象10的堆码方式进行调整来达到最佳的质量厚度dρ和扫描宽度W,从而最大化电子束8的利用效率并保障辐照加工效果。Furthermore, when the corresponding energy adjustment E and the real-time adjustment of the scanning width W of the electron accelerator 1 according to the measurement results of the mass thickness dρ and the item length L exceed the limits of the energy E and scanning width W of the electron accelerator 1 , the staff can be prompted to adjust the stacking method of the irradiated object 10 to achieve the best mass thickness dρ and scanning width W, so as to maximize the utilization efficiency of the electron beam 8 and ensure the irradiation processing effect.

另外,通过采用本发明中的用于提高效率的电子束辐照加工方法和装置,其中辐射装置,例如低能X射线装置300在进行质量厚度dρ和长度L测量的同时,信号分析处理装置4对探测器阵列3获取信号的进一步分析处理可以给出受辐照对象10的透视图像,从而使得工作人员可以辨别包装箱内物品是否与标识相符,进而判断待辐射加工的物品10是否符合电子束辐照安全。此外,还可以将辐射成像系统获取的图像进行存档,以作为辐照加工系统加工处理记录的补充资料。In addition, by adopting the electron beam irradiation processing method and device for improving efficiency in the present invention, wherein the radiation device, such as the low-energy X-ray device 300, measures the mass thickness dρ and the length L, the signal analysis and processing device 4 pairs The further analysis and processing of the signals acquired by the detector array 3 can give a perspective image of the irradiated object 10, so that the staff can identify whether the items in the packing box conform to the logo, and then judge whether the items 10 to be processed by radiation conform to the requirements of the electron beam radiation. Take safety photos. In addition, the images acquired by the radiation imaging system can also be archived as supplementary information for the processing records of the radiation processing system.

虽然本发明总体构思的一些实施例已被显示和说明,本领域普通技术人员将理解,在不背离本总体发明构思的原则和精神的情况下,可对这些实施例做出改变,本发明的范围以权利要求和它们的等同物限定。While certain embodiments of the present general inventive concept have been shown and described, those of ordinary skill in the art will appreciate that changes may be made to these embodiments without departing from the principles and spirit of the present general inventive concept. The scope is defined by the claims and their equivalents.

Claims (11)

1.一种电子束辐照加工的方法,包括:1. A method for electron beam irradiation processing, comprising: (a)提供辐射透视检测装置;(a) provide radiographic detection devices; (b)利用辐射透视检测装置进行检测获得关于受辐照加工对象的质量厚度(dρ)的信息的检测步骤;(b) The detection step of obtaining information about the mass thickness (dρ) of the irradiated processed object through detection by means of a radioscopic detection device; (c)提供电子束辐照加工装置;以及(c) provide electron beam irradiation processing equipment; and (d)通过控制装置调节电子束辐照加工装置的电子束的能量(E),以使电子束的能量(E)与辐照加工对象的质量厚度(dρ)相匹配的调节步骤;以及(d) adjusting the energy (E) of the electron beam of the electron beam irradiation processing device by the control device, so that the energy (E) of the electron beam matches the mass thickness (dρ) of the irradiated processing object; and (e)利用调节后的电子束辐照加工装置执行电子束辐照加工的加工步骤。(e) A processing step of performing electron beam irradiation processing using the adjusted electron beam irradiation processing apparatus. 2.根据权利要求1所述的电子束辐照加工的方法,其特征在于:2. The method for electron beam irradiation processing according to claim 1, characterized in that: 所述检测步骤(b)还包括利用辐射透视检测装置获得关于受辐照加工对象的长度(L)的信息的步骤;The detection step (b) further includes the step of obtaining information about the length (L) of the irradiated processing object by using a radioscopic detection device; 所述调节步骤(d)还包括通过控制装置调节电子束辐照加工装置的电子束的扫描宽度(W),以使电子束的扫描宽度(W)与辐照加工对象的长度(L)的相匹配的步骤。The adjustment step (d) also includes adjusting the scanning width (W) of the electron beam of the electron beam irradiation processing device through the control device, so that the scanning width (W) of the electron beam is equal to the length (L) of the irradiated processing object matching steps. 3.根据权利要求1或2所述的电子束辐照加工的方法,其特征在于:3. The method for electron beam irradiation processing according to claim 1 or 2, characterized in that: 在所述调节步骤(d)中,通过调节所述电子束的能量(E),以使所述电子束的能量(E)与辐照加工对象的质量厚度(dρ)满足一定的函数关系(f),即E=f(dρ)。In the adjusting step (d), the energy (E) of the electron beam is adjusted so that the energy (E) of the electron beam and the mass thickness (dρ) of the irradiated processing object satisfy a certain functional relationship ( f), namely E=f(dρ). 4.根据权利要求3所述的电子束辐照加工的方法,其特征在于:4. The method for electron beam irradiation processing according to claim 3, characterized in that: 所述电子束辐照加工的电子束的能量(E)具有最小值Emin和最大值Emax,如果所述调节步骤(d)中调节后的电子束的能量(E)不满足Emin≤E≤Emax,则进一步包括通过控制装置给出报警的步骤。The energy (E) of the electron beam processed by the electron beam irradiation has a minimum value Emin and a maximum value Emax, if the energy (E) of the electron beam adjusted in the adjustment step (d) does not satisfy Emin≤E≤Emax , it further includes the step of giving an alarm through the control device. 5.根据权利要求4所述的电子束辐照加工的方法,其特征在于:5. The method for electron beam irradiation processing according to claim 4, characterized in that: 如需要调整的电子束的能量(E)大于Emax,则控制装置给出受辐照对象质量厚度过大,并且要求将受辐照对象的厚度降低到可接受的范围的提示信息的步骤。If the energy (E) of the electron beam to be adjusted is greater than Emax, the control device gives a prompt message that the mass thickness of the irradiated object is too large and requires reducing the thickness of the irradiated object to an acceptable range. 6.根据权利要求5所述的电子束辐照加工的方法,其特征在于:6. The method for electron beam irradiation processing according to claim 5, characterized in that: 如果需要调整的电子束的能量(E)小于Emin,则控制装置控制电子束辐照加工装置将其输出电子束能量调整到Emin,并且给出要求将对受辐照对象的厚度增加到适当范围的提示信息。If the energy (E) of the electron beam to be adjusted is less than Emin, the control device controls the electron beam irradiation processing device to adjust the output electron beam energy to Emin, and gives a request to increase the thickness of the irradiated object to an appropriate range prompt information. 7.根据权利要求1或2所述的电子束辐照加工的方法,其特征在于所述检测步骤(b)还包括:7. The method for electron beam irradiation processing according to claim 1 or 2, characterized in that the detection step (b) further comprises: 利用辐射透射检测装置获得有关受辐照加工对象的透视图像的步骤。A step of obtaining a perspective image of an irradiated processing object by using a radiation transmission detection device. 8.一种电子束辐照加工系统,包括:8. An electron beam irradiation processing system, comprising: 电子束辐照加工装置,其包括电子加速器(1),以提供电子束(8)对受辐照加工对象进行扫描;An electron beam irradiation processing device, which includes an electron accelerator (1) to provide an electron beam (8) to scan an irradiated processing object; 辐射透视检测装置,其包括辐射源(2);探测器阵列(3);信号分析处理装置(4),用于获得关于受辐照加工对象的质量厚度(dρ)和/或长度(L)的信息;以及Radiation perspective detection device, which includes a radiation source (2); a detector array (3); a signal analysis and processing device (4), used to obtain the mass thickness (dρ) and/or length (L) of an irradiated processing object information; and 控制装置(5),其用于控制所述电子束辐照加工装置和所述辐射透视检测装置的操作,并且对所述电子加速器(1)的电子束的能量(E)和/或扫描宽度(W)进行调节,以使所述电子加速器(1)的电子束的能量(E)和/或扫描宽度(W)与受辐照加工对象的质量厚度(dρ)和/或长度(L)相匹配。A control device (5), which is used to control the operation of the electron beam irradiation processing device and the radiation perspective detection device, and to control the energy (E) and/or scan width of the electron beam of the electron accelerator (1) (W) is adjusted so that the energy (E) and/or scan width (W) of the electron beam of the electron accelerator (1) is consistent with the mass thickness (dρ) and/or length (L) of the irradiated processing object match. 9.根据权利要求8所述的电子束辐照加工系统,其特征在于还包括:9. The electron beam irradiation processing system according to claim 8, further comprising: 传输装置(6),其用于输送受辐照加工对象沿第一方向先后经过辐射透视检测装置和电子束辐照加工装置,以进行辐射透视检测和电子束辐照加工操作。A conveying device (6), which is used to transport the irradiated processing object successively through the radiation perspective detection device and the electron beam irradiation processing device along the first direction, so as to perform radiation perspective detection and electron beam irradiation processing operations. 10.根据权利要求8或9所述的电子束辐照加工系统,其特征在于:10. The electron beam irradiation processing system according to claim 8 or 9, characterized in that: 所述电子束辐照加工装置和辐射透视检测装置分别由辐射防护装置(7)围绕,以防止其相互之间产生信号干扰。The electron beam irradiation processing device and the radiation perspective detection device are respectively surrounded by radiation protection devices (7) to prevent signal interference between them. 11.根据权利要求9所述的电子束辐照加工系统,其特征在于:11. The electron beam irradiation processing system according to claim 9, characterized in that: 所述电子束辐照加工装置和辐射透视检测装置的中心出束方向沿第二方向延伸并且大体平行,所述第二方向与所述传输装置输送受辐照加工对象的第一方向大体垂直。The central beam output direction of the electron beam irradiation processing device and the radiation perspective detection device extends along a second direction and is generally parallel, and the second direction is generally perpendicular to the first direction in which the transport device transports the irradiated processing object.
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