CN101932204A - Circuit board manufacturing method - Google Patents
Circuit board manufacturing method Download PDFInfo
- Publication number
- CN101932204A CN101932204A CN2009101396096A CN200910139609A CN101932204A CN 101932204 A CN101932204 A CN 101932204A CN 2009101396096 A CN2009101396096 A CN 2009101396096A CN 200910139609 A CN200910139609 A CN 200910139609A CN 101932204 A CN101932204 A CN 101932204A
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- China
- Prior art keywords
- circuit board
- opening
- reinforcement
- pin
- soldering
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Abstract
The invention relates to a circuit board manufacturing method which is applied to a circuit board and comprises the following steps of: arranging a preset area with an opening on the circuit board before the circuit board is subject to wave soldering, providing a reinforcement with a pin corresponding to the opening, and arranging the reinforcement in the preset area through the combination of the opening and the pin; and taking down the reinforcement after the circuit board is subjected to the wave soldering. Thus, the strength of the circuit board is enhanced, the circuit board is not easy to bend during the wave soldering, and the yield of the product is improved.
Description
Technical field
The present invention relates to circuit board, particularly relate to a kind of manufacture method of circuit board.
Background technology
Wave-soldering (wave soldering) is to utilize the liquid tin of fusion under motor-mount pump drives, with single ripple or the double wave of upwards kicking up, oblique rising is carried and next circuit board, compressing from bottom to top makes liquid tin enter opening on the circuit board, or, fill out tin and form solder joint an empty pin place of glue location SMD element.
In the element assembling process on the circuit board now, use the mode of above-mentioned wave-soldering that element is assembled on the circuit board mostly, yet, in the element assembling process, if the thickness deficiency of circuit board, and when needing to carry many elements on the circuit board, cause the circuit board bending easily, and then make when carrying out wave-soldering, cause the element failure welding, cause the product yield to reduce.
Therefore, how to provide a kind of technical scheme that can strengthen circuit board, with the accentuator plate intensity in the process of carrying out at wave-soldering, make circuit board not flexible, and be beneficial to follow-up welding procedure, and then improve the product yield, be technical problem anxious to be solved in this area.
Summary of the invention
In view of the shortcoming of above-mentioned prior art, the invention provides a kind of method of manufacturing circuit board, to increase the intensity that circuit board carries out wave-soldering, make this circuit board not flexible when carrying out wave-soldering, and then improve the product yield.
For solving above-mentioned technical problem of the prior art, method of manufacturing circuit board provided by the present invention, be to be applied on the wave-soldering of circuit board, this method comprises: before this circuit board enters wave-soldering, on this circuit board, be provided with and have the presumptive area of opening, and provide the reinforcement that has pin that should opening, and, this reinforcement is arranged at this presumptive area by the combining of this opening and this pin; And after this circuit board is finished wave-soldering, take off this reinforcement.
In addition, this presumptive area is set when this circuit board connects up.This opening is combined by welding, interference engagement or buckle mode with this pin.Detailed it, be by interference engagement (interference fit) when being combined at this opening and this pin, the sectional area of this opening is slightly less than the sectional area of this pin; At this opening and this pin is when being combined by the buckle mode, and the end of this pin also has the buckle that fastens this opening.
Moreover this reinforcement is bonding jumper, metal derby or the sheet metal etc. with certain structural strength, for example is iron bar, but not as limit.
In sum, the invention provides a kind of method of manufacturing circuit board, be to be applied on the circuit board, mainly be before this circuit board enters wave-soldering, on this circuit board, be provided with and have the presumptive area of opening, and provide the reinforcement that has pin that should opening, and by combining of this opening and this pin, this reinforcement is arranged at this presumptive area, and after this circuit board is finished wave-soldering, takes off this reinforcement, than prior art, the present invention increases the intensity of this circuit board by this reinforcement, make this circuit board wave-soldering carry out in the process not flexiblely, and then improve the product yield.
Description of drawings
Fig. 1 is the presumptive area schematic diagram among first embodiment of method of manufacturing circuit board of the present invention;
Fig. 2 is the reinforcement schematic diagram among first embodiment of method of manufacturing circuit board of the present invention;
Fig. 3 is the generalized section of Fig. 2;
Fig. 4 is the second embodiment schematic diagram of method of manufacturing circuit board of the present invention;
Fig. 5 is the 3rd an embodiment schematic diagram of method of manufacturing circuit board of the present invention;
Fig. 6 is the 4th an embodiment schematic diagram of method of manufacturing circuit board of the present invention.
The simple declaration of component symbol:
1 circuit board
10,10a, 10b and 10c presumptive area
100 first joint portions
11,11a, 11b and 11c reinforcement
110 second joint portions
Embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantages of the present invention and effect easily by the content that this specification disclosed.
See also Fig. 1, method of manufacturing circuit board of the present invention is to be applied on the wave-soldering of circuit board 1, and this manufacture method is provided with presumptive area 10 earlier as shown in Figure 1 on this circuit board 1.In the present embodiment, this presumptive area 10 is a long strip type zone, but be not as limit, when reality is implemented, the wiring of 1 body structure of visual circuit board, circuit board 1 and the zone of desiring to gain in strength carry out position, shape, size and quantitative adjustment.In addition, this presumptive area 10 is before this circuit board 1 enters wave-soldering, and set when this circuit board 1 connects up, that is to say, when circuit board 1 wires design, be about to this presumptive area 10 and determine, and as shown in Figure 3, first joint portion 100 is set in this presumptive area 10, wherein, this first joint portion 100 is an opening, but not as limit, in other embodiments, this first joint portion 100 also can be projection.
Continue as shown in Figure 2, reinforcement 11 is set on this presumptive area 10.In the present embodiment, this reinforcement 11 is before this circuit board 1 enters wave-soldering, and it is set before this circuit board 1 carries out the element assembling, and for example shown in Figure 3,11 pairs of this reinforcements, first joint portions 100 in should presumptive area 10 be provided with second joint portion 110, and by the combining of this first joint portion 100 and this second joint portion 110, this reinforcement 11 can be arranged on this presumptive area 10, wherein, this second joint portion 110 is to pin that should opening.This first joint portion 100 can be combined by modes such as welding, interference engagement (interference fit) or buckle modes with this second joint portion 110.Detailed it, be by interference engagement (interference fit) when being combined at this opening and this pin, the sectional area of this opening is slightly less than the sectional area of this pin; At this opening and this pin is when being combined by the buckle mode, and the end of this pin also has the buckle that fastens this opening.
In addition, bonding jumper, metal derby or the sheet metal etc. of this reinforcement 11 for having certain structural strength for example are iron bar, but not as limit, still can select material heat-resisting and that have a structural strength to form this reinforcement 11 according to situation.When reality is implemented, this reinforcement 1 body structure of 11 visual circuit boards and the zone of desiring to gain in strength carry out the adjustment of position, shape, size and quantity.
In other embodiments, the configuration for presumptive area and reinforcement can be as Fig. 4 to shown in Figure 6 on circuit board in the present invention.As shown in Figure 4, a plurality of reinforcement 11a can be arranged in parallel and be arranged at presumptive area 10a on the circuit board 1, or as Fig. 5 to shown in Figure 6, a plurality of reinforcement 11b and 11c can be crisscross arranged presumptive area 10b and 10c on circuit board 1 use the intensity that increases this circuit board 1.
In sum, method of manufacturing circuit board of the present invention, be to be applied on the wave-soldering of circuit board, before this circuit board enters wave-soldering, on this circuit board, be provided with and have the presumptive area of opening, and provide the reinforcement that has pin that should opening, and by combining of this opening and this pin, this reinforcement is arranged at this presumptive area, and after this circuit board is finished wave-soldering, take off this reinforcement, increase this circuit board thus and carry out the intensity that wave-soldering is handled, make this circuit board not flexible in follow-up welding (as wave-soldering) program process, than prior art, when can be used for wave-soldering, strengthens method of manufacturing circuit board of the present invention circuit board, thus can avoid because of circuit board produces bending in the wave-soldering process, and the situation that causes the product yield to reduce takes place.
The above embodiments only are illustrative characteristics of the present invention and effect thereof, but not are used to limit the scope of essence technology contents of the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be foundation with the scope of claims.
Claims (7)
1. method of manufacturing circuit board is applied to it is characterized in that on the circuit board that this method of manufacturing circuit board comprises:
Before this circuit board enters wave-soldering, on this circuit board, be provided with and have the presumptive area of opening, and the reinforcement that has pin that should opening is provided, and, this reinforcement is arranged at this presumptive area by the combining of this opening and this pin; And
After this circuit board is finished wave-soldering, take off this reinforcement.
2. method of manufacturing circuit board according to claim 1 is characterized in that: this presumptive area is set when this circuit board connects up.
3. method of manufacturing circuit board according to claim 1 is characterized in that: this opening is combined by welding with this pin.
4. method of manufacturing circuit board according to claim 1 is characterized in that: this opening is combined by interference engagement with this pin.
5. method of manufacturing circuit board according to claim 4 is characterized in that: the sectional area of this opening is less than the sectional area of this pin.
6. method of manufacturing circuit board according to claim 1 is characterized in that: the end of this pin also has the buckle that fastens this opening.
7. method of manufacturing circuit board according to claim 1 is characterized in that: this reinforcement is wherein one of bonding jumper, metal derby or a sheet metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101396096A CN101932204A (en) | 2009-06-26 | 2009-06-26 | Circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101396096A CN101932204A (en) | 2009-06-26 | 2009-06-26 | Circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101932204A true CN101932204A (en) | 2010-12-29 |
Family
ID=43371007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101396096A Pending CN101932204A (en) | 2009-06-26 | 2009-06-26 | Circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101932204A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600931A (en) * | 2017-10-02 | 2019-04-09 | 瞻博网络公司 | For mitigating the devices, systems, and methods of circuit slab warping during reflux technique |
| CN114571026A (en) * | 2022-03-23 | 2022-06-03 | 美的集团股份有限公司 | Wave soldering device |
-
2009
- 2009-06-26 CN CN2009101396096A patent/CN101932204A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600931A (en) * | 2017-10-02 | 2019-04-09 | 瞻博网络公司 | For mitigating the devices, systems, and methods of circuit slab warping during reflux technique |
| CN114571026A (en) * | 2022-03-23 | 2022-06-03 | 美的集团股份有限公司 | Wave soldering device |
| CN114571026B (en) * | 2022-03-23 | 2024-03-29 | 美的集团股份有限公司 | Wave soldering apparatus |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101229 |