CN101923219A - 四分等比例分光装置及具有该装置的激光刻线机 - Google Patents
四分等比例分光装置及具有该装置的激光刻线机 Download PDFInfo
- Publication number
- CN101923219A CN101923219A CN 201010121762 CN201010121762A CN101923219A CN 101923219 A CN101923219 A CN 101923219A CN 201010121762 CN201010121762 CN 201010121762 CN 201010121762 A CN201010121762 A CN 201010121762A CN 101923219 A CN101923219 A CN 101923219A
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- CN
- China
- Prior art keywords
- light
- spectroscope
- focus lamp
- reflected light
- catoptron
- Prior art date
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- 238000010330 laser marking Methods 0.000 title 1
- 238000002310 reflectometry Methods 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims description 11
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 abstract description 7
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0905—Dividing and/or superposing multiple light beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0977—Reflective elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/106—Beam splitting or combining systems for splitting or combining a plurality of identical beams or images, e.g. image replication
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/145—Beam splitting or combining systems operating by reflection only having sequential partially reflecting surfaces
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101217629A CN101923219B (zh) | 2010-03-05 | 2010-03-05 | 四分等比例分光装置及具有该装置的激光刻线机 |
PCT/CN2010/074971 WO2011106958A1 (zh) | 2010-03-05 | 2010-07-05 | 四分等比例分光装置及具有该装置的激光刻线机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101217629A CN101923219B (zh) | 2010-03-05 | 2010-03-05 | 四分等比例分光装置及具有该装置的激光刻线机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101923219A true CN101923219A (zh) | 2010-12-22 |
CN101923219B CN101923219B (zh) | 2012-02-01 |
Family
ID=43338242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101217629A Expired - Fee Related CN101923219B (zh) | 2010-03-05 | 2010-03-05 | 四分等比例分光装置及具有该装置的激光刻线机 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101923219B (zh) |
WO (1) | WO2011106958A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103996973A (zh) * | 2014-05-09 | 2014-08-20 | 西安炬光科技有限公司 | 一种高功率半导体激光器的扩束装置 |
CN104842066A (zh) * | 2015-03-27 | 2015-08-19 | 龙游特美纸制品有限公司 | 一种激光打孔机的光束控制装置 |
CN104889564A (zh) * | 2015-06-03 | 2015-09-09 | 无锡信欧光电科技有限公司 | 一种多头激光切割头 |
CN109277691A (zh) * | 2018-11-14 | 2019-01-29 | 中国科学院宁波材料技术与工程研究所 | 一种多电极同步激光与电解复合加工装置 |
CN110883436A (zh) * | 2019-12-20 | 2020-03-17 | 武汉华工激光工程有限责任公司 | 实现大幅面多路激光并行刻划的方法和装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09171152A (ja) * | 1995-12-20 | 1997-06-30 | Miyachi Technos Corp | レーザ分岐装置 |
WO2005076883A2 (en) * | 2004-02-05 | 2005-08-25 | Oplink Communications, Inc. | Integrated optical multiplexer and demultiplexer |
CN101271204A (zh) * | 2008-04-24 | 2008-09-24 | 蚌埠市普乐新能源有限公司 | 用于多路激光刻划机的光功率均衡器 |
CN201681210U (zh) * | 2010-03-05 | 2010-12-22 | 东莞宏威数码机械有限公司 | 四分等比例分光装置及具有该装置的激光刻线设备 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1820888A (zh) * | 2006-03-24 | 2006-08-23 | 华中科技大学 | 一种医药用薄型材料的激光在线打孔的方法和装置 |
CN101020277A (zh) * | 2007-03-22 | 2007-08-22 | 苏州德龙激光有限公司 | 分布式激光加工系统 |
DE112008001873A5 (de) * | 2007-07-21 | 2010-06-10 | Du, Keming, Dr. | Optische Anordnung zur Erzeugung von Multistrahlen |
CN101434005B (zh) * | 2008-11-20 | 2011-05-25 | 武汉凌云光电科技有限责任公司 | 多通道非晶硅太阳能板激光刻膜机 |
-
2010
- 2010-03-05 CN CN2010101217629A patent/CN101923219B/zh not_active Expired - Fee Related
- 2010-07-05 WO PCT/CN2010/074971 patent/WO2011106958A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09171152A (ja) * | 1995-12-20 | 1997-06-30 | Miyachi Technos Corp | レーザ分岐装置 |
WO2005076883A2 (en) * | 2004-02-05 | 2005-08-25 | Oplink Communications, Inc. | Integrated optical multiplexer and demultiplexer |
CN101271204A (zh) * | 2008-04-24 | 2008-09-24 | 蚌埠市普乐新能源有限公司 | 用于多路激光刻划机的光功率均衡器 |
CN201681210U (zh) * | 2010-03-05 | 2010-12-22 | 东莞宏威数码机械有限公司 | 四分等比例分光装置及具有该装置的激光刻线设备 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103996973A (zh) * | 2014-05-09 | 2014-08-20 | 西安炬光科技有限公司 | 一种高功率半导体激光器的扩束装置 |
CN103996973B (zh) * | 2014-05-09 | 2017-01-11 | 西安炬光科技有限公司 | 一种高功率半导体激光器的扩束装置 |
CN104842066A (zh) * | 2015-03-27 | 2015-08-19 | 龙游特美纸制品有限公司 | 一种激光打孔机的光束控制装置 |
CN104889564A (zh) * | 2015-06-03 | 2015-09-09 | 无锡信欧光电科技有限公司 | 一种多头激光切割头 |
CN109277691A (zh) * | 2018-11-14 | 2019-01-29 | 中国科学院宁波材料技术与工程研究所 | 一种多电极同步激光与电解复合加工装置 |
CN110883436A (zh) * | 2019-12-20 | 2020-03-17 | 武汉华工激光工程有限责任公司 | 实现大幅面多路激光并行刻划的方法和装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2011106958A1 (zh) | 2011-09-09 |
CN101923219B (zh) | 2012-02-01 |
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