CN101916736B - Method for repairing circuit - Google Patents
Method for repairing circuit Download PDFInfo
- Publication number
- CN101916736B CN101916736B CN2010102518924A CN201010251892A CN101916736B CN 101916736 B CN101916736 B CN 101916736B CN 2010102518924 A CN2010102518924 A CN 2010102518924A CN 201010251892 A CN201010251892 A CN 201010251892A CN 101916736 B CN101916736 B CN 101916736B
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- substrate
- foreign matter
- laser beam
- conduction foreign
- opening
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Abstract
The invention discloses a method for repairing a circuit, which is applied to repairing a short circuit among a plurality of connecting pads or a plurality of pins. The connecting pads are formed on a first substrate; the pins are formed on a second substrate; the second substrate is pressed on the first substrate; and each pin is electrically connected with a corresponding connecting pad through a conductive adhesive. At least one conductive foreign body is present between the conductive adhesive and the first substrate or the second substrate. The method comprises the following steps of: removing partial second substrate on the conductive foreign body by using laser beams to form a first opening; and removing the conductive foreign body by using the laser beams.
Description
[technical field]
The invention relates to a kind of method of repairing circuit, and particularly relevant for a kind of method of repairing circuit of escapable cost.
[background technology]
In recent years, be indebted to the tremendous progress of semiconductor subassembly, have that high image quality, space utilization efficient are good, the flat-panel screens of low consumpting power, advantageous characteristic such as radiationless becomes the main flow in market gradually.
The inner circuit of flat-panel screens is to be driven by the chip that is configured on the display floater, so that display floater can display image.Figure 1A is the sketch map of existing display floater, and Figure 1B is the generalized section of Figure 1A along I-I ' line.Please in the non-display area 110 of display floater 100, dispose a plurality of connection pads 122 simultaneously with reference to Figure 1A and 1B.These connection pads 122 in order to the pin 132 corresponding connections of chip 130, and chip 130 is that the non-display area 110 that is engaged in display floater 100 in hot pressing through conducting resinl 140.
Yet; Because processing environment or human factor; Usually have foreign matter 150 to fall between the connection pad 122 easily or between the pin 132, if these foreign matters 150 have conductivity, then the pin 132 of chip 130 and connection pad 122 hot pressing on the display floater 100 engage after; These conduction foreign matters 150 will cause short circuit each other between connection pad 122 or the pin 132, and then cause the picture display abnormality of display floater 100.
[summary of the invention]
In view of this, the object of the invention is exactly that a kind of method of repairing circuit is being provided, and in order to two substrates the processing procedure joint with hot pressing after, removes the conduction foreign matter between two substrates, to keep the normal operation of two suprabasil circuit.
The present invention proposes a kind of method of repairing circuit; Be applicable to the short circuit of repairing between a plurality of connection pads or a plurality of pin; Wherein these connection pads are to be formed in first substrate; These pins are to be formed in second substrate, and second substrate is pressed on first substrate top, and each pin is through conducting resinl and corresponding connection pad electric connection.Between conducting resinl and first substrate or second substrate, have at least one conduction foreign matter, the method promptly is part second substrate that elder generation's use laser beam removes conduction foreign matter top, to form first opening.Re-use this laser beam afterwards and remove above-mentioned conduction foreign matter.
In one embodiment of this invention, when above-mentioned conduction foreign matter is between first substrate and conducting resinl the time, then before removing this conduction foreign matter, more comprise the partially conductive glue that uses above-mentioned laser light to remove conduction foreign matter top.
In one embodiment of this invention, the method that removes above-mentioned conduction foreign matter comprises by first substrate or second base side launches above-mentioned laser beam, and this laser beam is focused on the conduction foreign matter.
In one embodiment of this invention, the method for using above-mentioned laser beam to remove this conduction foreign matter comprises uses the nitrogen laser beam to remove above-mentioned conduction foreign matter.
In one embodiment of this invention, the diameter of above-mentioned laser beam is between 5 microns to 8 microns.
In one embodiment of this invention, after removing above-mentioned conduction foreign matter, more comprise sealing first opening.
In one embodiment of this invention, the method for above-mentioned first opening of sealing comprises gel is disposed in second substrate.
In one embodiment of this invention, the first above-mentioned substrate can be display floater, printed circuit board (PCB) (Printed Circuit Board, PCB) or cover crystal glass (Chip On Glass, COG) substrate.
In one embodiment of this invention, the second above-mentioned substrate can be cover brilliant film (Chip On Film, COF) or flexible PCB (Flexible Printed Circuit, FPC).
The present invention is after processing procedure in the hot pressing of first substrate and second substrate, utilizes laser beam to remove the conduction foreign matter of position between first substrate and second substrate, causes short circuit each other between connection pad or pin to avoid conducting electricity foreign matter.Therefore, the present invention need not separate second substrate with first substrate be removable conduction foreign matter between first substrate and second substrate, the heavy industry number of times with the learies and the hot pressing thereof that reduce first substrate or second substrate, to save cost.
For let above and other objects of the present invention, feature and advantage can be more obviously understandable, hereinafter is special lifts preferred embodiment, and cooperates appended graphicly, elaborates as follows.
[description of drawings]
Figure 1A is the sketch map of existing display floater.
Figure 1B is the generalized section of Figure 1A along I-I ' line.
Fig. 2 A to Fig. 2 B is the flow process generalized section of the method for repairing circuit in one embodiment of the invention.
Fig. 3 A to Fig. 3 B is the part flow process generalized section of the method for repairing circuit in the another embodiment of the present invention.
Fig. 4 is the part flow process generalized section of the method for repairing circuit in the another embodiment of the present invention.
[primary clustering symbol description]
100: display floater
110: non-display area
122,210: connection pad
132,310: pin
140,400: conducting resinl
150,500: the conduction foreign matter
Substrate in 200: the first
Substrate in 300: the second
312: the first openings
410: the second openings
L: laser beam
[embodiment]
Fig. 2 A to Fig. 2 B is the generalized section of the flow process of the method for repairing circuit in one embodiment of the invention.Please earlier with reference to Fig. 2 A; The method is in order to repair the short circuit between a plurality of connection pads 210 or a plurality of pin 310; Wherein these connection pads 210 are formed in first substrate 200, and 310 of pins are formed in second substrate 300, and second substrate 300 is pressed on first substrate, 200 tops.Specifically, second substrate 300 for example is that heat is pressed on first substrate, 200 tops through conducting resinl 400, and each pin 310 in second substrate 300 promptly be through conducting resinl 400 with first substrate 200 on its pairing connection pad 210 electrically connect.Second substrate 300 and first substrate, 200 hot pressing engage before, tend to because of processing environment or human factor between the conducting resinl 400 and first substrate 200, or have at least one conduction foreign matter 500 between the conducting resinl 400 and second substrate 300.And method proposed by the invention promptly is in order to remove conduction foreign matter 500, to keep the normal electrical connection between first substrate 200 and second substrate 300.
Particularly, first substrate 200 of present embodiment for example is a display floater, and second substrate 300 for example is to cover brilliant film (Chip On Film COF), but the invention is not restricted to this.In other embodiments, first substrate 200 can also be that (Printed Circuit Board, PCB), 300 of second substrates are to cover brilliant film to printed circuit board (PCB).Perhaps, first substrate 200 also can be cover crystal glass (Chip On Glass, COG) substrate, 300 of second substrates be flexible PCB (Flexible Printed Circuit, FPC).The technical staff who is familiar with this field can be about to method provided by the present invention certainly and be applied to appropriate location, and the present invention does not do qualification at this.
The position of conduction foreign matter 500 can be according to carrying out the result of electrical detection to these pins 310 with connection pad 210 and deciding.For instance, if testing result shows certain two adjacent connection pad 210 short circuit each other, can infer that then conduction foreign matter 500 is to be present in 210 of this two adjacent connection pads.That is to say that conduction foreign matter 500 is to be present between second substrate 300 and the conducting resinl 400.On the other hand,, can infer that then conduction foreign matter 500 is to be present between the conducting resinl 400 and first substrate 200 if testing result shows certain two adjacent pin 310 short circuit each other, and between this two adjacent pin 310.
Please continue A, after detecting between the connection pad 210 or having conduction foreign matter 500 between the pin 310, then above conduction foreign matter 500, use laser beam L to shine second substrate 300, form first opening 312 with second substrate 300 that removes part with reference to Fig. 2.This moment, the focusing range of laser beam L was to decide according to the thickness of second substrate 300.And in the present embodiment, laser beam L for example is the nitrogen laser beam, and its diameter can be between 5 microns to 8 microns, but the invention is not restricted to this.
Afterwards, please with reference to Fig. 2 B, the focusing range of adjustment laser beam L, and it is injected between second substrate 300 and the conducting resinl 400 through first opening 312.At this moment,, then directly laser beam L is focused on the conduction foreign matter 500,, make it dissipate to the external world via first opening 312 to utilize laser beam L bump conduction foreign matter 500 if conduction foreign matter 500 is to be present between second substrate 300 and the conducting resinl 400.
It should be noted that present embodiment after removing conduction foreign matter 500, then for example is with 312 sealings of first opening, shown in Fig. 2 C, causes short circuit each other between the connection pad 210 between second substrate 300 and the conducting resinl 400 to avoid falling into because of particulate once more.Specifically, present embodiment for example be with gel coated in second substrate 300 sealing first opening 312, but the invention is not restricted to this.
Fig. 3 A to Fig. 3 B is the generalized section of part flow process of the method for repairing circuit in the another embodiment of the present invention.Please with reference to Fig. 3 A; If conduction foreign matter 500 is to be present between the conducting resinl 400 and first substrate 200; Then use laser beam L puncture part second substrate 300 and after forming first opening 312; Then be that laser beam L is focused to conducting resinl 400 through first opening 312 then, form second opening 410 that exposes conduction foreign matter 500 with disruptive conduction glue 400.Then, shown in Fig. 3 B, laser beam L is focused to conduction foreign matter 500, so that it receives the energy impact of laser beam and dissipates to the external world via first opening 312.
Specifically; Though the laser beam L of present embodiment is by second substrate, 300 sides; Expose to conduction foreign matter 500 via first opening 312 and second opening 410, but in other embodiments, if first substrate 200 is a light-transmitting materials; Also can use laser beam L irradiation conduction foreign matter 500 from first substrate, 200 sides, as shown in Figure 4.
Likewise, after removing conduction foreign matter 500, also can fall into between first substrate 200 and second substrate 300 from the external world to avoid particulate optionally with 312 sealings of first opening.And the method for sealing first opening 312 can be same or similar with previous embodiment, repeats no more here.
In sum, the present invention is after processing procedure in the hot pressing of first substrate and second substrate, utilizes laser beam to remove the conduction foreign matter of position between first substrate and second substrate, causes short circuit each other between connection pad or pin to avoid conducting electricity foreign matter.That is to say that the present invention need not separate second substrate with first substrate be removable conduction foreign matter between first substrate and second substrate.Therefore; In the back-end process of display, utilize method provided by the present invention to carry out the repairing of circuit; Just need not on display floater, tear off covering brilliant film or flexible PCB; So not only can shorten the time of the required cost of repairing circuit, more can reduce the heavy industry number of times that processing procedure in the learies that covers brilliant film or flexible PCB and hot pressing, to save cost.
Certainly, method provided by the present invention can also be covered the circuit between brilliant film and the printed circuit board (PCB) in order to reparation, and it can reach cost-effective effect equally.
Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Anyly have the knack of this art; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (9)
1. the method for a repairing circuit; Be suitable for repairing the short circuit between a plurality of connection pads or a plurality of pin, wherein said connection pad is formed in one first substrate, and said pin is formed in one second substrate; This second substrate is pressed on this first substrate top; And respectively this pin electrically connects with this corresponding connection pad through a conducting resinl, and has at least one conduction foreign matter between this conducting resinl and this first substrate or this second substrate, and this method comprises:
Use a laser beam to remove this second substrate of part of this conduction foreign matter top, to form one first opening;
Use this laser beam to remove this conduction foreign matter, wherein,
When this conduction foreign matter between this first substrate and this conducting resinl the time, comprise more that before removing this conduction foreign matter this laser beam laser of use removes this conducting resinl above this conduction foreign matter, to form one second opening.
2. the method for repairing circuit according to claim 1 is characterized in that, the method for using this laser beam to remove this conduction foreign matter comprises by this second substrate or this laser beam of this first base side emission, and this laser beam is focused on this conduction foreign matter.
3. the method for repairing circuit according to claim 2 is characterized in that, is comprised by the step of this laser beam of this second base side emission this laser beam is passed this first opening and this second opening and focuses on this conduction foreign matter.
4. the method for repairing circuit according to claim 1 is characterized in that, the method for using this laser beam to remove this conduction foreign matter comprises uses a nitrogen laser beam to remove this conduction foreign matter.
5. the method for repairing circuit according to claim 1 is characterized in that, the diameter of this laser beam is between 5 microns to 8 microns.
6. the method for repairing circuit according to claim 1 is characterized in that, after removing this conduction foreign matter, more comprises this first opening of sealing.
7. the method for repairing circuit according to claim 6 is characterized in that, the method for sealing this opening comprises a gel is disposed in this second substrate.
8. the method for repairing circuit according to claim 1 is characterized in that, this first substrate comprises a display floater, a printed circuit board (PCB) or covers the crystal glass substrate.
9. the method for repairing circuit according to claim 1 is characterized in that,
This second substrate comprises one and covers a brilliant film or a flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102518924A CN101916736B (en) | 2010-08-06 | 2010-08-06 | Method for repairing circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102518924A CN101916736B (en) | 2010-08-06 | 2010-08-06 | Method for repairing circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101916736A CN101916736A (en) | 2010-12-15 |
| CN101916736B true CN101916736B (en) | 2012-02-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102518924A Expired - Fee Related CN101916736B (en) | 2010-08-06 | 2010-08-06 | Method for repairing circuit |
Country Status (1)
| Country | Link |
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| CN (1) | CN101916736B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110783489B (en) * | 2019-10-31 | 2022-11-01 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101281303A (en) * | 2008-05-19 | 2008-10-08 | 华映视讯（吴江）有限公司 | Method for restoring LCD module short circuit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01224723A (en) * | 1988-03-03 | 1989-09-07 | Semiconductor Energy Lab Co Ltd | Production of liquid crystal cell |
| JP3386735B2 (en) * | 1999-02-10 | 2003-03-17 | シャープ株式会社 | Active matrix substrate defect repair method and liquid crystal panel manufacturing method |
| KR101032969B1 (en) * | 2007-07-30 | 2011-05-09 | 주식회사 코윈디에스티 | repairing apparatus and repairing method |
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2010
- 2010-08-06 CN CN2010102518924A patent/CN101916736B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101281303A (en) * | 2008-05-19 | 2008-10-08 | 华映视讯（吴江）有限公司 | Method for restoring LCD module short circuit |
Non-Patent Citations (2)
| Title |
|---|
| JP平1-224723A 1989.09.07 |
| JP特开2000-231121A 2000.08.22 |
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| Publication number | Publication date |
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| CN101916736A (en) | 2010-12-15 |
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