CN101887233A - Imaging case chip of imaging equipment, imaging case and imaging equipment - Google Patents

Imaging case chip of imaging equipment, imaging case and imaging equipment Download PDF

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Publication number
CN101887233A
CN101887233A CN 201010217462 CN201010217462A CN101887233A CN 101887233 A CN101887233 A CN 101887233A CN 201010217462 CN201010217462 CN 201010217462 CN 201010217462 A CN201010217462 A CN 201010217462A CN 101887233 A CN101887233 A CN 101887233A
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CN
China
Prior art keywords
chip
imaging
imaging device
circuit
current limliting
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Pending
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CN 201010217462
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Chinese (zh)
Inventor
丁励
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Apex Microelectronics Co Ltd
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Apex Microelectronics Co Ltd
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Priority to CN 201010217462 priority Critical patent/CN101887233A/en
Publication of CN101887233A publication Critical patent/CN101887233A/en
Pending legal-status Critical Current

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Abstract

The embodiment of the invention discloses an imaging case chip of imaging equipment, an imaging case and the imaging equipment, which are applied to the technical field of imaging. In the imaging case chip of the imaging equipment of the embodiment of the invention, a current-limiting unit is connected between two chip electrical contacts connected with an imaging device in the imaging equipment and after the imaging case chip is connected to the imaging device, an installation circuit is switched on, so that when the original current-limiting devices such as current-limiting resisters in the installation circuit of the imaging device have a short circuit for some reasons, the installation circuit can be subjected to current limiting through the current-limiting unit in the imaging case chip; therefore, the imaging equipment is protected against damages caused by overcurrent.

Description

A kind of imaging box chip of imaging device, imaging box and imaging device
Technical field
The present invention relates to technical field of imaging, particularly a kind of imaging box chip of imaging device, imaging box and imaging device.
Background technology
Existing imaging device such as printer, facsimile recorder etc. comprise imaging device and imaging box, wherein on the imaging box, have imaging box chip, storing the information such as data, imaging box build date data, imaging number of pages, imaging box sequence number and residue Mo Liang that are expressed as stored ink kind in the picture box in the imaging box chip; Electrical pickoff is set on the imaging device, connects with imaging box chip on the imaging box and communicate by letter, can read and write the data in the imaging box chip.
After the imaging box was installed to imaging device, before carrying out imaging operation, imaging device judged whether the imaging box is installed on the imaging device earlier by judging unit is installed, and installed then carried out next step operation if be judged as; If the imaging box is not successfully installed, imaging device then points out user's imaging box to lack print cartridge etc.
Generally speaking, judging unit is installed to be comprised testing circuit and circuit is installed, if the imaging box successfully is installed on the imaging device, then being communicated with the installation circuit in the imaging device, is to detect by testing circuit whether short circuit judges whether the imaging box is installed on the imaging device between two electrical pickofves that imaging device in the circuit is installed and judging unit is installed.
In the process that above-mentioned prior art is put into practice and studied, the present inventor finds: if current-limiting resistance is because cause for quality when causing short circuit in the installation circuit of imaging device, when the imaging box successfully is installed on the imaging device, cause the short circuit that circuit is installed easily, thereby cause imaging device to damage.
Summary of the invention
The embodiment of the invention provides a kind of imaging box chip, imaging box and imaging device of imaging device, and the protection imaging device is not damaged.
The embodiment of the invention provides a kind of imaging box chip of imaging device, comprising: two chip electrical pickofves that are connected with imaging device in the imaging device, and current limliting unit;
After described two chip electrical pickofves are connected to described imaging device, be communicated with the installation circuit in the imaging device; Described installation circuit is used to produce electric current;
Described current limliting unit is connected between described two chip electrical pickofves, is used for the described installation circuit of described imaging device is carried out current limliting.
The embodiment of the invention provides a kind of imaging box of imaging device, comprises imaging box body and imaging box chip, and described imaging box chip is connected a side of described imaging box body;
Described imaging box chip comprises: two chip electrical pickofves that are connected with imaging device in the imaging device, and current limliting unit; After described two chip electrical pickofves are connected to described imaging device, be communicated with the installation circuit in the described imaging device; Described installation circuit is used to produce electric current;
Described current limliting unit is connected between described two chip electrical pickofves; Be used for the installation circuit of described imaging device is carried out current limliting.
A kind of imaging device that the embodiment of the invention provides, comprise imaging device and chip unit, described chip unit comprises at least one imaging box chip, comprise testing circuit in the described imaging device and circuit is installed, at least one imaging box chip of described chip unit comprises two chip electrical pickofves that are connected with described imaging device, and the current limliting unit;
Described installation circuit comprises: the device electrical pickoff that is connected with chip unit, and described chip electrical pickoff is communicated with described installation circuit with after described device electrical pickoff is connected; Described installation circuit is used to produce electric current, and described testing circuit is used for detecting between two device electrical pickofves of described installation circuit whether short circuit;
Described current limliting unit is connected between described two chip electrical pickofves; Be used for the installation circuit of described imaging device is carried out current limliting.
As seen; in the imaging box chip of the imaging device by the embodiment of the invention; with two chip electrical pickofves that imaging device in the imaging device is connected between be connected with the current limliting unit; after imaging box chip is being connected to imaging device; be communicated with the installation circuit; make when current limiting device such as original current-limiting resistance is short-circuited for a certain reason in the installation circuit of imaging device; also can come to carry out current limliting, thereby protect imaging device can not damage because of electric current is excessive to circuit is installed by the current limliting unit in the imaging box chip.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the imaging box chip of the imaging device that provides of the embodiment of the invention one;
Fig. 2 is the structural representation of the imaging box of the imaging device that provides of the embodiment of the invention two;
Fig. 3 is the structural representation of the imaging device that provides of the embodiment of the invention three;
Fig. 4 successfully is installed to the circuit diagram of the installation circuit behind the imaging device for the imaging box;
Fig. 5 installs the circuit diagram of circuit for the imaging box successfully is installed to behind the imaging device another.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.And said imaging box chip can be ink box chip in the following embodiment of the invention, also can be selenium drum chip.
Embodiment one
With reference to the imaging box chip 100 that Figure 1 shows that imaging device, imaging device that draws among the figure and imaging device are for aid illustration imaging box chip 100, imaging box chip 100 in the embodiment of the invention can be connected imaging box one side, is storing the information such as data, imaging box build date data, imaging number of pages, imaging box sequence number and residue Mo Liang that are expressed as stored ink kind in the picture box.After the imaging box was installed to imaging device, imaging box chip 100 was connected with imaging device, can communicate.
Imaging box chip 100 comprises: two chip electrical pickoff a1 that are connected with imaging device in the imaging device and a2, and current limliting unit 10 after wherein two chip electrical pickoff a1 and a2 are connected to imaging device, have been communicated with the installation circuit in the imaging device;
It is to be used for producing electric current that circuit is installed here, can comprise a current-limiting resistance, one end of this current-limiting resistance is connected with power supply, the other end opens circuit by one and is connected with ground, after two chip electrical pickoff a1 and a2 are connected to imaging device, be communicated with and installed opening circuit in the circuit, make imaging box chip 100 and current-limiting resistance be connected in series in and power supply between.Be appreciated that circuit is installed can also comprise other components and parts.
Current limliting unit 10 is connected between two chip electrical pickoff a1 and the a2; Be used for the installation circuit of imaging device is carried out current limliting.
Be appreciated that, current limliting unit 10 can comprise resistance, and two chip electrical pickoff a1 and a2 are connected to after the installation circuit in the imaging device, and the resistance of this resistance makes that the voltage between these resistance two ends is low level voltage, generally speaking for being less than or equal to the voltage of 0.7V; Current limliting unit 10 also can other the device that is used for the restricting circuits electric current, and the specific implementation of current limliting unit 10 can not be construed as limiting the invention.
And current limliting unit 10 can be integrated into imaging box chip 100 inside and be connected between two chip electrical pickoff a1 and the a2; Or be integrated on the circuit board of imaging box chip 100 and be connected between two chip electrical pickoff a1 and the a2.
As seen; in the imaging box chip 100 of the imaging device by the embodiment of the invention; between two chip electrical pickoff a1 that are connected with imaging device in the imaging device and a2, be connected with current limliting unit 10; after imaging box chip 100 is being connected to imaging device; be communicated with the installation circuit; make when current limiting device such as original current-limiting resistance is short-circuited for a certain reason in the installation circuit of imaging device; also can come to carry out current limliting, thereby protect imaging device can not damage because of electric current is excessive to circuit is installed by the current limliting unit in the imaging box chip 100.
Embodiment two
With reference to the imaging box 200 that Figure 2 shows that imaging device, imaging device that draws among the figure and imaging device are for aid illustration imaging box 200, imaging box 200 in the embodiment of the invention comprises imaging box body 20 and imaging box chip 21, wherein imaging box chip 21 is connected a side of imaging box body 20, is used for storing the information such as data, imaging box body 20 build date data, imaging number of pages, imaging box body 20 sequence numbers and residue Mo Liang that are expressed as stored ink kind in the picture box body 20.After imaging box 200 was installed to imaging device, imaging box chip 21 was connected with imaging device, can communicate.
Need to prove that the imaging box chip 21 shown in Fig. 2 is not to be included in the imaging box body 20, but imaging box body 20 is seen in the past planimetric map from a side, and imaging box chip 21 be connected to picture box body 20 this above side.
Wherein imaging box chip 21 comprises: two chip electrical pickoff b1 that are connected with imaging device in the imaging device and b2, and current limliting unit 22; After two chip electrical pickoff b1 and b2 are connected to imaging device, be communicated with the installation circuit in the imaging device.
Circuit is installed here is used for producing electric current, can comprise a current-limiting resistance, one end of this current-limiting resistance is connected with power supply, the other end opens circuit by one and is connected with ground, after two chip electrical pickoff b1 and b2 are connected to imaging device, be communicated with and installed opening circuit in the circuit, make imaging box chip 21 and current-limiting resistance be connected in series in and power supply between.It also can be the circuit of the generation electric current of other form that circuit is installed.
Current limliting unit 22 is connected between two chip electrical pickoff b1 and the b2; Be used for the installation circuit of imaging device is carried out current limliting.
Be appreciated that, current limliting unit 22 can comprise resistance, and two chip electrical pickoff b1 and b2 are connected to after the installation circuit in the imaging device, and the resistance of this resistance makes that the voltage between these resistance two ends is low level voltage, generally speaking for being less than or equal to the voltage of 0.7V; Current limliting unit 22 also can other the device that is used for the restricting circuits electric current, and the specific implementation of current limliting unit 22 can not be construed as limiting the invention.
And current limliting unit 22 can be integrated into imaging box chip 21 inside and be connected between two chip electrical pickoff b1 and the b2; Or be integrated on the circuit board of imaging box chip 21 and be connected between two chip electrical pickoff b1 and the b2.
As seen; imaging box chip 21 in the imaging box 200 of the imaging device by the embodiment of the invention comprises: be connected with current limliting unit 22 between two chip electrical pickoff b1 that are connected with imaging device in the imaging device and b2; after imaging box chip 21 is being connected to imaging device; be communicated with the installation circuit; make when current limiting device such as original current-limiting resistance is short-circuited for a certain reason in the installation circuit of imaging device; also can come to carry out current limliting, thereby protect imaging device can not damage because of electric current is excessive to circuit is installed by the current limliting unit of imaging box chip 21 in the imaging box 200.
Embodiment three
With reference to Figure 3 shows that imaging device, comprise imaging device 300 and chip unit 310, wherein chip unit 310 comprises at least one imaging box chip 31 (in the present embodiment be example explanation with an imaging box); Imaging device 300 comprises testing circuit 32 and circuit 33 is installed.
Need to prove, the imaging device of present embodiment also comprises imaging box body (not drawing among the figure), and imaging box chip 31 can be a side that is connected the imaging box body, also can be to be connected with the imaging box body by the carriage that comprises in the imaging device 300, be to be used for storing the information such as data, imaging box body build date data, imaging number of pages, imaging box body sequence number and residue Mo Liang that are expressed as stored ink kind in the picture box body.After imaging box chip 31 in chip unit 310 was installed to imaging device, imaging box chip 31 was connected with imaging device, can communicate.
At least one imaging box chip 31 in the chip unit 310 comprises two chip electrical pickoff c1 and the c2 that is connected with imaging device, and current limliting unit 34; Circuit 33 is installed is comprised device electrical pickoff d1 and the d2 that is connected with imaging box chip 31 in the chip unit 310, two chip electrical pickoff c1 and c2 and device electrical pickoff d1 have been communicated with installation circuit 33 with after d2 is connected; And testing circuit 32 is used for detecting between device electrical pickoff d1 that circuit 33 is installed and the d2 whether short circuit;
Current limliting unit 34 is connected between two chip electrical pickoff c1 and the c2; Be used for the installation circuit 33 of imaging device is carried out current limliting.
Be appreciated that, current limliting unit 34 can comprise resistance, and two chip electrical pickoff c1 and c2 are connected to after the installation circuit in the imaging device, and the resistance of this resistance makes that the voltage between these resistance two ends is low level voltage, generally speaking for being less than or equal to the voltage of 0.7V; Current limliting unit 34 also can other the device that is used for the restricting circuits electric current, and the specific implementation of current limliting unit 34 can not be construed as limiting the invention.
And current limliting unit 34 can be integrated into imaging box chip 31 inside and be connected between two chip electrical pickoff c1 and the c2; Or be integrated on the circuit board of imaging box chip 31 and be connected between described two chip electrical pickoff c1 and the c2.
As seen; in the imaging device by the embodiment of the invention; at least one imaging box chip 31 in the chip unit 310 comprises: be connected with current limliting unit 34 between two chip electrical pickoff c1 that are connected with imaging device in the imaging device and c2; after imaging box chip 31 is being connected to imaging device; be communicated with the installation circuit 33 in the imaging device 300; make when current limiting device such as original current-limiting resistance is short-circuited for a certain reason in the installation circuit 33 of imaging device; also can come to carry out current limliting, thereby protect imaging device can not damage because of electric current is excessive to circuit is installed by the current limliting unit of imaging box chip 31 in the chip unit 310.
In a specific embodiment, when including only an imaging box chip in the chip unit 310, with reference to shown in Figure 4, successfully be installed to the circuit diagram of the installation circuit behind the imaging device for the imaging box.
Current limliting unit 34 in the imaging box chip 31 of the imaging device of present embodiment comprises resistance R 1, circuit 33 is installed is comprised current-limiting resistance R, the end C of this current-limiting resistance R is connected with power supply, when chip unit 310 also was not installed to imaging device, current-limiting resistance R other end D opened circuit by one and is connected with earth point F; After chip unit successfully is installed to imaging device, two the chip electrical pickoff c1 and the c2 of imaging box chip 31 have been communicated with the installation circuit, make resistance R 1 and current-limiting resistance R that imaging box chip 31 upper flow unit 34 comprise be connected in series between power supply and the earth point F.
Be appreciated that, after chip unit 310 is installed to imaging device 300, testing circuit 32 in the imaging device 300 can detect installs in the circuit in the connection-core blade unit between the device electrical pickoff of imaging box chip whether short circuit, determines whether chip unit 310 is installed on the imaging device 300.Concrete detection method is: detect the voltage of resistance R 1 ends A B among Fig. 4, and because the F point is an earth point, can directly detect the voltage that D is ordered, if the D point voltage is a high level voltage, then the circuit disconnection is installed in explanation, and chip unit 310 is incorrect to be installed; If the D point voltage is a low level voltage, then circuit communication, chip unit 310 successful installations are installed in explanation.Need to prove that after chip unit 310 successfully was installed to imaging device 300, the electric current of then installing in the circuit was: I=VCC/ (R+R1), wherein VCC is a supply voltage, this moment, electric current was limited; If make current-limiting resistance R short circuit R=0 when the circuit board of assembling imaging device 300, this electric current that circuit is installed is: I=VCC/R1, this moment, electric current still was limited, had protected imaging device can not damage like this.
Simultaneously, errorless for the detections of satisfying 32 pairs of installations of testing circuit circuit in the imaging device, need guarantee that after imaging box chip 31 is installed in imaging device 300 voltage that D is ordered is low level voltage, be that VD=VCCR1/ (R1+R) is a low level voltage, be generally voltage less than 0.7V.
Suppose VCC=5V, R=5.1K Ω obtains 0.7=5 * R1/ (R1+5.1) by VD=VCCR1/ (R1+R), again by VD less than 0.7V, learn that the resistance R 1 that comprises in the current limliting unit 34 need be less than 830 Ω.This is a specific embodiment, and in the concrete implementation procedure, the resistance that comprises in the current limliting unit need be determined according to the occurrence of current-limiting resistance and power supply in the installation circuit in the imaging device of imaging box correspondence.
In another specific embodiment, imaging device chips unit 310 comprises the individual imaging box chip 31 of N (N is greater than 1), then after this chip unit 310 is installed to imaging device, be communicated with the installation circuit, the imaging box chip of at least one imaging box chip 31 for providing in the embodiment of the invention in the chip unit 310 wherein, all imaging box chip imaging box all in the imaging device of present embodiment for providing in the embodiment of the invention.
As shown in Figure 5, current limliting unit 34 in the chip unit 310 of the imaging device of present embodiment in N imaging box chip comprises resistance R 1 to RN respectively, circuit 33 is installed is comprised current-limiting resistance R, the end C of this current-limiting resistance R is connected with power supply, when chip unit 310 also was not installed to imaging device, current-limiting resistance R other end D opened circuit by one and is connected with earth point F; After chip unit 310 successfully is installed to imaging device, the chip electrical pickoff of N imaging box chip 31 has been communicated with the installation circuit, makes the imaging box chip 31 upper flow unit 34 in N comprise in the chip unit 310 N resistance R 1 to RN and current-limiting resistance R be connected in series in mutually between power supply and the earth point F.
Be appreciated that, after chip unit 310 is installed to imaging device 300, testing circuit 32 in the imaging device 300 can detect between the device electrical pickoff that connection-core blade unit in the circuit is installed whether short circuit, determines whether chip unit 310 is installed on the imaging device 300.Concrete detection method is: the voltage between the pick-up unit electrical pickoff, if be high level voltage, then the circuit disconnection is installed in explanation, and at least one imaging box chip in chip unit 310 is not installed to imaging device; If be low level voltage, then circuit communication is installed in explanation, and all imaging box chips all are installed to imaging device in all chip units 310.
Need to prove, errorless in order to satisfy 32 pairs of detections that circuit 33 is installed of testing circuit in the imaging device, after need guaranteeing that N imaging box chip 31 is installed in imaging device 300 in chip unit 310, the voltage that D is ordered is low level voltage, be that VD=VCCR1/ (R1+R) is a low level voltage, be generally voltage less than 0.7V.
Suppose VCC=5V, R=5.1K Ω, then obtaining the resistance R I that comprises in N the imaging box chip 31 is 830 Ω to RN series connection resistance, if the resistance that N imaging box chip upper flow unit comprises all is the same, then the resistance that comprises of each imaging box chip upper flow unit is 830/N.
As seen; in the imaging box chip of the imaging device by the embodiment of the invention; with two chip electrical pickofves that imaging device in the imaging device is connected between be connected with the current limliting unit; after imaging box chip is being connected to imaging device; be communicated with the installation circuit; make when current limiting device such as original current-limiting resistance is short-circuited for a certain reason in the installation circuit of imaging device; also can come to carry out current limliting, thereby protect imaging device can not damage because of electric current is excessive to circuit is installed by the current limliting unit in the imaging box chip.
More than to imaging box chip, imaging box and the imaging device of the imaging device that the embodiment of the invention provided, be described in detail, used specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.

Claims (9)

1. the imaging box chip of an imaging device is characterized in that, comprising: two chip electrical pickofves that are connected with imaging device in the imaging device, and current limliting unit;
After described two chip electrical pickofves are connected to described imaging device, be communicated with the installation circuit in the imaging device; Described installation circuit is used to produce electric current;
Described current limliting unit is connected between described two chip electrical pickofves, is used for the described installation circuit of described imaging device is carried out current limliting.
2. imaging box chip according to claim 1 is characterized in that described current limliting unit comprises resistance, and described two chip electrical pickofves are connected to after the described imaging device, and the resistance of described resistance makes that the voltage between these resistance two ends is low level voltage.
3. imaging box chip as claimed in claim 1 or 2, it is characterized in that, it is inner and be connected between described two chip electrical pickofves that described current limliting unit is integrated into described imaging box chip, or be integrated on the circuit board of described imaging box chip and be connected between described two chip electrical pickofves.
4. the imaging box of an imaging device is characterized in that, comprises imaging box body and imaging box chip, and described imaging box chip is connected a side of described imaging box body;
Described imaging box chip comprises: two chip electrical pickofves that are connected with imaging device in the imaging device, and current limliting unit; After described two chip electrical pickofves are connected to described imaging device, be communicated with the installation circuit in the described imaging device; Described installation circuit is used to produce electric current;
Described current limliting unit is connected between described two chip electrical pickofves; Be used for the installation circuit of described imaging device is carried out current limliting.
5. as imaging box as described in the claim 4, it is characterized in that described current limliting unit comprises resistance, described two chip electrical pickofves are connected to after the described installation circuit, and the resistance of described resistance makes that the voltage between these resistance two ends is low level voltage.
6. as imaging box as described in claim 4 or 5, it is characterized in that, it is inner and be connected between described two chip electrical pickofves that described current limliting unit is integrated into described imaging box chip, or be integrated on the circuit board of described imaging box chip and be connected between described two chip electrical pickofves.
7. imaging device, comprise imaging device and chip unit, described chip unit comprises at least one imaging box chip, comprise testing circuit in the described imaging device and circuit is installed, it is characterized in that, at least one imaging box chip of described chip unit comprises two chip electrical pickofves that are connected with described imaging device, and the current limliting unit;
Described installation circuit comprises: the device electrical pickoff that is connected with chip unit, and described chip electrical pickoff is communicated with described installation circuit with after described device electrical pickoff is connected; Described installation circuit is used to produce electric current, and described testing circuit is used for detecting between two device electrical pickofves of described installation circuit whether short circuit;
Described current limliting unit is connected between described two chip electrical pickofves; Be used for the installation circuit of described imaging device is carried out current limliting.
8. as imaging device as described in the claim 7, it is characterized in that described current limliting unit comprises resistance, described two chip electrical pickofves are connected to after the described installation circuit, and the resistance of described resistance makes that the voltage between these resistance two ends is low level voltage.
9. as imaging device as described in claim 7 or 8, it is characterized in that, it is inner and be connected between described two chip electrical pickofves that described current limliting unit is integrated into described imaging box chip, or be integrated on the circuit board of described imaging box chip and be connected between described two chip electrical pickofves.
CN 201010217462 2010-07-01 2010-07-01 Imaging case chip of imaging equipment, imaging case and imaging equipment Pending CN101887233A (en)

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Application publication date: 20101117