CN101884981B - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
- Publication number
- CN101884981B CN101884981B CN 201010195939 CN201010195939A CN101884981B CN 101884981 B CN101884981 B CN 101884981B CN 201010195939 CN201010195939 CN 201010195939 CN 201010195939 A CN201010195939 A CN 201010195939A CN 101884981 B CN101884981 B CN 101884981B
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- bearing
- rotating shaft
- drive motors
- housing
- cover
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Abstract
The invention provides a wafer cleaning device, relating to the technical field of wafer cleaning devices of semiconductor special equipment. A drive motor is arranged on the piston rod of a cylinder body by a mounting seat, the axis of the drive motor is parallel with the movement direction of the piston rod, a motor shaft is connected with a spindle, and the end of the spindle is connected with a brush by an elastic holder. The invention can solve the problems of the prior art effectively, and realize flexible contact of the brush and wafers to prevent the wafers from damaging, thereby greatly improving cleaning quality and efficiency. The invention has the advantages of higher reliability and stability, simple and compact structure, convenient usage and long service life. The wafer cleaning device is particularly applicable to the semiconductor special equipment.
Description
Technical field
The present invention relates to semiconductor special-purpose equipment wafer cleaning device technical field
Background technology
Semiconductor manufacturing equipment need contact with wafer with hairbrush and clean in the process of carrying out wafer process, to remove impurity.Common cleaning device drives hairbrush by motor through ball-screw and moves up and down, and has some problems like this, like complex structure, poor sealing, flexible difference etc., thereby has influenced the raising of crudy and efficient.
Summary of the invention
The purpose of this invention is to provide a kind of wafer cleaning apparatus; Hairbrush and wafer flexibility is contacted, effectively prevent damage wafers, can improve cleaning quality and efficient greatly; Reliability and stability are higher, and have characteristics simple and compact for structure, easy to use, that the life-span is long.
The present invention is achieved in that a kind of wafer cleaning apparatus; Comprise drive motors; It is characterized in that drive motors is installed on the piston rod of cylinder apparatus through mount pad; The axis of drive motors is parallel with the piston rod movement direction, and motor shaft is connected with rotating shaft, and the end of rotating shaft is connected with hairbrush through elastic support.
For making elasticity better, the better structure and the annexation of described elastic support are: following disk is fixed on the end of rotating shaft through jam nut, and the upper end of elasticity support plate is fixedly connected with following disk, and the lower end connects with hairbrush.
For making rotation more accurately stable; More reasonable structure; Described rotating shaft topmost can be fixed in the hole of mount pad upper end through shaft coupling and drive motors, and rotating shaft is a multidiameter, is installed in bearing holder (housing, cover) through two angular contact ball bearings; Bearing gland is fixedly connected with the screw in compression bearing outer ring and with bearing holder (housing, cover), and the bearing nut compresses bearing inner race through the screw thread in the rotating shaft.
Between described two angular contact ball bearings the Internal and external cycle axle sleeve is installed, between angular contact ball bearing and the bearing nut inner ring axle sleeve is installed, better.
Lubricated better for making, rotation precision is high, between described rotating shaft and the bearing holder (housing, cover), is equipped with the radial labyrinth sealing between bearing gland and the bearing nut.
Described cylinder apparatus can be cylinder or cylinder apparatus.
Good effect of the present invention is: can effectively solve the problem that exists in the prior art, reach goal of the invention; Realize rectilinear motion by cylinder, when hairbrush was contacted with wafer, the elasticity support plate also produced distortion with following disk, can further cushion the active force between hairbrush and the wafer; Hairbrush and wafer flexibility is contacted, effectively prevent damage wafers, can improve cleaning quality and efficient greatly, reliability and stability are higher, and have characteristics simple and compact for structure, easy to use, that the life-span is long.Be particularly useful on the semiconductor manufacturing equipment.
Description of drawings
Fig. 1 is the structural representation of apparatus of the present invention.
Among the figure: disk, 11-jam nut, 12-elasticity support plate, 13-hairbrush, 14-cylinder apparatus (cylinder or oil cylinder) under 1-drive motors, 2-mount pad, 3-shaft coupling, 4-rotating shaft, 5-baffle plate, 6-angular contact ball bearing, 7-bearing holder (housing, cover), 8-bearing gland, 9-bearing nut, the 10-.
The specific embodiment
Below in conjunction with accompanying drawing and preferred embodiment the present invention is further specified, but not as to qualification of the present invention.
Referring to Fig. 1, this wafer cleaning apparatus, drive motors 1 are installed in through mount pad 2 on the piston rod of cylinder apparatus 14, and the axis of drive motors 1 and the direction of motion of piston rod parallel, and motor shaft is connected with rotating shaft 4, and the end of rotating shaft 4 is connected with hairbrush 13.The end of rotating shaft 4 is connected with hairbrush 13 through elastic support.The structure of elastic support and annexation are: following disk 10 is fixed on the end of rotating shaft 4 through jam nut 11, and the upper end of elasticity support plate 12 is fixedly connected with following disk 10, and the lower end connects with hairbrush 13.Rotating shaft 4 topmost is fixed in the hole of mount pad 2 upper ends through shaft coupling 3 and drive motors 1; Rotating shaft 4 is a multidiameter; Be installed in bearing holder (housing, cover) 7 through two angular contact ball bearings 6; Bearing gland 8 is fixedly connected with the screw in compression bearing outer ring and with bearing holder (housing, cover) 7, and bearing nut 9 compresses bearing inner race through the screw thread in the rotating shaft 4.Between two angular contact ball bearings 6 the Internal and external cycle axle sleeve is installed, between angular contact ball bearing 6 and the bearing nut 9 the inner ring axle sleeve is installed.Between rotating shaft 4 and the bearing holder (housing, cover) 7, be equipped with the radial labyrinth sealing between bearing gland 8 and the bearing nut 9.Mount pad 2 connects with cylinder, is moved up and down by its drive, and baffle plate 5 is fixed on the outside of mount pad 2.
During work, drive mounting seat by cylinder and move up and down, make the hairbrush contact wafer.Drive motors 1 drives hairbrush 9 through shaft coupling 3 and rotatablely moves, and the rotating speed of hairbrush can be realized through regulating the parameter of electric machine with turning to.The cylinder input air pressure can be through pressure-reducing valve control, and the exposure level with control hairbrush and wafer reaches different cleaning effects.Following disk 10 produces distortion with elasticity support plate 12 when hairbrush contacts with wafer, to cushion its interaction force.Realize rectilinear motion, simplified structure by cylinder.Hairbrush contacts with wafer is flexible, prevents damage wafers; Improve cleaning quality; Have compact conformation, simple, good airproof performance, long characteristics of life-span are installed.
Claims (1)
1. a wafer cleaning apparatus comprises drive motors (1), it is characterized in that drive motors (1) is installed on the cylinder rod of air cylinder device (14) by mount pad (2), and motor shaft is connected with rotating shaft (4), and the end of rotating shaft (4) is connected with hairbrush (13) through elastic support; The structure of described elastic support and annexation are: following disk (10) is fixed on the end of rotating shaft (4) through jam nut (11), and the upper end of elasticity support plate (12) is fixedly connected with following disk (10), and the lower end connects with hairbrush (13); Described rotating shaft (4) topmost links to each other with drive motors (1) through shaft coupling (3); Rotating shaft (4) is a multidiameter; Be installed in bearing holder (housing, cover) (7) through two angular contact ball bearings (6); Bearing gland (8) is fixedly connected with the screw in compression bearing outer ring and with bearing holder (housing, cover) (7), and bearing nut (9) compresses bearing inner race through the screw thread in the rotating shaft (4).Drive motors (1) is separately fixed in the circular hole of mount pad (2) top and bottom with bearing holder (housing, cover) (7); Between described rotating shaft (4) and the bearing holder (housing, cover) (7), be equipped with the radial labyrinth sealing between bearing gland (8) and the bearing nut (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010195939 CN101884981B (en) | 2010-06-10 | 2010-06-10 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010195939 CN101884981B (en) | 2010-06-10 | 2010-06-10 | Wafer cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101884981A CN101884981A (en) | 2010-11-17 |
| CN101884981B true CN101884981B (en) | 2012-12-26 |
Family
ID=43071165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010195939 Expired - Fee Related CN101884981B (en) | 2010-06-10 | 2010-06-10 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101884981B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102479669B (en) * | 2010-11-29 | 2013-09-11 | 中芯国际集成电路制造(上海)有限公司 | Wafer brush cleaning device and wafer brush cleaning method |
| KR20170063691A (en) * | 2014-09-26 | 2017-06-08 | 에이씨엠 리서치 (상하이) 인코포레이티드 | Apparatus and method for cleaning semiconductor wafer |
| CN108480244B (en) * | 2018-03-29 | 2023-11-17 | 池州海琳服装有限公司 | Efficient cleaning device for PCB |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101045272A (en) * | 2006-03-30 | 2007-10-03 | 日立比亚机械股份有限公司 | Laser processing machine and window unit |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0684858A (en) * | 1992-08-31 | 1994-03-25 | Dainippon Screen Mfg Co Ltd | Substrate cleaning apparatus |
| JP3324281B2 (en) * | 1994-06-28 | 2002-09-17 | カシオ計算機株式会社 | Cleaning equipment |
| JP3108312B2 (en) * | 1995-03-13 | 2000-11-13 | シャープ株式会社 | How to clean LCD panel |
| ES2287242T3 (en) * | 2001-03-05 | 2007-12-16 | Elm Inc. | DEVICE FOR CLEANING OPTICAL DISCS. |
-
2010
- 2010-06-10 CN CN 201010195939 patent/CN101884981B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101045272A (en) * | 2006-03-30 | 2007-10-03 | 日立比亚机械股份有限公司 | Laser processing machine and window unit |
Non-Patent Citations (3)
| Title |
|---|
| JP特开平6-84858A 1994.03.25 |
| JP特开平8-10721A 1996.01.16 |
| JP特开平8-248370A 1996.09.27 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101884981A (en) | 2010-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: CETC BEIJING ELECTRONIC EQUIPMENT CO., LTD. Free format text: FORMER OWNER: NO.45 INST., CHINA ELECTRONIC SCIENCE AND TECHNOLOGY GROUP CORP. Effective date: 20101215 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 065201 NO. 20, HAIYOU STREET, BEIJING EAST YANJIAO DEVELOPMENT AREA, YANJIAO DEVELOPMENT AREA, SANHE CITY, HEBEI PROVINCE TO: 100176 ROOM A119, NO. 18, XIHUAN SOUTH ROAD, ECONOMIC AND TECHNOLOGY DEVELOPMENT ZONE, BEIJING |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20101215 Address after: 100176 room All9, No. 18 West South Road, Beijing economic and Technological Development Zone Applicant after: CETC BEIJING ELECTRONIC EQUIPMENT Co.,Ltd. Address before: Beijing East Yanjiao Development Zone, Hebei province Sanhe 065201 Street CNOOC Yanjiao Development Zone No. 20 Applicant before: THE 45TH Research Institute OF CETC |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 |