CN101881420B - LED light source using fluorescence conversion device with transparent base material - Google Patents
LED light source using fluorescence conversion device with transparent base material Download PDFInfo
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- CN101881420B CN101881420B CN2009102653069A CN200910265306A CN101881420B CN 101881420 B CN101881420 B CN 101881420B CN 2009102653069 A CN2009102653069 A CN 2009102653069A CN 200910265306 A CN200910265306 A CN 200910265306A CN 101881420 B CN101881420 B CN 101881420B
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Abstract
This invention provides an LED light source using a fluorescence conversion device with a transparent base material. The LED light source comprises an LED device and a fluorescence conversion device, wherein the LED device has at least one LED chip; the fluorescence conversion device is arranged on the LED device and has the transparent base material; light emitted from the LED chip is mixed to form white light by using the fluorescence conversion device and emitted to the outside; and the fluorescence conversion device can be arranged on the LED device during package of the LED device and secondary package of the LED device, or a plurality of LED devices share a fluorescence conversion device. The fluorescence conversion device with the transparent base material is formed by coating a fluorescent powder film on the transparent base material shaped from any one material of ARTON, COC, COP, PMMA and optical glass; and the fluorescent powder film on the fluorescence conversion device is excited by a blue ray or an ultraviolet chip to produce visible light of other wave bands, and colors of various sections are mixed to form the white light. The invention further provides the fluorescence conversion device with the ARTON transparent base material and a preparation method thereof.
Description
Technical field
The invention belongs to the LED lighting technical field, especially the coating method of LED fluorescent material.Be specifically related to the sputter coating technology.
Technical background
Along with the appearance of ultra-bright LED, its efficient is increasingly high, and price descends gradually.Simultaneously LED have life-span length, vibration resistance, luminous efficiency high, noiseless, be not afraid of characteristics such as low temperature, no mercury pollution problem and cost performance height, big potentiality commodity of the alternative traditional lighting utensil of being had an optimistic view of by semicon industry.Ultra-high brightness LED has been expanded LED greatly and has been shown and the lighting source Application for Field at various signals, like car interior-exterior lamp, various traffic lights, indoor and outdoor information display screen and backlight.The LED product is used for illumination, will more wide application space be provided for LED.
A kind of traditional approach that forms white light LEDs is that blue light or ultraviolet chip excite the fluorescent material that covers above the chip, and the optical excitation fluorescent material that chip sends under electricity drives produces the visible light of other wave band, and the each several part colour mixture forms white light.
Excite the led chip that forms white light synthetic by fluorescent material by III-V compound semiconductor GaN material.The backing material that wherein is used for the GaN chip has Al
2O
3And SiC, chip can send the light of blue light, ultraviolet light or other short-wave band.
The fluorescent material that is used to form white light LEDs generally has YAG fluorescent material (be used for blue chip and excite YAG fluorescent material) and RGB fluorescent material (be used for the ultraviolet chip and excite RGB fluorescent material).Wherein adopt YAG fluorescent material to excite the mode that forms white light the most general.
Typical White-light LED package structure: for the small-power white light LEDs, led chip is placed in the reflector in the support, and support also provides the passage of chip heat diffusion simultaneously not only as the carrier of reflector but also as electrode and electrode pin use.Chip is positioned over the central authorities of reflector; The difference that is provided with according to chip electrode; (for the unipolar chip in top, the bottom is coated with the elargol of conduction, and for the chip of top bipolar electrode and coat elargol or insulating cement in bowl cup bottom; The bottom is coated with insulating cement), they not only can stick and fixed chip but also can realize good Ohmic contact between chip and electrode; The electrode of chip links to each other with another electrode of support through metal wire welding, on GaN blue-light-emitting chip, applies thick yttrium-aluminium-garnet (YAG) the yellow fluorescence bisque of about 100um, and entire bracket and chip are used the epoxy sealing sealing-in at last, the centre gas of not leaving a blank.Blue light that chip sends and fluorescent material effect fully and excitated fluorescent powder sends gold-tinted makes gold-tinted mix the formation white light mutually with the sodium yellow that appears from phosphor powder layer again.And aspect fluorescent powder coated technique; Lean on and directly to fill the conventional fluorescent powder application pattern that the cup bowl covers chip and cause photochromic inequality owing to technology is uncontrollable, and the generation of the fluorescent powder coated mode of directly filling cup bowl local heat owing to exciting makes the reduction of fluorescent material transformation efficiency.In US5962971 A, US5959316 A, US6294800 a series of patents such as (B1) and document, used fluorescent material territory far away and excited, companies such as the Lumileds of LED production firm, Osram, HP have all proposed the territory far away of fluorescent material separately excitation scheme.It is that a segment distance is arranged between fluorescent material and the chip that fluorescent material territory far away excites, and fluorescent material does not directly contact with chip, and the fluorescent powder coated mode in this far field helps improving light extraction efficiency and the performance that improves white light LED part.But, adopt traditional application pattern of the accent fluorescent material of resin or silica gel on consumption, accurately to control difficulty, make that the photochromic difference of making in batch of LED is bigger, controllable color property is relatively poor.
Summary of the invention
The present invention provides a kind of use to have the led light source of the fluorescence conversion device of transparent base.
As shown in Figure 1; The present invention uses the led light source of the fluorescence conversion device with transparent base; Comprise LED device 1 with at least one led chip 11; And be installed in the fluorescence conversion device with transparent base 2 on the LED device, wherein the light that sends of led chip is mixed into white light emission to outside through fluorescence conversion device; Fluorescence conversion device can just add when packaged LED device 1, also can when the LED device being carried out the secondary encapsulation, install, or a plurality of LED device uses a fluorescence conversion device jointly.
The LED device can be monochrome or polychrome, and monochrome is the led chip of a certain emission wavelength of encapsulation in the LED device, makes its light that sends a kind of color, has a led chip in the LED device at least; Polychrome then is that led chip mutual encapsulation with multiple different emission is in a LED device, like the mutual encapsulation of red, blue, green three color chip mutual encapsulation or other color chip portfolio.
Fluorescence conversion device with transparent base is that the transparent base by moulding carries out the fluorescent material plated film and forms; During led light source work, by blue light or the fluorescent powder film layer above the ultraviolet chip fluorescence excitation conversion equipment, the optical excitation fluorescent material that chip sends under electricity drives produces the visible light of other wave band, and the each several part colour mixture forms white light.
The present invention also provides a kind of fluorescence conversion device with transparent base and preparation method thereof.
Fluorescence conversion device with transparent base carries out plated film by the transparent base of moulding, comprises the lens of the arbitrary surface of moulding, perhaps diaphragm arbitrarily, perhaps arbitrarily the solid geometry shape as transparent base; It is characterized in that: by the transparent base surface plating fluorescent powder film layer of moulding.
Described fluorescent powder film layer forms for the fluorescent material plated film.Fluorescent material comprises following any or following any several kinds of combinations:
1) aluminate serial fluorescent material includes but not limited to:
YAG fluorescent material, contain the YAG fluorescent material of alloy, can be used for white light LEDs, wavelength-tunable, exciting light is green, yellow green, yellow or orange fluorescent powder.
2) silicate series fluorescent material includes but not limited to:
Contain rare earth, silicon, alkaline-earth metal, halogen, oxygen, and the silicate fluorescent powder of aluminium or gallium, under blue light, purple light or ultraviolet excitation, send peak value in the broadband of 500～600nm visible light, half-peak breadth is greater than 30nm;
The fluorescent material that forms by multiple element combinations such as alkaline-earth metal, rare earth, transition metal, halogens; Can be used as the light-emitting component of the emission spectrum of excitation source in ultraviolet-green glow zone of 240～510nm excites; Send the emission spectrum of peak value in 430～630 scopes, can present the light of indigo plant, bluish-green, green, yellowish green, yellow, Huang Hong, red, white colour;
Europkium-activated alkaline-earth metal phosphosilicate fluorescent material, emission wavelength ranges is at the bluish-green yellow orange light that arrives;
Be suitable for the yellow fluorescent powder that 220～530nm excites; With the orange colour silicate fluorescent powder of wavelength greater than 565nm.
3) nitride/nitrous oxides series fluorescent material includes but not limited to:
Be suitable for by the led chip excited fluorescent powder of 420～470nm, produce the emission of gold-tinted-ruddiness;
Can be obtained the wide range emission of 520～780nm by the effective excited fluorescent powder of the light below the 500nm;
At ultraviolet and the blue-light excited fluorescent material that can produce yellowish red color or red emission down;
Main is main fluorescent material with the transmitting green light, can suitably regulate the position of emission main peak through the ratio of adjustment alkaline-earth metal;
Can (380～480nm) excite the fluorescent material that produces green-yellow light by blue light and/or ultraviolet ray;
Emission wavelength is the fluorescent material of 550～610nm;
The grand type fluorescent material of d-match of multinomial jaundice green glow, gold-tinted or ruddiness;
Behind ultraviolet, visible light or the electron beam excitation of 250～500nm wavelength, can be emitted in the fluorescent material of the green glow of 500～600nm.
4) other fluorescent material includes but not limited to:
A kind of can be had the excitation spectrum of broad by the fluorescent material of ultraviolet light and near ultraviolet excitation, can effectively be excited by the light at 300-420nm; Through changing component and doping content, can change chromaticity coordinates;
A kind of red fluorescence powder, the emission peak of its excitation band and blue light gallium nitride based LED is overlapping, can effectively be excited, and main emission wavelength is positioned near the 612nm;
A kind ofly can effectively be excited and glow by ultraviolet, purple light or blue-ray LED, and when burst of ultraviolel another emission peak adjustable fluorescent material from ruddiness to the green glow;
A kind of fluorescent material is that 220 to 550nm visible light or UV radiation are excited the light emission to obtain to hope effectively through wavelength, glows especially efficiently;
A kind of fluorescent material that sends peak position 612nm ruddiness when being excited by LED;
A kind ofly excite the fluorescent material that issues gold-tinted in 300～500nm ultraviolet or blue-ray LED.
Described fluorescent powder membrane layer thickness is: 10～500 microns.
Described fluorescent powder film layer is one deck incessantly, can be as required according to the identical or different fluorescent powder film layer of graded plating several layers.
Aforesaid preparation method with fluorescence conversion device of transparent base is characterized in that comprising the steps:
1) at first transparent base to be coated is cleaned, after the drying, carries out the forevacuum transition; In vacuum equipment, carry out the ion reverse sputtering at last and clean, let speeding-up ion bombard substrate surface, remove impurity, the transparent base that obtains cleaning;
2) adopt the magnetron sputtering method of being coated with to be coated with rete then:
(1). the preparation target:
Prepare corresponding phosphor material powder, mix and sinter into target.
(2). magnetron sputtering plating: at pure argon or in oxygen argon mixture gas atmosphere transparent base is carried out magnetron sputtering plating, the sputtering pressure scope is 0.10Pa～3.0Pa, during sputter in the argon oxygen gas mixture the shared mass percent of oxygen be 0 to 90%; With ready fluorescent material target transparent base is carried out magnetron sputtering plating and obtain fluorescence conversion device.
Adopting online heating, heat treatment temperature during transparent base plated film described step 2) is 20～160 ℃.
Described step 2) fluorescence conversion device that obtains in adopts off-line heat treatment, and heat treatment temperature is 20～160 ℃, and heat treatment time is 10～240 minutes.
Said transparent base comprises wherein any material of ARTON, COC, COP, PMMA and optical glass.
Wherein ARTON has good optical characteristic, dimensional stability and very high stable on heating transparent resin (cyclic olefin resinoid); In the middle of transparent resin, have very high hear resistance, water absorption rate is low; Refractive index is stable; The transparency high (having about transmitance more than 93% in the visible light field), the characteristics that proportion is low are than the optics that is more suitable for led light source.
COC (Cyclic Olefin Copolymer; Cyclic olefine copolymer) extremely excellent optical of tool; The high grade of transparency and hear resistance (high glass transition temperature), light weight, low moisture absorption; Heat-resisting and excellent processing fluidity, high heat-resisting high optical characteristics, excellently block water, characteristics such as gas barrier property and acid and alkali-resistance solvent, than the optics that is more suitable for led light source.
COP (Cyclo-olefin polymer; Cyclic olefin polymer) transparent base of moulding has the characteristics of optical transmittance height (92%), saturated water absorption low (＜0.01%), glass transition temperature and loading flexure temperature higher (being respectively 140 ℃ and 123 ℃), than the optics that is more suitable for led light source.
The transparent base of PMMA (polymethyl methacrylate, acrylic) moulding has that optical transmittance height (92%), water absorption rate are low, shock resistance, wear-resisting, density is little, is widely used optical plastic, than the optics that is more suitable for led light source.
Optical glass is the main material of making optical lens, optical instrument.Optical glass must have highly accurate refractive index, Abbe number and the high grade of transparency, high evenness.Than the optics that is more suitable for led light source.
The present invention uses the led light source of the fluorescence conversion device with transparent base, can make the lighting of Any shape.The present invention is coated with fluorescent powder film layer with magnetron sputtering method on transparent base, the preparation method is simple, and controllability is strong.Led light source of the present invention can improve light extraction efficiency and the performance that improves white light LED part, avoids fluorescent material to receive heat ageing, and improves the uniformity of bulk article on photochromic.
Description of drawings
Fig. 1 is the structural profile sketch map of the present invention's led light source of using the fluorescence conversion device with transparent base;
Fig. 2 is the spectral component sketch map of an embodiment of led light source of the present invention;
Fig. 3 is the generalized section of the led light source of another embodiment of the present invention;
Fig. 4, Fig. 5, Fig. 6 are the spectral component sketch mapes of three kinds of embodiment of led light source of the present invention.
The specific embodiment
Embodiment one
See also Fig. 1, a LED device 1 has wherein encapsulated 11, one fluorescence conversion devices 2 of a led chip and has been positioned at led chip 11 tops, and fixing.
During work; The light that led chip 11 sends must be through just being transmitted into the outside behind the fluorescence conversion device 2; By the fluorescent powder film layer above the blue-light excited fluorescence conversion device, the optical excitation fluorescent material that chip sends under electricity drives produces the visible light of other wave band, and the each several part colour mixture forms white light.
Led chip 11 emission dominant wavelength ranges generally are 420nm～480nm, and the composition of the fluorescent powder film layer on the fluorescence conversion device is for exciting the aluminate YAG fluorescent material of gold-tinted.The blue light that led chip sends is through the fluorescent powder film layer on fluorescence conversion device and the fluorescence excitation conversion equipment, and a part of blue light changes gold-tinted into; Blue light and gold-tinted are mixed just to have produced white light, and chromaticity coordinates, colour temperature depend on the ratio of blue light and gold-tinted.The spectral component of led light source is as shown in Figure 2.
Preparation with fluorescence conversion device of transparent base, as an example, present embodiment is selected the ARTON transparent base for use, but also can select COC for use, the transparent base of COP, PMMA or optical glass moulding, other embodiment is identical therewith, comprises the steps:
1) at first ARTON transparent base to be coated is cleaned, after the drying, carries out the forevacuum transition; In vacuum equipment, carry out the ion reverse sputtering at last and clean, let speeding-up ion bombard substrate surface, remove impurity, the ARTON transparent base that obtains cleaning;
2) adopt the magnetron sputtering method of being coated with to be coated with rete then:
(1). the target of preparation fluorescent material:
(a) YAG fluorescent powder mixture being put into planetary ball mill, is medium with ethanol, and 210r/min wet-milling 24h mixes; (b) grind and sieve; (c) take by weighing the 70g powder and put into homemade graphite jig (φ 60mm), utilize the multifunctional vacuum hot-pressed sintering furnace, heat up automatically, when temperature reaches 200 ℃, feed the protective gas high-purity N with 5 ℃/min
2(purity 99.995%), when temperature is 1050 ℃, pressurization, hot pressing pressure is 15Mpa, and insulation 2h, cools to room temperature afterwards with the furnace, can obtain the high-compactness target of φ 60mm * 6mm.
(2). magnetron sputtering plating:
Adopt the vertical three target magnetic control sputtering coating systems of ultrahigh vacuum type, be equipped with rotation system, can make the film thickness of deposition even, reliability is higher.Technological parameter is: sputter gas: 95% argon and 5% oxygen gas mixture (purity>=99.9%); Sputter gas flow: 60cm
3/ s; Sputtering pressure: 1.0Pa; Back of the body end vacuum: 6.0 * 10
-5Pa; Sputtering power: 60W, 90W, 120W and 150W; Sputtering time: 3h; The spacing of target and ARTON transparent base is 65mm.The fluorescent powder membrane layer thickness is 210 microns.
Sputter is heat-treated after finishing, and adopts common chamber type electric resistance furnace, is warming up to 160 ℃ with 5～8 ℃/min; Cool to room temperature with the furnace behind the insulation 4h.
In the present embodiment, the ARTON transparent base is circular tabular thin slice.
Embodiment two
Basic identical with embodiment one, the transparent base of different is fluorescence conversion device is shaped to the round lens curved surface, and is as shown in Figure 3; Clean again and plated film again or be shaped to square lens curved surface.
Embodiment three
Basic identical with embodiment one, different is in the LED device, has encapsulated the led chip of a plurality of co-wavelengths, and like two blue chip mutual encapsulation, the emission dominant wavelength ranges generally is 420nm～480nm.
The blue light that led chip sends is through the fluorescent powder film layer on fluorescence conversion device and the fluorescence excitation conversion equipment, and a part of blue light changes gold-tinted into; Blue light and gold-tinted are mixed just to have produced white light, and chromaticity coordinates, colour temperature depend on the ratio of blue light and gold-tinted.The spectral component of led light source is as shown in Figure 2.
Embodiment four
Basic identical with embodiment one, different is in the LED device, has encapsulated the led chip of a plurality of different wave lengths.Use red LED chip and blue-light LED chip mutual encapsulation in same device.The fluorescent powder membrane composition of layer that plates on the fluorescence conversion device is for can be by blue-light excited silicate or the Nitride phosphor that goes out green glow.Silicate or nitride phosphor material sintering are made into target, transparent base is carried out magnetron sputtering plating, obtain fluorescence conversion device.
The emission dominant wavelength ranges of described blue-light LED chip generally is 380nm～480nm; The emission dominant wavelength ranges of red LED chip generally is 580nm～700nm; The peak wavelength scope of the green light of being launched by blue-light excited fluorescent material generally is: 490nm～570nm.
In the led light source, after the green light that blueness, red light and the fluorescent material that two kinds of led chips send excites is mixed, form white light.These three kinds of light components form complementary ideally in spectrum, can under high light efficiency, realize high color developing.The spectral component of led light source is as shown in Figure 4.
The chromaticity coordinates of led light source, colour temperature depend on the ratio of several kinds of color of light in the light source.In the light component of led light source, the shared ratio of versicolor light is decided as required.Can perhaps change the luminosity of two kinds of chips, with the spectral component of change whole light source through concentration, the thickness of fluorescent powder film layer on quantity and the fluorescence conversion device of two kinds of chips of configuration through the operating current of regulating led chip respectively.In this led light source, ruddiness generally occupies greater than one of percentage ratio in total light intensity or total light flux, specifically decides according to the use needs, accounts for 5%～20% like ruddiness, or 30%～40%, or other arbitrary proportions.
Embodiment five
Basic identical with embodiment one, different is in the LED device, has encapsulated the led chip of a plurality of different wave lengths.Use green light LED chip and blue-light LED chip mutual encapsulation in same device.The fluorescent powder membrane composition of layer that plates on the fluorescence conversion device is for can be by the blue-light excited Nitride phosphor that goes out ruddiness.The nitride phosphor material sintering is made into target, transparent base is carried out magnetron sputtering plating, obtain fluorescence conversion device.
The emission dominant wavelength ranges of described blue-light LED chip generally is 380nm～480nm; The emission dominant wavelength ranges of green light LED chip generally is 490nm～540nm; The peak wavelength scope of the red light of being launched by blue-light excited fluorescent material generally is: 580nm～655nm.
In the led light source, after the red light that blueness, green light and the fluorescent material that two kinds of led chips send excites is mixed, form white light.These three kinds of light components form complementary ideally in spectrum, can under high light efficiency, realize high color developing.The spectral component of led light source is as shown in Figure 5.
The chromaticity coordinates of led light source, colour temperature depend on the ratio of several kinds of color of light in the light source.In the light component of led light source, the shared ratio of versicolor light is decided as required.Can perhaps change the luminosity of two kinds of chips, with the spectral component of change whole light source through concentration, the thickness of fluorescent powder film layer on quantity and the fluorescence conversion device of two kinds of chips of configuration through the operating current of regulating led chip respectively.In this led light source, green glow generally occupies greater than one of percentage ratio in total light intensity or total light flux, specifically decides according to the use needs, accounts for 5%～20% like green glow, or 30%～40%, or other arbitrary proportions.
Embodiment six
Basic identical with embodiment one, different is the preparation of fluorescence conversion device, comprise in the fluorescent powder film layer can by the blue-light excited Nitride phosphor that goes out ruddiness with can be by blue-light excited silicate or the Nitride phosphor that goes out green glow.Above-mentioned two kinds of phosphor material powders are mixed in proportion, and sintering is made into target, transparent base is carried out magnetron sputtering plating, obtain fluorescence conversion device.
During work; The light that led chip sends must be through just being transmitted into the outside behind the fluorescence conversion device, by the fluorescent powder film layer above the blue-light excited fluorescence conversion device, and two kinds of phosphor material powders of optical excitation that chip sends under electricity drives; Produce ruddiness and green glow respectively, the each several part colour mixture forms white light.These three kinds of light components form complementary ideally in spectrum, can under high light efficiency, realize high color developing.The spectral component of led light source is as shown in Figure 6.
Embodiment seven
Basic identical with embodiment six; Different is the preparation of fluorescence conversion device; Two kinds of phosphor material powders sintering respectively are made into target; Earlier transparent base is carried out the magnetron sputtering inner layer film, on this basis, carry out the magnetron sputtering outer membrane by the Nitride phosphor target again and obtain product by silicate or Nitride phosphor target; Or by the Nitride phosphor target transparent base is carried out the magnetron sputtering inner layer film earlier, carry out the magnetron sputtering outer membrane by silicate or Nitride phosphor target again and obtain product; Or as required,, form product according to graded plating several layers fluorescent powder film layer.
Embodiment eight
Basic identical with embodiment six; Different is the preparation of fluorescence conversion device; Contain three kinds of phosphor material powders in the fluorescent powder film layer, comprise can by the blue-light excited Nitride phosphor that goes out ruddiness, can by the blue-light excited silicate that goes out green glow or Nitride phosphor, can be by the blue-light excited YAG fluorescent material that goes out gold-tinted.Above-mentioned three kinds of phosphor material powders are mixed in proportion, and sintering is made into target, transparent base is carried out magnetron sputtering plating, obtain fluorescence conversion device.
During work; The light that led chip sends must be through just being transmitted into the outside behind the fluorescence conversion device; By the fluorescent powder film layer above the blue-light excited fluorescence conversion device; Two kinds of phosphor material powders of optical excitation that chip sends under electricity drives produce ruddiness, green glow and gold-tinted respectively, and the each several part colour mixture forms white light.These three kinds of light components form complementary ideally in spectrum, can under high light efficiency, realize high color developing.
Equally, similar with embodiment seven, the preparation of fluorescence conversion device also has following scheme: three kinds of phosphor material powders sintering respectively are made into target, successively transparent base are carried out magnetron sputtering plating, obtain product; Or as required,, obtain product according to graded plating several layers fluorescent powder film layer.
Embodiment nine
A plurality of LED devices 1 are combined, and are installed on the PCB 3.At the light direction of all LED devices, a fluorescence conversion device 2 has been installed.
Use a fluorescence conversion device by a plurality of LED devices are common, comprise that also other must element such as PCB, shell, electronic component etc., constitute a led light source; The structure of whole LED light source is decided as required.During this led light source work; The light that led chip in all LED devices sends must be through just being transmitted into the outside behind the fluorescence conversion device; By blue light or the fluorescent powder film layer above the ultraviolet chip fluorescence excitation conversion equipment; The optical excitation fluorescent material that chip sends under electricity drives produces the visible light of other wave band, and the each several part colour mixture forms white light.
Wherein LED device 1 can be monochrome or polychrome, and during for monochrome, the led chip of at least one a certain emission wavelength of encapsulation in the LED device is the blue light of 460nm like dominant wavelength for example.During for polychrome, with the led chip mutual encapsulation of multiple different emission in a LED device, for example as the mutual encapsulation of red, blue two color chip mutual encapsulation or other color chip portfolio.
Embodiment ten
Being a kind of example of light fixture, is by the common led light source that uses a fluorescence conversion device of a plurality of LED devices equally.A plurality of LED device 1 is combined according to certain rule, and a spherical cover 2 of solid has been installed in the outside, and this cover is a fluorescence conversion device.During this led light source work, the light that the led chip in all LED devices sends is mixed into white light emission to outside through fluorescence conversion device.
Be suitable for the sketch map of the led light source of embodiments of the invention one～embodiment eight as the LCD TV backlight origin system.
The led light source 4 that a plurality of uses have the fluorescence conversion device of transparent base is installed on the PCB5, and led light source is evenly distributed.
Led light source adopts paster that the form of (SMT) is installed, and PCB is last to have made corresponding circuit, makes the led light source can operate as normal.
At the light direction of led light source, be arranged in order diffuser plate 6 and a series of bloomings 7.
During work, the light that led light source sent all gets into diffuser plate, and through fully reflection mixing, through blooming, its effect is that the direction of light is put in order again.Last irradiate light forms back lighting to the back surface of liquid crystal panel.
As backlight, present embodiment can be used for various liquid crystal displays, and for example: LCD TV, watch-dog, display are applicable to industry, field such as civilian, military.
More than be that preferred implementation of the present invention is described, those skilled in the art is in the scheme scope of the present invention's technology, and common variation and the replacement carried out all should be included in protection scope of the present invention.
Claims (3)
1. the preparation method with fluorescence conversion device of transparent base is characterized in that comprising the steps:
1) at first transparent base to be coated is cleaned, after the drying, carries out the forevacuum transition; In vacuum equipment, carry out the ion reverse sputtering at last and clean, let speeding-up ion bombard substrate surface, remove impurity, the transparent base that obtains cleaning;
2) adopt the magnetron sputtering method of being coated with to be coated with rete then:
(1). the preparation target:
Prepare corresponding phosphor material powder, mix and sinter into target;
(2). magnetron sputtering plating: in oxygen argon mixture gas atmosphere, transparent base is carried out magnetron sputtering plating, the sputtering pressure scope is 0.10Pa～3.0Pa; With ready fluorescent material target transparent base is carried out magnetron sputtering plating and obtain fluorescence conversion device;
(3). sputter is heat-treated after finishing, and is warming up to 160 ℃ with 5～8 ℃/min; Be cooled to room temperature behind the insulation 4h.
2. the preparation method of fluorescence conversion device according to claim 1 is characterized in that described step 2) in the transparent base plated film time to adopt online heating, heat treatment temperature be 20～160 ℃.
3. the preparation method of fluorescence conversion device according to claim 1, it is characterized in that said transparent base be cyclic olefin resinoid, cyclic olefine copolymer, cyclic olefin polymer and polymethyl methacrylate wherein any.
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| CN103022325B (en) * | 2012-12-24 | 2016-01-20 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | The LED encapsulation structure of application long distance formula phosphor powder layer and method for making thereof |
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2009
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