CN101879511A - 半导体硅片的清洗方法和装置 - Google Patents
半导体硅片的清洗方法和装置 Download PDFInfo
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- CN101879511A CN101879511A CN 200910050834 CN200910050834A CN101879511A CN 101879511 A CN101879511 A CN 101879511A CN 200910050834 CN200910050834 CN 200910050834 CN 200910050834 A CN200910050834 A CN 200910050834A CN 101879511 A CN101879511 A CN 101879511A
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- mega sonic
- semiconductor substrate
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 118
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 118
- 239000010703 silicon Substances 0.000 title claims abstract description 118
- 238000000034 method Methods 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000004140 cleaning Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract 7
- 230000009977 dual effect Effects 0.000 claims description 2
- 238000005507 spraying Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000003153 chemical reaction reagent Substances 0.000 description 10
- 239000008367 deionised water Substances 0.000 description 10
- 229910021641 deionized water Inorganic materials 0.000 description 10
- 239000012530 fluid Substances 0.000 description 7
- 239000000523 sample Substances 0.000 description 4
- 208000036829 Device dislocation Diseases 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000007115 recruitment Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 241000555268 Dendroides Species 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
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Abstract
Description
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200910050834 CN101879511B (zh) | 2009-05-08 | 2009-05-08 | 半导体衬底的清洗方法和装置 |
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CN 200910050834 CN101879511B (zh) | 2009-05-08 | 2009-05-08 | 半导体衬底的清洗方法和装置 |
Publications (2)
Publication Number | Publication Date |
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CN101879511A true CN101879511A (zh) | 2010-11-10 |
CN101879511B CN101879511B (zh) | 2013-01-02 |
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CN 200910050834 Active CN101879511B (zh) | 2009-05-08 | 2009-05-08 | 半导体衬底的清洗方法和装置 |
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103736690A (zh) * | 2013-12-31 | 2014-04-23 | 上海集成电路研发中心有限公司 | 硅片清洗方法 |
CN104900480A (zh) * | 2014-03-03 | 2015-09-09 | 盛美半导体设备(上海)有限公司 | 晶圆清洗方法 |
CN104889102A (zh) * | 2014-03-03 | 2015-09-09 | 盛美半导体设备(上海)有限公司 | 晶圆清洗方法 |
WO2016183811A1 (en) * | 2015-05-20 | 2016-11-24 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
CN108472558A (zh) * | 2015-12-09 | 2018-08-31 | 盛美半导体设备(上海)有限公司 | 使用高温化学品和超声波装置清洗衬底的方法和装置 |
CN109075103A (zh) * | 2016-04-06 | 2018-12-21 | 盛美半导体设备(上海)有限公司 | 清洗半导体衬底的方法和装置 |
CN109791899A (zh) * | 2016-09-20 | 2019-05-21 | 盛美半导体设备(上海)有限公司 | 衬底清洗方法及清洗装置 |
WO2019095127A1 (en) * | 2017-11-15 | 2019-05-23 | Acm Research (Shanghai) Inc. | System for cleaning semiconductor wafers |
WO2019095126A1 (en) * | 2017-11-15 | 2019-05-23 | Acm Research (Shanghai) Inc. | Method for cleaning semiconductor wafers |
CN109890520A (zh) * | 2016-10-25 | 2019-06-14 | 盛美半导体设备(上海)有限公司 | 清洗半导体硅片的装置和方法 |
WO2019205074A1 (en) * | 2018-04-27 | 2019-10-31 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
TWI721080B (zh) * | 2017-01-09 | 2021-03-11 | 大陸商盛美半導體設備(上海)股份有限公司 | 用來清洗襯底的裝置以及高溫化學溶液供液系統 |
US11103898B2 (en) | 2016-09-19 | 2021-08-31 | Acm Research, Inc. | Methods and apparatus for cleaning substrates |
US11141762B2 (en) | 2015-05-15 | 2021-10-12 | Acm Research (Shanghai), Inc. | System for cleaning semiconductor wafers |
TWI776884B (zh) * | 2018-04-24 | 2022-09-11 | 大陸商盛美半導體設備(上海)股份有限公司 | 清洗半導體矽片的裝置和方法 |
US11581205B2 (en) | 2017-11-20 | 2023-02-14 | Acm Research, Inc. | Methods and system for cleaning semiconductor wafers |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101069888A (zh) * | 2007-06-14 | 2007-11-14 | 北京七星华创电子股份有限公司 | 一种清洗单硅片的方法及装置 |
-
2009
- 2009-05-08 CN CN 200910050834 patent/CN101879511B/zh active Active
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103736690B (zh) * | 2013-12-31 | 2018-12-18 | 上海集成电路研发中心有限公司 | 硅片清洗方法 |
CN103736690A (zh) * | 2013-12-31 | 2014-04-23 | 上海集成电路研发中心有限公司 | 硅片清洗方法 |
CN104900480A (zh) * | 2014-03-03 | 2015-09-09 | 盛美半导体设备(上海)有限公司 | 晶圆清洗方法 |
CN104889102A (zh) * | 2014-03-03 | 2015-09-09 | 盛美半导体设备(上海)有限公司 | 晶圆清洗方法 |
US11633765B2 (en) | 2015-05-15 | 2023-04-25 | Acm Research (Shanghai) Inc. | System for cleaning semiconductor wafers |
US11141762B2 (en) | 2015-05-15 | 2021-10-12 | Acm Research (Shanghai), Inc. | System for cleaning semiconductor wafers |
US11911808B2 (en) | 2015-05-15 | 2024-02-27 | Acm Research (Shanghai) Inc. | System for cleaning semiconductor wafers |
US11752529B2 (en) | 2015-05-15 | 2023-09-12 | Acm Research (Shanghai) Inc. | Method for cleaning semiconductor wafers |
WO2016183811A1 (en) * | 2015-05-20 | 2016-11-24 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
CN107636799A (zh) * | 2015-05-20 | 2018-01-26 | 盛美半导体设备(上海)有限公司 | 清洗半导体衬底的方法和装置 |
CN107636799B (zh) * | 2015-05-20 | 2021-12-03 | 盛美半导体设备(上海)股份有限公司 | 清洗半导体衬底的方法和装置 |
US10910244B2 (en) | 2015-05-20 | 2021-02-02 | Acm Research, Inc. | Methods and system for cleaning semiconductor wafers |
CN108472558A (zh) * | 2015-12-09 | 2018-08-31 | 盛美半导体设备(上海)有限公司 | 使用高温化学品和超声波装置清洗衬底的方法和装置 |
US11000782B2 (en) | 2015-12-09 | 2021-05-11 | Acm Research (Shanghai) Inc. | Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device |
US11967497B2 (en) | 2016-04-06 | 2024-04-23 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
CN109075103B (zh) * | 2016-04-06 | 2022-06-10 | 盛美半导体设备(上海)股份有限公司 | 清洗半导体衬底的方法和装置 |
US11257667B2 (en) | 2016-04-06 | 2022-02-22 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
CN109075103A (zh) * | 2016-04-06 | 2018-12-21 | 盛美半导体设备(上海)有限公司 | 清洗半导体衬底的方法和装置 |
US11638937B2 (en) | 2016-09-19 | 2023-05-02 | Acm Research, Inc. | Methods and apparatus for cleaning substrates |
US11103898B2 (en) | 2016-09-19 | 2021-08-31 | Acm Research, Inc. | Methods and apparatus for cleaning substrates |
CN109791899A (zh) * | 2016-09-20 | 2019-05-21 | 盛美半导体设备(上海)有限公司 | 衬底清洗方法及清洗装置 |
US11037804B2 (en) | 2016-09-20 | 2021-06-15 | Acm Research, Inc. | Methods and apparatus for cleaning substrates |
CN109791899B (zh) * | 2016-09-20 | 2023-06-16 | 盛美半导体设备(上海)股份有限公司 | 衬底清洗方法及清洗装置 |
US11848217B2 (en) | 2016-09-20 | 2023-12-19 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning substrates |
CN109890520A (zh) * | 2016-10-25 | 2019-06-14 | 盛美半导体设备(上海)有限公司 | 清洗半导体硅片的装置和方法 |
TWI721080B (zh) * | 2017-01-09 | 2021-03-11 | 大陸商盛美半導體設備(上海)股份有限公司 | 用來清洗襯底的裝置以及高溫化學溶液供液系統 |
CN111386157A (zh) * | 2017-11-15 | 2020-07-07 | 盛美半导体设备(上海)股份有限公司 | 用于清洗半导体晶圆的方法 |
WO2019095126A1 (en) * | 2017-11-15 | 2019-05-23 | Acm Research (Shanghai) Inc. | Method for cleaning semiconductor wafers |
WO2019095127A1 (en) * | 2017-11-15 | 2019-05-23 | Acm Research (Shanghai) Inc. | System for cleaning semiconductor wafers |
US11581205B2 (en) | 2017-11-20 | 2023-02-14 | Acm Research, Inc. | Methods and system for cleaning semiconductor wafers |
TWI776884B (zh) * | 2018-04-24 | 2022-09-11 | 大陸商盛美半導體設備(上海)股份有限公司 | 清洗半導體矽片的裝置和方法 |
WO2019205074A1 (en) * | 2018-04-27 | 2019-10-31 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
US12062556B2 (en) | 2018-04-27 | 2024-08-13 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
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Publication number | Publication date |
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CN101879511B (zh) | 2013-01-02 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Method and device for cleaning semiconductor silicon wafer Effective date of registration: 20131021 Granted publication date: 20130102 Pledgee: Bank of Communications Ltd Shanghai New District Branch Pledgor: ACM (SHANGHAI) Inc. Registration number: 2013990000760 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20150521 Granted publication date: 20130102 Pledgee: Bank of Communications Ltd Shanghai New District Branch Pledgor: ACM (SHANGHAI) Inc. Registration number: 2013990000760 |
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Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Patentee after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang hi tech park, building 4, No. 1690 Cailun Road Patentee before: ACM (SHANGHAI) Inc. |