CN101877427B - Communication device, cavity filter, resonating tube and manufacturing method thereof - Google Patents
Communication device, cavity filter, resonating tube and manufacturing method thereof Download PDFInfo
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- CN101877427B CN101877427B CN201010216342.9A CN201010216342A CN101877427B CN 101877427 B CN101877427 B CN 101877427B CN 201010216342 A CN201010216342 A CN 201010216342A CN 101877427 B CN101877427 B CN 101877427B
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- resonatron
- quartz glass
- cavity
- body filter
- cavity body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
- H01P1/2084—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
Abstract
The embodiment of the invention discloses a cavity filter, a resonating tube and a manufacturing method thereof, wherein the resonating tube is arranged in the cavity of the cavity filter and is made of quartz glass, the resonating tube surface is metalized and during the metallization treatment on the resonating tube surface, firstly the surface is chrome plated in vacuum, then suffered to electrocoppering and silver treatment. Compared with the traditional resonating tube which is made of invar material, the resonating tube which is made of quartz glass material has low cost and good temperature drift index. Moreover, the embodiment of the invention also discloses a communication device which uses the cavity filter, the cavity filter is arranged at a signal transmit-receive circuit part of the communication device, equipment cost can be effectively reduced by adopting the resonating tube which is made of quartz glass material.
Description
[technical field]
The present invention relates to the wave filter technology field, particularly the resonatron of a kind of cavity body filter, a kind of filter and manufacture method thereof, also relate to a kind of communication equipment that uses this cavity body filter.
[background technology]
At present, the communication system frequency spectrum is more and more crowded, and mobile communication is from GSM900, and 1900MHz is toward TD2010～2025MHz, the high band development of Wimax3.5GHz, the volume of cavity body filter is also more and more less, and the base station system structure is compacter and flexible, but the temperature drift of cavity body filter (the lower temperature that is called for short is floated) is in general to increase along with the rising of frequency range, under low frequency, the temperature of filter is floated the index less, has arrived high frequency 3.5GHz, and the temperature of cavity body filter is floated very large.
In the research and practice process to prior art, the present inventor finds, in the prior art, traditional automatic steel and brass resonatron have been difficult to meet the realization of radio-frequency (RF) index, for the temperature that better realizes high-frequency band filter is floated index, resonatron must adopt the invar material of low linear expansion coefficient, yet the invar material is very expensive, is difficult to widely apply in the product for civilian use.
Therefore, need to adopt the material of a kind of cheapness and don't mistake effect to substitute expensive invar material.
[summary of the invention]
Adopt the very expensive problem of invar material cost in order to solve the prior art median filter, the present invention adopts the silica glass material of low linear expansion coefficient to manufacture resonatron, and cavity body filter and communication equipment with this resonatron also are provided simultaneously.
The embodiment of the present invention solves the problems of the technologies described above taked technical scheme and is to provide a kind of cavity body filter, this cavity body filter comprises cavity and is installed on the resonatron in this cavity, wherein, this cavity adopts the metal material manufacture to form, the rounded column of its profile or polygon column, and this resonatron adopting quartz glass is made, metalized is made on the resonatron surface, when metalized is made on the resonatron surface, first carry out surface vacuum chromium plating processing, and then carry out electro-coppering and silver processing; Wherein, this resonatron adopts low-expansion quartz glass to make; The rounded column of this resonatron or polygon column; This cavity body filter also comprises tuning plug and is covered on the cover plate on this cavity, and this cover plate is provided with connecting hole, this tuning plug is installed on this connecting hole, this resonatron is fixed in the bottom of this cavity, the first end of this tuning plug is inserted in this inside cavity, the second end of this tuning plug is positioned at this cover plate outside, this resonatron has depressed part, the first end of this tuning plug is inserted in depressed part, and the first end by this tuning plug fine position of this resonatron relatively changes the radio frequency parameter of this cavity body filter.
The embodiment of the present invention also provides a kind of communication equipment, and it comprises above-mentioned cavity body filter, and this chamber cavity body filter is located at the transceiver circuit part of this communication equipment, for signal is selected.
The embodiment of the present invention also provides a kind of resonatron, for being arranged on cavity body filter, wherein, this resonatron adopting quartz glass is made, metalized is made on the resonatron surface, when metalized is made on the resonatron surface, first carry out surface vacuum chromium plating processing, and then carry out electro-coppering and silver processing; Wherein, this resonatron adopts the quartz glass of low linear expansion coefficient to make; The rounded column of this resonatron or polygon column; This resonatron has depressed part.
The embodiment of the present invention also provides a kind of manufacture method of cavity body filter resonatron, and wherein, this manufacture method comprises the following steps: S1: quartz glass processing is to column; S2: this quartz glass is made to metalized.Step S2 is further comprising the steps: S21: quartz glass is carried out to surface vacuum chromium plating processing; S22: electro-coppering and silver processing are carried out in the quartz glass surface.
Compared with prior art, the resonatron adopting quartz glass material that the embodiment of the present invention provides is made, it is with low cost, functional, efficiently solve the temperature that perplexs for a long time radio-frequency filter and float On Index, and avoided using expensive invar material, greatly saved cost, the communication equipment that the embodiment of the present invention provides and cavity body filter thereof adopt above-mentioned resonatron, can effectively reduce equipment cost.
[accompanying drawing explanation]
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, in below describing embodiment, the accompanying drawing of required use is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the partial structurtes schematic diagram that comprises according to an embodiment of the invention the cavity body filter of resonatron;
Fig. 2 is a kind of manufacture method simple process figure of resonatron according to an embodiment of the invention; And
Fig. 3 is the another kind of manufacture method simple process figure of resonatron according to an embodiment of the invention.
[embodiment]
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making under the creative work prerequisite the every other embodiment obtained, belong to the scope of protection of the invention.
Refer to Fig. 1, Fig. 1 is the partial structurtes schematic diagram according to the cavity body filter that comprises resonatron 21 of first embodiment of the invention.
As shown in Figure 1, briefly, cavity body filter mainly comprises cavity 1, resonatron 2, tuning plug 3 and cover plate 12.Certainly, the cavity body filter of the present embodiment also comprises various other conventional components or structure, herein, the present embodiment is only to being described with the present embodiment inventive point relevant portion, other concrete parts or structure, can, with reference to existing conventional implementation, not be construed as limiting the invention.
In the present embodiment, cavity 1 adopts the metal material manufacture to form, and its profile can be square column cavity, circular cylindrical shape cavity or polygon column cavity.Cover plate 12 is covered on cavity 1.This cavity 1 covers and forms resonant cavity 13 with cover plate 12, only illustrates a resonant cavity in figure, in reality, a plurality of resonant cavitys may be arranged.Further be provided with connecting hole 121 on cover plate, this connecting hole 121 is for assembling tuning plug 3.
Resonatron 2 is positioned at the bottom of cavity 1, and this resonatron 2 has depressed part 21.Equally, the profile of resonatron 2 can be square column resonatron, circular cylindrical shape resonatron or polygon column resonatron.It should be noted that in the present embodiment, resonatron 2 adopting quartz glass are made (hereinafter will specifically introduce).
Tuning plug 3 is installed on connecting hole 121, the first end 31 of tuning plug 3 is inserted in depressed part 21, the second end 32 of tuning plug 3 is positioned at the outside (" outside " of cover plate is defined as cover plate one side relative with resonant cavity 11) of cover plate 12 herein, change the radio frequency parameter of this cavity body filter by the fine position of the second end in this depressed part of tuning plug 3, the degree of depth that stretches into resonant cavity by changing adjusting screw(rod) 3 changes electric capacity each other and the inductance of tuning plug 3 and resonatron 2, and then changes the radio frequency parameter of cavity body filter.
As a kind of modification of this embodiment, resonatron 2 can be set to the cylinder of other shapes such as solid cylinder, and does not comprise depressed part 21.Now the first end of tuning plug is arranged in the top of the resonatron of position shown in Fig. 1, and the fine position of the relative resonatron of first end that equally can be by tuning plug changes the radio frequency parameter of cavity body filter.Float problem in order to reduce costs and solve temperature, embodiment of the present invention adopting quartz glass is manufactured resonatron 2.The preferential employing of the quartz glass of the embodiment of the present invention is made because of the quartz glass that doping has low linear expansion coefficient.Generally speaking, quartz glass has low-down coefficient of linear expansion (Coefficient of Linear Thermal Expansion, CLTE, thermal linear expansion coefficient, be called for short coefficient of linear expansion), in room temperature to 100 ℃ scope, its CLTE is less than 1ppm(part per million, PPM).1ppm/ ℃ of expression when ambient temperature 1 ℃ of the every variation of certain reference point (normally 25 ℃), output voltage depart from 1,000,000 of its nominal value/.In the embodiment of the present invention, adopting quartz glass is made resonatron, and its CLTE is well below automatic steel and brass material, and and invar compare, more than the price energy drop by half of quartz glass.
Next, refer to Fig. 2, Fig. 2 is a kind of manufacture method simple process figure of resonatron 2 according to an embodiment of the invention.
The roughly manufacture process of resonatron 2 comprises the following steps:
S1: utilize mould that quartz glass processing is to column, can be processed into circular cylindrical shape, square column and polygon column etc.;
S2: metalized is made in resonatron 2 surfaces.In the present embodiment, the metalized process is further comprising the steps:
S21: first vacuum chromium-coated processing is carried out in these resonatron 2 surfaces; And
S22: and then copper plating treatment is carried out in these resonatron 2 surfaces, thus complete metalized.
Next, refer to Fig. 3, Fig. 3 is the another kind of manufacture method simple process figure of resonatron 2 according to an embodiment of the invention.
In the present embodiment, the roughly manufacture process of resonatron 2 comprises the following steps:
S1 ': utilize mould that quartz glass processing is to column, can be processed into circular cylindrical shape, square column and polygon column etc.
S2 ': metalized is made in resonatron 2 surfaces.In the present embodiment, the metalized process is further comprising the steps:
S23: first surface spraying silver slurry is carried out in these resonatron 2 surfaces and process; And
S24: and then the high temperature sintering processing is carried out in these resonatron 2 surfaces, thus complete metalized.
In sum, one of ordinary skill in the art will readily recognize that the glass that adopts low linear expansion coefficient, the resonatron of the invar material that it is relatively traditional, with low cost, functional, solve the temperature that perplexs for a long time radio-frequency filter and floated On Index, and greatly cost-saving.To comprise that the cavity body filter 1 of the resonatron 2 of this quartz glass material is applied to the transceiver circuit part of communication equipment, can effectively reduce equipment cost, and be suitable for generally applying.
It is pointed out that the terms such as " first " mentioned in an embodiment of the present invention, " second " are only the letter symbols adopted as required, be not limited to this in practice, and this letter symbol can Alternate.
In the above-described embodiments, only the present invention has been carried out to exemplary description, but those skilled in the art can carry out various modifications to the present invention without departing from the spirit and scope of the present invention after reading present patent application.
Claims (6)
1. a cavity body filter, described cavity body filter comprises cavity and is installed on the resonatron in described cavity, it is characterized in that, described cavity adopts the metal material manufacture to form, the rounded column of its profile or polygon column, and described resonatron adopting quartz glass is made, metalized is made on described resonatron surface, when metalized is made on described resonatron surface, first carry out surface vacuum chromium plating processing, and then carry out electro-coppering and silver processing; Wherein, described resonatron adopts low-expansion quartz glass to make; The rounded column of described resonatron or polygon column; Described cavity body filter also comprises tuning plug and is covered on the cover plate on described cavity, and described cover plate is provided with connecting hole, described tuning plug is installed on described connecting hole, described resonatron is fixed in the bottom of described cavity, the first end of described tuning plug is inserted in described inside cavity, the second end of described tuning plug is positioned at described cover plate outside, described resonatron has depressed part, the first end of described tuning plug is inserted in depressed part, and the fine position of the relatively described resonatron of first end by described tuning plug changes the radio frequency parameter of described cavity body filter.
2. a communication equipment, is characterized in that, it comprises cavity body filter according to claim 1, and described cavity body filter is located at the transceiver circuit part of described communication equipment, for signal is selected.
3. a resonatron, for being arranged on cavity body filter, it is characterized in that, described resonatron adopting quartz glass is made, metalized is made on described resonatron surface, when metalized is made on described resonatron surface, first carry out surface vacuum chromium plating processing, and then carry out electro-coppering and silver processing; Wherein, described resonatron adopts the quartz glass of low linear expansion coefficient to make; The rounded column of described resonatron or polygon column; Described resonatron has depressed part.
4. resonatron according to claim 3, is characterized in that, while on described resonatron surface, making metalized, first carries out surface spraying silver slurry and process, and then carries out the high temperature sintering processing.
5. the manufacture method of a cavity body filter resonatron, is characterized in that, described manufacture method comprises the following steps:
S1. quartz glass processing is to column; And
S2. described quartz glass is made to metalized;
Described step S2 is further comprising the steps:
S21: described quartz glass is carried out to surface vacuum chromium plating processing; And
S22: electro-coppering and silver processing are carried out in described quartz glass surface.
6. manufacture method according to claim 5, is characterized in that, described step S2 is further comprising the steps:
S23: described quartz glass is carried out to surface spraying silver slurry and process; And
S24: the high temperature sintering processing is carried out in described quartz glass surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010216342.9A CN101877427B (en) | 2010-07-02 | 2010-07-02 | Communication device, cavity filter, resonating tube and manufacturing method thereof |
| PCT/CN2011/076715 WO2012000447A1 (en) | 2010-07-02 | 2011-06-30 | Communication device, cavity filter, resonance tube and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010216342.9A CN101877427B (en) | 2010-07-02 | 2010-07-02 | Communication device, cavity filter, resonating tube and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101877427A CN101877427A (en) | 2010-11-03 |
| CN101877427B true CN101877427B (en) | 2014-01-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010216342.9A Active CN101877427B (en) | 2010-07-02 | 2010-07-02 | Communication device, cavity filter, resonating tube and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN101877427B (en) |
| WO (1) | WO2012000447A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101877427B (en) * | 2010-07-02 | 2014-01-08 | 深圳市大富科技股份有限公司 | Communication device, cavity filter, resonating tube and manufacturing method thereof |
| CN102214852B (en) | 2011-03-16 | 2014-06-04 | 华为技术有限公司 | Method for manufacturing resonant tube, resonant tube and filter |
| CN102145977B (en) | 2011-03-16 | 2013-09-11 | 华为技术有限公司 | Powdered materials, communication equipment manufacturing method and communication equipment |
| CN102290622A (en) * | 2011-04-29 | 2011-12-21 | 深圳市大富科技股份有限公司 | Communication equipment, cavity filter, resonant rod and manufacturing method of resonant rod |
| CN102810715A (en) * | 2011-06-01 | 2012-12-05 | 深圳市大富科技股份有限公司 | Resonance rod, cavity filter and method for manufacturing resonance rod |
| CN103840239A (en) * | 2012-11-20 | 2014-06-04 | 深圳光启创新技术有限公司 | Resonant cavity, filter and electromagnetic wave equipment |
| CN103840241B (en) * | 2012-11-20 | 2018-05-22 | 深圳光启创新技术有限公司 | A kind of resonator, filtering device and electromagnetic wave device |
| CN103855455B (en) * | 2012-11-30 | 2018-05-22 | 深圳光启创新技术有限公司 | A kind of harmonic oscillator, resonator, filtering device and electromagnetic wave device |
| CN103855454B (en) * | 2012-11-30 | 2018-04-17 | 深圳光启创新技术有限公司 | A kind of resonator, filtering device and electromagnetic wave device |
| CN105140615B (en) * | 2015-09-18 | 2018-09-25 | 武汉凡谷陶瓷材料有限公司 | Microminiature dielectric resonator |
| CN111211395B (en) * | 2020-01-20 | 2022-05-17 | 江苏宝利金材科技有限公司 | Preparation method of high-molecular composite material cavity filter |
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| CN1259231A (en) * | 1997-06-06 | 2000-07-05 | 奥根公司 | Microwave resonator with dielectric tuning body resiliently secured to a movable rod by spring means |
| CN101267191A (en) * | 2007-03-13 | 2008-09-17 | 广州埃信电信设备有限公司 | Cavity resonancer with temperature stabilization and compensation function |
| CN101312263A (en) * | 2008-06-30 | 2008-11-26 | 摩比天线技术（深圳）有限公司 | Cavity filter and duplex device |
| CN201466183U (en) * | 2009-07-27 | 2010-05-12 | 郑州华航科技有限公司 | Double-cavity band-pass filter |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57112103A (en) * | 1980-12-29 | 1982-07-13 | Fujitsu Ltd | Dielectric resonator |
| JPH0974302A (en) * | 1995-09-05 | 1997-03-18 | Matsushita Electric Ind Co Ltd | Dielectric resonator, manufacture of the same and dielectric filter using the same |
| JP2001156546A (en) * | 1999-11-26 | 2001-06-08 | Nec Corp | Voltage controlled oscillator and method for adjusting its oscillating frequency |
| CN101555612A (en) * | 2008-04-11 | 2009-10-14 | 深圳富泰宏精密工业有限公司 | Method for processing surface of shell |
| CN201421872Y (en) * | 2009-04-23 | 2010-03-10 | 鸿富锦精密工业（深圳）有限公司 | Hollow cavity filter |
| CN101877427B (en) * | 2010-07-02 | 2014-01-08 | 深圳市大富科技股份有限公司 | Communication device, cavity filter, resonating tube and manufacturing method thereof |
-
2010
- 2010-07-02 CN CN201010216342.9A patent/CN101877427B/en active Active
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2011
- 2011-06-30 WO PCT/CN2011/076715 patent/WO2012000447A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1259231A (en) * | 1997-06-06 | 2000-07-05 | 奥根公司 | Microwave resonator with dielectric tuning body resiliently secured to a movable rod by spring means |
| CN101267191A (en) * | 2007-03-13 | 2008-09-17 | 广州埃信电信设备有限公司 | Cavity resonancer with temperature stabilization and compensation function |
| CN101312263A (en) * | 2008-06-30 | 2008-11-26 | 摩比天线技术（深圳）有限公司 | Cavity filter and duplex device |
| CN201466183U (en) * | 2009-07-27 | 2010-05-12 | 郑州华航科技有限公司 | Double-cavity band-pass filter |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012000447A1 (en) | 2012-01-05 |
| CN101877427A (en) | 2010-11-03 |
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Effective date of registration: 20180731 Address after: 233400 Huaiyuan County Economic Development Zone, Bengbu, Anhui Patentee after: Anhui Dafu Electromechanical Technology Co., Ltd. Address before: 518108 Shenzhen, Baoan District, Guangdong, Baoan District, Qun Road, Shiyan and the rich industrial zone 1-2 factory buildings Patentee before: Shenzhen Tat Fook Technology Co., Ltd. |
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