CN101873763B - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN101873763B CN101873763B CN 201010208380 CN201010208380A CN101873763B CN 101873763 B CN101873763 B CN 101873763B CN 201010208380 CN201010208380 CN 201010208380 CN 201010208380 A CN201010208380 A CN 201010208380A CN 101873763 B CN101873763 B CN 101873763B
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- substrate
- copper
- circuit board
- printed circuit
- hole
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Abstract
The invention relates to a printed circuit board. The printed circuit board comprises a substrate, a copper sheet laid on the front surface of the substrate, and a front-surface insulating layer which is pressed outside the copper sheet and provided with a copper-exposed region, wherein the copper-exposed region is provided with holes along a thickness direction of the substrate, and the copper sheet in the copper-exposed region extends to the inside walls of the holes. The copper-exposed region of the printed circuit board is provided with the holes along the thickness direction of the substrate, and the copper sheet is laid on the inside walls of the holes, so that solder joints in the copper-exposed region grasp the substrate tightly as a hand; when the copper sheet at the solder joints is peeled off or torn down from the substrate, a wire soldered in the copper-exposed region overcomes adhesive forces in horizontal and vertical directions, and also overcomes an additional adhesive force due to the area increase of the laid copper sheet; therefore, the reliability of the printed circuit board can be protected effectively.
Description
Technical field
The present invention relates to printed circuit board arrangement, relate in particular to and to resist lead copper sheet torn, prevents the printed circuit board (PCB) that copper sheet comes off from substrate.
Background technology
Common printed circuit board comprises substrate, copper sheet and insulating barrier, wherein on substrate, is covered with the copper sheet that is used to conduct electricity, and on copper sheet, is pressed with insulating barrier, and insulating barrier also can play the effect of copper sheet on the protective substrate except that being used for insulation.
According to circuit design, the printed circuit board (PCB) of being everlasting is provided with the dew copper district that several places are used for welding lead, the i.e. terminal point of copper conductor.Lead is welded on through scolding tin and reveals in the copper district, thereby is electrically connected with printed circuit board (PCB).
When selecting lead,, then can select the lead that insulating barrier is thicker, wire diameter is thicker if required electric current of flowing through is bigger.So just, produce a problem, heavy gauge wire hardness is bigger, and is soft inadequately; After being welded on the printed circuit board (PCB); In circuit board assembling or disassembly process, can make lead easily copper sheet peeled off from substrate, thereby reduce the reliability of quality of printed circuits through bending.
Usually be with through adopting lead to pass substrate in the prior art,, make fixation between lead and the substrate again with the opposite side of wire bonds at substrate.But because problems such as installation only require the one side of printed circuit board (PCB) that solder joint is arranged, another side will insulate fully sometimes, and just can not use the method to increase the fastness of wire bonds this moment.
Summary of the invention
The technical problem that the present invention will solve is that the above-mentioned defective to prior art provides a kind of printed circuit board (PCB), and it can strengthen the adhesive force of copper sheet solder joint and substrate through to applying the design of brazing point, resists lead tearing copper sheet.
The technical solution adopted for the present invention to solve the technical problems is:
Construct a kind of printed circuit board (PCB); Comprise substrate, the copper sheet of the said substrate front side that is laid in, also comprise the front insulating barrier, said front insulating barrier is pressed on outside the said copper sheet; And leave at least one and reveal the copper district; Wherein, said dew copper district is provided with porose along said substrate thickness direction, and the copper sheet in said dew copper district extends to said hole madial wall.
Printed circuit board (PCB) of the present invention, wherein, said dew copper district is provided with a plurality of said holes.
Printed circuit board (PCB) of the present invention, wherein, a plurality of said holes are circle distribution in said dew copper district.
Printed circuit board (PCB) of the present invention, wherein, said hole is the through hole that passes said substrate, is laid with the reverse side insulating barrier at said substrate reverse side.
Printed circuit board (PCB) of the present invention, wherein, said hole is a blind hole.
Printed circuit board (PCB) of the present invention, wherein, the diameter in said hole is less than said substrate thickness.
Printed circuit board (PCB) of the present invention, wherein, the copper sheet in said dew copper district extends to said hole madial wall and said hole is filled up, and is laid with the reverse side insulating barrier at said substrate reverse side.
The present invention is through the thickness direction along substrate is provided with the hole in the dew copper district of printed circuit board (PCB); And in the hole madial wall lays copper sheet; Reveal copper district solder joint like this just as there being a hand to catch substrate, want solder joint place copper sheet is peeled off or tears from substrate, be welded on the adhesive force that the lead that reveals the copper district will overcome level and vertical direction simultaneously firmly; And will overcome because of laying the extra adhesive force that the increase of copper sheet area brings, so just can effectively protect the reliability of printed circuit board (PCB).
Description of drawings
To combine accompanying drawing and embodiment that the present invention is described further below, in the accompanying drawing:
Fig. 1 is the perspective view one of the printed circuit board (PCB) of the embodiment of the invention;
Fig. 2 is the partial sectional view of printed circuit board (PCB) among Fig. 1;
Fig. 3 is the perspective view two of the printed circuit board (PCB) of the embodiment of the invention;
Fig. 4 is an A part enlarged diagram among Fig. 3;
Fig. 5 is the sectional structure sketch map of the printed circuit board (PCB) of the embodiment of the invention;
Fig. 6 is a B part enlarged diagram among Fig. 5.
Embodiment
Below in conjunction with diagram, the preferred embodiments of the present invention are described in detail.
The printed circuit board arrangement sketch map of preferred embodiment of the present invention is as shown in Figure 1, consults Fig. 2 simultaneously, and it comprises substrate 1; The positive copper sheet 2 of substrate 1 is laid in; Also comprise front insulating barrier 3, this front insulating barrier 3 is pressed on outside the copper sheet 2, and leaves at least one and reveal copper district 4.Be provided with porosely 41 revealing the thickness direction of copper district 4 along substrate 1, hole 41 madial walls are attached with copper sheet 2.Through the thickness direction along substrate 1 is provided with hole 41 in the dew copper district 4 of printed circuit board (PCB); And in the hole 41 madial walls lay copper sheet 2; Make the lead solder joint that reveals copper district 4 just as there being a hand to catch substrate 1 firmly; Want solder joint place copper sheet 2 is peeled off or tears from substrate 1; Be welded on the lead (not shown) that reveals copper district 4 and will overcome the adhesive force of level and vertical direction simultaneously, and will overcome, so just can effectively protect the reliability of printed circuit board (PCB) because of laying the extra adhesive force that the increase of copper sheet 2 areas brings.
Preferably; Be arranged on printed circuit board (PCB) and reveal the thickness of hole 41 diameters in copper district 4 less than substrate 1; Can increase the copper sheet 2 that reveals in copper district 4 and the hole 41 thereof and the adhesive force between the substrate 1 like this; Further prevent to be welded on the lead that reveals copper district 4 solder joint place copper sheet 2 is peeled off or tears from substrate 1, if hole 41 diameters are excessive, the copper sheet 2 and the adhesive force between the substrate 1 that then reveal in copper district 4 and the hole 41 thereof can reduce.
In a further embodiment, like Fig. 3 and shown in Figure 4, be provided with a plurality of holes 41 in the dew copper district 4 of printed circuit board (PCB); The number in hole 41 can be set as required, also can set with reference to the area size of revealing copper district 4, under the situation that the area that reveals copper district 4 allows; The number in hole 41 is many more; The copper sheet 2 that reveals in copper district 4 and the hole 41 thereof is big more with the adhesive force of substrate 1, is connected more firmly between solder joint place copper sheet 2 and the substrate 1, so quality of printed circuits is good more.
Preferably; As shown in Figure 4; A plurality of holes 41 among the above embodiment are circle distribution (or the distribution that is centrosymmetric) and are revealing copper district 4, like this can be so that the copper sheet 2 in dew copper district 4 and the hole 41 thereof and the adhesive force more even distribution of substrate 1 can further improve adhesive force.
More than among each embodiment; Like Fig. 5 and shown in Figure 6, the hole 41 that is arranged on printed circuit board (PCB) dew copper district 4 preferably is set to pass the through hole of substrate 1, during actual production; Be that elder generation relevant position on substrate 1 is provided with the hole earlier; This basis is gone up and is adopted the mode of chemical reaction on substrate 1, to lay copper sheet 2 then, hole 41 is set to through hole can makes the copper sheet 2 of hole 41 inner side edges more be prone to lay, convenient production.
As shown in Figure 6; For preventing when revealing copper district 4 welding leads; Scolding tin sees through hole 41 makes substrate 1 reverse side conduct electricity, and is laid with reverse side insulating barrier 5 at substrate 1 reverse side, can hole 41 be blocked from the reverse side of substrate 1; Prevent substrate 1 reverse side conduction, to meet the manufacturing technique requirent that printed circuit board (PCB) has only one side conduction, another side insulation.
Equally; In above each embodiment, the hole 41 that is arranged on the dew copper district 4 of printed circuit board (PCB) also can be set to blind hole, if the blind hole of being set to; May cause hole 41 inboard copper sheets 2 to be not easy to lay; Bring certain difficulty to production, but can reach the purpose of the copper sheet 2 that increase to reveal in copper district 4 and the hole 41 thereof and the adhesive force of substrate 1 equally, also can improve the quality of printed circuit board (PCB).
Perhaps will be set to blind hole or through hole in the hole 41 in the dew copper district 4 of printed circuit board (PCB); Be laid with reverse side insulating barrier 5 at substrate 1 reverse side, different with aforementioned each embodiment is, reveal the copper sheet in copper district 4 in extending to hole 41; Also fill up whole hole 41; Promptly form in dew copper district 4 and be deep into the copper post in the substrate 1, promptly substrate 1 further improves the adhesive force between dew copper district 4 and the substrate 1.
Need to prove; In above all embodiment, clearer for embodiment is explained, what label in the accompanying drawing " 2 " was identified only is the pairing position of copper sheet; On concrete printed circuit board (PCB), copper sheet 2 outsides of this identified areas still have one deck front insulating barrier 3.
The present invention is through the thickness direction along substrate 1 is provided with hole 41 in the dew copper district 4 of printed circuit board (PCB); And in the hole 41 madial walls lay copper sheet 2; Reveal copper district 4 solder joints like this just as there being a hand to catch substrate 1 firmly; Want solder joint place copper sheet 2 is peeled off or tears from substrate 1; Be welded on the lead that reveals copper district 4 and will overcome the adhesive force of level and vertical direction simultaneously, and will overcome, so just can effectively protect the reliability of printed circuit board (PCB) because of laying the extra adhesive force that the increase of copper sheet area brings.
Should be understood that, concerning those of ordinary skills, can improve or conversion, and all these improvement and conversion all should belong to the protection range of accompanying claims of the present invention according to above-mentioned explanation.
Claims (5)
1. printed circuit board (PCB); The copper sheet (2) of comprise substrate (1), the said substrate (1) that is laid in is positive also comprises front insulating barrier (3), and said front insulating barrier (3) is pressed on outside the said copper sheet (2); And leave at least one and reveal copper district (4); It is characterized in that said dew copper district (4) is provided with porose (41) along said substrate (1) thickness direction, the copper sheet (2) in said dew copper district (4) extends to said hole (41) madial wall; Said dew copper district (4) is provided with a plurality of said holes (41), and the copper sheet in said dew copper district (4) extends to said hole (41) madial wall and said hole (41) are filled up, and is laid with reverse side insulating barrier (5) at said substrate (1) reverse side.
2. printed circuit board (PCB) according to claim 1 is characterized in that, a plurality of said holes (41) are circle distribution in said dew copper district (4).
3. printed circuit board (PCB) according to claim 1 is characterized in that, said hole (41) are laid with reverse side insulating barrier (5) for passing the through hole of said substrate (1) at said substrate (1) reverse side.
4. printed circuit board (PCB) according to claim 1 is characterized in that, said hole (41) are blind hole.
5. printed circuit board (PCB) according to claim 1 is characterized in that, the diameter of said hole (41) is less than said substrate (1) thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010208380 CN101873763B (en) | 2010-06-24 | 2010-06-24 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010208380 CN101873763B (en) | 2010-06-24 | 2010-06-24 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101873763A CN101873763A (en) | 2010-10-27 |
| CN101873763B true CN101873763B (en) | 2012-12-26 |
Family
ID=42998351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010208380 Expired - Fee Related CN101873763B (en) | 2010-06-24 | 2010-06-24 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101873763B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245575A (en) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | Design method of PCB resistance welding zigzag circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6362436B1 (en) * | 1999-02-15 | 2002-03-26 | Mitsubishi Gas Chemical Company, Inc. | Printed wiring board for semiconductor plastic package |
| CN1462171A (en) * | 2002-05-31 | 2003-12-17 | 株式会社东芝 | Electronic device, printed substrate and method for fixing connector |
| CN200983719Y (en) * | 2006-11-29 | 2007-11-28 | 康佳集团股份有限公司 | Welding tray on PCB |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2886613B2 (en) * | 1990-05-07 | 1999-04-26 | イビデン株式会社 | Multilayer printed wiring board for surface mounting |
-
2010
- 2010-06-24 CN CN 201010208380 patent/CN101873763B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6362436B1 (en) * | 1999-02-15 | 2002-03-26 | Mitsubishi Gas Chemical Company, Inc. | Printed wiring board for semiconductor plastic package |
| CN1462171A (en) * | 2002-05-31 | 2003-12-17 | 株式会社东芝 | Electronic device, printed substrate and method for fixing connector |
| CN200983719Y (en) * | 2006-11-29 | 2007-11-28 | 康佳集团股份有限公司 | Welding tray on PCB |
Non-Patent Citations (1)
| Title |
|---|
| JP平4-14286A 1992.01.20 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101873763A (en) | 2010-10-27 |
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| PB01 | Publication | ||
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20190624 |