CN101861052A - Circuit board - Google Patents
Circuit board Download PDFInfo
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- CN101861052A CN101861052A CN200910133648A CN200910133648A CN101861052A CN 101861052 A CN101861052 A CN 101861052A CN 200910133648 A CN200910133648 A CN 200910133648A CN 200910133648 A CN200910133648 A CN 200910133648A CN 101861052 A CN101861052 A CN 101861052A
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- glass fibre
- fibre structure
- weft threads
- warp yarn
- circuit board
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Abstract
The invention relates to a circuit board which comprises at least one insulating layer and at least one conducting layer, wherein the insulating layer comprises at least one first glass fiber structure, at least one second glass fiber structure and a resin material; the first glass fiber structure is provided with a plurality of first warp threads and a plurality of first weft threads; the second glass fiber structure is superposed on the first glass fiber structure and provided with a plurality of second warp threads and a plurality of second weft threads; the first warp threads and the first weft threads are not completely superposed with the second warp threads and the second weft threads; the resin material is coated on the first glass fiber structure and the second glass fiber structure; and the conducting layer is arranged on at least one surface of the insulating layer.
Description
Technical field
The present invention relates to a kind of circuit board, particularly relate to a kind of a plurality of coinciding mutually and the circuit board of the glass fibre structure that its warp yarn and weft threads not exclusively overlap that have.
Background technology
(Printed Circuit Board is that patterned conductive layer by individual layer, bilayer or multilayer is attached on formed multilayer composite board with the insulating barrier pressing PCB) to printed circuit board (PCB).Generally speaking, be to come the pattern-making conductive layer in the printed circuit board (PCB), and epoxy resin and glass fibre are to be used for making making the insulating barrier that is electrically insulated between two patterned conductive layers with as thin as a wafer fine copper matter tinsel.
Because the warp yarn and the formed woven areas of weft threads of the glass fibre in the existing insulating barrier are bigger, therefore when patterned conductive layer is disposed on the insulating barrier, the holding wire of a part can be positioned at (being woven areas) on the epoxy resin in the patterned conductive layer, and the holding wire of another part can be positioned at warp yarn or weft threads in the patterned conductive layer, that is to say that prior art can't be avoided connecting up in woven areas.Therefore, the holding wire in the patterned conductive layer is because of producing the problem with differing dielectric constant across woven areas.
In order to address the above problem, prior art is normally utilized the adjustment design of angle of lay, and meaning is promptly avoided woven areas and connected up, and this kind practice not only can waste whole a part of arrangement space, increase outside the design time, more time then need be expended as if needing to revise in the design back, and is difficult for revising.
Summary of the invention
The invention provides a kind of circuit board, stride woven areas and have the problem that differing dielectric constant is produced to solve existing holding wire.
The present invention proposes a kind of circuit board, and it comprises at least one insulating barrier and at least one conductive layer.Insulating barrier comprises one first glass fibre structure, one second glass fibre structure and a resin material.First glass fibre structure has many first warp yarn and many first weft threads.Second glass fibre structure coincides on first glass fibre structure, and second glass fibre structure has many second warp yarn and many second weft threads, and wherein said first warp yarn, described first weft threads and described second warp yarn, described second weft threads not exclusively overlap.Resin material coats first glass fibre structure and second glass fibre structure.Conductive layer is disposed at least one surface of insulating barrier.
In an embodiment of the present invention, above-mentioned conductive layer comprises a copper foil layer or a pattern metal routing layer.
In an embodiment of the present invention, the spacing of wantonly two of above-mentioned first glass fibre structure adjacent described first warp yarn is different in essence with the spacing of wantonly two adjacent described first weft threads.The spacing of wantonly two adjacent described second warp yarn of second glass fibre structure is different in essence with the spacing of wantonly two adjacent described second weft threads.
In an embodiment of the present invention, above-mentioned second glass fibre structure is identical in fact with first glass fibre structure, and second glass fibre structure revolves to turn 90 degrees and coincides on first glass fibre structure.
In an embodiment of the present invention, above-mentioned first glass fibre structure and second glass fibre structure are different in essence.
In an embodiment of the present invention, above-mentioned resin material comprises epoxy resin (epoxy resin).
Based on above-mentioned, because the present invention's second glass fibre structure coincides on first glass fibre structure, and first warp yarn, first weft threads and second warp yarn, second weft threads not exclusively overlap, therefore can effectively dwindle coincide and pressing after warp yarn and the formed woven areas of weft threads, and also may form no woven areas.
In addition, because coincide and pressing after first glass fibre structure and second glass fibre structure can effectively dwindle woven areas, therefore when the pattern metal routing layer is disposed on the insulating barrier, can have preferable and more stable dielectric constant, can solve existing holding wire and have the problem of differing dielectric constant because of striding woven areas.
For the above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. elaborates.
Description of drawings
Figure 1A is the generalized section of a kind of circuit board of one embodiment of the invention.
Figure 1B is first glass fibre structure of Figure 1A circuit board schematic diagram with the front and back that coincide of second glass fibre structure.
Fig. 1 C is another first glass fibre structure of Figure 1A circuit board schematic diagram with the front and back that coincide of another second glass fibre structure.
Fig. 2 is the generalized section of a kind of circuit board of another embodiment of the present invention.
Description of reference numerals:
100,200-circuit board; 110,210-insulating barrier;
110a, 110b-surface; 112,112 '-the first glass fibre structure;
112a, 112a '-first warp yarn; 112b, 112b '-first weft threads;
114,114 '-the second glass fibre structure; 114a, 114a '-second warp yarn;
114b, 114b '-second weft threads; 116,116 ', 216-glass fibre structure;
118,218-resin material; 120,220-conductive layer;
The 210a-surface; P1～P4-spacing;
S1, S1 ', S2, S2 '-woven areas.
Embodiment
Figure 1A is the generalized section of a kind of circuit board of one embodiment of the invention, and 1B is first glass fibre structure of Figure 1A circuit board schematic diagram with the front and back that coincide of second glass fibre structure.Please also refer to Figure 1A and Figure 1B, in the present embodiment, circuit board 100 comprises at least one insulating barrier 110 (only schematically illustrating one deck among Figure 1A) and at least one conductive layer 120 (only schematically illustrating two-layer among Figure 1A), wherein insulating barrier 110 comprises at least one first glass fibre structure 112, at least one second glass fibre structure 114 and a resin material 118, and conductive layer 120 is disposed on relative two surperficial 110a, the 110b of insulating barrier 110.Particularly, present embodiment conductive layer 120 is a copper foil layer.
Specifically, first glass fibre structure 112 has many first warp yarn 112a (the first warp yarn 112a only schematically illustrates four among Figure 1B) and many first weft threads 112b (the first weft threads 112b only schematically illustrates three among Figure 1B), wherein said first warp yarn 112a and the described first weft threads 112b constitute a plurality of woven areas S1, and the spacing P2 of the spacing P1 of wantonly two adjacent described first warp yarn 112a of first glass fibre structure 112 and wantonly two adjacent described first weft threads 112b is different in essence.Second glass fibre structure 114 has many second warp yarn 114a (the second warp yarn 114a only schematically illustrates four among Figure 1B) and many second weft threads 114b (the second weft threads 114b only schematically illustrates three among Figure 1B), wherein said second warp yarn 114a and the described second weft threads 114b constitute a plurality of woven areas, and the spacing P4 of the spacing P3 of wantonly two adjacent described second warp yarn 114a of second glass fibre structure 114 and wantonly two adjacent described second weft threads 114b is different in essence.
Particularly, in the present embodiment, second glass fibre structure 114 is identical in fact with first glass fibre structure 112, and second glass fibre structure 114 revolves and turn 90 degrees (please refer to Figure 1B) and coincide on first glass fibre structure 112, so that the described first warp yarn 112a, the described first weft threads 112b and the described second warp yarn 114a, the described second weft threads 114b not exclusively overlap, can form less woven areas S1 '.In other words, the described first warp yarn 112a of first glass fibre structure 112, the described first weft threads 112b with revolve that the described second warp yarn 114a of second glass fibre structure 114 that turn 90 degrees, the described second weft threads 114b coincide and pressing after formed glass fibre structure 116, can have less woven areas S1 '.
What deserves to be mentioned is; the present invention does not limit the form of first glass fibre structure 112 and second glass fibre structure 114; though first glass fibre structure 112 that reaches mentioned herein is identical in fact with second glass fibre structure 114; and first glass fibre structure 112 and second glass fibre structure 114 are specialized and are all one; but known other can reach the structural design of dwindling woven areas or forming no woven areas; still belong to the adoptable technical scheme of the present invention, the scope that does not break away from the present invention and protected.
For instance, please refer to Fig. 1 C, when if first glass fibre structure 112 ' and second glass fibre structure 114 ' are different in essence, meaning is the described first warp yarn 112a ' of first glass fibre structure 112 ' and the width of the described second weft threads 112b ', quantity or spacing are different from the described second warp yarn 114a ' of second glass fibre structure 114 ' and the width of the described second weft threads 114b ', quantity or spacing, second glass fibre structure 114 ' can directly coincide on first glass fibre structure 112 ', and the described first warp yarn 112a ', described first weft threads 112b ' and the described second warp yarn 114a ', the described second weft threads 114b ' not exclusively overlaps, and forms the glass fibre structure 116 ' with no woven areas.
Specifically, a plurality of woven areas S2 that described first warp yarn 112a ' and the described first weft threads 112b ' constitute, a plurality of woven areas S2 ' that described second warp yarn 114a ' and the described second weft threads 114b ' constitute, when first glass fibre structure 112 ' and second glass fibre structure 114 ' not simultaneously, second glass fibre structure 114 ' can directly coincide on first glass fibre structure 112 ', and the first warp yarn 112a ' of feasible part, the first weft threads 112b ', the second warp yarn 114a ' and the second weft threads 114b ' coincide in woven areas S2, on the S2 ', and form glass fibre structure 116 ' with no woven areas.
Certainly, in the embodiment that other does not illustrate, insulating barrier also can be to be formed by a plurality of first glass fibre structures and staggered the coinciding of a plurality of second glass fibre structure.Specifically, when if described first glass fibre structure is identical in fact with described second glass fibre structure, coincide on each first glass fibre structure after the rotatable angle of each second glass fibre structure, so that described warp yarn and described weft threads not exclusively overlap, and the glass fibre structure of the no woven areas of formation.In addition, also can have the glass fibre structure that different width, thickness or angle form no woven areas with weft threads, still belong to the adoptable technical scheme of the present invention, the scope that does not break away from the present invention and protected by the design warp yarn.
Refer again to Figure 1A, in the present embodiment, resin material 118 coats first glass fibre structure 112 and second glass fibre structure 114, and wherein resin material 118 can be an epoxy resin.Generally speaking, be that first glass fibre structure 112 and 114 immersions of second glass fibre structure are contained in the resin material 118 of epoxy resin, make resin material 118 coat first glass fibre structure 112 and second glass fibre structure 114 fully, and form a semi-solid preparation tree resin layer (pre-preg).Afterwards, again through a heating processing, make semi-solid preparation tree resin layer (pre-preg) full solidification after, promptly form above-mentioned so-called insulating barrier 120.
In brief, because present embodiment second glass fibre structure 114 coincides on first glass fibre structure 112, and the described first warp yarn 112a, the described first weft threads 112b and the described second warp yarn 114a, the described second weft threads 114b not exclusively overlap, therefore can effectively dwindle coincide and pressing after the first warp yarn 112a, the first weft threads 112b and the second warp yarn 114a, the formed woven areas S1 ' of the second weft threads 114b, and also may form no woven areas.In terms of existing technologies, the present invention's first glass fibre structure 112 (or 112 ') and second glass fibre structure 114 (or 114,) design, except making the glass fibre structure 116 (or 116 ') after coinciding have less woven areas S1 ' or not have woven areas, also can effectively reduce production costs.
Fig. 2 is the generalized section of a kind of circuit board of another embodiment of the present invention.Please refer to Fig. 2, in the present embodiment, circuit board 200 comprises at least one insulating barrier 210 (only schematically illustrating one deck among Fig. 2) and at least one conductive layer 220 (only schematically illustrating one deck among Fig. 2), wherein conductive layer 220 is disposed on the surperficial 210a of insulating barrier 210, and conductive layer 220 is a pattern metal routing layer.In the present embodiment, insulating barrier 210 is as above-mentioned insulating barrier 110, meaning is that insulating barrier 210 has second glass fibre structure 114 and coincides on first glass fibre structure 112, and the characteristic (please refer to Figure 1B) that the described first warp yarn 112a, the described first weft threads 112b and the described second warp yarn 114a, the described second weft threads 114b not exclusively overlap, that is to say that the glass fibre structure 216 that curing resin material 218 is surrounded in the insulating barrier 210 has less woven areas or do not have woven areas.
Because the glass fibre structure 216 in the insulating barrier 210 has less woven areas or does not have woven areas, therefore when conductive layer 220 is disposed on the surperficial 210a of insulating barrier 210, holding wire in the conductive layer 220 (not illustrating) is positioned at the top of glass fibre structure 216, can have preferable and more stable dielectric constant.That is to say that the holding wire in the conductive layer 220 has approximately identical effective non-conducting constant and corresponding speed.In other words, present embodiment circuit board 200 can solve existing holding wire and has the problem of differing dielectric constant because of striding woven areas.
What deserves to be mentioned is; the present invention does not limit the number of plies of insulating barrier 210 and conductive layer 220; though specific one deck that is all of insulating barrier that reaches 210 mentioned herein and conductive layer 220; meaning is that circuit board 200 is a single layer board; but in other embodiments; circuit board 200 also can be to replace storehouse by multilayer dielectric layer 210 with multi-layered patterned line layer 220 to be formed, and still belongs to the adoptable technical scheme of the present invention, does not break away from the scope of institute of the present invention desire protection.
In sum, because the present invention's second glass fibre structure coincides on first glass fibre structure, and first warp yarn, first weft threads and second warp yarn, second weft threads not exclusively overlap, therefore can effectively dwindle coincide and pressing after warp yarn and the formed woven areas of weft threads, and also may form no woven areas.In terms of existing technologies, the design of glass fibre structure of the present invention can effectively reduce production costs.
In addition, first glass fibre structure and second glass fibre structure can effectively dwindle woven areas or the no woven areas of formation owing to coincide and after the pressing, therefore when the pattern metal routing layer is disposed on the insulating barrier, the holding wire of pattern metal routing layer is the top that is positioned at glass fibre structure, but not only be positioned at the top of resin material, can have preferable and more stable dielectric constant, can solve existing holding wire and have the problem of differing dielectric constant because of striding woven areas.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (7)
1. a circuit board is characterized in that, comprising:
At least one insulating barrier, described insulating barrier comprises:
At least one first glass fibre structure has many first warp yarn and many first weft threads;
At least one second glass fibre structure, coincide on described first glass fibre structure, have many second warp yarn and many second weft threads, wherein said first warp yarn, described first weft threads and described second warp yarn, described second weft threads not exclusively overlap;
One resin material coats described first glass fibre structure and described second glass fibre structure; And
At least one conductive layer is disposed at least one surface of described insulating barrier.
2. circuit board according to claim 1 is characterized in that, wherein said conductive layer comprises a copper foil layer or a pattern metal routing layer.
3. circuit board according to claim 1, it is characterized in that, the spacing of wantonly two adjacent described first warp yarn of wherein said first glass fibre structure is different in essence with the spacing of wantonly two adjacent described first weft threads, and the spacing of the spacing of wantonly two adjacent described second warp yarn of described second glass fibre structure and wantonly two adjacent described second weft threads is different in essence.
4. circuit board according to claim 3 is characterized in that, wherein said second glass fibre structure is identical in fact with described first glass fibre structure.
5. circuit board according to claim 3 is characterized in that, wherein said first glass fibre structure and described second glass fibre structure are different in essence.
6. according to claim 4 or 5 described circuit boards, it is characterized in that wherein said second glass fibre structure revolves to turn 90 degrees and coincides on described first glass fibre structure.
7. circuit board according to claim 1 is characterized in that wherein said resin material comprises epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910133648A CN101861052A (en) | 2009-04-13 | 2009-04-13 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910133648A CN101861052A (en) | 2009-04-13 | 2009-04-13 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101861052A true CN101861052A (en) | 2010-10-13 |
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ID=42946603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910133648A Pending CN101861052A (en) | 2009-04-13 | 2009-04-13 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101861052A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102443928A (en) * | 2011-10-29 | 2012-05-09 | 常熟市福嘉丽织造有限公司 | Novel electric insulating fabric |
| CN113496898A (en) * | 2020-04-01 | 2021-10-12 | 澜起电子科技(昆山)有限公司 | Package substrate and manufacturing method thereof |
-
2009
- 2009-04-13 CN CN200910133648A patent/CN101861052A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102443928A (en) * | 2011-10-29 | 2012-05-09 | 常熟市福嘉丽织造有限公司 | Novel electric insulating fabric |
| CN113496898A (en) * | 2020-04-01 | 2021-10-12 | 澜起电子科技(昆山)有限公司 | Package substrate and manufacturing method thereof |
| US11825607B2 (en) | 2020-04-01 | 2023-11-21 | Montage Technology (Kunshan) Co., Ltd. | Package substrate manufacturing method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101013 |