CN101859591A - USB flash disk with display screen and capable of wireless transmission - Google Patents
USB flash disk with display screen and capable of wireless transmission Download PDFInfo
- Publication number
- CN101859591A CN101859591A CN201010209958A CN201010209958A CN101859591A CN 101859591 A CN101859591 A CN 101859591A CN 201010209958 A CN201010209958 A CN 201010209958A CN 201010209958 A CN201010209958 A CN 201010209958A CN 101859591 A CN101859591 A CN 101859591A
- Authority
- CN
- China
- Prior art keywords
- module
- usb flash
- flash disk
- microprocessor
- display screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Recrystallisation Techniques (AREA)
Abstract
The invention provides a USB flash disk which comprises a microprocessor, a data storage module, a display screen, a display module, a wireless transmission module and a power supply; one end of the display module is connected with the microprocessor for receiving data from the microprocessor and sending the same to the display screen; the display screen is connected with the display module for receiving the data sent by the display module and displaying the same; the wireless transmission module is connected with the microprocessor for receiving the data from the microprocessor and wirelessly transmitting the same; and the power supply is connected with the microprocessor, the data storage module and the other end of the display module for supplying power to the display module, the microprocessor and the data storage module. The invention is convenient for a user to quite easily check contents stored in the USB flash disk when a computer and other display equipment are not on hand, and can exchange data with external equipment through wireless transmission.
Description
Technical field
The present invention relates to a kind of USB flash disk, but relate in particular to a kind of USB flash disk with display screen and wireless transmission.
Background technology
Along with popularizing of electronic products such as computer, USB flash disk is widely used as the instrument of a kind of data storing and transmission.In the prior art, USB flash disk generally is by being plugged on the computer or on other electronic product, using to obtain power supply, such as carrying out data transmission and storage by operation on computers, showing the fileinfo of its storage etc. by computer.Obviously, USB flash disk must use in conjunction with miscellaneous equipment, and this brings certain limitation just for the user in the use, does not especially have computer at one's side when but seeking out very much USB flash disk internal information content as the USB flash disk holder.In addition, when the interface of apparatus such as computer and USB flash disk are pegged graft increased frequency each other, make interface damage such as distortion grade occur easily, and then cause data to transmit mutually, make troubles to the user.
Summary of the invention
The objective of the invention is to overcome the defective that above-mentioned prior art exists, provide a kind of and show the USB flash disk fileinfo and avoid interface the USB flash disk that damages to occur.
Above-mentioned purpose of the present invention is achieved through the following technical solutions:
According to the present invention, but provide a kind of USB flash disk, comprise microprocessor and data memory module, wherein, also comprise display screen, display module, wireless transport module and power supply with display screen and wireless transmission,
One end of described display module is connected with described microprocessor, is used to receive from the data of described microprocessor and sends it to display screen;
Described display screen is connected with described display module, is used to receive the data that described display module sends, and displays it;
Described wireless transport module is connected with described microprocessor, is used to receive data and wireless transmission from described microprocessor;
Described power supply is connected with the other end of described microprocessor, data memory module and described display module, is used for to described display module, microprocessor and the power supply of described data memory module.
In described USB flash disk, described display screen comprises organic light-emitting diode (OLED) display screen or LCDs.
In described USB flash disk, described organic light-emitting diode (OLED) display screen adopts low-temperature polysilicon film as substrate.
In described USB flash disk, described low-temperature polysilicon film is from comprising substrate, first restraining barrier, metal induction layer, second restraining barrier and polysilicon layer down.
In described USB flash disk, described low-temperature polysilicon film comprises substrate from descending, has first restraining barrier, metal induction layer, second restraining barrier and the polysilicon layer of groove structure.
In described USB flash disk, described low-temperature polysilicon film comprises from bottom to up: substrate, restraining barrier and the polysilicon layer with continuous domain.
In described USB flash disk, described power supply comprises solar cell.Described solar cell is preferably thin-film solar cells.Described thin-film solar cells comprises amorphous silicon thin-film solar cell or multi-crystal silicon film solar battery.
In described USB flash disk, described thin-film solar cells and described low-temperature polysilicon film are made on the upper and lower surface of same substrate.
In described USB flash disk, described wireless transport module comprises infrared interface or bluetooth module.
In technique scheme, described USB flash disk also comprises battery management module and charging inlet, one end of described power management module links to each other with power supply, be used to receive electric energy from power supply, its other end links to each other respectively with described display module, operational module, microprocessor, data memory module and charging inlet, gives display module, operational module, microprocessor, data memory module and charging inlet with power supply.
In technique scheme, described USB flash disk also comprises operational module and input media, one end of described operational module is connected with input media, be used to receive the input information of described input media, the other end of described operational module is connected with described microprocessor, is used for sending the input information that is received to microprocessor.
In technique scheme, described USB flash disk also comprises thoughts and feelings module and touch-screen, and an end of described thoughts and feelings module is connected with described touch-screen, is used for the input information of perception touch-screen, its other end is connected with described microprocessor, and the information that is used for perceiving sends described microprocessor to.
Compared with prior art, USB flash disk of the present invention has the following advantages:
1, USB flash disk can directly show the wherein file of storage;
2, can operate the file in the USB flash disk, use convenient;
3, use solar cell for supplying power to avoid environment is polluted energy savings;
4, use wireless transmission to avoid the damage of docking port.
Description of drawings
The present invention is further illustrated below in conjunction with accompanying drawing, wherein:
Fig. 1 is the front schematic perspective view of the USB flash disk of the embodiment of the invention;
Fig. 2 is the back side schematic perspective view of USB flash disk shown in Figure 1;
Fig. 3 is the internal circuit block diagram of the USB flash disk of the embodiment of the invention;
Fig. 4 is the circuit block diagram with display screen part of touch-screen;
Fig. 5 a is in the low-temperature polysilicon film manufacture process of USB flash disk according to an embodiment of the invention, the cross sectional representation of the multilayer film after forming first restraining barrier on the substrate;
Fig. 5 b is according to an embodiment of the invention in the low-temperature polysilicon film manufacture process of USB flash disk, forms the cross sectional representation of the multilayer film after first restraining barrier, metal induction layer, second restraining barrier, amorphous silicon layer and the metal absorption layer on substrate;
Fig. 5 c is the partial enlarged drawing of the multilayer film of Fig. 5 a;
Fig. 5 d is the cross sectional representation of the multilayer film shown in Fig. 5 b during heating crystallization;
Fig. 5 e is the cross sectional representation of the polysilicon membrane of low-temperature polysilicon film after removing behind the heating crystallization and with the metal adsorption layer of USB flash disk according to an embodiment of the invention;
Fig. 6 is the low-temperature polysilicon film preparation method's of USB flash disk according to another embodiment of the present invention a process flow diagram;
Fig. 7 a is the sectional view of low-temperature polysilicon film behind the crystal film surface deposition metal absorption layer after the first time annealing process of USB flash disk according to another embodiment of the present invention.
Embodiment
With reference to shown in Figure 1, be the front schematic perspective view of according to a preferred embodiment of the invention USB flash disk.This USB flash disk comprises housing 1, infrared interface 4 and is arranged on display screen 2 on the first surface 11 that it is used to make the user can directly check the information that needs show, preferably, also is provided with the input media such as keyboard 5 on the housing 1, so that user's operation.Fig. 2 is the back side schematic perspective view of USB flash disk according to a preferred embodiment of the invention.As shown in the figure, the second surface 12 that is oppositely arranged with first surface 11 is provided with solar cell 3, and it is used for received conversion of solar energy is that electric energy is powered to USB flash disk.This USB flash disk also comprises the circuit board (not shown) that is arranged in the housing 1.
Fig. 3 is the inner structure block diagram of USB flash disk shown in Figure 1.As shown in the figure, comprise infrared interface, microprocessor, data memory module, demonstration and operational module and solar cell.Wherein, an end of display module is connected with microprocessor, is used to receive the data from microprocessor, and its other end is connected with display screen, is used to show received data.Infrared interface is connected with described microprocessor, is used for wireless receiving and dispatching from microprocessor or such as the data of terminals such as notebook computer, personal digital assistant, mobile phone.One end of operational module is connected with input media, is used to receive the input information from input media, and its other end is connected with microprocessor, is used for received input information is transmitted to microprocessor.Described power supply is connected respectively with display module, operational module, microprocessor and data memory module, is used for to they power supplies.
Principle of work of the present invention is: the user who holds terminal can send to the data in the terminal in the USB flash disk by the infrared interface of USB flash disk, simultaneously, also can receive the data of storing in the USB flash disk, carry out the damage that exchanges data may bring for interface thereby avoided repeatedly using USB interface to peg graft by it.In addition, under illumination or daylight lamp, solar cell can be powered to each module in the USB flash disk, at this moment, the display screen of USB flash disk can show wherein institute's canned data automatically, for example about the tabulation of Folder Name, subsequently the user can be by keyboard to microprocessor input such as checking or the instruction of deleted file etc., operational module sends to microprocessor with this input information subsequently, microprocessor sends to data memory module with this input information again, finally by display module with specifying information or data presentation on display screen, thereby realize the operation of the content that the user stores USB flash disk.This USB flash disk that can display file has avoided the user because of not having computer at one's side, can't in time check in the USB flash disk file or the USB flash disk content such as is deleted at operation, greatly facilitates user's use.
In the above-described embodiments, operational module only is convenient to the convenient operation of user, if therefore this operational module not can be realized the object of the invention equally.In other embodiments of the invention, described infrared interface also can use a wireless transport module such as bluetooth module to substitute.
As the preferred implementation of another kind, described USB flash disk can also comprise power management module and charging inlet.One end of this power management module links to each other with solar cell, be used to receive the electric energy of solar cell, its other end links to each other respectively with display module, operational module, microprocessor, data memory module and charging inlet, gives display module, operational module, microprocessor, data memory module and charging inlet with power supply.When being inserted in external charge equipment on this charging inlet, described power management module will transfer to charging inlet from the electric energy that solar cell receives, thereby external charging equipment is charged.
As the preferred implementation of another kind, above-mentioned USB flash disk also comprises thoughts and feelings module and touch-screen.In one embodiment, will feel module and be arranged in the housing, touch-screen is arranged on the display screen, makes it become the display screen with touch function.The user can operate USB flash disk by touch-screen, thereby makes input convenient.This have touch-screen the display part circuit theory diagrams as shown in Figure 4, comprise the thoughts and feelings module that links to each other with touch-screen, the display module that links to each other with display screen, and described thoughts and feelings module and described display panel module link to each other with above-mentioned microprocessor all.The thoughts and feelings module is used for the input of perception touch-screen, and is translated into corresponding signal and sends described microprocessor to, and described microprocessor is controlled described display module, and the content in the USB flash disk is shown by display screen.
In the above-described embodiments, solar cell only is a kind of preferred implementation, in other embodiments of the invention, can also use the other types power supply such as dry cell, lithium ion battery to substitute.When adopting solar cell for supplying power, housing is preferably made by transparent material, makes luminous energy see through housing, is absorbed by described solar cell.
More preferably, solar cell can adopt thin-film solar cells, comprises monocrystalline silicon thin film solar cell, amorphous silicon thin-film solar cell or multi-crystal silicon film solar battery.Wherein, when described solar cell was amorphous silicon thin-film solar cell, it was compared with monocrystaline silicon solar cell and has the following advantages: the absorption coefficient of light of (1) amorphous silicon is big, thereby during as solar cell, when relative other materials of film desired thickness such as gallium arsenide, much smaller; (2) with respect to monocrystalline silicon, the amorphous silicon thin-film solar cell manufacturing process is simple, the manufacture process consuming little energy; (3) can realize that large tracts of landization reaches continuous production; (4) can adopt materials such as glass or stainless steel as substrate, thereby reduce cost easily; (5) can make rhythmo structure, raise the efficiency.When described solar cell is multi-crystal silicon film solar battery, it has the following advantages: (1) is because polysilicon (poly-Si) film is to be made of many little crystal grain that differ in size, have different high preferred orientations, it has better photosensitivity in long-wave band, visible luminous energy is effectively absorbed, and having the light durability the same with crystalline silicon, therefore is optimal photovoltaic device material efficient, low consumption; (2) have advantages such as the high conversion efficiency of monocrystalline silicon and polysilicon body battery and long-life concurrently because of multi-crystal silicon film solar battery, material preparation process is simple relatively simultaneously, has the high mobility and the low advantage of amorphous silicon material cost of monocrystalline silicon; (3) silicon materials of Shi Yonging are few far beyond monocrystalline silicon, inefficiency decline problem again, and polysilicon thin-film solar battery is that polysilicon membrane is grown in cheaply on the backing material, with the crystal silicon layer of relative thin active coating as solar cell, the high-performance and the stability that have not only kept crystal-silicon solar cell, and the consumption of material descends significantly, reduced the battery cost significantly.Therefore adopt amorphous silicon, multi-crystal silicon film solar battery for preferred.
In the above-described embodiments, described display screen comprises LCDs or Organic Light Emitting Diode (Organic Light-Emitting Diode is called for short OLED) display screen.In one embodiment of the invention, preferred organic light-emitting diode (OLED) display screen (the Organic Light-Emitting Diode that adopts, be called for short OLED), this display screen adopts the thin film transistor (TFT) of being made by low-temperature polysilicon film (thin filmtransistor is called for short TFT) as substrate.More preferably, this low-temperature polysilicon film comprises following three kinds:
A. first kind of low-temperature polysilicon film comprises substrate, first restraining barrier, metal induction layer, second restraining barrier and polysilicon layer from bottom to up.
Wherein, first restraining barrier also claims first separation layer, it mainly acts on is in order to prevent that the impurity in the substrate from spreading in the film on being coated on first restraining barrier in follow-up heating process, and it also is used to increase the thickness and the hardness of substrate, thereby is convenient to it is handled.Usually, described first restraining barrier can be substituted by the oxide of the metal with barrier properties, silit, silicon or the nitride of silicon, and thickness can be between the 0.1-1.0 micron, in one embodiment, described first restraining barrier is cryogenic oxidation silicon or silicon oxynitride, and thickness is 1.0 microns;
Be arranged in metal induction layer on first restraining barrier and contain any one or a few of following metal material: Ni, Ai, Ti, Ag, Au, Co, Sb, Pb and Cu, thickness is between the 100-900 nanometer, in one embodiment, metal induction layer is nickel or the nickeliferous material that contains 0.01%-0.1%;
The material and the thickness that are positioned at the material on second restraining barrier on the metal induction layer and thickness and first restraining barrier can be identical;
The polysilicon layer that is positioned on second restraining barrier is by the amorphous silicon membrane crystallization, and described polysilicon layer thickness is generally in the 1-100 nanometer.
B. second kind of low-temperature polysilicon film comprises substrate from bottom to up, has first restraining barrier, metal induction layer, second restraining barrier and the polysilicon layer of groove structure.
The key distinction point of this second kind of low-temperature polysilicon film and described first kind of low-temperature polysilicon film is that described first restraining barrier 202 is provided with groove structure.Specific as follows:
In above-mentioned steps 1) described first restraining barrier 202 is etched on the basis and has groove structure.Particularly, described first restraining barrier 202 with described substrate 201 facing surfaces on etch a plurality of grooves.Fig. 5 a is the multilayer film cross sectional representation behind etching first restraining barrier 202.As shown in the figure, comprise substrate 201 and first restraining barrier 202 that is coated on the substrate 201, wherein this first restraining barrier 202 comprises a plurality of grooves 2021 and the bossing between groove 2022.In one embodiment, the spacing between adjacent two bossings 2022 can be the 10-100 micron, and the height of bossing 2022 is the 1-5 nanometer.The cross section of bossing 2022 is preferably rectangle or trapezoidal shape, and when the cross section was rectangle, preferred wide was the 1.5-3.0 micron; When cross section when being trapezoidal, this trapezoidal upper base width is the 0.5-3.0 micron, and the width of going to the bottom is the 0.5-6.0 micron.
On 202 bases, described first restraining barrier, form metal induction layer 203, second restraining barrier 204, amorphous silicon layer 205 and metal absorption layer 206 then, Fig. 5 b is for forming first restraining barrier 202, inducing the multilayer film cross sectional representation after metal level 203, second restraining barrier 204, amorphous silicon layer 205 and the metal absorption layer 206 on substrate 201, wherein, the thickness of described metal induction layer 203 should be lower than 5 nanometers, itself has the concaveconvex structure with described first restraining barrier 202 fluctuations to guarantee metal induction layer 203.Should make described second restraining barrier 204 after the coating cover described metal induction layer 203 fully, preferably, described second restraining barrier 204 is smooth with the contact plane of described amorphous silicon layer 205.This concaveconvex structure of metal induction layer 203 helps forming inconsistent distance between metal induction layer 203 and amorphous silicon layer 205, thereby more helps to control the direction and the speed of metal diffusing in the metal induction layer.Shown in Fig. 5 c, to be a from the distance definition of the upper surface (that surface that promptly contacts with amorphous silicon film) on groove 2021 to second restraining barriers 204 of metal induction layer 203, will be b from the distance definition of the upper surface on bossing 2022 to second restraining barriers 204 of metal induction layer 203.In one embodiment, a is approximately the 3.0-4.0 micron, and b is approximately the 1.0-2.0 micron.
Then above-mentioned multilayer film is carried out annealing in process.Fig. 5 d is that the amorphous silicon evolution of the multilayer film shown in Fig. 5 b in annealing process is the cross sectional representation of polysilicon.As can be seen from the figure, in the metal induction layer in the annealing process 203 such as the metal in nickel source constantly to diffusion in the amorphous silicon membrane 205 (as black to shown in the upward arrow), as previously described, owing between metal induction layer 203 and amorphous silicon layer 205, have inconsistent spacing, nickel at first restraining barrier, 102 bossings 2022 at first arrives amorphous silicon layer 205, form the polysilicon nucleus and induce multi-crystal silicon area (being the darker regions in the amorphous silicon layer 205), form the transverse crystallization district with this place for the middle mind-set amorphous silicon transverse crystallization (shown in the black lateral arrows) corresponding then with the first restraining barrier recess in this place's formation.Last nickel source layer consumes gradually, from the barrier layer diffusion to the amorphous silicon layer in, then constantly be adsorbed thereby induce the nickel in source as the metal absorption layer of inducing the forward to be advanced into such as phosphorosilicate glass for polysilicon.Because the metal adsorption layer promptly is coated on the amorphous silicon layer before annealing in process, thus only need an annealing in process can finish the process of crystallization and metal adsorption, thus shortened the running time of entire method.Finally, the product cross sectional representation behind the removal metal adsorption layer is shown in Fig. 5 e.
C. the third polycrystalline silicon film material comprises from bottom to up: substrate, restraining barrier and the polysilicon layer with continuous domain; Wherein, the thickness of described polysilicon layer is the 10-500 nanometer, and the uniform crystal particles in the described polysilicon layer distributes; Wherein, described polysilicon layer is the polysilicon layer that the metal inducement film is contacted with described amorphous silicon membrane and form through the twice annealing crystallization by the overlayer photoetching induction port on amorphous silicon membrane, at described induction port.
Fig. 6 illustrates preparation method's the process flow diagram of an embodiment of described the third polycrystalline silicon film material, and this method comprises: cvd silicon oxide or silicon nitride barrier 212 on substrate 211, and deposition of amorphous silicon films 213 (step 301); On amorphous silicon membrane 213, form one deck monox or silicon nitride overlayer 214, and on overlayer 214 etching induction port (step 302); On overlayer 214, form layer of metal and induce film 215, make this metal inducement film contact (step 303) with amorphous silicon membrane at the induction port place; Carry out first step annealing process, obtain polysilicon island 300 (step 304) in the amorphous silicon membrane below induction port; Plated metal absorption layer 216 on metal inducement film 215 carries out the annealing process second time then, forms the amorphous silicon membrane (step 305) of the crystallization of uniform crystal particles distribution; Remove metal absorption layer and overlayer (step 306).Fig. 7 a illustrates the structure of the crystal film surface deposition metal absorption layer after first time annealing process of polysilicon membrane according to an embodiment of the invention.
In sum, second kind of low-temperature polysilicon film all can be achieved as follows beneficial effect with described first kind of low-temperature polysilicon film: because described metal induction layer is positioned under the amorphous silicon layer and is positioned between two-layer restraining barrier, this induces metal to open key effect toward the amorphous silicon layer diffusion for shortening heat processing time, raising crystallite dimension, control, avoided metal induction layer to be exposed to contaminated possibility in the air simultaneously, improve the quality of polysilicon membrane, and then made the performance of described display screen be improved.In addition, described second kind of polysilicon membrane and preparation method thereof can also be achieved as follows beneficial effect: 1) Zhi Bei crystallographic grain size depends on distance and proportional (this can get according to great deal of experiment data) between projection, fully can be according to the crystal grain of virtually any size in the design preparation scope of protruding spacing, complete like this can the preparation thin film transistor (TFT) in crystal grain, the performance that is equivalent to monocrystal is improved performances such as leakage current, carrier mobility greatly.Compare, can solve existing method and prepare in the process of polycrystalline silicon material, the nickel source is too abundant, and nucleus has limited the defective of growing up of crystal than comparatively dense; 2) time of complete crystallization is depended on the height of projection, therefore can control crystallization time preferably, has solved and has induced the metal stochastic distribution in the prior art, uncontrollable problem of complete crystallization time; 3) well-known, the existence meeting of residual metal increases leakage current greatly, and particularly for thin film transistor (TFT) TFT, can not there be a large amount of metal residues in its active channel, otherwise can have a strong impact on the stability of device.And second kind prepare in the polysilicon process, only diffuse to form nucleus at first in the nickel source of high spot, other zone is only replenishing usefulness, therefore can reduce the use of nickel amount, and, along with finishing of crystallization process, the accumulation of device material zone nickel remnants has been avoided all with inducing the peak to pass to the crystal boundary place of clashing in the nickel source.
Comprise crystallization in the preparation of described the third polysilicon membrane and absorb process targetedly, wherein: (1) forms the micro-nickel source in amorphous silicon surfaces, uses induction port to be controlled to the position of epipole in advance; (2), form the polysilicon spot at the induction port place through first step annealing; (3) at above-mentioned film surface, sedimentary phosphor silex glass (PSG) film, and carry out the annealing second time, finish the crystallization process of whole polysilicon membrane.The PSG film side absorbs the nickel crystal limit growth at induction port place, needs the ground of consumable nickel to protect well around induction port in the crystallization process and is not absorbed by PSG.Therefore, there is not the interval of inducing the obvious high nickel content of the induction port in the transverse crystallization method (MILC) as conventional metals in such crystallization process, when shortening the process time, to obtaining polysilicon membrane with continuous domain.Thereby further make any zone of whole polysilicon membrane to have eliminated the crystallization process substrate and to have shunk the aligning plate problem of misalignment that causes as the active layer of high-quality TFT.In addition, the preparation of described the third polysilicon membrane, also the induction port to the nucleus location is optimized the honeycomb crystal film that designs formation such as regular hexagon.Because the rule that is distributed as of induction port repeats to distribute, the domain shape of formation and measure-alike can accurately be controlled crystallization process, has the high controllability of crystallization time and the high stability of technological process, is suitable for the suitability for industrialized production requirement.
Preferably, the transparent material that adopts quartz or glass when above-mentioned low-temperature polysilicon film is during as substrate, and the light that display screen sends can arrive described solar cell, is converted into electric energy for described solar cell.
Preferably, when using thin-film solar cells to power as power supply, thin-film solar cells and display screen are made on the same substrate, not only can save material, simultaneously can reduce thin-film solar cells effectively and display screen takies the volume of USB flash disk, and then be beneficial to USB flash disk and develop to miniaturization.Therefore, according to the present invention, provide a kind of described thin-film solar cells 3 and described display screen 2 are made in the embodiment of the preparation method on the same substrate, this method comprises the steps:
1): amorphous silicon membrane is successively prepared on two surfaces up and down in transparent substrates;
2): with the amorphous silicon membrane crystallization of the upper surface of transparent substrates is low-temperature polysilicon film;
3): on low-temperature polysilicon film, be manufactured with OLED;
4): preparation solar film battery or solar energy film laminated cell on the amorphous silicon membrane of the lower surface of transparent substrates;
5): organic light-emitting diode (OLED) display screen and solar film battery are adopted two glass or multilayer film sealed package.
In other embodiments of the invention, described step 1) can adopt plasma reinforced chemical vapour deposition (PECVD) technology or low-pressure chemical vapor deposition (LPCVD) or liquid phase epitaxial method (LPE) or sputtering method, successively prepares amorphous silicon membrane on the two sides of transparent substrates;
Described step 2) preferably can adopt the preparation method of described three kinds of low-temperature polysilicon films before;
Described step 3) further comprises:
Step 3a): the active island of processing TFT pattern on low-temperature polysilicon film, the deposition gate oxide forms gate electrode;
Step 3b): N, P type doped source are injected in the active layer by ion, and form heavily doped source-drain area;
Step 3c): use laser, short annealing modes such as flashing light activate doped layer, and depositing insulating layer is opened the contact hole of grid, source, drain electrode;
Step 3d): adopt the vacuum sputtering method to prepare transparent conductive film, transparent conductive film is connected with source, drain electrode by contact hole; And adopt the photoresist release method to be photo-etched into pixel image;
Step 3e): prepare insulation course with spin coating method, photoetching exposes 6) described in nesa coating;
Step 3f): with the transparent conductive film is anode, prepares Organic Light Emitting Diode and its metallic cathode with vacuum deposition method;
Preferably, after described step 4), further comprising the steps of: as to adopt buried regions electrode, surface passivation, close grid technique, optimization back of the body electric field or contact electrode to wait the recombination losses that reduces photo-generated carrier, improve the collection efficiency of charge carrier, thereby improve the efficient of solar cell.
The present invention is by being provided with display screen on housing, absorb luminous energy by solar cell simultaneously and give described housing and the power supply of described display screen, even make the user not have computer etc. at one's side when showing docking device, still can see the related content of its stored by the display screen on the described USB flash disk, to make things convenient for user's use, in addition, by solar cell absorb luminous energy for, avoided common batteries can only use once, need the often shortcoming of displacement, so also avoided a large amount of discarded common batteries to the pollution that environment causes, helped saving the energy, the inconvenience that can avoid rechargeable battery to need often charging to bring simultaneously.
Although the present invention is made specific descriptions with reference to the above embodiments, but should be appreciated that for the person of ordinary skill of the art, the size of described solar cell, keyboard, USB interface and display screen, shape and layout are schematic, can make amendment or improve these modifications and improving all within spirit of the present invention and scope not breaking away within spirit of the present invention and the scope based on content disclosed by the invention.
Claims (14)
1. but the USB flash disk with display screen and wireless transmission comprises microprocessor and data memory module, it is characterized in that, also comprises display screen, display module, wireless transport module and power supply,
One end of described display module is connected with described microprocessor, is used to receive from the data of described microprocessor and sends it to display screen;
Described display screen is connected with described display module, is used to receive the data that described display module sends, and displays it;
Described wireless transport module is connected with described microprocessor, is used to receive data and wireless transmission from described microprocessor;
Described power supply is connected with the other end of described microprocessor, data memory module and described display module, is used for to described display module, microprocessor and the power supply of described data memory module.
2. USB flash disk as claimed in claim 1 is characterized in that described display screen comprises organic light-emitting diode (OLED) display screen or LCDs.
3. USB flash disk as claimed in claim 2 is characterized in that, described organic light-emitting diode (OLED) display screen adopts low-temperature polysilicon film as substrate.
4. USB flash disk as claimed in claim 3 is characterized in that, described low-temperature polysilicon film is from comprising substrate, first restraining barrier, metal induction layer, second restraining barrier and polysilicon layer down.
5. USB flash disk as claimed in claim 3 is characterized in that, described low-temperature polysilicon film comprises substrate from descending, has first restraining barrier, metal induction layer, second restraining barrier and the polysilicon layer of groove structure.
6. USB flash disk as claimed in claim 3 is characterized in that, described low-temperature polysilicon film comprises from bottom to up: substrate, restraining barrier and the polysilicon layer with continuous domain.
7. as each described USB flash disk in the claim 1 to 6, it is characterized in that described power supply comprises solar cell.
8. USB flash disk as claimed in claim 7 is characterized in that, described solar cell is a thin-film solar cells.
9. USB flash disk as claimed in claim 8 is characterized in that described thin-film solar cells comprises amorphous silicon thin-film solar cell or multi-crystal silicon film solar battery.
10. USB flash disk as claimed in claim 9 is characterized in that, described thin-film solar cells and described low-temperature polysilicon film are made on the upper and lower surface of same substrate.
11. USB flash disk as claimed in claim 1 is characterized in that, described wireless transport module comprises infrared interface or bluetooth module.
12. USB flash disk as claimed in claim 1, it is characterized in that, also comprise battery management module and charging inlet, one end of described power management module links to each other with power supply, be used to receive electric energy from power supply, its other end links to each other respectively with described display module, operational module, microprocessor, data memory module and charging inlet, gives display module, operational module, microprocessor, data memory module and charging inlet with power supply.
13. USB flash disk as claimed in claim 1, it is characterized in that, also comprise operational module and input media, one end of described operational module is connected with input media, be used to receive the input information of described input media, the other end of described operational module is connected with described microprocessor, is used for sending the input information that is received to microprocessor.
14. USB flash disk as claimed in claim 1, it is characterized in that, also comprise thoughts and feelings module and touch-screen, one end of described thoughts and feelings module is connected with described touch-screen, the input information that is used for the perception touch-screen, its other end is connected with described microprocessor, and the information that is used for perceiving sends described microprocessor to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010209958A CN101859591A (en) | 2010-06-22 | 2010-06-22 | USB flash disk with display screen and capable of wireless transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010209958A CN101859591A (en) | 2010-06-22 | 2010-06-22 | USB flash disk with display screen and capable of wireless transmission |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101859591A true CN101859591A (en) | 2010-10-13 |
Family
ID=42945429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010209958A Pending CN101859591A (en) | 2010-06-22 | 2010-06-22 | USB flash disk with display screen and capable of wireless transmission |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101859591A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104260027A (en) * | 2014-07-15 | 2015-01-07 | 国家电网公司 | Torque spanner capable of recording data for aerial operation |
| CN107180601A (en) * | 2017-05-19 | 2017-09-19 | 凡方数码设备有限公司 | Display device and its communication means, the device with store function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1719615A (en) * | 2004-07-07 | 2006-01-11 | 三星Sdi株式会社 | Thin film transistor and method of fabricating the same |
| CN101064246A (en) * | 2006-04-27 | 2007-10-31 | 香港科技大学 | Metal-induced crystallization of amorphous silicon and metal removal techniques |
| CN201063560Y (en) * | 2007-06-01 | 2008-05-21 | 北京恒基伟业投资发展有限公司 | Solar energy electronic book |
| WO2009018472A1 (en) * | 2007-07-31 | 2009-02-05 | The Regents Of The University Of California | Low-temperature formation of polycrystalline semiconductor films via enhanced metal-induced crystallization |
| CN201707715U (en) * | 2010-06-22 | 2011-01-12 | 广东中显科技有限公司 | USB flash disk with display screen and capable of wireless transmission |
-
2010
- 2010-06-22 CN CN201010209958A patent/CN101859591A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1719615A (en) * | 2004-07-07 | 2006-01-11 | 三星Sdi株式会社 | Thin film transistor and method of fabricating the same |
| CN101064246A (en) * | 2006-04-27 | 2007-10-31 | 香港科技大学 | Metal-induced crystallization of amorphous silicon and metal removal techniques |
| CN201063560Y (en) * | 2007-06-01 | 2008-05-21 | 北京恒基伟业投资发展有限公司 | Solar energy electronic book |
| WO2009018472A1 (en) * | 2007-07-31 | 2009-02-05 | The Regents Of The University Of California | Low-temperature formation of polycrystalline semiconductor films via enhanced metal-induced crystallization |
| CN201707715U (en) * | 2010-06-22 | 2011-01-12 | 广东中显科技有限公司 | USB flash disk with display screen and capable of wireless transmission |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104260027A (en) * | 2014-07-15 | 2015-01-07 | 国家电网公司 | Torque spanner capable of recording data for aerial operation |
| CN107180601A (en) * | 2017-05-19 | 2017-09-19 | 凡方数码设备有限公司 | Display device and its communication means, the device with store function |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202423298U (en) | TFT (Thin Film Transistor), array substrate and display device | |
| US10068809B2 (en) | TFT backplane manufacturing method and TFT backplane | |
| CN104538429B (en) | The production method and its structure of AMOLED backboard | |
| CN104022077B (en) | Array substrate, preparing method thereof and display device | |
| US9214482B2 (en) | Array substrate and display device | |
| CN103000628B (en) | Display device, array substrate and manufacture method of array substrate | |
| WO2016173322A1 (en) | Array substrate and manufacturing method thereof, and display device | |
| CN103715147B (en) | Complementary thin-film transistor drives backboard and preparation method thereof, display floater | |
| CN104393017B (en) | Preparation method, array base palte and the display device of array base palte | |
| CN105633101A (en) | TFT array substrate and manufacture method thereof, and display device | |
| CN106910748A (en) | A kind of array base palte, display device and preparation method thereof | |
| CN102751200B (en) | Thin film transistor, array substrateand manufacturing method thereof | |
| CN102969362A (en) | High-stability amorphous metallic oxide thin film transistor (TFT) device | |
| CN104143565A (en) | Flexible display substrate, manufacturing method thereof and display device | |
| CN103928474A (en) | Array substrate, manufacturing method of array substrate and display panel | |
| CN105576017B (en) | A kind of thin film transistor (TFT) based on zinc-oxide film | |
| WO2021259361A1 (en) | Thin-film transistor and manufacturing method therefor, and array substrate and display panel | |
| EP2523216B1 (en) | Manufacturing method for thin film transistor with polysilicon active layer | |
| CN104269413B (en) | Array base palte and preparation method thereof, liquid crystal display device | |
| CN105390443A (en) | Manufacture method of TFT substrate | |
| CN105655407A (en) | Polycrystalline silicon thin film transistor and preparation method thereof, array substrate and display device | |
| CN103022355B (en) | A kind of low-temperature polysilicon film transistor and preparation method thereof | |
| CN201707715U (en) | USB flash disk with display screen and capable of wireless transmission | |
| CN102629611B (en) | Display device, array substrate and manufacturing method thereof | |
| WO2020052333A1 (en) | Active-matrix organic light-emitting diode backplane, manufacturing method therefor, and display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101013 |