CN101848598B - Soft and hard printing circuit board module and manufacturing method and processing method thereof - Google Patents
Soft and hard printing circuit board module and manufacturing method and processing method thereof Download PDFInfo
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- CN101848598B CN101848598B CN2009101196827A CN200910119682A CN101848598B CN 101848598 B CN101848598 B CN 101848598B CN 2009101196827 A CN2009101196827 A CN 2009101196827A CN 200910119682 A CN200910119682 A CN 200910119682A CN 101848598 B CN101848598 B CN 101848598B
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Abstract
The invention relates to a soft and hard printing circuit board module and a manufacturing method and a processing method thereof. Particularly, the soft and hard printing circuit board module comprises a nonclient area and a client area, wherein the nonclient area defines with a containing space, the client area is arranged in the accommodation space and is connected with the nonclient area by a plurality of linkage areas, and each linkage area is a soft area of which the hardness is smaller than that of the client area. The thickness and the material of the linkage area are same, the linkage area is defined by a soft circuit board, and thus the soft and hard printing circuit board module can quickly cut off the linkage area by a single tool when cutting off the linkage area during the processing; the separation speed of the client area and the nonclient area is effectively improved, manufacturing cost and manufacturing working hour during the processing are lowered, and meanwhile, the product quality of the client area after cut can be assured while simplifying the processing flow.
Description
Technical field
The present invention relates to a kind of soft and hard printed circuit board module and manufacturing approach and processing method, particularly relate to soft and hard printed circuit board module and manufacturing approach and processing method that a kind of service area is connected with nonclient area through soft bonding pad.
Background technology
Soft and hard printed circuit board (Rigid-Flex PCB) (or claiming Rigid Flex) is a kind of electronic component with soft circuit board and the synthetic same circuit board of rigid circuit board group; Because the pliability characteristics of soft and hard printed circuit board; But make the product configurations of its fit applications and be designed to required pattern or profile; Except having good design freedom; And the weight that can effectively reduce the design volume of product and alleviate product, therefore, soft and hard printed circuit board has been widely used in as on the electronic products such as mobile phone, personal digital assistant, digital camera or DV at present.
Because the design of electronic product is compact day by day at present; And the soft and hard printed circuit board quantity that is applied on the electronic product is also more and more many; Therefore; How effectively to reduce the cost of soft and hard printed circuit board module in manufacturing, the course of processing, and can effectively promote the service area of soft and hard printed circuit board module and the separating rate of nonclient area, become an important problem then.
Summary of the invention
Main purpose of the present invention; Be to provide a kind of soft and hard printed circuit board module; Its service area is connected with nonclient area through soft bonding pad, can effectively promote the separating rate that cuts of service area and nonclient area, and can reduce manufacturing cost and the worker in the course of processing time.
Another object of the present invention is to provide a kind of manufacturing approach that can effectively promote the soft and hard printed circuit board module of manufacturing speed.
Another purpose of the present invention is to provide a kind of processing method that can effectively promote the soft and hard printed circuit board module of process velocity.
The object of the invention and solution prior art problem adopt following technological means to realize; According to the disclosed soft and hard printed circuit board module of the present invention; Comprise a nonclient area and a service area, nonclient area defines an accommodation space, and the service area is located in the accommodation space; The service area has only through a plurality of bonding pads connection nonclient areas, and each bonding pad is the hardness soft zone soft than nonclient area.
Aforesaid soft and hard printed circuit board module, the thickness and the material of said bonding pad are identical, the soft and hard printed circuit board module comprise one define said bonding pad the flexible circuit plate.
Aforesaid soft and hard printed circuit board module; Comprise a hard circuit board spare, and a flexible circuit plate, hard circuit board spare comprises one first plate body; The flexible circuit plate comprises one second plate body, and first, second plate body piles up mutually and engages and define jointly the service area.Hard circuit board spare also comprises first framework that is centered around the first plate body outside and separates with first plate body; The flexible circuit plate also comprise one be centered around the second plate body outside second framework; First, second framework is piled up mutually and is engaged and define jointly nonclient area, and the flexible circuit plate defines the said bonding pad that connects second plate body and second framework.
The manufacturing approach of aforesaid soft and hard printed circuit board module is applicable to that said method comprises following step on a hard circuit board spare and the flexible circuit plate:
(A) cut hard circuit board spare and flexible circuit plate; Make hard circuit board spare be formed with first plate body that is connected with one first framework through a plurality of connecting portions, and make the flexible circuit plate be formed with second plate body that is connected with one second framework through a plurality of bonding pads;
(B) pile up hard circuit board spare and flexible circuit plate; First framework is spliced with second framework mutually; First plate body splices with second plate body mutually, and each connecting portion is not overlapping with second plate body, and at least a portion is not overlapping with each connecting portion and first plate body in the said bonding pad; And
(C) each connecting portion of severing makes first plate body separate with first framework.
The manufacturing approach of aforesaid soft and hard printed circuit board module; In step (A); Hard circuit board spare is formed with the corresponding hollow-out parts in position, a plurality of and said bonding pad, and in step (B), each bonding pad is corresponding with each hollow-out parts position and not overlapping with each connecting portion and first plate body.
The processing method of aforesaid soft and hard printed circuit board module; Said soft and hard printed circuit board comprises a nonclient area; And the service area that is connected with said nonclient area through a plurality of bonding pads, each said bonding pad is the soft soft zone of the more said nonclient area of hardness, comprises following step:
(A) electronic building brick is set in the service area; And
(B) the said bonding pad between severing service area and the nonclient area makes the service area separate with nonclient area.
According to the disclosed soft and hard printed circuit board module of the present invention, comprise a nonclient area, and two service areas; Nonclient area defines two adjacent accommodation spaces; Each service area is located in each accommodation space, and each service area has only through a plurality of bonding pads connection nonclient areas, and each bonding pad is the hardness soft zone soft than nonclient area; Certainly, the quantity of service area also can be a plurality of.
Aforesaid soft and hard printed circuit board module; Comprise a hard circuit board spare, and a flexible circuit plate, hard circuit board spare comprises one first framework; The flexible circuit plate comprises one second framework, and first, second framework is piled up mutually and engaged and define jointly nonclient area.
Aforesaid soft and hard printed circuit board module; Hard circuit board spare also comprises two first plate bodys; First framework is centered around around each first plate body and with each first plate body separates, and the flexible circuit plate also comprises two second plate bodys, and second framework is centered around around each second plate body; Each first, second plate body piles up mutually and engages and define jointly each service area, and the flexible circuit plate defines the said bonding pad that connects each second plate body and second framework.
The manufacturing approach of aforesaid soft and hard printed circuit board module is applicable to that said method comprises following step on a hard circuit board spare and the flexible circuit plate:
(A) cut hard circuit board spare and flexible circuit plate; Make hard circuit board spare be formed with at least two first plate bodys that are connected with one first framework through a plurality of connecting portions respectively, and make the flexible circuit plate be formed with at least two second plate bodys that are connected with one second framework through a plurality of bonding pads respectively;
(B) pile up hard circuit board spare and flexible circuit plate; First framework is spliced with second framework mutually; Each first plate body splices with each second plate body mutually, and each connecting portion is not overlapping with second plate body, and at least a portion is not overlapping with each connecting portion and first plate body in the said bonding pad; And
(C) each connecting portion between each first plate body of severing and first framework makes each first plate body separate with first framework.
The manufacturing approach of aforesaid soft and hard printed circuit board module; In step (A); Hard circuit board spare is formed with the corresponding hollow-out parts in position, a plurality of and said bonding pad, and in step (B), each bonding pad is corresponding with each hollow-out parts position and not overlapping with each connecting portion and first plate body.
The processing method of aforesaid soft and hard printed circuit board module; Said soft and hard printed circuit board module comprises a nonclient area; And two service area; Each said service area connects said nonclient area through a plurality of bonding pads, and each said bonding pad is the soft soft zone of the more said nonclient area of hardness, and said method comprises following step:
(A) electronic building brick is set in each service area; And
(B) the said bonding pad between each service area of severing and the nonclient area makes each service area separate with nonclient area.
Soft and hard printed circuit board module of the present invention is connected with nonclient area through a plurality of soft bonding pads by the service area, makes when the soft and hard printed circuit board module is carried out the severing operation of bonding pad in the course of processing; Can carry out the severing operation of bonding pad through single toolroom machine apace; By this, can effectively promote the separating rate of each service area and nonclient area, during with reduction manufacturing cost and worker; Simultaneously, can simplify the product quality that work flow and guaranteeing cuts the service area, back.
Description of drawings
Fig. 1 is the vertical view of first preferred embodiment of soft and hard printed circuit board module of the present invention, explains that each service area is connected with nonclient area through the bonding pad;
Fig. 2 is the cutaway view of being got along the I-I hatching line among Fig. 1;
Fig. 3 is the cutaway view of being got along the II-II hatching line among Fig. 1;
Fig. 4 is the vertical view of flexible circuit plate of first preferred embodiment of soft and hard printed circuit board module of the present invention, explains that second plate body is connected with second framework through the bonding pad;
Fig. 5 is the manufacturing approach flow chart of first preferred embodiment of soft and hard printed circuit board module of the present invention;
Fig. 6 is the manufacturing sketch map of first preferred embodiment of soft and hard printed circuit board module of the present invention, and the shape after hard circuit board spare and flexible circuit plate cut is described;
Fig. 7 is the vertical view of the hard circuit board spare after the cutting of first preferred embodiment of soft and hard printed circuit board module of the present invention, explains that first plate body is connected with first framework through connecting portion;
Fig. 8 is the vertical view of first preferred embodiment of soft and hard printed circuit board module of the present invention, explain that hard circuit board spare and flexible circuit plate splice, and each bonding pad corresponds to each hollow-out parts position;
Fig. 9 is the processing method flow chart of first preferred embodiment of soft and hard printed circuit board module of the present invention;
Figure 10 is the vertical view of first preferred embodiment of soft and hard printed circuit board module of the present invention, explains electronic building brick to be set on each first plate body;
Figure 11 is the vertical view of first preferred embodiment of soft and hard printed circuit board module of the present invention, the state after each service area being described and nonclient area separating;
Figure 12 is the vertical view of second preferred embodiment of soft and hard printed circuit board module of the present invention, explains that the service area is connected with nonclient area through the bonding pad;
Figure 13 is the cutaway view of being got along the III-III hatching line among Figure 12;
Figure 14 is the manufacturing approach flow chart of second preferred embodiment of soft and hard printed circuit board module of the present invention;
Figure 15 is the manufacturing sketch map of second preferred embodiment of soft and hard printed circuit board module of the present invention, and the shape after hard circuit board spare and flexible circuit plate cut is described;
Figure 16 is the vertical view of second preferred embodiment of soft and hard printed circuit board module of the present invention, explain that hard circuit board spare and flexible circuit plate splice, and each bonding pad corresponds to each hollow-out parts position;
Figure 17 is the processing method flow chart of second preferred embodiment of soft and hard printed circuit board module of the present invention;
Figure 18 is the vertical view of second preferred embodiment of soft and hard printed circuit board module of the present invention, explains electronic building brick to be set on first plate body; And
Figure 19 is the vertical view of second preferred embodiment of soft and hard printed circuit board module of the present invention, the state after the service area being described and nonclient area separating.
The primary clustering symbol description:
(the present invention) 21 second frameworks
100,110 soft and hard printed circuit board modules, 22 second plate bodys
1,10 hard circuit board spares, 221 contact sites
1 ' hard circuit board spare 222 extensions after cutting
11 first frameworks, 23 bonding pads
12 first plate bodys, 3 nonclient areas
121 surperficial 31 accommodation spaces
13 connecting portions, 4 service areas
14 hollow-out parts, 91～95 steps
15,16 electronic building bricks 91 '～95 ' step
2,20 flexible circuit plate I, II, III hatching line
Embodiment
About aforementioned and other technology contents, characteristics and effect of the present invention, in the detailed description of following cooperation, can clearly appear with reference to two preferred embodiments of accompanying drawing.Through the explanation of embodiment, should be to reach technological means and the effect that predetermined purpose takes to be able to more deeply and concrete understanding to the present invention, yet appended accompanying drawing only provide the usefulness of reference and explanation, is not to be used for the present invention is limited.
Before the present invention is described in detail, be noted that in following description similarly assembly is to represent with identical numbering.
Like Fig. 1 and shown in Figure 2; It is first preferred embodiment of soft and hard printed circuit board module of the present invention; This soft and hard printed circuit board module 100 is to comprise a plurality of hard circuit board spares 1; And one pile up the flexible circuit plate 2 of joint mutually with hard circuit board spare 1, and in the present embodiment, hard circuit board spare 1 is to be that example is explained with two.
Like Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4; Each hard circuit board spare 1 comprises one first framework 11, and a plurality of first plate body 12, in the present embodiment; First framework 11 is that to be square latticed, and first framework 11 is centered around around each first plate body 12 and with each first plate body 12 separates.Flexible circuit plate 2 comprises one second framework 21; And a plurality of second plate bodys 22; Second framework 21 and first framework, 11 shapes are quite and be centered around around each second plate body 22; Second framework 21 is piled up between first framework 11 that is bonded on two hard circuit board spares 1, and second framework 21 and first framework 11 define a nonclient area 3 jointly, and nonclient area 3 defines a plurality of adjacent accommodation spaces 31.Each second plate body 22 is to pile up between first plate body 12 that is bonded on two hard circuit board spares 1; Each second plate body 22 comprises a shape and quite and with first plate body 12 piles up the contact site 221 that engages with first plate body, 12 shapes; And one be connected in contact site 221 1 sides and expose outside the extension 222 of first plate body 12; First plate body, 12 conductings that contact site 221 can pile up through circuit (figure do not show) and two; Subregion on the surface 121 that two first plate bodys 12 do not contact with contact site 221 can be provided with Copper Foil (figure does not show), and installs in order to power supply sub-component (figure does not show), and the extension 222 of second plate body 22 is then in order to transmit the signal of telecommunication or power supply.Each second plate body 22 is to be connected with second framework 21 through a plurality of bonding pads of being located at respectively on contact site 221 and the extension 222 23; By this, make each second plate body 22 and 12 service areas of defining jointly 4 of two first plate bodys of piling up to be positioned in each accommodation space 31 with it.Wherein, because bonding pad 23 is to be defined by flexible circuit plate 2, therefore, the thickness of each bonding pad 23 and material are all identical, and the soft zone soft than first framework 11 of nonclient area 3 that be hardness, each bonding pad 23.
What specify is; In the present embodiment; Service area 4 quantity that the accommodation space 31 that nonclient area 3 is defined and first, second plate body 12,22 are defined are respectively to be that example is explained with four, certainly, and the demand of visual reality and the quantity of corresponding adjustment accommodation space 31 and service area 4.In addition, second plate body 22 also can define a service area 4 with two or more first plate bodys 21 that separate spaced apart jointly, and two first plate bodys 21 that are not limited to present embodiment pile up contact site 221 tops, the two sides, the end that is bonded on second plate body 22 respectively.Moreover, accommodation space 31 shapes that nonclient area 3 is defined, and disclosed shape is exceeded in the neither accompanying drawing with present embodiment of the shape of first, second plate body 12,22, visual actual demand changes the shape style of design.
Below will be elaborated to the manufacturing approach of soft and hard printed circuit board module 100, like Fig. 4, Fig. 5, Fig. 6 and shown in Figure 7, Fig. 5 is the manufacturing approach flow chart of soft and hard printed circuit board module 100, and its main flow process is:
Like step 91; Cut hard circuit board spare 10 and flexible circuit plate 20; Make the hard circuit board spare 1 ' after cutting be formed with a plurality of first plate bodys 12; And each first plate body 12 is connected with first framework 11 through a plurality of connecting portions 13, and makes the flexible circuit plate 2 after cutting be formed with a plurality of second plate bodys 22, and each second plate body 22 is connected with second framework 21 through a plurality of bonding pads 23.In the present embodiment; Each first plate body 12 is to be connected with first framework 11 through four connecting portions 13 that are connected to four corner places, and respectively second plate body 22 is to be located at contact site 221 respectively through four to be connected with second framework 21 with bonding pad 23 on the extension 222.
Like Fig. 5, Fig. 6 and shown in Figure 8; In step 92; Pile up two hard circuit board spares 1 ' and flexible circuit plate 2 after cutting; Present embodiment is that the hard circuit board spare 1 ' after cutting two is stacked on two sides at the bottom of the top of flexible circuit plate 2 respectively, makes each first framework 11 overlapping with second framework 21 and engage, and respectively the contact site 221 of first plate body 12 and each second plate body 22 is overlapping and engage; Each connecting portion 13 is not overlapping with second plate body 22, and the bonding pad 23 of at least a portion is not overlapping with each connecting portion 13 and first plate body 12 in the said bonding pad 23.
In the present embodiment; Owing to be formed with a hollow-out parts 14 between the per two adjacent connecting portions 13 that are connected with each first plate body 12; And the position of each hollow-out parts 14 is corresponding with each 23 position, bonding pad of flexible circuit plate 2; And because of the size of first plate body 12 and contact site 221 sizableness of second plate body 22, therefore, after the hard circuit board spare 1 ' after cutting piles up with flexible circuit plate 2; Each bonding pad 23 can correspond to each hollow-out parts 14 position and be not overlapping with each connecting portion 13 and first plate body 12 fully; And because of extension 222 and bonding pad 23 of second plate body 22 corresponds to one of them hollow-out parts 14 position simultaneously, so each connecting portion 13 can be not overlapping with second plate body 22.What specify is; In the present embodiment; Though the hard circuit board spare 1 ' after cutting is to be stacked on respectively with two that the mode on two sides is that example is explained at the bottom of flexible circuit plate 2 tops, in practical application, the usage quantity of the hard circuit board spare 1 ' after cutting also can be one or more; And the mode of piling up can be after the hard circuit board spare 1 ' after a plurality of the cutting is stacked; Flexible circuit plate 2 is stacked on the top layer or the bottom of the hard circuit board spare 1 ' after aforementioned a plurality of the cutting again, or wherein arbitrary layer, makes the contact site 221 of second plate body 22 can be stacked on top layer or bottom or wherein arbitrary layer of a plurality of first plate bodys 12 accordingly.Moreover contact site 221 areas of second plate body 22 are also not necessarily identical with the area of first plate body 12, and contact site 221 areas can make first plate body, 12 subregions contact conducting with contact site 221 less than first plate body, 12 areas.
Then; Shown in step 93; Each connecting portion 13 between each first plate body 12 and first framework 11 is carried out the operation of milling by milling machine (figure does not show); With each connecting portion 13 of severing, each first plate body 12 is separated with first framework 11 as illustrated in fig. 1, promptly accomplish the manufacturing of soft and hard printed circuit board module 100.
What need explanation is; In the step 91; Hard circuit board spare 1 ' after cutting is formed with four connecting portions 13 that are connected 12 4 corner places of first plate body; But the quantity of connecting portion 13 also can be three or two, as long as can first plate body 12 firmly be connected with first framework 11, does not exceed with the quantity of disclosed four connecting portions 13 in the present embodiment.Moreover; As in the step 92; At least a portion bonding pad 23 in the said bonding pad 23 also might be designed to the connecting portion 13 or first plate body 12 overlapping, that is to say, the part area of the bonding pad 23 that has can then correspond to hollow-out parts 14 positions with connecting portion 13 overlapping all the other areas; If under the situation of first plate body, 12 areas greater than contact site 221 areas of second plate body 22, the part area of the bonding pad 23 that has can then correspond to hollow-out parts 14 positions with first plate body, 12 overlapping all the other areas.
Like Fig. 9 and shown in Figure 10, take the soft and hard printed circuit board module of make accomplishing 100 (like Fig. 1) when system assembles factory after, can carry out follow-up process operation according to demand, below will be described further to the processing method of soft and hard printed circuit board module 100:
Like step 94; Soft and hard printed circuit board module 100 is sent in the automatic production line (figure does not show); Conveying by delivery track; Make each work station in the automatic production line can various different types of electronic building bricks 15,16 be arranged on the surface 121 of first plate body 12 of each service area 4, or be arranged on the extension 222 of second plate body 21, wherein; The set-up mode of electronic building brick 15,16 can be that mode, plant mode or other the mode by surface mount technology (SMT) carried out, and the visual actual demand of quantity that is provided with of electronic building brick 15,16 increases and decreases.
Like step 95; After the setting operation of electronic building brick 15,16 is accomplished in each service area 4 of soft and hard printed circuit board module 100; Then, with each bonding pad 23 severing, each service area 4 is separated by punch press (figure does not show) as illustrated in fig. 11 with nonclient area 3; At this moment, each service area 4 just is able to proceed to be assembled in the assembly operation in the electronic product.Certainly, present embodiment carries out the severing operation of each bonding pad 23 except using punch press, also can adopt the toolroom machine of other types to carry out the operation of severing.
Because the design of electronic product is compact day by day at present; And the soft and hard printed circuit board quantity that is applied on the electronic product is also more and more many; Therefore; How effectively to reduce the cost of soft and hard printed circuit board module 100 in the course of processing, and can effectively promote each service area 4 of soft and hard printed circuit board module 100 and the separating rate of nonclient area 3, become an important problem then.In the present embodiment, owing to each service area 4 in the soft and hard printed circuit board module 100 is connected with nonclient area 3 through bonding pad 23, and each bonding pad 23 is to be defined by flexible circuit plate 2; Therefore; Each bonding pad 23 has identical material and thickness, so, when soft and hard printed circuit board module 100 in severing when operation of carrying out bonding pad 23; Can carry out the severing operation of bonding pad 23 through single toolroom machine (like the punch press of being proposed in the present embodiment) apace; By this, can effectively promote the separating rate of each service area 4 and nonclient area 3, when reducing manufacturing cost and the worker of soft and hard printed circuit board module 100 in the course of processing; Simultaneously, can simplify the product quality that the work flow in the course of processing and guaranteeing cuts each service area 4, back.
Like Figure 12 and shown in Figure 13, be second preferred embodiment of soft and hard printed circuit board module of the present invention, its manufacturing approach is roughly identical with first preferred embodiment with processing method, and difference is that the overall structure of soft and hard printed circuit board module 110 is slightly variant.Soft and hard printed circuit board module 110 in the present embodiment can be considered an one-piece construction, and it is 1/4th of the soft and hard printed circuit board modules 100 (like Fig. 1) that join chips more.
Like Figure 14, Figure 15 and shown in Figure 16, the manufacturing approach of soft and hard printed circuit board module 110 is following:
Like step 91 '; Cut hard circuit board spare 10 and flexible circuit plate 20; Make the hard circuit board spare 1 ' after cutting be formed with one first plate body 12; And first plate body 12 is connected with first framework 11 through a plurality of connecting portions 13, and makes the flexible circuit plate 2 after cutting be formed with one second plate body 22, and second plate body 22 is connected with second framework 21 through a plurality of bonding pads 23.
In step 92 ' in; Pile up two hard circuit board spares 1 ' and flexible circuit plate 2 after cutting; Make each first framework 11 overlapping with second framework 21 and engage; The contact site 221 of each first plate body 12 and second plate body 22 is overlapping and engage, and each connecting portion 13 is not overlapping with second plate body 22, and the bonding pad 23 of at least a portion is not overlapping with each connecting portion 13 and first plate body 12 in the said bonding pad 23.In the present embodiment; After hard circuit board spare 1 ' after cutting piles up with flexible circuit plate 2; Each bonding pad 23 can correspond to each hollow-out parts 14 position and be not overlapping with each connecting portion 13 and first plate body 12 fully, and because of the size of first plate body 12 and contact site 221 sizableness of second plate body 22, the extension 222 of second plate body 22 and a bonding pad 23 correspond to one of them hollow-out parts 14 position simultaneously; So each connecting portion 13 can be not overlapping with second plate body 22.
Like step 93 ' shown in; Each connecting portion 13 between first plate body 12 and first framework 11 is carried out the operation of milling by milling machine; With each connecting portion 13 of severing, first plate body 12 is separated with first framework 11 as illustrated in fig. 13, promptly accomplish the manufacturing of soft and hard printed circuit board module 110.
Like Figure 17 and shown in Figure 180, under the processing method of soft and hard printed circuit board module 110:
Like step 94 '; Soft and hard printed circuit board module 110 is sent in the automatic production line (figure does not show); Conveying by delivery track; Make each work station in the automatic production line can various different types of electronic building bricks 15,16 be arranged on the surface 121 of first plate body 12 of service area 4, or be arranged on the extension 222 of second plate body 21.
Like step 95 ', with each bonding pad 23 severing, service area 4 is separated by punch press as illustrated in fig. 19 with nonclient area 3, at this moment, the assembly operation in the electronic product can be proceeded to be assembled in service area 4.
Conclude above-mentionedly, the soft and hard printed circuit board module 100,110 of two embodiment is connected with nonclient area 3 through a plurality of soft bonding pads 23 by service area 4; Make when soft and hard printed circuit board module 100,110 is carried out the severing operation of bonding pad 23 in the course of processing; The severing operation of bonding pad 23 can be carried out through single toolroom machine apace, by this, the separating rate of each service area 4 and nonclient area 3 can be effectively promoted; During with the manufacturing cost that reduces soft and hard printed circuit board module 100,110 and worker; Simultaneously, can simplify work flow and guarantee to cut the product quality of service area 4, back, so can reach the purpose of institute of the present invention demand really.
The above-described content of thought; Be merely preferred embodiment of the present invention; Can not limit the scope that the present invention implements with this, promptly every simple equivalent that claims scope and invention description are done according to the present invention changes and modifies, and all still belongs in the scope that patent of the present invention contains.
Claims (10)
1. soft and hard printed circuit board module comprises:
One nonclient area defines an accommodation space; And
One service area is located in the said accommodation space, and said service area connects said nonclient area through a plurality of bonding pads, and each said bonding pad is the soft soft zone of the more said nonclient area of hardness;
Wherein, Said soft and hard printed circuit board module comprises a hard circuit board spare, and a flexible circuit plate, and said hard circuit board spare comprises one first plate body; Said flexible circuit plate comprises one second plate body, and said first, second plate body piles up mutually and engages and define jointly said service area; Said hard circuit board spare comprises that also one is centered around around said first plate body and first framework of separating with said first plate body; Said flexible circuit plate comprises that also one is centered around said second plate body second framework on every side; Said first, second framework is piled up mutually and is engaged and define jointly said nonclient area, and said flexible circuit plate defines the said bonding pad that connects said second plate body and said second framework.
2. soft and hard printed circuit board module according to claim 1, wherein, the thickness and the material of said bonding pad are identical.
3. soft and hard printed circuit board module comprises:
One nonclient area defines two adjacent accommodation spaces; And
Two service areas, each said service area are located in each said accommodation space, and each said service area connects said nonclient area through a plurality of bonding pads, and each said bonding pad is the soft soft zone of the more said nonclient area of hardness;
Wherein, Said soft and hard printed circuit board module comprises a hard circuit board spare; An and flexible circuit plate; Said hard circuit board spare comprises one first framework, and said flexible circuit plate comprises one second framework, and said first, second framework is piled up mutually and engaged and define jointly said nonclient area; Said hard circuit board spare also comprises 2 first plate bodys; Said first framework is centered around around each said first plate body and with each said first plate body separates; Said flexible circuit plate also comprises 2 second plate bodys; Said second framework is centered around around each said second plate body, and each said first, second plate body piles up mutually and engages and define jointly each said service area, and said flexible circuit plate defines the said bonding pad that connects each said second plate body and said second framework.
4. soft and hard printed circuit board module according to claim 3, wherein, the thickness and the material of said bonding pad are identical.
5. the manufacturing approach of a soft and hard printed circuit board module is applicable to that said method comprises the steps: on a hard circuit board spare and the flexible circuit plate
(A) cut said hard circuit board spare and said flexible circuit plate; Make said hard circuit board spare be formed with first plate body that is connected with one first framework through a plurality of connecting portions; And make said flexible circuit plate be formed with second plate body that is connected with one second framework through a plurality of bonding pads; Wherein, said bonding pad is the soft soft zone of more said first framework of hardness;
(B) pile up said hard circuit board spare and said flexible circuit plate; Said first framework is spliced with said second framework mutually; Said first plate body splices with said second plate body mutually; Each said connecting portion is not overlapping with said second plate body, and at least a portion is not overlapping with each said connecting portion and said first plate body in the said bonding pad; And
(C) each said connecting portion of severing makes said first plate body separate with said first framework.
6. the manufacturing approach of soft and hard printed circuit board module according to claim 5; Wherein, In said step (A); Said hard circuit board spare is formed with the corresponding hollow-out parts in position, a plurality of and said bonding pad, and in said step (B), each said bonding pad is corresponding with each said hollow-out parts position and not overlapping with each said connecting portion and said first plate body.
7. the manufacturing approach of a soft and hard printed circuit board module is applicable to that said method comprises the steps: on a hard circuit board spare and the flexible circuit plate
(A) cut said hard circuit board spare and said flexible circuit plate; Make said hard circuit board spare be formed with at least two first plate bodys that are connected with one first framework through a plurality of connecting portions respectively; And make said flexible circuit plate be formed with at least two second plate bodys that are connected with one second framework through a plurality of bonding pads respectively; Wherein, said bonding pad is the soft soft zone of more said first framework of hardness;
(B) pile up said hard circuit board spare and said flexible circuit plate; Said first framework is spliced with said second framework mutually; Each said first plate body splices with each said second plate body mutually; Each said connecting portion is not overlapping with said second plate body, and at least a portion is not overlapping with each said connecting portion and said first plate body in the said bonding pad; And
(C) each said connecting portion between each said first plate body of severing and said first framework makes each said first plate body separate with said first framework.
8. the manufacturing approach of soft and hard printed circuit board module according to claim 7; Wherein, In said step (A); Said hard circuit board spare is formed with the corresponding hollow-out parts in position, a plurality of and said bonding pad, and in said step (B), each said bonding pad is corresponding with each said hollow-out parts position and not overlapping with each said connecting portion and said first plate body.
9. the processing method of a soft and hard printed circuit board module; Said soft and hard printed circuit board comprises a nonclient area; And the service area that is connected with said nonclient area through a plurality of bonding pads; Each said bonding pad is the soft soft zone of the more said nonclient area of hardness, and said method comprises the steps:
(A) electronic building brick is set in said service area; And
(B) the said bonding pad between said service area of severing and the said nonclient area makes said service area separate with said nonclient area;
Wherein, Said soft and hard printed circuit board module comprises a hard circuit board spare, and a flexible circuit plate, and said hard circuit board spare comprises one first plate body; Said flexible circuit plate comprises one second plate body, and said first, second plate body piles up mutually and engages and define jointly said service area; Said hard circuit board spare comprises that also one is centered around around said first plate body and first framework of separating with said first plate body; Said flexible circuit plate comprises that also one is centered around said second plate body second framework on every side; Said first, second framework is piled up mutually and is engaged and define jointly said nonclient area, and said flexible circuit plate defines the said bonding pad that connects said second plate body and said second framework.
10. the processing method of a soft and hard printed circuit board module; Said soft and hard printed circuit board module comprises a nonclient area; And two service area; Each said service area connects said nonclient area through a plurality of bonding pads, and each said bonding pad is the soft soft zone of the more said nonclient area of hardness, and said method comprises the steps:
(A) electronic building brick is set in each said service area; And
(B) the said bonding pad between each said service area of severing and the said nonclient area makes each said service area separate with said luxuriant and rich with fragrance service area;
Wherein, Said soft and hard printed circuit board module comprises a hard circuit board spare; An and flexible circuit plate; Said hard circuit board spare comprises one first framework, and said flexible circuit plate comprises one second framework, and said first, second framework is piled up mutually and engaged and define jointly said nonclient area; Said hard circuit board spare also comprises 2 first plate bodys; Said first framework is centered around around each said first plate body and with each said first plate body separates; Said flexible circuit plate also comprises 2 second plate bodys; Said second framework is centered around around each said second plate body, and each said first, second plate body piles up mutually and engages and define jointly each said service area, and said flexible circuit plate defines the said bonding pad that connects each said second plate body and said second framework.
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| CN2009101196827A CN101848598B (en) | 2009-03-26 | 2009-03-26 | Soft and hard printing circuit board module and manufacturing method and processing method thereof |
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| CN2009101196827A CN101848598B (en) | 2009-03-26 | 2009-03-26 | Soft and hard printing circuit board module and manufacturing method and processing method thereof |
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| CN101848598B true CN101848598B (en) | 2012-01-04 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1838862A (en) * | 2005-03-25 | 2006-09-27 | 华通电脑股份有限公司 | Soft-hard composite circuit board manufacturing method |
| CN101175379A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Production method for soft and hard combined printing circuit board |
| CN101304631A (en) * | 2007-05-10 | 2008-11-12 | 比亚迪股份有限公司 | Soft and hard composite circuit board and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1838862A (en) * | 2005-03-25 | 2006-09-27 | 华通电脑股份有限公司 | Soft-hard composite circuit board manufacturing method |
| CN101175379A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Production method for soft and hard combined printing circuit board |
| CN101304631A (en) * | 2007-05-10 | 2008-11-12 | 比亚迪股份有限公司 | Soft and hard composite circuit board and manufacturing method thereof |
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| CN101848598A (en) | 2010-09-29 |
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