CN101844867A - Glass powder applied to ceramic substrate and metal bonding layer and preparation method thereof - Google Patents
Glass powder applied to ceramic substrate and metal bonding layer and preparation method thereof Download PDFInfo
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- CN101844867A CN101844867A CN 201010180159 CN201010180159A CN101844867A CN 101844867 A CN101844867 A CN 101844867A CN 201010180159 CN201010180159 CN 201010180159 CN 201010180159 A CN201010180159 A CN 201010180159A CN 101844867 A CN101844867 A CN 101844867A
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- glass
- glass powder
- ceramic substrate
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Abstract
The invention relates to glass powder applied to a ceramic substrate and a metal bonding layer and a preparation method thereof. The glass powder consists of B2O3, SiO2, Al2O3 and PbO. The preparation method for the glass powder comprises the following steps of: (1) mixing the glass raw materials B2O3, SiO2, Al2O3 and PbO by weight uniformly; (2) putting the uniformly mixed glass raw materials into a glass melting furnace to perform melting and preserve heat; (3) pouring the melted glass into deionized water to perform water quenching, then taking out the water quenched glass, and ball-milling and crushing the glass by using a ball mill; and (4) sieving the ball-milled glass powder, and drying the sieved glass powder in an oven or under an infrared lamp to obtain the required glass powder. The invention provides the glass powder with proper softening point, good sintering performance and strong bonding capability and the preparation method thereof.
Description
Technical field
The present invention relates to a kind of glass powder and preparation method thereof, relate in particular to a kind of glass powder that is used for the ceramic substrate composite bed and preparation method thereof.
Background technology
Ceramic substrate is difficult to directly combine with the metal fin of surface for Cu, but can realize combination by a middle close binder.Moreover this middle close binder is called transition layer.By sintering, this transition layer both can closely be connected with metal substrate, also can combine with ceramic substrate is close.Because glass has bonding characteristic, and can change its character, so transition layer can select glass powder as the function phase for use by adjusting chemical constitution.But when common glass powder was applied between ceramic substrate and the metal substrate as the transition layer function mutually, itself and ceramic substrate and metal substrate bonding force were very little, poor effect, a lot of glass even do not have keying action.Mainly show: 1, glass softening point can not satisfy the use needs of ceramic substrate metal substrate key coat.2, sintering character is poor, and the surface current levelling is poor during sintering under 800～900 ℃ of nitrogen atmospheres, and there is bubble inside.3, poor bonding strength is difficult to reach between ceramic substrate and the metal substrate needs than high bond strength.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, glass powder that a kind of softening temperature is fit to, sintering character is good, the adhesive bond ability is strong and preparation method thereof is provided.
The present invention is achieved by the following technical solutions:
Be applied to the glass powder of ceramic substrate and metal bonding layer, by B
2O
3, SiO
2, Al
2O
3, PbO forms; The weight percent of each component is: B
2O
35～30%, SiO
210～50%, Al
2O
32～30%, PbO 10～50%.
Be applied to the glass powder of ceramic substrate and metal bonding layer, described glass powder body is the borosilicate glass powder.
Be applied to the preparation method of ceramic substrate and metal bonding layer glass powder, may further comprise the steps:
(1) with frit B
2O
3, SiO
2, Al
2O
3, PbO mixes according to quantity;
(2) frit of mixing is put into glass furnace and melt, temperature of fusion is 1100 ℃～1400 ℃, and soaking time is 20～60min;
(3) pour fused glass in deionized water shrend, take out shrend glass then and utilize the ball mill ball mill pulverizing, the ball milling time is 12～24h;
(4) glass powder behind the ball milling is sieved, remove the glass powder of not pulverized glass or larger particles, the glass powder after sieving is put into baking oven or infrared lamp oven dry down, promptly obtains required glass powder after the oven dry.
In frit, different oxide compounds has different effects.B
2O
3Can reduce the thermal expansivity of glass, improve physical strength and toughness, increase chemical stability, and make glass be easy to fusing.SiO
2Can reduce the thermal expansivity of glass, the thermostability of raising glass, chemical stability, softening temperature, thermotolerance, hardness, physical strength, viscosity etc.For glassy phase and metal substrate are more mated, both thermal expansivity should be approaching, by adjusting SiO
2Content can change the thermal expansivity of transition layer.Al
2O
3Can reduce the crystallization tendency of glass, prevent phase-splitting, improve chemical stability, thermostability, physical strength etc.Add a certain amount of PbO and can reduce the glass smelting temperature, make glass have good flowability, and make glass be easy to grind.
Beneficial effect of the present invention have following some:
1, glass softening point is fit to.Its glass softening point of glass powder that utilizes the present invention to make satisfies the use needs of ceramic substrate-metal substrate key coat easily.And the softening temperature of general glass is difficult to satisfy these needs.
2, sintering character is good.This glass is sintering time surface good leveling property under 800-900 ℃ of nitrogen atmosphere, and inner no bubble has good wetting property with ceramic substrate and metal substrate.And general glass is difficult to reach this state at this sintering temperature.
3, bonding strength height.When the glass powder that the present invention is made is used for transition layer between ceramic substrate and the metal substrate, has very high bonding strength between ceramic substrate and the metal substrate.General glass powder then is difficult to reach this intensity.
Embodiment
Embodiment 1
The glass powder that is applied to ceramic substrate and metal bonding layer is by B
2O
3, SiO
2, Al
2O
3, PbO forms; The weight percent of each component is: B
2O
315%, SiO
230%, Al
2O
315%, PbO 40%.The preparation method of glass powder may further comprise the steps:
(1) with frit B
2O
3, SiO
2, Al
2O
3, PbO mixes by above proportioning weighing;
(2) frit of mixing is put into glass furnace and melt, temperature of fusion is 1200 ℃, and soaking time is 30min;
(3) pour fused glass in deionized water shrend, take out shrend glass then and utilize the ball mill ball mill pulverizing, the ball milling time is 12h;
(4) glass powder behind the ball milling is sieved, remove the glass powder of not pulverized glass or larger particles, the glass powder after sieving is put into baking oven or infrared lamp oven dry down, promptly obtains required glass powder after the oven dry.
Its glass softening point of glass powder that utilizes the present invention to make satisfies the use needs of ceramic substrate-metal substrate key coat easily.Glass is sintering time surface good leveling property under 800-900 ℃ of nitrogen atmosphere, and inner no bubble has good wetting property with ceramic substrate and metal substrate.When glass powder is used for transition layer between ceramic substrate and the metal substrate, has very high bonding strength between ceramic substrate and the metal substrate.
Embodiment 2
The glass powder that is applied to ceramic substrate and metal bonding layer is by B
2O
3, SiO
2, Al
2O
3, PbO forms; The weight percent of each component is: B
2O
35%, SiO
210%, Al
2O
350%, PbO 35%.The preparation method of glass powder may further comprise the steps:
(1) with frit B
2O
3, SiO
2, Al
2O
3, PbO mixes by above proportioning weighing;
(2) frit of mixing is put into glass furnace and melt, temperature of fusion is 1100 ℃, and soaking time is 20min;
(3) pour fused glass in deionized water shrend, take out shrend glass then and utilize the ball mill ball mill pulverizing, the ball milling time is 12h;
(4) glass powder behind the ball milling is sieved, remove the glass powder of not pulverized glass or larger particles, the glass powder after sieving is put into baking oven or infrared lamp oven dry down, promptly obtains required glass powder after the oven dry.
Embodiment 3
The glass powder that is applied to ceramic substrate and metal bonding layer is by B
2O
3, SiO
2, Al
2O
3, PbO forms; The weight percent of each component is: B
2O
320%, SiO
220%, Al
2O
310%, PbO 50%.The preparation method of glass powder may further comprise the steps:
(1) with frit B
2O
3, SiO
2, Al
2O
3, PbO mixes by above proportioning weighing;
(2) frit of mixing is put into glass furnace and melt, temperature of fusion is 1400 ℃, and soaking time is 60min;
(3) pour fused glass in deionized water shrend, take out shrend glass then and utilize the ball mill ball mill pulverizing, the ball milling time is 24h;
(4) glass powder behind the ball milling is sieved, remove the glass powder of not pulverized glass or larger particles, the glass powder after sieving is put into baking oven or infrared lamp oven dry down, promptly obtains required glass powder after the oven dry.
Claims (3)
1. be applied to the glass powder of ceramic substrate and metal bonding layer, it is characterized in that by B
2O
3, SiO
2, Al
2O
3, PbO forms; The weight percent of each component is: B
2O
35～30%, SiO
210～50%, Al
2O
32～30%, PbO 10～50%.
2. the glass powder that is applied to ceramic substrate and metal bonding layer according to claim 1 is characterized in that described glass powder is the borosilicate glass powder.
3. be applied to the preparation method of ceramic substrate and metal bonding layer glass powder, it is characterized in that may further comprise the steps:
(1) with frit B
2O
3, SiO
2, Al
2O
3, PbO mixes according to quantity;
(2) frit of mixing is put into glass furnace and melt, temperature of fusion is 1100 ℃～1400 ℃, and soaking time is 20～60min;
(3) pour fused glass in deionized water shrend, take out shrend glass then and utilize the ball mill ball mill pulverizing, the ball milling time is 12～24h;
(4) glass powder behind the ball milling is sieved, remove the glass powder of not pulverized glass or larger particles, the glass powder after sieving is put into baking oven or infrared lamp oven dry down, promptly obtains required glass powder after the oven dry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010180159 CN101844867A (en) | 2010-05-19 | 2010-05-19 | Glass powder applied to ceramic substrate and metal bonding layer and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010180159 CN101844867A (en) | 2010-05-19 | 2010-05-19 | Glass powder applied to ceramic substrate and metal bonding layer and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101844867A true CN101844867A (en) | 2010-09-29 |
Family
ID=42769703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010180159 Pending CN101844867A (en) | 2010-05-19 | 2010-05-19 | Glass powder applied to ceramic substrate and metal bonding layer and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101844867A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101859751A (en) * | 2010-05-20 | 2010-10-13 | 中国电子科技集团公司第四十三研究所 | Ceramic composite substrate |
| CN108863089A (en) * | 2018-06-19 | 2018-11-23 | 张其峰 | A kind of semiconductor passivation encapsulation glass powder and preparation method thereof |
| CN109674094A (en) * | 2019-01-26 | 2019-04-26 | 深圳市合元科技有限公司 | Electronic smoke atomizer and electronic cigarette, atomizing component preparation method |
| CN111958819A (en) * | 2020-07-24 | 2020-11-20 | 汕头大学 | Novel purple sand inner container and preparation process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3973976A (en) * | 1974-06-03 | 1976-08-10 | Corning Glass Works | High index ophthalmic glasses |
| JP2001048580A (en) * | 1999-08-13 | 2001-02-20 | Nippon Electric Glass Co Ltd | Frit for crt |
| US6432853B1 (en) * | 2000-06-01 | 2002-08-13 | Corning Incorporated | Medium expansion leaded copper boroaluminosilicate glasses |
| CN1459428A (en) * | 2002-05-21 | 2003-12-03 | 北京博迩工贸公司 | Lead borate substrate glass and sealing glass powder containing said substrate glass |
| CN101585660A (en) * | 2009-06-23 | 2009-11-25 | 珠海彩珠实业有限公司 | Lead-silicon-aluminum glass powder for passivation encapsulation of semiconductor and preparation thereof |
-
2010
- 2010-05-19 CN CN 201010180159 patent/CN101844867A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3973976A (en) * | 1974-06-03 | 1976-08-10 | Corning Glass Works | High index ophthalmic glasses |
| JP2001048580A (en) * | 1999-08-13 | 2001-02-20 | Nippon Electric Glass Co Ltd | Frit for crt |
| US6432853B1 (en) * | 2000-06-01 | 2002-08-13 | Corning Incorporated | Medium expansion leaded copper boroaluminosilicate glasses |
| CN1459428A (en) * | 2002-05-21 | 2003-12-03 | 北京博迩工贸公司 | Lead borate substrate glass and sealing glass powder containing said substrate glass |
| CN101585660A (en) * | 2009-06-23 | 2009-11-25 | 珠海彩珠实业有限公司 | Lead-silicon-aluminum glass powder for passivation encapsulation of semiconductor and preparation thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101859751A (en) * | 2010-05-20 | 2010-10-13 | 中国电子科技集团公司第四十三研究所 | Ceramic composite substrate |
| CN108863089A (en) * | 2018-06-19 | 2018-11-23 | 张其峰 | A kind of semiconductor passivation encapsulation glass powder and preparation method thereof |
| CN109674094A (en) * | 2019-01-26 | 2019-04-26 | 深圳市合元科技有限公司 | Electronic smoke atomizer and electronic cigarette, atomizing component preparation method |
| CN111958819A (en) * | 2020-07-24 | 2020-11-20 | 汕头大学 | Novel purple sand inner container and preparation process thereof |
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Open date: 20100929 |