CN101841971B - Auxiliary materials for lamination of flexibility circuit board and lamination process of same - Google Patents
Auxiliary materials for lamination of flexibility circuit board and lamination process of same Download PDFInfo
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- CN101841971B CN101841971B CN2010101407746A CN201010140774A CN101841971B CN 101841971 B CN101841971 B CN 101841971B CN 2010101407746 A CN2010101407746 A CN 2010101407746A CN 201010140774 A CN201010140774 A CN 201010140774A CN 101841971 B CN101841971 B CN 101841971B
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Abstract
The invention relates to an auxiliary material for lamination of a flexibility circuit board and lamination process of the same. The auxiliary material (4) for lamination of the flexibility circuit board comprises the following layers: heat-resistant release film (1), a filling and coating material (2) and a deformation control material (3), wherein the heat-resistant release film (1) is fluorinated ethylene propylene or polytetrafluoroethylene film; the filling and coating material (2) comprises the following components: crylic acid alkyl ester polymer, polysiloxane and polyethylene; the deformation control material (3) comprises PET, PBT or PA film; and at least two adjacent layers of the heat-resistant release film (1), the filling and coating material (2), the deformation control material (3) are composited into a whole or three layers are composited into a whole. The invention solves the problem that foreign body plug the hole; and the special filling and coating material can not escape in cross flow in the process of the lamination. The invention also provides a lamination process with excellent glue resistance capability.
Description
Technical field
The present invention relates to a kind of flexible electric circuit board, particularly a kind of lamination of flexible electric circuit board is with auxiliary material and use the laminating technology of the flexible electric circuit board of this kind lamination auxiliary material.
Background technology
The laminating technology of the single face flexible electric circuit board that generally adopts in the prior art is: isolate steel plate, deformation control material for example brown paper, filling coated material for example polyethylene film, high temperature resistant mould release film, circuit board diaphragm, the board substrate that has the conducting wire, high temperature resistant mould release film, isolate steel plate are tiled into a laminated units; In each opening of laminating machine, can stack one or more laminated units; Under the parameter condition of certain vacuum degree, temperature, pressure and time; Use laminating machine to carry out pressing; Make that diaphragm is closely coated to have on the flexible circuit base board of conductor line; And, make to be integrally formed diaphragm and circuit and base plate bonding by means of the semi-curing glue of diaphragm reverse side.Lamination is peeled off isolate steel plate, deformation control material, filling coated material and high temperature resistant mould release film after accomplishing from circuit board, form the flexible electric circuit board that has diaphragm.
The laminating technology two-sided or the multi-layer flexible circuit board that generally adopts in the prior art is: isolate steel plate; The deformation control material is brown paper for example; Filling coated material is polyethylene film for example; High temperature resistant mould release film; The flexible electric circuit board diaphragm; Have board substrate two-sided or the multilayer conductive circuit; The flexible electric circuit board diaphragm; High temperature resistant mould release film; Filling coated material is polyethylene film for example; The deformation control material is brown paper for example; It is a laminated units that isolate steel plate in layer tiles.In each opening of laminating machine, can stack one or more laminated units, the laminating technology of other operations and technological parameter and single face flexible electric circuit board is similar, and after lamination was accomplished, formation had the two-sided of diaphragm or multi-layer flexible circuit board.
In above-mentioned laminating technology, flow easily when lamination is heated as the polyethylene film of filling coated material, can flow to the outside of whole laminating area in the horizontal direction, pollute, influence the quality of wiring board.And filling coated material directly contacts with the deformation control material, can in the deformation control material, permeate when being heated, and flowing and infiltration of escape character just taken place on thickness direction, causes utilization efficiency of material not high.Because the cause of lamination auxiliary material, semi-curing glue is also bad at the gummosis rejection at bonding pad opening place under the diaphragm, generally more than 3.5mil.
The patent No. is that the patent of invention of CN200410041690.1 discloses a kind of laminating technology; This technology is earlier to be one with high temperature resistant mould release film, filling coated material, deformation control material and high temperature resistant mould release film are compound; Process lamination and use auxiliary material, and then utilize this lamination to carry out lamination with auxiliary material.Can reduce the flowability of film layer to a certain extent through said method, avoid entrained dirt and reduce the operation element amount that stacks of lamination greatly.But in the deformation control material, permeate after still can't avoiding polyethylene to be heated.
The essence of patent 200710190328.4 is with the PE in the lamination (polyethylene, down with) film, and is additive agent modified with calcium carbonate etc.; Reducing PE laterally escapes under HTHP; Modifier such as while calcium carbonate are sealed the pore on the brown paper, thereby stop PE vertically infiltration escape in brown paper under HTHP, thereby can reduce the thickness of PE film; Reduce production costs, and improve the production capacity of laminating apparatus.Permeated but still have part brown paper in the use, and use the brown paper thickness can not can be very thin, objectively limited the further raising of circuit board lamination equipment capacity.
The essence of patent 200710134689.7 is that the high-temperature resistant membrane with patent 200410041690.1 replaces with FEP, and the foreign matter of eliminating on the circuit board plate face is residual, improves FPC pad gummosis rejection.But emerging have the FPC laminate surface of micropore before, keep away also that a small amount of foreign matter can be embedded in this new problem of aperture the inside of circuit board under the unavoidable general laminating technology, thereby influence the performance and the rate of finished products of circuit board.Shown in figure (six), figure (seven).
Summary of the invention
One of the object of the invention provides a kind of circuit board lamination auxiliary material, can avoid lamination auxiliary material behind the lamination or other foreign matter chip to be embedded in the defective of the aperture the inside of circuit board, and the deformation control material is done improvement, improves the lamination efficient of circuit board.
Two of the object of the invention provides a kind of circuit board lamination auxiliary material; Better prevent PE vertically infiltration escape in brown paper under HTHP than patent 200710190328.4; Reduce PE lateral flow under HTHP simultaneously and escape, further make the gross thickness of lamination auxiliary material significantly reduce a raising equipment capacity.
Three of the object of the invention provides a kind of laminating technology of flexible electric circuit board, has used the circuit board lamination auxiliary material in the technical scheme one in this technology.
Technical scheme
A kind of lamination of flexible electric circuit board is used auxiliary material; Described lamination comprises following each layer that tiling successively stacks at least with auxiliary material: high temperature resistant mould release film, filling coated material, deformation control material is characterized in that described high temperature resistant mould release film is perfluoroethylene-propylene or polytetrafluoroethylene film; Described filling coated material component is that acrylic acid alkyl ester polymer, polysiloxane and polyethylene are formed by above-mentioned two kinds of manufacturings at least; Described deformation control material is a PET (PETG; PBT (polybutylene terephthalate (PBT) down together); Together following) or PA (nylon, down together) film; Described high temperature resistant mould release film, filling coated material, deformation control material, having at least adjacent two layers compound is one;
As the described high temperature resistant mould release film of a kind of optimal way, filling coated material, deformation control material, three layers compound is one.
As the described alkyl acrylate of a kind of optimal way is CH=CHCOOR, and wherein R is C1～C18 alkyl.
As the described alkyl acrylate of further optimal way is ethyl acrylate, n-butyl acrylate, Isooctyl acrylate monomer or octadecyl acrylate.
As the described polysiloxane of a kind of optimal way is MQ resin and hydroxy-end capped silicon rubber.
Described MQ resin can be vinyl, methyl or phenyl MQ resin, and the numerical value of M/Q is between 0.6～0.9
Described MQ resin, the structural formula of hydroxy-end capped silicon rubber does
As the described filling coated material of a kind of optimal way; Difference according to the processing technology that is adopted; The percentage by weight of acrylic acid alkyl ester polymer and polysiloxane can change between 0 to 90%, and poly weight percentages of components can change between 0～50%.
Thickness as the described filling coated material of a kind of optimal way is 0.01mm～0.16mm.
Thickness as the described filling coated material of a kind of optimal way is 0.04mm.
Thickness as the described high temperature resistant mould release film of a kind of optimal way is 0.005mm～0.024mm.
Thickness as the described high temperature resistant mould release film of further optimal way is 0.01mm.
Thickness as the described deformation control material of a kind of optimal way is 0.012mm～0.05mm.
Thickness as the described deformation control material of a kind of optimal way is 0.12mm
A kind of laminating technology that has used described lamination with the single face flexible electric circuit board of auxiliary material; It is characterized in that: use auxiliary material, circuit board diaphragm, single face flexible circuit base board, high-temperature resistant membrane, isolate steel plate to be the unit with isolate steel plate, lamination successively, tiling stacks one or more unit and carries out pressing in the opening of press; Described lamination comprises following each layer that tiling successively stacks at least with auxiliary material: high temperature resistant mould release film, filling coated material, deformation control material; Described circuit board diaphragm is through coated closely on said single face flexible electric circuit board after the described pressing step; Before described tiling stacks step, described high temperature resistant mould release film, filling coated material, deformation control material, having at least adjacent two layers compound is one; Perhaps before described tiling stacks step, described high temperature resistant mould release film, filling coated material, deformation control material, three layers are compound is one.
A kind of laminating technology that has used described lamination with the two-sided of auxiliary material or multi-layer flexible circuit board; It is characterized in that: use auxiliary material, circuit board diaphragm, two-sided or multi-layer flexible circuit board substrate, circuit board diaphragm, lamination to use auxiliary material, isolate steel plate to be the unit with isolate steel plate, lamination successively, in laminating machine, tiling stacks one or more unit and carries out pressing; Described lamination comprises following each layer that tiling successively stacks at least with auxiliary material: high temperature resistant mould release film, filling coated material, deformation control material; Described circuit board diaphragm is through coated closely on said bilayer or multi-layer flexible circuit board substrate after the described pressing step; Perhaps before described tiling stacks step, described high temperature resistant mould release film, filling coated material, deformation control material have that adjacent two layers is compound to be one at least.Perhaps described high temperature resistant mould release film, filling coated material, deformation control material, three layers compound is one.
Process conditions as the described pressing step of a kind of optimal way are: temperature: in 150～220 ℃ of scopes, vacuum degree is that 68～72cmHg scope is interior, lamination pressure is 10～25kg/cm
2In the scope, the lamination time is in 3 seconds to 180 minutes scopes.
Described high temperature resistant mould release film, filling coated material, deformation control material; Have at least adjacent two layers compound for the lamination auxiliary material of one; Can the components such as acrylic acid alkyl ester polymer of filling coated material be processed emulsion; Be coated on high temperature resistant mould release film or the deformation control material and drying through coating process, obtain having the double-layer lamination auxiliary material of filling coated layer; Also can be with the prior mixing tackifying resin that becomes of acrylic acid alkyl ester polymer, polysiloxane and PE particle; Adopt the processing technology of heat seeling coating or curtain coating again; On high temperature resistant mould release film or deformation control material, directly be coated with or curtain coating layer of filled coating, obtain having the double-layer lamination auxiliary material of filling coated layer
Described high temperature resistant mould release film, filling coated material, deformation control material; Three layers compound is the lamination auxiliary material of one; Be on the double-layer lamination auxiliary material; With hot pressing or the cold processing technology of mounting, high temperature resistant mould release film or deformation control material that compound again one deck is corresponding, obtaining structure is the lamination auxiliary material of high temperature resistant mould release film/filling coated material/three layers of one of deformation control material
Beneficial effect
1, deformation control material brown paper is replaced by PET, PBT or PA film.Although brown paper can lateral magnification in the process of exerting pressure, have the infiltration of PE.Adopt PET, PBT or PA film, the longtitudinal dispersion of coated material enough and not can take place in its temperature tolerance; PET, PBT or PA film can descend than brown paper thickness greatly, and be thinner 1/2～2/3 than brown paper, can circuit board lamination equipment do not carried out improving greatly under any technical modification equipment capacity like this.
2, to the lamination of the FPC that has pore openings that occurs in the near future, use general lamination auxiliary material and laminating technology thereof at present, through behind the lamination of HTHP; Laminated material or other foreign matter chip can embed the aperture the inside, and in the time will assisting laminated material and circuit board FPC branch to open, foreign matter and chip tend to remain on the hole wall; Like Fig. 6 and Fig. 7, and the inventor finds through a large amount of tests, if adopted through still sticking filling coated material behind the lamination; If in lamination process; Laminated material is embedded in the aperture, and the high-temperature resistant membrane on top layer is very thin, is stretched by several times in aperture embedding place again; Often have small breaking; Sticking coated material exposes and contact with hole wall, and the lamination end is when opening lamination auxiliary material and circuit board FPC branch, and these have the very big coated material of the cohesive force of viscosity and can cling and pull out together the retained foreign body in the hole is residual.That is to say that the coated material with viscosity has cleaning action to retained foreign body in the hole.Filling coated material among the present invention for carbon number be that 4～21 alkyl acrylate, polysiloxane and polyethylene constitute; This filling coated material is at normal temperature; Special still have certain viscosity behind high temperature and high temperature, thereby guarantee that lamination finishes in the time will assisting laminated material and circuit board FPC branch to open, interior foreign matter in the aperture to be taken out of in the lump; So can solve foreign matter residue problem in the hole; The composition that this glue-line is special guarantees that simultaneously glue has viscoplasticity and has lateral flow escape problem hardly under high temperature and high pressure environment.Specifically see Fig. 6 and Fig. 7.The initial bonding strength of filling clad material is 7～No. 10 steel balls be advisable (initial bonding strength adopts the inclined-plane rolling ball method to measure).
3, high temperature resistant mould release film of the present invention adopts polytetrafluoroethyl-ne propylene (FEP) or polytetrafluoroethylene (PTFE) film, and this plastic film has chemical inertness, and temperature tolerance is good, in technology of the present invention, can not be higher than steady operation under 220 ℃ of conditions.
4, deformation control material of the present invention is selected PBT for use, PET or PA film, and perhaps stretched PET or PA film, thickness can be between 12 microns to 50 microns.
Description of drawings
Accompanying drawing 1 is the structural representation of lamination among the present invention with auxiliary material;
Accompanying drawing 2 is a single face flexible electric circuit board laminating technology sketch map;
Accompanying drawing 3 is a single face flexible circuit board finished product sketch map
Accompanying drawing 4 is double-deck or multi-layer flexible board layer compression technology sketch map.
Accompanying drawing 5 is two-sided or multi-layer flexible circuit board finished product sketch map
Foreign matter produces sketch map in the accompanying drawing 6FPC lamination hole
The residual sketch map of foreign matter in the accompanying drawing 7FPC lamination hole
Wherein: 1, high temperature resistant mould release film; 2, filling coated material; 3, deformation control material; 4, lamination is used auxiliary material; 5, isolate steel plate; 6, circuit board diaphragm; 7, single face flexible circuit base board; 8, high-temperature resistant membrane; 9, two-sided or multi-layer flexible circuit board substrate; 10, aperture; 11, residue
Embodiment
Embodiment 1: lamination is used auxiliary material A
Lamination comprises following each layer that tiling successively stacks with the physical structure of auxiliary material A: high temperature resistant mould release film 1, filling coated material 2, deformation control material 3, trilaminate material is compound successively to be one.
It is that to select thickness for use be the biaxial tension PET film of 12 μ m for the FEP film deformation control material 3 of 10 μ m that high temperature resistant mould release film 1 is selected thickness for use
(percentage by weight is that 30% viscosity is the Isooctyl acrylate monomer of 2000cPa.s with tackifying resin to adopt the curtain coating processing technology; Percentage by weight is the vinyl MQ resin of 10% M/Q=0.75, and percentage by weight is that 10% viscosity is the hydroxy-end capped vinylsiloxane rubber of 20000cPa.s; Percentage by weight is 50% low density PE plastic pellet [LL0220KJ of trade mark Shanghai match section]; With the said components high speed mixing tackifying resin) in curtain coating under 200 ℃ of temperature behind the filling coated material 2 that forms 40 μ m on the PET film of 12 μ m with viscosity, directly compound that lamination is used auxiliary material A again with the FEP film hot-pressings of 10 μ m.
Embodiment 2: lamination is used auxiliary material B
Lamination is identical with auxiliary material A with lamination with the physical structure of auxiliary material B.It is the PTFE film of 25 μ m that high temperature resistant mould release film 1 is selected thickness for use; It is the biaxial tension PA film of 15 μ m that deformation control material 3 is selected thickness for use
Adopting the coating processing technology is that copolymer and the percentage by weight of Isooctyl acrylate monomer/ethyl acrylate of 30% is the aqueous liquid dispersion (all the other are water) of the vinyl MQ resin of 20% M/Q=0.75 with percentage by weight; Be coated on the deformation control material 3 and drying under 110 degrees centigrade; Copolymer and the percentage by weight that obtains containing percentage by weight after the drying and be Isooctyl acrylate monomer/ethyl acrylate of 60% is the filling coated material with viscosity 2 of the vinyl MQ resin of 40% M/Q=0.75; The 30 μ m that thickness is, more directly with high temperature resistant mould release film 1 cold mount compound that lamination used auxiliary material B.
Embodiment 3: lamination is used auxiliary material C
Lamination is identical with auxiliary material A with lamination with the physical structure of auxiliary material C.It is the FEP film of 12 μ m that high temperature resistant mould release film 1 is selected thickness for use; It is the biaxial tension PA film of 15 μ m that deformation control material 3 is selected thickness for use
(percentage by weight is that 40% viscosity is the Isooctyl acrylate monomer of 25000cPa.s with tackifying resin to adopt the heat seeling coating processing technology; Percentage by weight is the vinyl MQ resin of 30% M/Q=0.80; Percentage by weight is that 30% viscosity is the hydroxy-end capped vinylsiloxane rubber of 20000cPa.s mixing the tackifying resin of heating) 210 ℃ of following heat seeling coatings on the deformation control material 3 behind the filling coated material 2 of 30 μ m thickness, directly compound that lamination is used auxiliary material C again with high temperature resistant mould release film 1 hot pressing.
Embodiment 4: lamination is used auxiliary material D
Lamination is identical with auxiliary material A with lamination with the physical structure of auxiliary material D.It is the FEP film of 12 μ m that high temperature resistant mould release film 1 is selected thickness for use; It is the biaxial tension PA film of 15 μ m that deformation control material 3 is selected thickness for use
(percentage by weight is 50% with tackifying resin to adopt the heat seeling coating processing technology; The vinyl MQ resin of M/Q=0.80; Percentage by weight is that 40% viscosity is the hydroxy-end capped vinylsiloxane rubber of 20000cPa.s; Percentage by weight is 10% low density PE plastic pellet [the Shanghai match LL0220KJ of section] mixing the tackifying resin of heating); After getting the filling coated material 2 of 30 μ m thickness on the deformation control material 3, directly use auxiliary material D at 200 ℃ of following heat seeling coatings again with the high temperature resistant mould release film 1 compound lamination that gets.
Embodiment 5: lamination is used auxiliary material E
Lamination is identical with auxiliary material A with lamination with the physical structure of auxiliary material E.It is the FEP film of 12 μ m that high temperature resistant mould release film 1 is selected thickness for use; It is the biaxial tension PA film of 15 μ m that deformation control material 3 is selected thickness for use
(percentage by weight is that 50% viscosity is the Isooctyl acrylate monomer of 25000cPa.s with tackifying resin to adopt the heat seeling coating processing technology; Percentage by weight is 50% low density PE plastic pellet [the Shanghai match LL0220KJ of section] mixing the tackifying resin of heating); After getting the filling coated material 2 of 30 μ m thickness on the deformation control material 3, directly use auxiliary material E at 195 ℃ of following heat seeling coatings again with the high temperature resistant mould release film 1 compound lamination that gets.
Embodiment 6
Select vacuum laminator for use; Tiling isolate steel plate, lamination are a unit with auxiliary material, circuit board diaphragm (semi-curing glue of 1mil), single face flexible circuit base board, 5 TPX films, isolate steel plate; After in opening of laminating machine, stacking 20 unit, at 180 ℃, pressure 20kg/cm
2, vacuum degree 75mmhg, the lamination time is under 150 minutes conditions, to select for use the lamination of gained among the embodiment 1～5 to carry out lamination process with auxiliary material A～E respectively, the result is following:
| The lamination auxiliary material | Whole plate breathing amount behind the lamination | The diaphragm adhesion | Bubble under the diaphragm | Pad oozes golden stannize | Pad gummosis (Mil) | Superficial Foreign Body | The diaphragm fold |
| A | Qualified | Qualified | Do not have | Do not have | 2.1 | Do not have | Do not have |
| B | Qualified | Qualified | Do not have | Do not have | 1.8 | Do not have | Do not have |
| C | Qualified | Qualified | Do not have | Do not have | 1.6 | Do not have | Do not have |
| D | Qualified | Qualified | Do not have | Do not have | 1.8 | Do not have | Do not have |
| E | Qualified | Qualified | Do not have | Do not have | 1.9 | Do not have | Do not have |
Embodiment 6
Select vacuum laminator for use, tiling isolate steel plate, lamination are a unit with auxiliary material, circuit board diaphragm (semi-curing glue of 1mil), double-sided belt aperture flexible circuit base board, lamination use auxiliary material, isolate steel plate, in opening of laminating machine, stack 20 unit after; At 180 ℃; Pressure 20kg/cm2, vacuum degree 75mmhg, the lamination time is under 150 minutes conditions; Select for use the lamination of gained among the embodiment 1～5 to carry out lamination process with auxiliary material A～E respectively, the result is following:
| The lamination auxiliary material | Whole plate breathing amount behind the lamination | The diaphragm adhesion | Bubble under the diaphragm | Pad oozes golden stannize | Pad gummosis (Mil) | Superficial Foreign Body | The diaphragm fold | The aperture foreign matter |
| A | Qualified | Qualified | Do not have | Do not have | 2.2 | Do not have | Do not have | Do not have |
| B | Qualified | Qualified | Do not have | Do not have | 1.9 | Do not have | Do not have | Do not have |
| C | Qualified | Qualified | Do not have | Do not have | 1.8 | Do not have | Do not have | Do not have |
| D | Qualified | Qualified | Do not have | Do not have | 1.7 | Do not have | Do not have | Do not have |
| E | Qualified | Qualified | Do not have | Do not have | 1.9 | Do not have | Do not have | Do not have |
Embodiment 7
Select vacuum laminator for use; It is a unit that tiling isolate steel plate, lamination use auxiliary material, isolate steel plate with auxiliary material, circuit board diaphragm (semi-curing glue of 1mil), sandwich tape aperture flexible circuit base board, lamination; After in opening of laminating machine, stacking 20 unit; At 180 ℃, pressure 20kg/cm
2, vacuum degree 75mmhg, the lamination time is under 150 minutes conditions, to select for use the lamination of gained among the embodiment 1～5 to carry out lamination process with auxiliary material A～E respectively, the result is following:
| The lamination auxiliary material | Whole plate breathing amount behind the lamination | The diaphragm adhesion | Bubble under the diaphragm | Pad oozes golden stannize | Pad gummosis (Mi1) | Superficial Foreign Body | The diaphragm fold | The aperture foreign matter |
| A | Qualified | Qualified | Do not have | Do not have | 1.6 | Do not have | Do not have | Do not have |
| B | Qualified | Qualified | Do not have | Do not have | 1.9 | Do not have | Do not have | Do not have |
| C | Qualified | Qualified | Do not have | Do not have | 2.0 | Do not have | Do not have | Do not have |
| D | Qualified | Qualified | Do not have | Do not have | 1.8 | Do not have | Do not have | Do not have |
| E | Qualified | Qualified | Do not have | Do not have | 1.9 | Do not have | Do not have | Do not have |
Embodiment 8
Select vacuum laminator for use, tiling isolate steel plate, 2 brown paper (grammes per square metre 180g/m
2), PE film (thickness 120 μ m), high-temperature resistant membrane, circuit board diaphragm (semi-curing glue of 1mil), sandwich tape aperture flexible circuit base board, high-temperature resistant membrane, PE film (thickness 120 μ m), 2 brown paper (grammes per square metre 180g/m
2), isolate steel plate is a unit, in opening of laminating machine, stack 20 unit after, at 180 ℃, pressure 20kg/cm
2, vacuum degree 75mmhg, the lamination time is that high-temperature resistant membrane is selected 5 TPX film X respectively for use under 150 minutes conditions, 5 PTFE film Y, 2.5 FEP film Z carries out lamination process, and the result is following:
| The lamination auxiliary material | Whole plate breathing amount behind the lamination | The diaphragm adhesion | Bubble under the diaphragm | Pad oozes golden stannize | Pad gummosis (Mil) | Superficial Foreign Body | The diaphragm fold | The aperture foreign matter |
| Film X | Qualified | Qualified | Do not have | Do not have | 3.7 | 1% has | Do not have | 7% has |
| Film Y | Qualified | Qualified | Do not have | Do not have | 3.6 | Do not have | Do not have | 5% has |
| Film Z | Qualified | Qualified | Do not have | Do not have | 2.9 | Do not have | Do not have | 5% has |
Embodiment 9
Select quick laminating machine for use, steel plate+silicon rubber is upper and lower opening, the tiling lamination with auxiliary material, circuit board diaphragm (semi-curing glue of 1mil), single face flexible circuit base board, 5 TPX films in opening, at 190 ℃, pressure 22kg/cm
2, the lamination time is under 3 seconds conditions, to select for use the lamination of gained among the embodiment 1～5 to carry out lamination process with auxiliary material A～E respectively, the result is following:
| The lamination auxiliary material | Whole plate breathing amount behind the lamination | The diaphragm adhesion | Bubble under the diaphragm | Pad oozes golden stannize | Pad gummosis (Mil) | Superficial Foreign Body | The diaphragm fold |
| A | Qualified | Qualified | Do not have | Do not have | 1.9 | Do not have | Do not have |
| B | Qualified | Qualified | Do not have | Do not have | 2.0 | Do not have | Do not have |
| C | Qualified | Qualified | Do not have | Do not have | 1.8 | Do not have | Do not have |
| D | Qualified | Qualified | Do not have | Do not have | 1.9 | Do not have | Do not have |
| E | Qualified | Qualified | Do not have | Do not have | 2.0 | Do not have | Do not have |
As stated, we are illustrated according to aim of the present invention fully, but the present invention is not limited to the foregoing description and implementation method.The practitioner of correlative technology field can carry out different variations and enforcement in the scope of technological thought permission of the present invention.
Claims (8)
1. the lamination of a flexible electric circuit board is used auxiliary material; Described lamination comprises following each layer that tiling successively stacks at least with auxiliary material (4): high temperature resistant mould release film (1), filling coated material (2), deformation control material (3) is characterized in that described high temperature resistant mould release film (1) is perfluoroethylene-propylene or polytetrafluoroethylene; Described filling coated material (2) is that acrylic acid alkyl ester polymer, polysiloxane and polyethylene are formed by above-mentioned two kinds of manufacturings at least; Described deformation control material (3) is PET, PBT or PA film; Described high temperature resistant mould release film (1), filling coated material (2), deformation control material (3), having at least adjacent two layers compound is one.
2. use auxiliary material according to the lamination of flexible electric circuit board described in the claim 1, it is characterized in that high temperature resistant mould release film (1), filling coated material (2), deformation control material (3), three layers compound is one.
3. the lamination of flexible electric circuit board according to claim 1 and 2 is used auxiliary material, it is characterized in that described alkyl acrylate is CH=CHCOOR, and wherein R is C1～C18 alkyl.
4. the lamination of flexible electric circuit board according to claim 1 and 2 is used auxiliary material, it is characterized in that described acrylic acid alkyl ester polymer is for being polymer of monomers with ethyl acrylate, n-butyl acrylate, Isooctyl acrylate monomer or octadecyl acrylate.
5. the lamination of flexible electric circuit board according to claim 1 is used auxiliary material, it is characterized in that: described polysiloxane is MQ resin or hydroxy-end capped silicon rubber.
6. laminating technology that has used lamination as claimed in claim 1 with the single face flexible electric circuit board of auxiliary material; It is characterized in that: be the unit with isolate steel plate (5), lamination with auxiliary material (4), circuit board diaphragm (6), single face flexible circuit base board (7), high-temperature resistant membrane (8), isolate steel plate (5) successively, tiling stacks one or more unit and carries out pressing in press; Described lamination comprises following each layer that tiling successively stacks at least with auxiliary material (4): high temperature resistant mould release film (1), filling coated material (2), deformation control material (3); Described circuit board diaphragm (6) is through coated closely on said single face flexible electric circuit board (7) after the described pressing step; Before described tiling stacked step, described high temperature resistant mould release film (1), filling coated material (2), deformation control material (3) had the two-layer compound one that is at least; Perhaps before described tiling stacks step, described high temperature resistant mould release film (1), filling coated material (2), deformation control material (3), trilaminate material is compound to be one.
7. laminating technology that has used lamination as claimed in claim 1 with the two-sided of auxiliary material or multi-layer flexible circuit board; It is characterized in that: be unit with auxiliary material (4), circuit board diaphragm (6), two-sided or multi-layer flexible circuit board substrate (9), circuit board diaphragm (6), lamination with auxiliary material (4), isolate steel plate (5) with isolate steel plate (5), lamination successively, tiling stacks one or more unit and carries out pressing in laminating machine; Described lamination comprises following each layer that tiling successively stacks at least with auxiliary material (4): high temperature resistant mould release film (1), filling coated material (2), deformation control material (3); Described circuit board diaphragm (6) is through coated closely on said bilayer or multi-layer flexible circuit board substrate (9) after the described pressing step; Before described tiling stacks step, described high temperature resistant mould release film (1), filling coated material (2), deformation control material (3), having at least adjacent two layers compound is one; Perhaps before described tiling stacks step, described high temperature resistant mould release film (1), filling coated material (2), deformation control material (3), trilaminate material is compound to be one.
8. according to claim 6 or 7 described technologies, it is characterized in that the process conditions of described lamination step are: temperature in 150～220 ℃ of scopes, vacuum degree is in 68～72cmHg scope, lamination pressure is 10～25kg/cm
2In the scope, the lamination time is in 3 seconds to 180 minutes scopes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101407746A CN101841971B (en) | 2010-04-06 | 2010-04-06 | Auxiliary materials for lamination of flexibility circuit board and lamination process of same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101407746A CN101841971B (en) | 2010-04-06 | 2010-04-06 | Auxiliary materials for lamination of flexibility circuit board and lamination process of same |
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| CN101841971A CN101841971A (en) | 2010-09-22 |
| CN101841971B true CN101841971B (en) | 2012-07-18 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102573336B (en) * | 2010-12-30 | 2016-05-04 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and for the pressing structure of layers of multilayer circuit board |
| CN103722793B (en) * | 2012-10-12 | 2016-07-06 | 昆山雅森电子材料科技有限公司 | For the silicon steel paper tinsel of printed circuit board (PCB) pressing and use the compression method of this silicon steel paper tinsel |
| CN103544881A (en) * | 2013-09-22 | 2014-01-29 | 国家电网公司 | Deformation-resisting power cable passage mark and using method thereof |
| CN105838046B (en) * | 2016-05-16 | 2017-12-05 | 久裕电子科技（江苏）有限公司 | A kind of three-layer co-extruded high temperature resistant resistance glue mould release membrance and its production technology |
| KR102154193B1 (en) * | 2018-02-20 | 2020-09-09 | 주식회사 아모그린텍 | Flexible printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339244A (en) * | 1999-03-26 | 2002-03-06 | 松下电工株式会社 | Method and system for processing metal-cold laminate for printed-circuit board |
| JP2002371263A (en) * | 2001-06-14 | 2002-12-26 | Nitto Denko Corp | Adhesive composition for multilayer flexible printed circuit board and multilayer flexible printed circuit board obtained by using the same |
| CN1664041A (en) * | 2004-03-02 | 2005-09-07 | 日东电工株式会社 | Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same |
| CN1912039A (en) * | 2005-08-08 | 2007-02-14 | 日东电工株式会社 | Adhesive film and image display device |
| CN101224650A (en) * | 2007-10-17 | 2008-07-23 | 周伟 | Auxiliary material for laminating flexible circuit board and laminating process thereof |
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2010
- 2010-04-06 CN CN2010101407746A patent/CN101841971B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339244A (en) * | 1999-03-26 | 2002-03-06 | 松下电工株式会社 | Method and system for processing metal-cold laminate for printed-circuit board |
| JP2002371263A (en) * | 2001-06-14 | 2002-12-26 | Nitto Denko Corp | Adhesive composition for multilayer flexible printed circuit board and multilayer flexible printed circuit board obtained by using the same |
| CN1664041A (en) * | 2004-03-02 | 2005-09-07 | 日东电工株式会社 | Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same |
| CN1912039A (en) * | 2005-08-08 | 2007-02-14 | 日东电工株式会社 | Adhesive film and image display device |
| CN101224650A (en) * | 2007-10-17 | 2008-07-23 | 周伟 | Auxiliary material for laminating flexible circuit board and laminating process thereof |
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| CN101841971A (en) | 2010-09-22 |
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