CN101838441A - Manufacturing method of acoustic mold - Google Patents

Manufacturing method of acoustic mold Download PDF

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Publication number
CN101838441A
CN101838441A CN 201010182984 CN201010182984A CN101838441A CN 101838441 A CN101838441 A CN 101838441A CN 201010182984 CN201010182984 CN 201010182984 CN 201010182984 A CN201010182984 A CN 201010182984A CN 101838441 A CN101838441 A CN 101838441A
Authority
CN
China
Prior art keywords
epoxy
mold
resins
acoustic
die cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201010182984
Other languages
Chinese (zh)
Inventor
庄顺宝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Microtech Changzhou Co Ltd
AAC Optoelectronic Changzhou Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Optoelectronic Changzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Optoelectronic Changzhou Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to CN 201010182984 priority Critical patent/CN101838441A/en
Publication of CN101838441A publication Critical patent/CN101838441A/en
Pending legal-status Critical Current

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Abstract

The invention provides a manufacturing method of an acoustic mold, which comprises the following steps: providing a die cavity of the acoustic mold and liquid epoxy resin; filling the epoxy resin into the die cavity; and cooling. The manufacturing method of the acoustic mold provided by the invention has the advantages of low cost and high molding speed.

Description

The making method of acoustic mold
[technical field]
The present invention relates to the Resins, epoxy Application Areas, relate in particular to a kind of method of making acoustic mold of Resins, epoxy.
[background technology]
Epoxy resin embedding adhesive is that epoxy curing agent mixes the composition epoxy resin that obtains with Resins, epoxy and additive.At present, Chang Yong amine epoxy resin solidifying agent has fatty amine and the solidifying agent of modification and the aromatic amine solidifying agent of hot setting of intermediate temperature setting.
The fatty amine of intermediate temperature setting and the solidifying agent of modification thereof, normal temperature for liquid, easily mixes with Resins, epoxy down, and processing performance is good.
The aromatic amine solidifying agent is because of all containing the phenyl ring of Heat stability is good, so its thermotolerance, chemical proofing, electromechanical properties that solidifies the gained composition epoxy resin is better than using the intermediate temperature setting agent in its molecular structure.But, being generally solid under the aromatic amine normal temperature of this class, fusing point is higher, is that 91-93 ℃, diaminodiphenylsulfone(DDS) fusing point are 178-179 ℃ as the diaminodiphenylmethane fusing point.As the necessary first heat fused of solidifying agent, could mix with Resins, epoxy down at 90 ℃ then, obtain the joint sealant that can be used for pouring into a mould.
In the correlation technique, the method for making acoustic mold mainly comprises: the die cavity that removes to pour into acoustic mold with the plastic pellet under the molten state.In this method, the cooling time of plastics is longer, in case and acoustic mold need to revise, the change repeatedly of mold needs higher cost and speed obviously to slow down.
[summary of the invention]
The technical problem that the present invention need solve provides a kind of method of making acoustic mold fast of Resins, epoxy.
For solving the problems of the technologies described above, the invention provides a kind of method of making acoustic mold, this method may further comprise the steps:
Provide the die cavity of described acoustic mold, the Resins, epoxy of liquid state;
Pour into described die cavity with described Resins, epoxy;
Cooling.
Beneficial effect of the present invention is: be liquid before Resins, epoxy is uncured, have suitable intensity and hardness after the curing; Liquid Resins, epoxy is similar with the plastic pellet under the molten state, state after the curing is similar with the characteristic of cooling back plastics, utilize this characteristic, use the rapid shaping of Resins, epoxy to make the injection moulding frock of the alternative short run of acoustic mold and the early development that is applied to product, advantages such as it is low to have cost, and speed is fast.
[description of drawings]
Fig. 1 is one embodiment of the invention acoustic mold die cavity synoptic diagram.
[embodiment]
The invention will be further described below in conjunction with drawings and embodiments.
The invention provides a kind of method of making acoustic mold, this method may further comprise the steps:
Provide the die cavity 1 of described acoustic mold, the Resins, epoxy of liquid state;
Pour into described die cavity with described Resins, epoxy;
Cooling.
Be illustrated in figure 1 as one embodiment of the invention acoustic mold die cavity synoptic diagram, practical Resins, epoxy injects die cavity 1, and is promptly plastic after the curing.
For the research and development of new product, the Resins, epoxy acoustic mold of practical this method rapid shaping product need not die sinking, just can finish the affirmation of product at client performance, rapidly and efficiently, more can effectively avoid the change repeatedly of mold simultaneously.
Above-described only is embodiments of the present invention, should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite that does not break away from the invention design, can also make improvement, but these all belongs to protection scope of the present invention.

Claims (1)

1. the making method of an acoustic mold, it is characterized in that: this method may further comprise the steps:
Provide the die cavity of described acoustic mold, the Resins, epoxy of liquid state;
Pour into described die cavity with described Resins, epoxy;
Cooling.
CN 201010182984 2010-05-25 2010-05-25 Manufacturing method of acoustic mold Pending CN101838441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201010182984 CN101838441A (en) 2010-05-25 2010-05-25 Manufacturing method of acoustic mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201010182984 CN101838441A (en) 2010-05-25 2010-05-25 Manufacturing method of acoustic mold

Publications (1)

Publication Number Publication Date
CN101838441A true CN101838441A (en) 2010-09-22

Family

ID=42742130

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201010182984 Pending CN101838441A (en) 2010-05-25 2010-05-25 Manufacturing method of acoustic mold

Country Status (1)

Country Link
CN (1) CN101838441A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1962757A (en) * 2006-05-25 2007-05-16 山东轻工业学院 Epoxy mould material for ceramic forming and its preparation method
CN101099983A (en) * 2006-07-06 2008-01-09 北京豪仪润世科技有限公司 Metal thin plate calendaring resin die

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1962757A (en) * 2006-05-25 2007-05-16 山东轻工业学院 Epoxy mould material for ceramic forming and its preparation method
CN101099983A (en) * 2006-07-06 2008-01-09 北京豪仪润世科技有限公司 Metal thin plate calendaring resin die

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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20100922