CN101827466A - Flat heating device - Google Patents
Flat heating device Download PDFInfo
- Publication number
- CN101827466A CN101827466A CN 201010139342 CN201010139342A CN101827466A CN 101827466 A CN101827466 A CN 101827466A CN 201010139342 CN201010139342 CN 201010139342 CN 201010139342 A CN201010139342 A CN 201010139342A CN 101827466 A CN101827466 A CN 101827466A
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- CN
- China
- Prior art keywords
- heating device
- top board
- resistance wire
- mounting groove
- lower shoe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 85
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 230000000295 complement effect Effects 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000004945 silicone rubber Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract 7
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- 230000002045 lasting effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000015220 hamburgers Nutrition 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
Images
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- Resistance Heating (AREA)
Abstract
The invention discloses a flat heating device, comprising an upper pressure board, a lower bottom board and a heating piece, wherein, the upper end surface of the lower bottom board is provided with a first installation groove and a second installation groove which are distributed in a step shape; the first installation groove is matched with the upper pressure board; the second installation groove is arranged in the first installation groove and matched with the heating piece; the upper pressure board is installed in the first installation groove and fixedly connected with the lower bottom board; the heating piece is installed in the second installation groove and arranged between the upper pressure board and a lower pressure board; and the heating piece comprises resistance wires, an insulation film and electrodes, the resistance wires are sealed in the insulation film and are in regular bent shapes, and two ends of the resistance threads are electrically connected with a positive electrode and a negative electrode correspondingly. Compared with the prior art, the flat heating device has simple structure, low cost, easy achievement, uneasy damage, saved space and uniform heating.
Description
Technical field
The present invention relates to a kind of flat heating device, relate in particular to a kind of flat heating device that plane heat source is provided for flat board.
Background technology
OLED, i.e. Organic Light Emitting Diode (Organic Light-Emitting Diode), be called again organic electric laser show (Organic Electroluminesence Display, OELD).Because possess characteristics such as frivolous, power saving, so it is had an optimistic view of by the insider always also.The OLED Display Technique is different with traditional LCD display mode, need not backlight, adopts extremely thin coating of organic material and glass substrate, and when electric current passed through, these organic materials will be luminous.And the OLED display screen can do lighter and thinnerly, and visible angle is bigger, and can significantly save electric energy, is regarded as one of product of tool future of 21 century.
But also there are defectives such as weak point in useful life, screen maximization difficulty in the organic light emitting display technology.For image explanation OLED structure, each OLED unit ratio can be cooked a hamburger, luminescent material is exactly the vegetables that are clipped in the middle.The display unit of each OLED can both produce the light of three kinds of different colours controllably.The basic structure of OLED is by the indium tin oxide of a thin and transparent tool characteristic of semiconductor (ITO), links to each other with the positive pole of electric power, adds another metallic cathode, is bundled into the structure as sandwich.Comprised in the total layer: electric hole transport layer (HTL), luminescent layer (EL) and electron transfer layer (ETL).When supplying power to appropriate voltage, the positive electrical hole will combine in luminescent layer with the negative electrode electric charge, produces light, according to the different red, green and blue RGB three primary colors that produce of its prescription, constitutes basic color.
The principle of luminosity of organic light emitting diode is similar with the inorganic light-emitting diode.When element is subjected to forward bias voltage drop that direct current derives, voltage energy will drive electronics and electric hole respectively by negative electrode and anode injection element in addition outward, and when both meet in conduction, combination, it is compound promptly to form so-called electronics-electric hole.Being subjected to external energy excitation Hou and work as chemical molecular, if electron spin and ground state electronics are paired, then is singlet state, and the light that it discharged is so-called fluorescent; Otherwise, if the excitation state electronics is not paired and parallel with the ground state electron spin, then being called triplet, the light that it discharged is so-called phosphorescence.When stable state low energy rank are got back to by excite state high energy rank in the state position of electronics, its energy will be emitted in the mode of photon or heat energy respectively.
Because organic material and metal pair oxygen and aqueous vapor are quite responsive, the Hou that completes needs to handle through packaging protection, also can carry out heat treated to the glass substrate of encapsulation in addition, with effect that improves encapsulation and the quality of improving product.All can relate to heating technique in numerous vacuum technique fields in addition.Coating rete technology under the typical vacuum environment, in order to improve coating quality, optimized technical scheme usually also is to select heated substrates.Yet existing substrate heating equipment lacks and to have variety of issue, as can not evenly heating, and perhaps complex structure cost height.
Therefore, be badly in need of a kind of homogeneous heating, simple in structure, flat heating device that cost is low.
Summary of the invention
The purpose of this invention is to provide a kind of homogeneous heating, simple in structure, flat heating device that cost is low.
For on realizing purpose is arranged, the invention discloses a kind of flat heating device, comprise top board, lower shoe and heating plate, the upper surface of described lower shoe offers first mounting groove and second mounting groove that is step-like distribution, described first mounting groove and described top board are complementary, and described second mounting groove is positioned at described first mounting groove and is complementary with described heating plate; Described top board is installed in described first mounting groove and with described lower shoe fixedlys connected; Described heating plate is installed in described second mounting groove and between described top board and described lower platen, described heating plate comprises resistance wire, dielectric film and electrode, described resistance wire is packaged in the described dielectric film and described resistance wire is bending regularly, and described resistance wire two ends are corresponding to be electrically connected with positive and negative electrode.
Preferably, described dielectric film comprises upper nonconductive Film and following dielectric film, and described resistance wire is packaged between described upper nonconductive Film and the following dielectric film, and described upper nonconductive Film contacts with described top board, and described dielectric film down contacts with described lower shoe.Described upper and lower dielectric film has not only played protection, insulating effect in resistance wire is packaged in, and the heat that resistance wire is produced is sent to top board and lower shoe fast.
Preferably, described top board and lower shoe are metallic plate.When the heating plate energising produced heat energy, top board and lower platen transferred out the heat of heating plate by thermal-radiating mode, adopted metallic plate to serve as top board and lower platen, and good heat conductivity can transfer out the mode of heat energy by radiation fast.Especially adopt the bigger metal material of specific heat ratio to serve as top board and lower shoe, for example adopt metallic aluminium, iron and alloy thereof, can be so that the heat radiation of flat heating device of the present invention be even, lasting, avoid the heating plate local overheating, improved its working life greatly, temperature is fluctuated when preventing dull and stereotyped the heating, is difficult to regulation and control.
Preferably, described resistance wire is a copper wire.Resistance wire produces heat by the intervention of electrode, and the metal that its material preferably conducts electricity very well, quality is soft for example can adopt metals such as silver, copper, aluminium to make resistance wire; Yet in the practical operation because the cost of argent is higher, metallic copper not only cost low, conduct electricity very well, and cold draw is also fine, the resistance wire that is well suited for doing heating plate uses.
Preferably, described dielectric film is polyimide film or silicone rubber membrane.Dielectric film has two effects, described resistance wire on the one hand is used to insulate, be used on the other hand heat transferred is arrived described top board and lower platen, the material of its dielectric film is preferably selected polyimide film (polyimide) or silicone rubber membrane (siliconerubber).
Preferably, offer screw on described first mounting groove, described top board is provided with the installing hole that matches with described screw.Use securing member to pass installing hole and screw, can be firm top board and lower shoe are fixed together, not only cost is low, fixed, and top board and lower shoe dismounting can be come when maintenance, and is convenient, for ease of maintenaince.
Preferably, the edge of the described lower shoe formation fixed block that stretches out, described fixed block is provided with fixing hole.Can conveniently flat heating device be fixed on suitable place by the fixing hole on the fixed block, for example be fixed in the vacuum chamber of OLED production system.
Preferably, the thickness of described top board, lower shoe and heating plate is all less than 1 centimetre.The present invention adopts also can be less relatively than thin thickness discharge quantity, further reduced the interference of gas to process environments, is specially adapted in the vacuum environment (as vacuum cavity).
Preferably, flat heating device of the present invention also comprises temperature detecting unit and thermostat unit, and described temperature detecting unit and thermostat unit all are electrically connected with described resistance wire.The present invention adds temperature detecting unit and dull and stereotyped temperature and the firing rate that heats can be monitored and control to thermostat unit easily.Particularly, can detect temperature of the present invention by installing thermocouple temperature sensor additional, and as required temperature of the present invention be regulated by thermostat unit.
Compared with prior art, the present invention directly produces heat by heating plate, transmit heat by being close to bilevel top board of heating plate and lower shoe by thermal-radiating mode again, during work, the present invention not necessarily will directly contact with flat board, can directly place a dull and stereotyped side, by thermal-radiating mode heated plate, as long as the distance between dull and stereotyped and lower shoe of the present invention or the top board is suitable, the efficiency of heating surface can guaranteed.Therefore, on the one hand, the present invention includes top board, lower shoe and heating plate, heating plate is sandwiched between top board and the lower platen, and fixedly connected between top board and the lower platen, not only heating plate can well be fixed and protect, not fragile, and simple in structure, cost is low, be easy to realize; On the other hand, the present invention is superimposed by three plate objects and forms, and it is very thin to make that the dull and stereotyped firing equipment of the present invention can design, and saves the space; On the one hand, the resistance wire of heating plate of the present invention is bending regularly, and it is evenly arranged on the heating plate again, and the heating of energising back is even, and heats is good.In a word, the present invention compared with prior art, have simple in structure, cost is low, be easy to realize, not fragile, the advantage of saving space, homogeneous heating.
Description of drawings
Fig. 1 is the structural representation of flat heating device of the present invention.
Fig. 2 is the cut-away view along A-A line among Fig. 1.
Fig. 3 is the three-dimensional exploded view of flat heating device of the present invention.
Fig. 4 is the structural representation of the heating plate of flat heating device of the present invention.
Fig. 5 is the schematic partial cross-sectional view of the heating plate of flat heating device of the present invention.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
With reference to figure 1, Fig. 2 and Fig. 3, flat heating device 100 of the present invention comprises top board 1, lower shoe 2 and heating plate 3, the upper surface of described lower shoe 2 offers first mounting groove 21 and second mounting groove 22 that is step-like distribution, described first mounting groove 21 is complementary with described top board 1, and described second mounting groove 22 is positioned at described first mounting groove 21 and is complementary with described heating plate 3; Described top board 1 is installed in described first mounting groove 21 and with described lower shoe 2 fixedlys connected; Described heating plate 3 is installed in described second mounting groove 22 and between described top board 1 and described lower platen 2.
With reference to figure 4 and Fig. 5, described heating plate 3 comprises resistance wire 31, dielectric film 32 and electrode 33, described resistance wire 31 is encapsulated in the dielectric film 32, and resistance wire 31 is bending regularly, make resistance wire be evenly distributed on the described heating plate 3 and form heating circuit, the positive terminal 311 of described resistance wire 31 is connected with the positive electrical of electrode 33, and the negative pole end 312 of described resistance wire 31 is connected with the negative electricity of described electrode 33.Particularly, described dielectric film 32 is divided into upper nonconductive Film 321 and following dielectric film 322, described resistance wire 31 is between upper nonconductive Film 321 and following dielectric film 322, and described upper nonconductive Film 321 contacts with described top board 1, and described dielectric film 322 down contacts with described lower shoe 2.More specifically, have an opening 23 on the lower shoe 2, the lead-in wire of resistance wire is drawn the also positive pole and the negative pole of connection electrode 33 by opening 23 places.Wherein, the loop number of resistance wire 31 formations is decided by concrete condition.
The preferably with reference to figure 3, offers screw 24 on described first mounting groove 21, and described top board 1 is provided with the installing hole 11 that matches with described screw 24.Use securing member to pass installing hole 11 and screw 24, top board 1 and lower shoe 2 can be fixed together, and heating plate 3 safety and firmnesses are clipped between top board 1 and the lower shoe 2, again because as can see from Figure 3, screw 24 is evenly distributed on first mounting groove 21, and surrounds a rectangular-shaped loops.Like this, make that not only the structure of flat heating device 100 of the present invention is firm, and when maintenance, top board 1 and lower shoe 2 dismountings can be come, conveniently, for ease of maintenaince.
The preferably, with reference to figure 3, the edge of described lower shoe 2 stretches out and forms fixed block 25, and described fixed block 25 is provided with fixing hole.Can conveniently flat heating device 100 be fixed on suitable place by the fixing hole on the fixed block 25, for example be fixed in the vacuum chamber of OLED production system.In the present embodiment, fixed block 25 is one group of both sides that are symmetrically distributed in lower shoe 2 long limits with two.
The preferably, the thickness of described top board 1, lower shoe 2 and heating plate 3 is all less than 1 centimetre.The present invention adopts also can be less relatively than thin thickness discharge quantity, further reduced the interference of gas to process environments, is specially adapted in the vacuum environment (as vacuum cavity).
The preferably, described top board 1 is a metallic plate with lower shoe 2.In the present embodiment, described top board 1 and lower shoe 2 are made by metallic aluminium, certain described top board 1 also can be made by other metal materials or its alloy with lower shoe 2, the material of but selecting for use is with good heat conductivity, and specific heat capacity is greatly good, like this can be so that the heat radiation of flat heating device of the present invention 100 is even, lasting, avoid heating plate 3 local overheatings, improved its working life greatly, temperature is fluctuated when preventing dull and stereotyped the heating, is difficult to regulation and control.
The preferably, described resistance wire 31 is a copper wire.Resistance wire 31 produces heat by the intervention of electrode 33, and the metal that its material preferably conducts electricity very well, quality is soft for example can adopt metals such as silver, copper, aluminium to make resistance wire; Yet in the practical operation because the cost of argent is higher, metallic copper not only cost low, conduct electricity very well, and cold draw is also fine, so resistance wire 31 adopts metallic coppers to make in the present embodiment.
The preferably, described dielectric film 32 is polyimide film or silicone rubber membrane.Dielectric film 32 has two effects; be used for insulation on the one hand and protect described resistance wire 31; the heat transferred that is used on the other hand resistance wire 31 is produced is to described top board 1 and lower platen 2, and the material of its dielectric film 32 is preferably selected polyimide film or silicone rubber membrane.
The preferably, flat heating device 100 of the present invention also comprises temperature detecting unit and thermostat unit, described temperature detecting unit and thermostat unit all are electrically connected with described resistance wire 31.The present invention adds temperature detecting unit and dull and stereotyped temperature and the firing rate that heats can be monitored and control to thermostat unit easily.Particularly, can detect temperature of the present invention by installing thermocouple temperature sensor additional, and as required temperature of the present invention be regulated by thermostat unit.Wherein, the concrete formation of temperature detecting unit and thermostat unit is well known to those skilled in the art, just will not repeat once more.
With reference to the accompanying drawings, describe the operation principle and the course of work of flat heating device 100 of the present invention in detail.When carrying out the flat board heating, can be fixed on suitable place (in vacuum cavity) by the fixing hole flat heating device 100 of fixed block 25 as required, then will be heated the dull and stereotyped below of lower shoe 2 in the flat heating device 100 or the top of top board 1 of placing, face to face, and between dull and stereotyped and top board 1 and lower shoe 2, keep suitably apart from (optimum distance should be selected a small distance to guarantee the efficiency of heating surface), give the both positive and negative polarity energising of electrode 33, heating circuit energising that resistance wire 31 is formed and generation heat, heat is respectively by upper nonconductive Film 321 and top board 1, following dielectric film 322 and lower shoe 2 are passed on the heated flat board in thermal-radiating mode, if desired, can add thermocouple temperature sensor and detect the temperature of flat heating device 100 of the present invention, in time feedback data and as required temperature of the present invention is regulated by thermostat unit.Certainly, the present invention also can directly be conducted heat flat heating device 100 according to special circumstances with dull and stereotyped the contact.
Above disclosed only is the preferred embodiments of the present invention, can not limit the present invention's interest field certainly with this, and therefore the equivalent variations of being done according to the present patent application claim still belongs to the scope that the present invention is contained.
Claims (9)
1. flat heating device, it is characterized in that: comprise top board, lower shoe and heating plate, the upper surface of described lower shoe offers first mounting groove and second mounting groove that is step-like distribution, described first mounting groove and described top board are complementary, and described second mounting groove is positioned at described first mounting groove and is complementary with described heating plate; Described top board is installed in described first mounting groove and with described lower shoe fixedlys connected; Described heating plate is installed in described second mounting groove and between described top board and described lower platen, described heating plate comprises resistance wire, dielectric film and electrode, described resistance wire is packaged in the described dielectric film and described resistance wire is bending regularly, and described resistance wire two ends are corresponding to be electrically connected with positive and negative electrode.
2. flat heating device as claimed in claim 1, it is characterized in that: described dielectric film comprises upper nonconductive Film and following dielectric film, described resistance wire is packaged between described upper nonconductive Film and the following dielectric film, and described upper nonconductive Film contacts with described top board, and described dielectric film down contacts with described lower shoe.
3. flat heating device as claimed in claim 1 is characterized in that: described top board and lower shoe are metallic plate.
4. flat heating device as claimed in claim 1 is characterized in that: described resistance wire is a copper wire.
5. flat heating device as claimed in claim 1 is characterized in that: described dielectric film is polyimide film or silicone rubber membrane.
6. flat heating device as claimed in claim 1 is characterized in that: offer screw on described first mounting groove, described top board is provided with the installing hole that matches with described screw.
7. flat heating device as claimed in claim 1 is characterized in that: the edge of the described lower shoe formation fixed block that stretches out, described fixed block is provided with fixing hole.
8. flat heating device as claimed in claim 1 is characterized in that: the thickness of described top board, lower shoe and heating plate is all less than 1 centimetre.
9. flat heating device as claimed in claim 1 is characterized in that: also comprise temperature detecting unit and thermostat unit, described temperature detecting unit and thermostat unit all are electrically connected with described resistance wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101393423A CN101827466B (en) | 2010-03-30 | 2010-03-30 | Flat heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101393423A CN101827466B (en) | 2010-03-30 | 2010-03-30 | Flat heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101827466A true CN101827466A (en) | 2010-09-08 |
| CN101827466B CN101827466B (en) | 2012-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101393423A Expired - Fee Related CN101827466B (en) | 2010-03-30 | 2010-03-30 | Flat heating device |
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| Country | Link |
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| CN (1) | CN101827466B (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131313A (en) * | 2011-03-29 | 2011-07-20 | 宁波市万泓电器科技有限公司 | Safety protection system of electric heating film heater |
| CN102200318A (en) * | 2011-04-19 | 2011-09-28 | 廖合堂 | Thermostatic fire-proof plate for heating |
| CN104093224A (en) * | 2014-06-11 | 2014-10-08 | 浙江西德斯电气有限公司 | Heating plate based on large-power thick-membrane resistor, and parallel screen printing method thereof |
| CN104223765A (en) * | 2014-08-18 | 2014-12-24 | 天长市地震办公室 | Office desk |
| CN104269368A (en) * | 2014-08-29 | 2015-01-07 | 沈阳拓荆科技有限公司 | Device and method utilizing front end module for heating wafers |
| CN104717817A (en) * | 2013-12-12 | 2015-06-17 | 中微半导体设备(上海)有限公司 | Heating device used for radio frequency window of inductive coupling-type plasma processor |
| CN106825185A (en) * | 2016-11-25 | 2017-06-13 | 机械科学研究总院先进制造技术研究中心 | A kind of superplastic forming equipment platform heating means |
| CN107282157A (en) * | 2017-05-18 | 2017-10-24 | 杭州依美洛克医学科技有限公司 | The board-like understructure of one kind heating |
| CN108205065A (en) * | 2016-12-19 | 2018-06-26 | 航天科工惯性技术有限公司 | A kind of accelerometer heats piece |
| CN108511831A (en) * | 2017-02-27 | 2018-09-07 | 湖南妙盛汽车电源有限公司 | A kind of lithium battery heating component |
| CN109357755A (en) * | 2018-10-11 | 2019-02-19 | 上海理工大学 | A kind of test macro and method of glass transmission solar radiation |
| CN109414063A (en) * | 2016-06-27 | 2019-03-01 | 日本烟草产业株式会社 | Aerosol extractor smoke grenade, the aerosol extractor for having aerosol extractor smoke grenade and aerosol extractor fever tablet |
| CN110241403A (en) * | 2019-07-23 | 2019-09-17 | 芜湖通潮精密机械股份有限公司 | A kind of heater and preparation method thereof reducing the temperature difference and application |
| CN111955803A (en) * | 2020-08-07 | 2020-11-20 | 深圳麦克韦尔科技有限公司 | Heating element and electronic atomization device adopting same |
| CN114073337A (en) * | 2020-08-19 | 2022-02-22 | 深圳市新宜康创新技术有限公司 | Method for manufacturing heating non-combustion device |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131313A (en) * | 2011-03-29 | 2011-07-20 | 宁波市万泓电器科技有限公司 | Safety protection system of electric heating film heater |
| CN102200318A (en) * | 2011-04-19 | 2011-09-28 | 廖合堂 | Thermostatic fire-proof plate for heating |
| CN104717817A (en) * | 2013-12-12 | 2015-06-17 | 中微半导体设备(上海)有限公司 | Heating device used for radio frequency window of inductive coupling-type plasma processor |
| CN104093224A (en) * | 2014-06-11 | 2014-10-08 | 浙江西德斯电气有限公司 | Heating plate based on large-power thick-membrane resistor, and parallel screen printing method thereof |
| CN104223765A (en) * | 2014-08-18 | 2014-12-24 | 天长市地震办公室 | Office desk |
| CN104269368A (en) * | 2014-08-29 | 2015-01-07 | 沈阳拓荆科技有限公司 | Device and method utilizing front end module for heating wafers |
| CN109414063A (en) * | 2016-06-27 | 2019-03-01 | 日本烟草产业株式会社 | Aerosol extractor smoke grenade, the aerosol extractor for having aerosol extractor smoke grenade and aerosol extractor fever tablet |
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