CN101820735A - Radiation device with enhanced radiation effect and related radiation system thereof - Google Patents
Radiation device with enhanced radiation effect and related radiation system thereof Download PDFInfo
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- CN101820735A CN101820735A CN200910118322A CN200910118322A CN101820735A CN 101820735 A CN101820735 A CN 101820735A CN 200910118322 A CN200910118322 A CN 200910118322A CN 200910118322 A CN200910118322 A CN 200910118322A CN 101820735 A CN101820735 A CN 101820735A
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- heat
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- conducting substrate
- radiating fins
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Abstract
The invention discloses a radiation device with enhanced radiation effect, which comprises a thermal-conductive substrate arranged on a heat source to conduct heat generated by the heat source, and a plurality of radiating fins arranged substantially in parallel on the thermal-conductive substrate, wherein each radiating fin is provided with a plurality of protrusions along the directions where the corresponding radiating fins are extended from the thermal-conductive substrate; and the plurality of protrusions of adjacent radiating fins are arranged in a staggering way in the directions where the corresponding radiating fins are extended from the thermal-conductive substrate so as to dissipate the heat which is received by the thermal-conductive substrate and is generated by the heat source.
Description
Technical field
The present invention relates to a kind of heat abstractor and relevant cooling system thereof, relate in particular to a kind of heat abstractor and relevant cooling system thereof of promoting radiating efficiency.
Background technology
Heat dissipation problem still is the difficult problem that a urgent need overcomes in the application of cooling system now, and in the streets various dissimilar cooling system also adopts various different radiating mode.Right existing heat dissipation technology has not been applied and has been solved a large amount of heats that produce of various thermal source, thus there is the application of many heat dissipation technologys just to arise at the historic moment, so that electronic installation can be kept the effect of normal working temperature.Yet the present air cooling system that generally uses, no matter how the usefulness of cooling fan improves, still have its restriction on the heat dissipation problem solving, so the efficient of utilizing existing conventional fan forced air convection and improving other radiating subassembly still is one to be established in the mode of increase radiating efficiency on the existing heat abstractor.
See also Fig. 1 and Fig. 2, Fig. 1 is the schematic diagram of prior art one heat abstractor 20, and Fig. 2 is the generalized section of prior art heat abstractor 20.Heat abstractor 20 comprises a heat-conducting substrate 22, and it is arranged on the thermal source 24, the heat that is produced with conduction heat sources 24; And a plurality of radiating fins 26, it is set in parallel in fact on the heat-conducting substrate 22,26 of each adjacent radiating fins form a plurality of passages 261, so that cross-ventilated path to be provided, each radiating fin 26 is gone up in its direction (directions X) of extending from heat-conducting substrate 22 and is smooth flat, removes the heat that heat-conducting substrate 22 thermal source of being accepted 24 is produced to loose.As shown in Figure 1, heat-conducting substrate 22 can be made up of the metal material of high conduction coefficient, as aluminium or copper material.The side that heat-conducting substrate 22 is arranged at thermal source 24 is in direct contact with it, and the heat energy that thermal source 24 is produced promptly can be passed on the heat-conducting substrate 22 because of heat-conduction effect.Meanwhile, owing to a plurality of radiating fins 26 also can be made up of the metal material of high conduction coefficient, as aluminium or copper material, thus conduct to the heat energy of heat-conducting substrate 22 by thermal source 24, just can be passed on a plurality of radiating fins 26 because of heat-conduction effect.A plurality of radiating fins 26 are set in parallel in fact on the heat-conducting substrate 22, its purpose is to increase the area that heat energy contacts with air, the area that promptly contact of meaning with air by on the heat-conducting substrate 22 with respect to a side surface area of contact thermal source 24 these sides, increase into the summation that a plurality of radiating fin 26 its both side surface are amassed.Therefore, the heat energy that thermal source 24 produced just can be by significantly increasing area that radiating fin 26 contacts with air looses heat energy effectively and removes.Because a plurality of spacing W1 by 261 optional position are definite value, when so air flows in a plurality of passages 261, its suffered air drag is that this kind natural circulation, the compulsory convection type of no external force are called free convection (Natural convection) uniformly.The advantage of heat abstractor 20 is that its smooth surface can reduce windage when side air intake and top air intake.The shortcoming of heat abstractor 20 then is that cooling surface area is big inadequately, so heat dissipation is relatively poor.Therefore, heat abstractor 20 can add a fan 28 in addition to strengthen the cross-ventilation effect, and this kind borrows the auxiliary convection type of external force to be called forced convertion (Forced convection).Fan 28 is arranged at the side or the top of a plurality of radiating fins 26, strengthens air with the air-supply or the mode of exhausting and passes through convection action 261 in a plurality of, with the heat that looses and produced except that thermal source 24.
See also Fig. 3 and Fig. 4, Fig. 3 can increase the schematic diagram of a heat abstractor 40 of radiating efficiency for prior art, and Fig. 4 is the generalized section of prior art heat abstractor 40.Heat abstractor 40 comprises a heat-conducting substrate 42, and it is arranged on the thermal source 44, the heat that is produced with conduction heat sources 44; And a plurality of radiating fins 46, it is set in parallel in fact on the heat-conducting substrate 42,46 of each adjacent radiating fins form a plurality of passages 461, so that cross-ventilated path to be provided, each radiating fin 46 is formed with a plurality of protuberances 463 in it on the direction (directions X) that heat-conducting substrate 42 extends, and a plurality of protuberances 463 of adjacent radiating fin 46 are symmetric arrays in radiating fin 46 on the direction that heat-conducting substrate 42 extends, and remove the heat that heat-conducting substrate 42 thermal source of being accepted 44 is produced to loose.The function of heat-conducting substrate 42, thermal source 44 and a plurality of radiating fin 46 with the configuration as previously mentioned, so no longer describe in detail in this.Yet heat abstractor 40 is formed with a plurality of protuberances 463 in order to increase the area that contacts with air on a plurality of radiating fins 46.Each protuberance 463 of adjacent radiating fin 46 is formed with a spacing W20, and the smooth surface of adjacent radiating fin 46 is formed with a spacing W22, and spacing W22 is greater than spacing W20.
Compared to heat abstractor 20, heat abstractor 40 has bigger surface area, and the heat energy that can faster thermal source 44 be produced is loose by the air cooling mode and removes, so radiating efficiency is good than heat abstractor 20.But because the difference of spacing W20 and spacing W22, make and cause the free convection effect of a plurality of passages 461 to be restricted by air drag and the blast skewness that a plurality of passages 461 are interior.Therefore, heat abstractor 40 can be provided with a fan 48 to strengthen cross-ventilation effect (forced convertion).As shown in Figure 3, be arranged at the side of a plurality of radiating fins 46 when fan 48, when strengthening cross-ventilation in the mode of air-supply or exhausting, the difference that is caused because of the protuberance 463 of symmetric arrays makes the windage inequality in inlet air place and a plurality of passage 461, meaning is to take away the distinguished and admirable inequality of heat on the radiating fin 46, cause the unstable airflow degree to descend, thus force the distinguished and admirable stability of taking away heat to descend, and reduce its radiating efficiency.Be arranged at the top of a plurality of radiating fins 46 in addition when fan, mode with air-supply or exhausting strengthens air when circulate in the space of adjacent radiating fin 46, also can make that the windage in inlet air place and a plurality of passage 461 is big than heat abstractor 20 suffered windages because of the difference that protuberance 463 caused of symmetric arrays, meaning is that the air quantity of taking away heat on the radiating fin 46 descends, and make the usefulness that can take away heat by a plurality of passages 461 interior forced draft descend, so influence its radiating efficiency.Therefore, because the configuration of a plurality of protuberances 463 of heat abstractor 40 is unsatisfactory, so heat abstractor 40 only can be applicable to the cooling application of forced convertion and can't reach desirable radiating efficiency.So how designing not only to increase the area that contacts with air, and can be applicable to the heat abstractor of the cooling application of free convection and forced convertion simultaneously, just is the important topic of the required effort of scientific and technological industry now.
Summary of the invention
Technical problem to be solved by this invention is, discloses a kind of heat abstractor of promoting radiating efficiency.
To achieve these goals, the present invention discloses a kind of heat abstractor of promoting radiating efficiency, it is characterized in that, includes:
One heat-conducting substrate, it is arranged on the thermal source, to conduct the heat that this thermal source is produced; And
A plurality of radiating fins, it is arranged in parallel on this heat-conducting substrate, each radiating fin is formed with a plurality of protuberances in it on the direction that this heat-conducting substrate extends, and a plurality of protuberances of this of adjacent radiating fin in this radiating fin on the direction that this heat-conducting substrate extends for being staggered, with the heat that looses and produced except that this thermal source that this heat-conducting substrate is accepted.
To achieve these goals, the present invention discloses a kind of cooling system of promoting radiating efficiency, it is characterized in that, includes:
One circuit board;
One thermal source, it is installed on this circuit board; And
One heat abstractor, it includes:
One heat-conducting substrate, it is arranged on this thermal source, to conduct the heat that this thermal source is produced; And
A plurality of radiating fins, it is arranged in parallel on this heat-conducting substrate, each radiating fin is formed with a plurality of protuberances in it on the direction that this heat-conducting substrate extends, and a plurality of protuberances of this of adjacent radiating fin in this radiating fin on the direction that this heat-conducting substrate extends for being staggered, with the heat that looses and produced except that this thermal source that this heat-conducting substrate is accepted.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the schematic diagram of prior art heat abstractor;
Fig. 2 is the generalized section of prior art heat abstractor;
Fig. 3 can increase the schematic diagram of the heat abstractor of radiating efficiency for prior art;
Fig. 4 is the generalized section of prior art heat abstractor;
Fig. 5 can promote the schematic diagram of the heat abstractor of radiating efficiency for first embodiment of the invention;
Fig. 6 is the generalized section of first embodiment of the invention heat abstractor;
The schematic diagram of Fig. 7 heat abstractor of a plurality of triangle protuberances for second embodiment of the invention has;
The schematic diagram of Fig. 8 heat abstractor of a plurality of zigzag protuberances for third embodiment of the invention has;
The schematic diagram of Fig. 9 heat abstractor of a plurality of waveform protuberances for fourth embodiment of the invention has;
Figure 10 disposes the schematic diagram of the heat abstractor of staggered a plurality of protuberance and corresponding recess in addition on a plurality of waveform protuberances for fifth embodiment of the invention.
Figure 11 has the schematic diagram of the heat abstractor of staggered a plurality of protuberance and smooth flat simultaneously for sixth embodiment of the invention;
Figure 12 has the schematic diagram of heat abstractor of a plurality of protuberances of staggered a plurality of protuberance and symmetric arrays simultaneously for seventh embodiment of the invention;
Figure 13 is the schematic diagram of the radiating fin of eighth embodiment of the invention column structure;
Figure 14 is the schematic diagram of the radiating fin of the short matrix shape of ninth embodiment of the invention structure.
Wherein, Reference numeral
20,40,60,70,80,90,100,110,120 heat abstractors
463,663,72,82,92,102,104,1104,1204,1206 protuberances
22,42,62 heat-conducting substrates
28,48,68 fans
63 circuit boards
W1, W20, W22, W3 spacing
24,44,64 thermals source
664,106 recess
26,46,66,1102,1202,1306,1406 radiating fins
1106 smooth flat
261,461,661 passages
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
See also Fig. 5 and Fig. 6, Fig. 5 can promote the schematic diagram of a heat abstractor 60 of radiating efficiency for first embodiment of the invention, and Fig. 6 is the generalized section of first embodiment of the invention heat abstractor 60.Heat abstractor 60 comprises a heat-conducting substrate 62, and it is arranged on the thermal source 64, the heat that is produced with conduction heat sources 64; And a plurality of radiating fins 66, it is set in parallel in fact on the heat-conducting substrate 62,66 of each adjacent radiating fins form a plurality of passages 661, so as to cross-ventilated path is provided, each radiating fin 66 is formed with a plurality of protuberances 663 in it on the direction (directions X) that heat-conducting substrate 62 extends, and the direction (directions X) that a plurality of protuberances 663 of adjacent radiating fin 66 extend from heat-conducting substrate 62 in radiating fin 66 goes up to being staggered, and removes the heat that heat-conducting substrate 62 thermal source of being accepted 64 is produced to loose.663 of adjacent protuberances are formed with the recess 664 of a corresponding protuberance 663, and meaning is that 663 of a plurality of protuberances are formed with a plurality of recess 664.Being staggered the both sides of a plurality of passages 661 of being defined as 66 of adjacent radiating fins respectively can be along forming the recess 664 of a plurality of protuberances 663 with corresponding protuberance 663 on the directions X, wherein the protuberance 663 of radiating fin 66 regards to the recess of adjacent radiating fin 66, with the width that keeps a plurality of passages 661 along all keeping definite value on the directions X.Thermal source 64 optionally is installed on the circuit board 63.For example: thermal source 64 can be a central processing unit or a chip, is installed on the circuit board 63, because of high-speed computation produces heat energy.Thermal source 64 also can be a metallic plate, in order to from heat generating component conduction heat energy to heat abstractor 60 with the dissipation heat, then thermal source 64 need not be installed on the circuit board 63.Heat-conducting substrate 62 can be made up of metal material with a plurality of radiating fins 66, as copper or aluminium material.The side that heat-conducting substrate 62 is arranged at thermal source 64 is in direct contact with it, and the heat energy that thermal source 64 is produced promptly can be passed on the heat-conducting substrate 62 because of heat-conduction effect.Meanwhile, conduct to the heat energy of heat-conducting substrate 62, also can be passed on a plurality of radiating fins 66 because of heat-conduction effect by thermal source 64.A plurality of radiating fins 66 are set in parallel in fact on the heat-conducting substrate 62, and its purpose is to increase the area that heat energy contacts with air.
As Fig. 5 and shown in Figure 6, the present invention is formed with staggered a plurality of protuberance 663 in each radiating fin 66 on the direction that heat-conducting substrate 62 extends, and a plurality of protuberance 663 can be respectively a long strip type structure, and its direction is parallel to this heat-conducting substrate 62 in fact.The function of a plurality of protuberances 663 is to increase the surface area that a plurality of radiating fins 66 contact with air, to promote radiating efficiency.Because being configured to of a plurality of protuberances 663 is staggered, so a spacing W3 of adjacent radiating fin 66 all can keep definite value in a plurality of optional positions of passing through in 661, makes air drag and blast all can keep constant in a plurality of optional positions of passing through in 661.When the side air intake of a plurality of radiating fins 66, because of staggered protuberance 663 and recess 664 make windage equalization in inlet air place and a plurality of passage 661, air-flow in a plurality of passages can be taken away the usefulness of heat and stablizes, so radiating efficiency is good than the heat abstractor 40 of prior art.When the air intake of the top of a plurality of radiating fins, because of staggered protuberance 663 and recess 664 make windage in inlet air place and a plurality of passage 661 than the heat abstractor 40 of prior art for little, the usefulness that makes air-flow in a plurality of passages can take away heat is difficult for being affected, so radiating efficiency is good than the heat abstractor 40 of prior art.Therefore, the free convection function well of the side air intake of a plurality of radiating fins 66 and top air intake.
Moreover a plurality of protuberances 663 can be not limited to Fig. 5 and circular arc shown in Figure 6, and it can be the polygon of triangle, zigzag, waveform or other kind.See also Fig. 7, Fig. 8, Fig. 9 and Figure 10.Fig. 7 has the schematic diagram of the heat abstractor 70 of a plurality of triangle protuberances 72 for second embodiment of the invention one.Fig. 8 has the schematic diagram of the heat abstractor 80 of a plurality of zigzag protuberances 82 for third embodiment of the invention one.Fig. 9 has the schematic diagram of the heat abstractor 90 of a plurality of waveform protuberances 92 for fourth embodiment of the invention one.Figure 10 disposes the schematic diagram of the heat abstractor 100 of staggered a plurality of protuberance 104 and corresponding recess 106 in addition on a plurality of waveform protuberances 102 for fifth embodiment of the invention one.The configuration of respectively forming assembly of heat abstractor 70, heat abstractor 80, heat abstractor 90 and heat abstractor 100 and function are as described in as described in first embodiment, it can increase the surface area that a plurality of radiating fins contact with air, to promote radiating efficiency, and distance is in all keeping definite value by interior optional position between the adjacent radiating fin, make air drag and blast in all keeping constant, so no longer describe in detail in this by interior optional position.Triangle protuberance 72, zigzag protuberance 82, waveform protuberance 92 and function with a plurality of protuberances 104 and waveform protuberance 102 of recess 106 are also identical with the described protuberance of first embodiment 663, precisely because the selection of profile and configuration are looked closely practical application and decided.
Moreover radiating fin of the present invention can be not limited to the configuration shown in the previous embodiment, and it can be the radiating fin configuration of a compound prior art and embodiment of the present invention in addition.See also Figure 11 and Figure 12.Figure 11 has the schematic diagram of the heat abstractor 110 of staggered a plurality of protuberance 1104 and smooth flat 1106 simultaneously for sixth embodiment of the invention one.Figure 12 has the schematic diagram of heat abstractor 120 of a plurality of protuberances 1206 of staggered a plurality of protuberance 1204 and symmetric arrays simultaneously for seventh embodiment of the invention one.When the heat of the dissipation that desire in the centre position of a plurality of radiating fins 1202 of a plurality of radiating fins 1102 of heat abstractor 110 and heat abstractor 120 when being high than the heat of fin dissipation that desire both sides, only need strengthen the free convection effect and the forced convertion effect in heat abstractor 110 and heat abstractor 120 centre positions, so can have the radiating fin 1102 and radiating fin 1202 of the technology of the present invention feature in the centre position design, and radiating requirements lower position in both sides is provided with the radiating fin of prior art.The selection of the various radiating fin on heat abstractor 110 and the heat abstractor 120 and configuration are looked closely practical application and are decided, and it is described that its action principle is same as previous embodiment, no longer describes in detail in this.
Moreover, a plurality of radiating fins 66 can be not limited to the elongated laminated structure shown in the previous embodiment, it can be respectively in addition a column structure or a short matrix shape structure, to increase the area that heat abstractor 60 contacts with air and the effect of enhancement free convection and forced convertion simultaneously.See also Figure 13 and Figure 14.Figure 13 is the schematic diagram of the radiating fin 1306 of eighth embodiment of the invention one column structure, and Figure 14 is the schematic diagram of the radiating fin 1406 of ninth embodiment of the invention one short matrix shape structure.It is described that its action principle is same as previous embodiment, so no longer describe in detail in this.
Compared to prior art, the heat abstractor that the present invention can promote radiating efficiency can improve the surface area that prior art only focuses on increases radiating fin, descends in the importance that influences free convection heat exchange between adjacent radiating fin and ignore the uneven and unstable airflow degree of windage; The position of a plurality of protuberances on the interconnected radiating fin of the present invention make the windage of adjacent radiating fin internal channel keep impartial at an arbitrary position, and the air quantity of convection action is stable.Thus, the present invention is increasing area of dissipation with when improving radiating efficiency, and the thermal cycle that also can strengthen free convection or forced convertion is used for further promoting radiating efficiency.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (21)
1. the heat abstractor that can promote radiating efficiency is characterized in that, includes:
One heat-conducting substrate, it is arranged on the thermal source, to conduct the heat that this thermal source is produced; And
A plurality of radiating fins, it is arranged in parallel on this heat-conducting substrate, each radiating fin is formed with a plurality of protuberances in it on the direction that this heat-conducting substrate extends, and a plurality of protuberances of this of adjacent radiating fin in this radiating fin on the direction that this heat-conducting substrate extends for being staggered, with the heat that looses and produced except that this thermal source that this heat-conducting substrate is accepted.
2. heat abstractor according to claim 1 is characterized in that, these a plurality of radiating fins are made up of metal material.
3. heat abstractor according to claim 1 is characterized in that, these a plurality of radiating fins are made up of copper or aluminium material.
4. heat abstractor according to claim 1 is characterized in that, these a plurality of radiating fins are respectively a sheet structure or a column structure.
5. heat abstractor according to claim 1 is characterized in that the surface spacing of adjacent radiating fin is kept equidistantly.
6. heat abstractor according to claim 1 is characterized in that, these a plurality of protuberances are respectively circular arc, triangle or zigzag.
7. heat abstractor according to claim 1 is characterized in that, these a plurality of protuberances are respectively a long strip type structure, and its direction is for being parallel to this heat-conducting substrate.
8. heat abstractor according to claim 1 is characterized in that this heat abstractor includes a fan in addition, and it is arranged at the side or the top of these a plurality of radiating fins, removes the heat of these a plurality of radiating fins to loose.
9. heat abstractor according to claim 1 is characterized in that, these a plurality of radiating fins are to paste or welding manner is fixed on this heat-conducting substrate.
10. heat abstractor according to claim 1 is characterized in that, these a plurality of radiating fins take shape on this heat-conducting substrate with cutting, pressing mold or impact style.
11. the cooling system that can promote radiating efficiency is characterized in that, includes:
One circuit board;
One thermal source, it is installed on this circuit board; And
One heat abstractor, it includes:
One heat-conducting substrate, it is arranged on this thermal source, to conduct the heat that this thermal source is produced; And
A plurality of radiating fins, it is arranged in parallel on this heat-conducting substrate, each radiating fin is formed with a plurality of protuberances in it on the direction that this heat-conducting substrate extends, and a plurality of protuberances of this of adjacent radiating fin in this radiating fin on the direction that this heat-conducting substrate extends for being staggered, with the heat that looses and produced except that this thermal source that this heat-conducting substrate is accepted.
12. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that, this thermal source is a central processing unit or a chip.
13. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that, these a plurality of radiating fins are made up of metal material.
14. the cooling system of promoting radiating efficiency according to claim 13 is characterized in that, these a plurality of radiating fins are made up of copper or aluminium material.
15. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that, these a plurality of radiating fins are respectively a sheet structure or a column structure.
16. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that the surface spacing of adjacent radiating fin is kept equidistantly.
17. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that, these a plurality of protuberances are respectively circular arc, triangle or zigzag.
18. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that, these a plurality of protuberances are respectively a long strip type structure, and its direction is for being parallel to this heat-conducting substrate.
19. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that this heat abstractor includes a fan in addition, it is arranged at the side or the top of these a plurality of radiating fins, removes the heat of these a plurality of radiating fins to loose.
20. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that, these a plurality of radiating fins are to paste or welding manner is fixed on this heat-conducting substrate.
21. the cooling system of promoting radiating efficiency according to claim 11 is characterized in that, these a plurality of radiating fins take shape on this heat-conducting substrate with cutting, pressing mold or impact style.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910118322A CN101820735A (en) | 2009-02-27 | 2009-02-27 | Radiation device with enhanced radiation effect and related radiation system thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910118322A CN101820735A (en) | 2009-02-27 | 2009-02-27 | Radiation device with enhanced radiation effect and related radiation system thereof |
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| CN101820735A true CN101820735A (en) | 2010-09-01 |
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| CN200910118322A Pending CN101820735A (en) | 2009-02-27 | 2009-02-27 | Radiation device with enhanced radiation effect and related radiation system thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290383A (en) * | 2011-08-31 | 2011-12-21 | 昆山锦泰电子器材有限公司 | Radiating fin |
| CN103412626A (en) * | 2013-07-26 | 2013-11-27 | 昆山维金五金制品有限公司 | CPU radiating fin |
| CN103607869A (en) * | 2013-11-28 | 2014-02-26 | 张家港润盛科技材料有限公司 | Efficient heat dissipation aluminum plate |
| CN108255276A (en) * | 2018-04-26 | 2018-07-06 | 刘康 | Heat dissipation performance is not easy the air-cooled laptop decayed |
| CN112020268A (en) * | 2019-05-31 | 2020-12-01 | 讯凯国际股份有限公司 | Heat sink device |
| TWI781718B (en) * | 2021-08-06 | 2022-10-21 | 陳桂芳 | One-piece formed metal heat dissipation plate and heat dissipation device using thereof |
-
2009
- 2009-02-27 CN CN200910118322A patent/CN101820735A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290383A (en) * | 2011-08-31 | 2011-12-21 | 昆山锦泰电子器材有限公司 | Radiating fin |
| CN103412626A (en) * | 2013-07-26 | 2013-11-27 | 昆山维金五金制品有限公司 | CPU radiating fin |
| CN103607869A (en) * | 2013-11-28 | 2014-02-26 | 张家港润盛科技材料有限公司 | Efficient heat dissipation aluminum plate |
| CN108255276A (en) * | 2018-04-26 | 2018-07-06 | 刘康 | Heat dissipation performance is not easy the air-cooled laptop decayed |
| CN112020268A (en) * | 2019-05-31 | 2020-12-01 | 讯凯国际股份有限公司 | Heat sink device |
| TWI781718B (en) * | 2021-08-06 | 2022-10-21 | 陳桂芳 | One-piece formed metal heat dissipation plate and heat dissipation device using thereof |
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Open date: 20100901 |