CN101818866B - Led lamp - Google Patents
Led lamp Download PDFInfo
- Publication number
- CN101818866B CN101818866B CN2010101393758A CN201010139375A CN101818866B CN 101818866 B CN101818866 B CN 101818866B CN 2010101393758 A CN2010101393758 A CN 2010101393758A CN 201010139375 A CN201010139375 A CN 201010139375A CN 101818866 B CN101818866 B CN 101818866B
- Authority
- CN
- China
- Prior art keywords
- lampshade
- cooling base
- heat radiation
- led
- lamp socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 33
- 239000007789 gas Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 239000006185 dispersion Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 241000131853 Solifugae Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an LED lamp which comprises an LED chip, a heat dissipation base and a lampshade, wherein the lampshade is fixed on the heat dissipation base, the LED chip is positioned in the lampshade, and the lampshade is filled with the heat conduction gas. The LED lamp promotes the heat dissipation property by a large extent and can work better at lower temperature.
Description
Technical field
The present invention relates to a kind of light source, relate in particular to a kind of LED lamp.
Background technology
Prior art LED bulb lamp generally comprises radiator, globe holder and led chip, and said radiator one end is a lamp holder, other end fixed L ED chip and lampshade.
But the heat dispersion of LED lamp is very crucial, and too high temperature can cause the LED job insecurity, even the lost of life, and the led chip in the prior art LED lamp can only dispel the heat through the cooling base above it.
Therefore, be necessary to design radiating effect LED lamp better, simple in structure, to adapt to the needs of LED lantern fair field.
Summary of the invention
The technical problem that the present invention mainly solves provide a kind of heat dispersion significantly promote, can be at a lower temperature than the LED lamp of good berth.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: a kind of LED lamp is provided, comprises led chip, cooling base and lampshade, said lampshade is fixed in said cooling base; Said led chip is positioned at said lampshade, and said lampshade is filled with heat-conducting gas.
Wherein, said heat-conducting gas is hydrogen or helium.
Wherein, said cooling base is hollow and the long all around column radiator that a plurality of radial heat radiation fins are arranged, and said fin axially is provided with along said cooling base, and also is hollow structure.
Wherein, comprise the heat radiation lamp socket that is connected between said cooling base and the lampshade, said led chip is fixed on the said lamp socket, and said fin hollow structure open upper end communicates with the external world, the contiguous said heat radiation lamp socket of lower ending opening.
Wherein, the cross section of said fin hollow structure is a Pear-Shaped, and the upper end is the inclined-plane.
Wherein, it is groove structure that said cooling base connects heat radiation lamp socket one end, and said heat radiation lamp socket embeds in the said groove, and upper and lower surfaces is provided with the radiating fin around led chip.
Wherein, contiguous cooling base one end of said heat radiation lamp socket is provided with the bulge loop that fixes with said hollow cooling base inwall, and contiguous lampshade one end of said heat radiation lamp socket is provided with the scrobicular ring that fixes with said lampshade edge.
Wherein, said heat radiation lamp socket is provided with aspirating hole and the air admission hole that is communicated with the lampshade inner chamber.
Wherein, said hollow cooling base inner chamber is provided with the driving power that connects said led chip.
Wherein, said lampshade is a globe glass lamp shade.
Wherein, said led chip comprises the fluorescence coating that chip body and corresponding chip body exiting surface are provided with, and has the gap between said chip body and the fluorescence coating, and said gap communicates with the interior space of said lampshade.
The invention has the beneficial effects as follows: be different from the not enough situation of prior art LED bulb lamp heat dispersion; The present invention is except that designing for led chip cooling base dispels the heat; Also utilize the heat-conducting gas in the lampshade to carry out heat loss through convection in lampshade one side; Through the lampshade distribute heat, overcome prior art and no matter in lampshade, vacuumized or fill inert gas and cause the technical problem that can't effectively dispel the heat in lampshade one side to avoid the led chip oxidation, realize the effect of three-dimensional heat radiation; And; To prior art heat radiation is fully considered in the design of lampshade in addition in lampshade filling with inert gas or vacuumize make on the basis of no heat dissipation design the further situation of deterioration lampshade one side heat dispersion; The present invention overcomes the technological prejudice that prior art can't be carried out heat dissipation design basically in lampshade one side; Significantly promote heat dispersion, make led chip steady operation at a lower temperature, increase working life.
Description of drawings
Fig. 1 is the front schematic view of LED lamp embodiment one of the present invention;
Fig. 2 is the schematic perspective view of Fig. 1 LED lamp;
Fig. 3 is the generalized section of Fig. 1 LED lamp;
Fig. 4 is the schematic perspective view of Fig. 1 LED lamp;
Fig. 5 is the combination sketch map of lampshade and cooling base among Fig. 4;
Fig. 6 is the vertical view of Fig. 1 LED lamp;
Fig. 7 is the three-dimensional exploded view of LED lamp embodiment two of the present invention;
Fig. 8 is the front exploded view of LED lamp embodiment three of the present invention;
Fig. 9 is the three-dimensional exploded view of LED lamp embodiment four of the present invention;
Figure 10 is the three-dimensional exploded view of LED lamp embodiment five of the present invention.
The specific embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
See also Fig. 1, Fig. 2 and Fig. 3; LED lamp embodiment of the present invention comprises cooling base 10, lampshade 20 and led chip 30; Said lampshade 20 is fixed in said cooling base 10, and said led chip 30 is positioned at said lampshade 20, and said lampshade 20 is filled with heat-conducting gas 40.
During work; The heat that led chip 30 sends can dispel the heat through said cooling base 10 on the one hand; Heat the heat-conducting gas 40 in the lampshade 20 on the other hand, it is produced flow, hot gas arrives lampshade 20 inwalls; Heat reaches lampshade 20, and lampshade 20 is again with the outside air on heat conduction, radiation to the outer wall.
More than; The present invention is except that dispelling the heat for led chip 30 design cooling bases 10; Also utilize the heat-conducting gas 40 in the lampshade 20 to carry out heat loss through convection in lampshade 20 1 sides; Through lampshade 20 distribute heats, overcome prior art and no matter in lampshade, vacuumized or fill inert gas and cause the technical problem that can't effectively dispel the heat in lampshade one side to avoid the led chip oxidation, realize the effect of three-dimensional heat radiation; And; To prior art heat radiation is fully considered in the design of lampshade in addition in lampshade filling with inert gas or vacuumize make on the basis of no heat dissipation design the further situation of deterioration lampshade one side heat dispersion; The present invention overcomes the technological prejudice that prior art can't be carried out heat dissipation design basically in lampshade 20 1 sides; Significantly promote heat dispersion, make led chip 30 steady operation at a lower temperature, increase working life.
In one embodiment, said heat-conducting gas 40 is hydrogen or helium etc., possesses good performance of heat dissipation, and both thermal conductivity factors are respectively:
Hydrogen 0.163
Helium 0.144
Consult Fig. 2 and Fig. 3; In one embodiment, said cooling base 10 is hollow and the long all around column radiator that a plurality of radial heat radiation fins 11 are arranged, and said fin 11 axially is provided with along said cooling base 10; And also be hollow structure; The design of the column radiator of the radial heat radiation fin 11 of this tool possesses bigger area of dissipation, good heat dispersion performance.
Consult Fig. 2, Fig. 3 and Fig. 4; In one embodiment; Can comprise the heat radiation lamp socket 50 that is connected between said cooling base 10 and the lampshade 20; Said led chip 30 is fixed on the said lamp socket, and said fin 11 hollow structure open upper end communicate with the external world, the contiguous said heat radiation lamp socket 50 of lower ending opening.This embodiment is except dispelling the heat through common fin 11; Also fin 11 is designed to hollow; Be actually and utilized that fin 11 makes full use of this part space away from the bigger characteristics of the terminal surrounding space of root in radial fin 11 structures, increase area of dissipation.The more important thing is; Utilize fin 11 structures of hollow, make the air that carries 30 evolutions of heat of led chip carry out heat loss through convection up and down through said fin 11 hollow structures, hot-air can pass through said fin 11 hollow bulbs from bottom to top; Form the tunnel wind scorpion, accelerate the heat transmission.
Consult Fig. 5 together; In one embodiment, the cross section of said fin 11 hollow structures is a Pear-Shaped, and the upper end is the inclined-plane; This structure is except that the area of dissipation of further increasing fin 11; Also because of end structure on the fin 11 on inclined-plane, make the open upper end of fin 11 hollow structures strengthen, the air that is beneficial to fin 11 hollow bulbs flows out.
Consult Fig. 2 to Fig. 6, in one embodiment, it is groove structure (not indicating) that said cooling base 10 connects heat radiation lamp socket 50 1 ends; Said heat radiation lamp socket 50 embeds in the said groove, and upper and lower surfaces is provided with the radiating fin 51 around led chip 30, and this groove structure can contain heat radiation lamp socket 50; The multi-section position contacts with heat radiation lamp socket 50 to make cooling base 10 have more; Increase the path that heat transmits, and on heat radiation lamp socket 50, design radiating fin 51, also can further improve radiating effect.
Also consult Fig. 3; In one embodiment; Said heat radiation lamp socket 50 contiguous cooling base 10 1 ends are provided with the bulge loop 52 that fixes with said hollow cooling base 10 inwalls; Said heat radiation lamp socket 50 contiguous lampshade 20 1 ends are provided with the scrobicular ring 53 that fixes with said lampshade 20 edges, and this structure makes things convenient for the sealing and the installation of lampshade 20.
Also consult Fig. 3, in one embodiment, said heat radiation lamp socket 50 is provided with the aspirating hole 54 and air admission hole 55 that is communicated with lampshade 20 inner chambers, can utilize aspirating hole 54 to take out lampshade 20 vacuum, utilizes air admission hole 55 to fill heat-conducting gas 40 again.
Also consult Fig. 4, in one embodiment, said hollow cooling base 10 inner chambers are provided with the driving power 60 that connects said led chip 30, can protect driving power, water proof and dust proof well.
Wherein, said lampshade 20 can be a globe glass lamp shade 20.
In one embodiment, said led chip 30 comprises the fluorescence coating (figure does not show) that chip body and corresponding chip body exiting surface are provided with, and has the gap between said chip body and the fluorescence wafer, and said gap communicates with said lampshade 20 interior spaces.Such as, as shown in Figure 7, plurality of LEDs chip 30 is encapsulated on the aluminium base 70, between said lampshade 20 and led chip 30, establishes fluorescence wafer 80, has the gap between fluorescence wafer 80 and the aluminium base 70, communicates with the space of lampshade 20.Above-mentionedly between lampshade 20 and led chip 30, establish fluorescence wafer 80 and stay the scheme in gap that multiple implementation can be arranged; Such as said fluorescence wafer 80 are hierarchies; The phosphor powder layer (not indicating) that comprises cloche and cloche surface-coated; Or the single-glass structure, in said single-glass structure, sneak into fluorescent material.Thisly between lampshade 20 and led chip 30, establish fluorescence wafer 80 and stay the scheme in gap can avoid fluorescent material to receive directly that led chip 30 heating, temperature are too high to cause too fast aging problem, also just avoid because the too fast aging technical problem that causes occurring too early light decay even serious light decay of fluorescent material.In addition, can one deck silica gel layer be set, just can under the situation that need not vacuumize, avoid led chip 30 oxidations in the lampshade 20 like this on 30 surfaces of the led chip under this structure.
The form of said led chip can have multiple, and such as as shown in Figure 8, single chips 30 combines with lens 90, and this moment, lampshade 20 can be transparent for fully.Or as shown in Figure 9, led chip 30 directly is encapsulated on the heat radiation lamp socket 50 installation plurality of LEDs chip 30 on aluminium base 70 that can also be shown in figure 10.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (6)
1. a LED lamp comprises led chip, cooling base and lampshade, it is characterized in that; Said lampshade is fixed in said cooling base, and said led chip is positioned at said lampshade, and said lampshade is filled with heat-conducting gas; Said heat-conducting gas is hydrogen or helium, and said cooling base is hollow and the long all around column radiator that a plurality of radial heat radiation fins are arranged, and said fin axially is provided with along said cooling base; And also be hollow structure, said LED lamp comprises the heat radiation lamp socket that is connected between said cooling base and the lampshade, and said led chip is fixed on the said lamp socket; Said fin hollow structure open upper end communicates with the external world; The contiguous said heat radiation lamp socket of lower ending opening, the cross section of said fin hollow structure is a Pear-Shaped, and the upper end is the inclined-plane.
2. LED lamp according to claim 1 is characterized in that: it is groove structure that said cooling base connects heat radiation lamp socket one end, and said heat radiation lamp socket embeds in the said groove, and upper and lower surfaces is provided with the radiating fin around led chip.
3. LED lamp according to claim 1 is characterized in that: contiguous cooling base one end of said heat radiation lamp socket is provided with the bulge loop that fixes with said hollow cooling base inwall, and contiguous lampshade one end of said heat radiation lamp socket is provided with the scrobicular ring that fixes with said lampshade edge.
4. LED lamp according to claim 1 is characterized in that: said heat radiation lamp socket is provided with aspirating hole and the air admission hole that is communicated with the lampshade inner chamber.
5. LED lamp according to claim 1 is characterized in that: said hollow cooling base inner chamber is provided with the driving power that connects said led chip.
6. LED lamp according to claim 1; It is characterized in that: said led chip comprises the fluorescence coating that chip body and corresponding chip body exiting surface are provided with; Have the gap between said chip body and the fluorescence coating, said gap communicates with the interior space of said lampshade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101393758A CN101818866B (en) | 2010-03-29 | 2010-03-29 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101393758A CN101818866B (en) | 2010-03-29 | 2010-03-29 | Led lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101818866A CN101818866A (en) | 2010-09-01 |
| CN101818866B true CN101818866B (en) | 2012-11-14 |
Family
ID=42654069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101393758A Expired - Fee Related CN101818866B (en) | 2010-03-29 | 2010-03-29 | Led lamp |
Country Status (1)
| Country | Link |
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| CN (1) | CN101818866B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101929668B (en) * | 2010-10-07 | 2012-07-25 | 东莞市万丰纳米材料有限公司 | Radiating module |
| WO2012095929A1 (en) * | 2011-01-13 | 2012-07-19 | パナソニック株式会社 | Substrate for mounting, light emitting device, and lamp |
| CN102072475B (en) * | 2011-01-25 | 2012-09-05 | 惠州雷士光电科技有限公司 | Multi-stage cooling LED (Light Emitting Diode) lamp |
| JP5475732B2 (en) * | 2011-02-21 | 2014-04-16 | 株式会社東芝 | Lighting device |
| SG185159A1 (en) * | 2011-04-26 | 2012-11-29 | Novalite Technology Pte Ltd | Gas cooled light emitting diodes |
| CN102147070B (en) * | 2011-05-17 | 2013-03-20 | 潘宇强 | Led lamp |
| CN102748738A (en) * | 2012-07-08 | 2012-10-24 | 任永斌 | Semiconductor light radiator filled with hydrogen or helium |
| CN103363355A (en) * | 2013-07-08 | 2013-10-23 | 华南理工大学 | Two-channel radiating LED lamp |
| WO2016061813A1 (en) * | 2014-10-24 | 2016-04-28 | 苏州汉克山姆照明科技有限公司 | Lamp bulb having hollow led luminous body |
| CN105402618A (en) * | 2015-12-04 | 2016-03-16 | 江阴乐圩光电股份有限公司 | Led lamp |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201137904Y (en) * | 2007-11-23 | 2008-10-22 | 张家港金田高科电子有限公司 | Lamp radiating assembly |
| CN101307867A (en) * | 2008-05-14 | 2008-11-19 | 浙江大学 | Liquid immersion type packaged large power LED light source |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040201990A1 (en) * | 2003-04-10 | 2004-10-14 | Meyer William E. | LED lamp |
| CN101080159A (en) * | 2007-06-28 | 2007-11-28 | 上海隆光蜃景光电科技有限公司 | A wind channel heat radiator |
-
2010
- 2010-03-29 CN CN2010101393758A patent/CN101818866B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201137904Y (en) * | 2007-11-23 | 2008-10-22 | 张家港金田高科电子有限公司 | Lamp radiating assembly |
| CN101307867A (en) * | 2008-05-14 | 2008-11-19 | 浙江大学 | Liquid immersion type packaged large power LED light source |
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| Publication number | Publication date |
|---|---|
| CN101818866A (en) | 2010-09-01 |
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Application publication date: 20100901 Assignee: Zhejiang Emitting Optoelectronic Technology Co., Ltd. Assignor: Cai Hong Contract record no.: 2012330000527 Denomination of invention: Radiator of LED banks License type: Exclusive License Record date: 20121030 |
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Owner name: DONGGUAN HULUBAO FURNITURE CO., LTD. Free format text: FORMER OWNER: CAI HONG Effective date: 20140129 |
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Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 523900 DONGGUAN, GUANGDONG PROVINCE |
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Effective date of registration: 20140129 Address after: 523900 Guangdong city of Dongguan province Dongcheng District Dongguan long way cattle Hill section qiantou emerging industrial zone Patentee after: Dongguan calabash Furniture Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Qianjin Road Po Road Tiansan bota Industrial Zone 43 Patentee before: Cai Hong |
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Owner name: GUANGDONG HULUBAO CULTURE TECHNOLOGY CO., LTD. Free format text: FORMER NAME: DONGGUAN HULUBAO FURNITURE CO., LTD. |
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Address after: Hsinchu Songshan Lake high tech Industrial Development Zone of Dongguan City, Guangdong province 523900 new No. 4 15 101.. Patentee after: GUANGDONG HULUBAO CULTURE TECHNOLOGY CO., LTD. Address before: 523900 Guangdong city of Dongguan province Dongcheng District Dongguan long way cattle Hill section qiantou emerging industrial zone Patentee before: Dongguan calabash Furniture Co., Ltd. |
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Granted publication date: 20121114 Termination date: 20140329 |