CN101814281A - Cooling of using in the electric performance test of flat display substrate and damp-proof device - Google Patents
Cooling of using in the electric performance test of flat display substrate and damp-proof device Download PDFInfo
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- CN101814281A CN101814281A CN201010114278A CN201010114278A CN101814281A CN 101814281 A CN101814281 A CN 101814281A CN 201010114278 A CN201010114278 A CN 201010114278A CN 201010114278 A CN201010114278 A CN 201010114278A CN 101814281 A CN101814281 A CN 101814281A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/04—Auxiliary arrangements, e.g. for control of pressure or for circulation of fluids
- H01M8/04007—Auxiliary arrangements, e.g. for control of pressure or for circulation of fluids related to heat exchange
- H01M8/04014—Heat exchange using gaseous fluids; Heat exchange by combustion of reactants
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Abstract
The invention discloses a kind of cooling and damp-proof device, be used to utilize the substrate surface of pressure gas cooling flat-panel display panel, prevent that simultaneously hydrogenesis contained in the air from forming water droplet and dropping on the substrate surface.This device comprises: flow velocity is used to control flow velocity; Cold/the hot gas generation unit, the pressure gas that is used for providing is divided into hot and cold air-flow; Well heater is used for the cold airflow heating of will discharge from cold/hot gas generation unit; The cold airflow nozzle is used for the jet surface cold air to the FPD substrate, cools off its surface, and described cold air is to give off and carry out temperature control by well heater from cold/hot gas generation unit; Moistureproof unit is used for spraying thermal current around the cold airflow of ejection, realizes the protection against the tide of FPD substrate.When device of the present invention is applied in the existing heat-flow device, then can under condition, carry out electric performance test to the FPD substrate above and below normal temperature, strengthen the FPD reliability of products.
Description
Technical field
The present invention relates to the device that in the electric performance test of flat-panel display panel (FDP) substrate, uses, especially relate to cooling and damp-proof device, this device adopts the surface of the substrate of pressure gas cooling flat-panel display panel, and is used for preventing the condensate moisture that air is contained and forming the surface that water droplet drops on described substrate in the substrate cooling procedure.
Background technology
The description of prior art
As is known in the art, flat-panel monitor (FPDs) is being researched and developed as display device energetically to substitute traditional cathode-ray tube (CRT).The representative instance of this flat-panel display panel comprises LCD (LCDs), Plasmia indicating panel (PDPs), field-emitter display (FEDs), and vacuum tube fluorescence display (VFDs).
This FPD makes through the following steps, and described step comprises the manufacturing lower basal plate, makes upper substrate, and with the top and the bottom substrate bonding together.More specifically, in order to make lower basal plate, on exposed glass plate, form a plurality of unit, in each unit, many horizontal lines and perpendicular line are formed mutual intersection according to matrix-style, and on each point of crossing between horizontal line and the perpendicular line, form pixel cell with transparent pixels electrode.In addition, form pixel cell in thin film transistor (TFT), described thin film transistor (TFT) is connected with perpendicular line and pixel electrode with horizontal line.The unit that will form on unprocessed glass plate cuts out via scribe step, and scribe step is immediately following after checking step.Cut out each unit from unprocessed glass plate in this manner, promptly, respectively lower basal plate is adhered on the upper substrate of finishing in the upper substrate manufacturing step, and will be used to drive the driving circuit of pixel cell and various assembled, make FPD then to the top and the bottom substrate.
Simultaneously, with the device of probe station as the transistorized electric property of the circuit diagram that is used to test the FPD substrate, wherein, probe station is by realizing probe and transistor contacts each the very little transistorized electric property that forms on the FPD substrate is tested.
The same with the general semiconductor device, the electric property of test transistor on the FPD substrate usually is subjected to Temperature Influence.Especially, under the situation that adopts FPD backlight, the sudden change of the experience temperature when work of the transistor in the FPD substrate, this is owing to the heat of As time goes on generation backlight and because the temperature variation that external environment condition causes.For this reason, optionally put on heat on the FPD when need and make FPD in exploitation after, the electric property of test FPD.For example, can come the device of control basal plate temperature to be installed on the LCD probe system by heated substrates to carry out such test.
Fig. 1 has shown a kind of common apparatus, and it is by the hot plate method heated substrates.This method is carried out according to following manner, promptly, hot plate 2 is arranged on the platform 1 as firing equipment, on be placed with substrate S, and will pop one's head in by linear drive 4 and 3 to move along the X-axis and the Y-axis of platform 1, with the transistor of test via the substrate S of hot plate 2 heating.Yet when device adopted this hot plate 2, hot plate 2 only heated the regional area of substrate S.Therefore, the problem that exists test in the zone of heating, to carry out.
Fig. 2 has shown another kind of common apparatus, and it is by the heat flow method heated substrates.This device has the hot blast exhaust apparatus, the hot-fluid 40 of probe on 20 need be installed on the linear drive 20 like this, and wherein linear drive 20 moves along the X-axis and the Y-axis of platform 10, on be placed with substrate S.That is to say, will pop one's head in 30 by linear drive 20 when moving with hot-fluid 40, hot-fluid 40 with spray hot wind to substrate S, thereby heated substrates S.Therefore, might test the whole zone of substrate S.Yet, owing to be to carry out being higher than under the temperature of normal temperature, be lower than under the situation of normal temperature the problem that can not test the transistor of substrate S so exist when temperature conditions by hot-fluid 40 heated substrates S.
The FPD product mainly only is used in indoorly in the past, and portable apparatus is used for the position of contiguous human body, and this just needn't test the FPD substrate being lower than under the cold state of normal temperature.Yet, recently,, comprising the navigation that is used for automobile along with the amplification of demand FPD product scope, the situation that requires the FPD product to be exposed under the temperature that is lower than normal temperature is increased sharply.Therefore, this surge inevitable requirement is tested the transistorized electric property on the FPD substrate in exploitation with when making the FPD product.
In the past, for the FPD substrate is carried out low-temperature test, it must be cut into substrate a plurality of fritters, to test fritter in cooling chamber, perhaps tests by red tape.
Summary of the invention
Therefore, the present invention is the problems referred to above that occur in the prior art in order to solve, and the object of the present invention is to provide and be used for the cooling and the damp-proof device that use in the electric property of flat panel display (FDP) substrate, wherein or even be lower than under the sub-cooled situation of normal temperature, cooling and damp-proof device not only allow the electric property on the FPD whole area of substrates is carried out simply and easily test, when the FPD substrate is cooled to low temperature following time, can also prevent to produce moisture.
In order to realize this purpose, provide here to be used for the cooling and the damp-proof device that use in the electric property of flat panel display (FPD) substrate, this device comprises: flow velocity is used to control the flow velocity of introducing from the external world; Cold/the hot gas generation unit, the pressure gas that is used for obtaining from flow velocity is divided into cold airflow and thermal current, and discharges cold airflow and thermal current; Well heater is used to heat the cold airflow of discharging from cold/hot gas generation unit, thereby the temperature of air-flow is controlled to the required temperature of electric property that is used to test the FPD substrate; Power supply is used to the heater fed heat to generate the source; The cold airflow nozzle is used for the jet surface cold air to the FPD substrate, thereby cools off its surface, and described cold air is discharged from cold/hot gas generation unit, and carries out temperature control by well heater; Moistureproof unit is used for spraying thermal current around the cold airflow of cold airflow nozzle ejection, and described thermal current is discharged from cold/hot gas generation unit, thereby realizes the protection against the tide of FPD substrate; And control module, be used to control the work of flow velocity and power supply.
Here, cold/hot gas generation unit can be made of vortex tube.
In addition, well heater has such structure, and promptly in this structure, the heat that is connected to power supply generates electric wire and embeds in the ceramic body.
In addition, power supply can be linear DC power supply.
In addition, moistureproof unit can comprise: the thermal current guide element, the hot gas of this element is connected to cold/hot gas generation unit is discharged the end, and combine with the top edge of cold airflow nozzle, thereby thermal current is introduced in the thermal current guide element, the thermal current guide element has the ejiction opening of one or more inclinations, thereby the thermal current of introducing is discharged around the cold airflow nozzle obliquely; And thermal current ejection nozzle, it extends and surrounds the cold airflow nozzle from the thermal current guide element, the thermal current ejection nozzle provides the thermal current of discharging via tilt port, and it is ejected into forms cyclone on the substrate surface simultaneously, thermal current can make the temperature of cold air be elevated under the normal temperature like this, described cold air is with the surface cool of substrate, thereby prevents to produce aqueous vapor on the surface of substrate.
In addition, device of the present invention can further comprise: the operation valve of thermal current flow velocity is used to be controlled under the control of flow velocity the flow velocity from cold/hot gas generation unit thermal current that discharge and that offer moistureproof unit; And the ratio operation valve of cold air and hot gas, its thermal current that is arranged on cold/hot gas generation unit is discharged side, cold air is to the unlatching of the ratio operation valve of hot gas or to close be to finish with the operation valve of thermal current flow velocity is collaborative, thereby the cold air that control is discharged by cold/hot gas generation unit flows to the ratio of thermal current.
Cold air can be connected with flow velocity by pipeline to the ratio operation valve of hot gas, passes through flow velocity like this, and the hot discharge gas that described cold air will have been discharged to hot gas is to the outside.
Simultaneously, well heater has the cold airflow temperature sensor, it is used to detect the temperature by the cold airflow of heater heats, device of the present invention can further comprise temperature controller, be used to control power supply, thereby according to the control of the controller that on the basis of the temperature information of detected cold airflow, carries out, the temperature of coming control heater that cold airflow is heated.
Apparatus of the present invention with above-mentioned structure can also be avoided producing aqueous vapor on the surface of FPD substrate with the surface cool of FPD substrate below normal temperature simultaneously.Therefore, device of the present invention can be used for simply and easily the electric property of FPD substrate being tested at low temperatures.
If device of the present invention is installed in and is used for existing heat-flow device, then may not only be higher than under the hot conditions of normal temperature, and can also be lower than under the sub-cooled condition of normal temperature, the FPD substrate is carried out electric performance test, therefore, device of the present invention helps to strengthen the FPD reliability of products.
Description of drawings
Specific descriptions in conjunction with the drawings subsequently, above-mentioned and other purpose of the present invention, feature and advantage will become clearer, wherein:
Fig. 1 is the end face view that utilizes the common apparatus of hot plate method heated substrates;
Fig. 2 is the end face view that utilizes the common apparatus of heat flow method heated substrates;
Fig. 3 has shown the total of devices in accordance with embodiments of the present invention;
Figure 4 shows that viewgraph of cross-section as the vortex tube of cold/hot gas generation unit example of Fig. 3;
Fig. 5 has shown the concrete structure of the well heater of Fig. 3; And
Fig. 6 is the moistureproof cellular construction of presentation graphs 3 and the viewgraph of cross-section of work.
Embodiment
Next, will introduce the preferred embodiments of the present invention with reference to the accompanying drawings.In ensuing description and accompanying drawing, identical reference numerals is used to represent identical or similar parts, and will be omitted about this being repeated in this description of same or similar parts.
Fig. 3 has shown the total of devices in accordance with embodiments of the present invention.
As shown in Figure 3, according to embodiments of the invention, the cooling and the damp-proof device that are used for flat panel display (FPD) substrate electric property comprise flow velocity 110, this flow velocity be used for control from extraneous (as, forbay) flow velocity of Yin Ruing, cold/hot gas generation unit 120, this is cold/and pressure gas that the hot gas generation unit is used for providing from flow velocity is divided into cold airflow and thermal current, and discharges cold airflow and thermal current; Well heater 130 is used for the cold airflow from cold/hot gas generation unit 120 discharges is heated to suitable temperature; Power supply 140 is used to well heater 130 heat supplieds to generate the source; Cold airflow nozzle 150 is used for the jet surface cold air to the FPD substrate, thereby cools off its surface, and described cold air is discharged from cold/hot gas generation unit 120, and by well heater 130 control temperature; Moistureproof unit 160 is used for spraying thermal current around the cold airflow of ejection, thereby realizes the protection against the tide of FPD substrate; And control module 170, be used to control the work of flow velocity 110 and power supply 140.
Cold/hot gas generation unit 120 is a kind of equipment, this equipment is used for after pressure gas is divided into cold airflow and thermal current, to discharge from the pressure gas that flow velocity 110 obtains, wherein in an embodiment of the present invention vortex tube will be applied to cold/hot gas generation unit 120.Promptly, as shown in Figure 4, if pressure gas is offered vortex tube 121, superfast air-flow whirlpool appears being in swirl chamber 121a, wherein vortical flow (main whirlpool) is drawn towards hot gas outlet 121b, by operation valve 121c the part vortical flow is discharged via hot gas outlet 121b like this, remaining vortical flow is returned from operation valve 121c, and flow to cold air and export 121d and form second eddy current simultaneously.Meanwhile, second eddy current flow is crossed an area of low pressure, and described area of low pressure forms in the inboard of main eddy current, so loses heat, flow to cold air outlet 121d then.In two kinds of vortical flow (forming whirlpool on the same direction and in same angular velocity), the time that the rotation of the air particle of internal gas flow is once spent equals the air particle of outer gas stream is rotated once institute's time spent, and this is because they form whirlpool with same angular velocity.Therefore, the movement velocity of the particle of inner gas is less than outer gas stream.This species diversity that exists in movement velocity means that the kinetic energy of internal flow reduces, and the kinetic energy of loss is converted into heat energy, with the air themperature rising of outer gas stream, further reduces the air themperature of internal gas flow.Of the present invention cold/hot generation unit 120 adopts this principle of work of vortex tubes 121.
In an embodiment of the present invention, linear DC power supply can be used as power supply 140, is used to well heater 130 to provide heat to generate the source.Although common heat generates element and adopts AC power supplies, because the 60Hz noise of AC power supplies then can give rise to trouble when the electric property of test base.Therefore, linear DC power supply is adopted in expectation, and it can not cause the problems referred to above.
Simultaneously, as shown in Figure 3, thermal current flow control valve 130 can be used for controlling the flow velocity of thermal current, and discharge and the thermal current that provide for moistureproof unit 160 under the control of flow velocity 110 from cold/hot gas generation unit is provided this thermal current.In addition, in the thermal current waste side of cold/hot gas generation unit 120, have cold air to hot gas ratio operation valve 190, it is by flow velocity 110 controls.Cold air is to the unlatching of hot gas ratio operation valve 190 or to close be operation valve 180 collaborative finishing with the thermal current flow velocity, thereby control is by cold/cold airflow that hot gas generation unit 120 is discharged and the ratio between the thermal current.Especially, cold air can be substituted by the above-mentioned operation valve 121c of vortex tube 121 or constitute jointly to hot gas ratio operation valve 190.Cold air is connected on the flow velocity 110 by pipeline P ' to hot gas ratio operation valve 190, thereby by flow velocity 110, thermal current is discharged into the outside.
Simultaneously, reference numerals 210 among Fig. 3 and 220 expression reference temperature sensor 210 and reference temperature controllers 220, described reference temperature sensor 210 is installed in (not shown) on the platform, platform is provided with substrate S, this is in the electric property of checking FPD substrate S under cold conditions, can set reference temperature; Described reference temperature controller 220 is used to operate reference temperature sensor 210, wherein by control module 170 control reference temperature controllers 220.
Cooling of introducing above of the present invention and damp-proof device can be assembled together with existing heat-flow device, like this, carry out electric performance test for the FPD whole area of substrates and will become simple and convenient, can not only be under hot conditions, and can also carry out electric performance test being lower than under the sub-cooled condition of normal temperature.
Next, with the course of work of introducing for cooling of the present invention and damp-proof device.
At first, under the control of control module 170, after being controlled at pressure gas under suitable flow velocity and the pressure by flow velocity 110, the pressure gas that will be incorporated into from the external world the flow velocity 110 offers cold/hot gas generation unit 120.
According to the whirlpool phenomenon in the vortex tube 121, the pressure gas of introducing cold/hot gas generation unit 120 is divided into cold air and hot gas, cold air is drained into cold air outlet 121d like this, and hot gas is drained into hot gas outlet 121c.Meanwhile, along with cold air to the unlatching of hot gas ratio operation valve 190 or close and the cold air of discharging is determined the temperature of cold air and hot gas to the ratio of hot gas, cold air is to the unlatching of hot gas ratio operation valve 190 or close operation valve 180 collaborative finishing with the thermal current flow velocity.That is to say that if cold air is opened gradually to hot gas ratio operation valve, the gas gross that is discharged into hot gas outlet 121c like this increases, the gas gross that is discharged into cold air outlet 121d then reduces, thereby the temperature of cold air further reduces.On the contrary, if cold air is closed gradually to hot gas ratio operation valve 190, the gas gross that is discharged into hot gas outlet 121c reduces, and is discharged into the gas gross increase of cold air outlet 121d, and then the temperature of cold air reduces lessly.
Generally, if at 5kg/cm
2Pressure under cold air be 2: 8 to the ratio of hot gas, then might obtain than gas supplied 65 ℃ refrigerating gas of low temperature more.The temperature of supposing supply gas is a normal temperature, and 25 ℃, then approximately-40 ℃ cold air is disposed to cold air outlet 121d, and with the hot gas outlet 121c of about 65 ℃ hot discharge gas to opposition side.
The cold air of as above discussing that will be disposed to cold air outlet 121d offers well heater 130, and be heated to the required temperature of electric performance test by well heater 130, be disposed on the surface of substrate S through cold airflow nozzle 150 then, therefore with the surface cool of substrate S to suitable temperature for electric performance test.
In addition, the hot gas that is disposed to hot gas outlet 121c offers moistureproof unit 160 via the operation valve 180 of hot gas flow velocity, wherein as shown in Figure 6, hot gas is discharged obliquely by the inclination injection orifice 161a that thermal current guide element 161 has round cold air nozzle 150, thereby the hot gas that forms low pressure in hot gas nozzle 162 revolves, described hot gas nozzle 162 be enclosed in cold airflow nozzle 150 around.As a result, the surface of facing substrate S is mobile from the teeth outwards from the cold air of cold airflow nozzle 150 ejections, and mixes with the hot gas of thermal current nozzle 162 ejections.Therefore, the temperature of cold air is elevated to normal temperature, can not produce aqueous vapor like this on substrate S.
Although be to have introduced the preferred embodiments of the present invention here in the mode that exemplifies, it will be understood by those skilled in the art that into, various distortion, interpolation and replacement in not breaking away from appended claims of the present invention scope of disclosure and spirit all are possible.
Claims (8)
1. one kind is cooled off and damp-proof device, uses in the electric property of flat panel display substrate, and this device comprises:
Flow velocity is used to control the flow velocity of introducing from the external world;
Cold/the hot gas generation unit, the pressure gas that is used for providing from flow velocity is divided into cold airflow and thermal current, and discharges cold airflow and thermal current;
Well heater is used to heat the cold airflow of discharging from cold/hot gas generation unit, thereby the temperature of air-flow is controlled to the required temperature of electric property that is used for the flat panel display substrate;
Power supply is used to the heater fed heat to generate the source;
The cold airflow nozzle is used for the jet surface cold air to flat display substrate, thereby cools off described surface, and described cold air is discharged from cold/hot gas generation unit, and carries out temperature control by well heater;
Moistureproof unit is used for spraying thermal current around the cold airflow of cold airflow nozzle ejection, thereby realizes the protection against the tide of flat display substrate, and described thermal current is discharged from cold/hot gas generation unit; And
Control module is used to control the work of flow velocity and power supply.
2. device as claimed in claim 1, wherein cold/hot gas generation unit is a vortex tube.
3. device as claimed in claim 1, wherein well heater has such structure, and in this structure, the heat that is connected to power supply generates electric wire and embeds in the ceramic body.
4. device as claimed in claim 1, wherein power supply is linear DC power supply.
5. device as claimed in claim 1, wherein moistureproof unit comprises:
The thermal current guide element, described thermal current guide element is connected to the hot gas of cold/hot gas generation unit and discharges the end, and combine with the top edge of cold airflow nozzle, thereby thermal current is introduced in the thermal current guide element, the thermal current guide element has the ejiction opening of one or more inclinations, and then the thermal current of introducing is discharged obliquely about the cold airflow nozzle; And
The thermal current ejection nozzle, described thermal current ejection nozzle extends and surrounds the cold airflow nozzle from the thermal current guide element, the thermal current ejection nozzle provides the thermal current of discharging via tilt port, and described thermal current is ejected on the surface of substrate and forms cyclone simultaneously, thermal current can make the temperature of cold air be elevated under the normal temperature like this, this cold air is with the surface cool of substrate, thereby prevents to produce aqueous vapor on the surface of substrate.
6. device as claimed in claim 1 further comprises:
The operation valve of thermal current flow velocity is used to be controlled under the control of flow velocity the flow velocity from cold/hot gas generation unit thermal current that discharge and that offer moistureproof unit; And
Cold air is to the ratio operation valve of hot gas, described cold air is arranged on the thermal current discharge side of cold/hot gas generation unit to the ratio operation valve of hot gas, cold air is to the unlatching of the ratio operation valve of hot gas or to close be to finish with the operation valve of thermal current flow velocity is collaborative, thereby the cold air that control is discharged by cold/hot gas generation unit flows to the ratio of thermal current.
7. device as claimed in claim 6, wherein cold air is to be connected with flow velocity by pipeline to the ratio operation valve of hot gas, thus by flow velocity, described cold air arrives the outside to hot gas with the hot discharge gas of discharging.
8. device as claimed in claim 1, wherein well heater has the cold airflow temperature sensor, be used to detect temperature by the cold airflow of heater heats, this device further comprises temperature controller, be used to control power supply, thereby based on the control of the controller of the temperature information of detected cold airflow, the temperature of coming control heater that cold airflow is heated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090014879A KR101011457B1 (en) | 2009-02-23 | 2009-02-23 | Apparatus for cooling and desiccating FPD substrate during the electric property test |
| KR10-2009-0014879 | 2009-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101814281A true CN101814281A (en) | 2010-08-25 |
| CN101814281B CN101814281B (en) | 2012-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101142783A Active CN101814281B (en) | 2009-02-23 | 2010-02-22 | Cooling and damp-proof device for electric performance test of flat display substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4919439B2 (en) |
| KR (1) | KR101011457B1 (en) |
| CN (1) | CN101814281B (en) |
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| CN108773258A (en) * | 2018-08-10 | 2018-11-09 | 大连民族大学 | Electric vehicle heating system based on vortex tube |
| CN109085707A (en) * | 2018-08-31 | 2018-12-25 | 武汉华星光电技术有限公司 | LCD tester |
| CN111537800A (en) * | 2020-05-25 | 2020-08-14 | 国家电网有限公司 | Intelligent power transformer dielectric loss factor and insulation resistance measuring device |
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| JP5741893B2 (en) | 2010-09-03 | 2015-07-01 | 株式会社ジェイテクト | Camshaft device |
| KR101970557B1 (en) * | 2012-08-07 | 2019-04-19 | 엘지디스플레이 주식회사 | Cooling system and method for pc of cooling manufacturing execution device |
| CN109186891B (en) * | 2018-09-14 | 2020-10-09 | 安徽苏立科技股份有限公司 | Heating pipe sealing test equipment |
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| CN1920585A (en) * | 2005-08-25 | 2007-02-28 | 日本电产理德株式会社 | Substrate detector and substrate detection method |
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| CN111537800A (en) * | 2020-05-25 | 2020-08-14 | 国家电网有限公司 | Intelligent power transformer dielectric loss factor and insulation resistance measuring device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010198015A (en) | 2010-09-09 |
| KR101011457B1 (en) | 2011-01-28 |
| CN101814281B (en) | 2012-09-05 |
| JP4919439B2 (en) | 2012-04-18 |
| KR20100095865A (en) | 2010-09-01 |
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