CN101813746A - Detection circuit for printed circuit boards - Google Patents
Detection circuit for printed circuit boards Download PDFInfo
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- CN101813746A CN101813746A CN201010172620A CN201010172620A CN101813746A CN 101813746 A CN101813746 A CN 101813746A CN 201010172620 A CN201010172620 A CN 201010172620A CN 201010172620 A CN201010172620 A CN 201010172620A CN 101813746 A CN101813746 A CN 101813746A
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- detection
- printed circuit
- circuit board
- detection circuit
- early warning
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- 238000001514 detection method Methods 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 claims description 11
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 4
- 230000009977 dual effect Effects 0.000 claims description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 8
- 230000005856 abnormality Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention provides a detection circuit suitable for detecting printed circuit boards. The detection circuit at least comprises a power supply device, a plurality of detection components, an early warning component and a plurality of wires, wherein the power supply device is used to supply power to the detection circuit; the detection components are placed in a special area of a printed circuit board respectively in order to detect whether the work of electronic elements in the special area is abnormal; the early warning component is used to send early warning signals when at least one of the detection components detects that the work of the electronic elements is abnormal; and the wires are electrically connected with the power supply device, the detection components and the early warning component. When the detection circuit is adopted, the detection components in the circuit are placed in the special area of the printed circuit board, so circuit abnormalities of the printed circuit board are easy to track and detect in time. In addition, as the detection circuit is independent of function circuits in the printed circuit board, the set control function expected to be achieved by the detection circuit cannot be affected.
Description
Technical Field
The invention relates to a printed circuit board of a liquid crystal television, in particular to a circuit design for conveniently detecting the printed circuit board.
Background
In many everyday household appliances, the control circuit mainly implements the relevant application functions through a printed circuit board, on which not only various connectors and electronic components are included, but also a dedicated heat sink for dissipating heat of the electronic components. Generally, fixing electronic components to a printed circuit board is mostly performed by using solder in an SMT (Surface mount Technology) process or a DIP (dual in-line Package) process.
However, in the manufacturing, transporting and product assembling processes of the printed circuit board, the electronic component solder joints on the printed circuit board are often abnormal due to human factors or external factors, and thus the function of part of the circuit is abnormal or fails. Actual data statistics show that a lot of manpower is consumed and the manufacturing process cost is increased due to the fact that the terminal product cannot be normally used due to the welding abnormity of the electronic element.
How to design a simple and easy-to-operate warning circuit to detect the circuit abnormality of the printed circuit board early and reduce the occurrence rate of defective products is one of the issues to be considered urgently by technical workers in the related art.
Disclosure of Invention
Aiming at the possible abnormal phenomena of the printed circuit board in the production, manufacture, transportation and product assembly processes in the prior art, the invention provides a detection circuit for the printed circuit board, which sends out an early warning signal and is easy to identify when detecting circuit faults.
According to an aspect of the present invention, there is provided a detection circuit adapted to detect a printed circuit board, comprising at least: a power supply device for supplying power to the detection circuit; a plurality of detection components which are respectively arranged in a specific area of the printed circuit board to detect whether the electronic elements on the specific area work abnormally or not; the early warning assembly is used for sending out an early warning signal when at least one of the detection assemblies detects that the electronic element works abnormally; and a plurality of wires electrically connected with the power supply device, the detection assembly and the early warning assembly.
Wherein, the detection assembly is placed on the printed circuit board by adopting SMT (Surface Mounted Technology) and/or DIP (Dual In-line Package) Technology. Preferably, at least two detection assemblies are provided on each of the four sides of the printed circuit board. And the two detection assemblies on each edge are respectively placed by adopting an SMT process and a DIP process.
The specific area of the printed circuit board is an area with larger mechanical stress, an area with the narrowest circuit trace width or an area with larger weight of electronic components thereon. Specifically, the areas of the printed circuit board where mechanical stress is greater include where the connector is located and where it is furthest from the printed circuit board screw attachment holes. The area of the printed circuit board where the electronic component is heavy includes the location of the heat spreader and corresponds to the inspection assembly of the heat spreader with a pad diameter no greater than the pad diameter of the heat spreader.
Wherein, the early warning subassembly is LED pilot lamp, bee calling organ or wireless transmitting device.
The width of the lead of the detection circuit is not more than the narrowest width of the circuit wire in the printed circuit board.
By adopting the detection circuit, the detection assembly in the circuit is placed in a specific area of the printed circuit board, such as an area which is easily damaged due to larger mechanical stress, an area with the narrowest wiring width or an area with heavier electronic components, so that the situation that circuit abnormality possibly occurs on the printed circuit board can be easily tracked and detected in time. In addition, the power supply device and the early warning component in the detection circuit form a detection loop independent of related functional circuits in the printed circuit board together with the detection component, so that the intended control function expected to be realized by the functional circuits is not influenced.
Drawings
The various aspects of the present invention will become more apparent to the reader after reading the detailed description of the invention with reference to the attached drawings. Wherein,
FIG. 1 is a schematic diagram illustrating a structure of a detection circuit according to an embodiment of the present invention; and
fig. 2 shows a schematic diagram of the position distribution of the optimal placement areas of the detection components in the detection circuit shown in fig. 1.
Detailed Description
Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a schematic diagram illustrating a structure of a detection circuit according to an embodiment of the invention. Referring to fig. 1, the detection circuit includes a lead 100, a detection component 102, a power supply 104, and an early warning component 106. The wire 100 is used to electrically connect a plurality of detecting elements 102, a power supply 104 and a warning element 106, for example, the wire 100 is electrically connected to the power supply 104 and the detecting elements 102, the wire 100 is also electrically connected to the warning element 106 and the detecting elements 102, and the wire can also be electrically connected to two detecting elements 102. In an embodiment of the present invention, the trace width of the conductive line 100 in the detection circuit is not greater than the narrowest conductive line of the trace width of the control circuit on the printed circuit board.
The power supply device 104 is disposed in the detection circuit to independently provide a power supply for the detection circuit. That is, the detecting component 102 and the early warning component 106 are electrically connected to form a complete current loop through the power supply device. The early warning component 106 is disposed at any position of the detection circuit, and sends out an early warning signal when at least one of the detection components 102 detects that the electronic components on the printed circuit board are abnormal in operation. In one embodiment of the present invention, the warning module 106 is an LED indicator light. In another embodiment of the present invention, the warning component 106 is a buzzer or a wireless transmitter. Therefore, the processing personnel can conveniently detect whether the control circuit of the printed circuit board works abnormally in time through the detection circuit, for example, when the printed circuit board works normally, the LED indicating lamp used as the early warning component 106 is in a lighting state; when the printed circuit board works abnormally, the LED indicator lamp as the early warning assembly 106 is in an off state. For another example, when the printed circuit board works normally, the buzzer as the warning component 106 sends out a buzzer signal; when the printed circuit board is abnormally operated, the buzzer as the warning component 106 does not respond any more.
In addition, the detecting components 102 are respectively disposed in specific areas of the printed circuit board to detect whether specific electronic components on the specific areas are in a normal operating state. In an embodiment of the invention, the printed circuit board has a rectangular shape, and at least two detection assemblies are arranged on each of four sides of the rectangle. Preferably, the two detection assemblies on each side are respectively placed by adopting an SMT process and a DIP process. The optimal placement area for the detection assembly 102 will be described in detail later.
It should be understood by those skilled in the art that fig. 1 is only a schematic diagram illustrating the structural composition of the detection circuit, and is not fully equivalent to a trace diagram of the detection circuit on the printed circuit board. For example, in fig. 1, the wires between the detecting element 102 and the power supply 104 are right-angled, and the wires between the detecting element 102 and the warning element 106 are also right-angled, however, in the actual detecting circuit of the printed circuit board, the wires between them may be connected in a circular arc shape or have an obtuse angle of 135 degrees.
Fig. 2 shows a schematic diagram of the position distribution of the optimal placement areas of the detection components in the detection circuit shown in fig. 1. It will be understood by those skilled in the art that the detection assembly is used to quickly detect whether the printed circuit board is operating abnormally, and the locations of electronic components on the printed circuit board where abnormal phenomena may occur are the detection areas of particular interest for the detection circuit of the present invention. In this sense, the region where the electronic component is most likely to be abnormal is the optimal region for detecting the placement of the component in the detection circuit.
Referring to fig. 2, the optimal placement area 20 of the detection assembly is distributed mainly over 3 areas: a region 202 of the pcb that is more vulnerable to damage, a region 204 of the pcb where the trace width of the control circuitry is narrowest, and a region 206 of components on the pcb that weigh more. For example, the areas 202 of the printed circuit board that are more susceptible to damage may be, but are not limited to, areas of greater mechanical stress. For example, when a printed circuit board is subjected to a certain degree of compression deformation, the circuit board is more susceptible to damage, and the first damage is likely to be an area of greater mechanical stress. In an embodiment of the invention, the region of the printed circuit board with the larger mechanical stress may be a position where the connector in the control circuit is located, or may be a position farthest from the screw locking hole of the printed circuit board.
For the heavy component area 206 on the printed circuit board, some electronic components in the control circuit dissipate heat in normal operation, and it is necessary to introduce some heat sinks with large volume and high heat dissipation efficiency near these electronic components. At the same time, the weight of these heat sinks also affects the weight of the printed circuit board. As such, the detection circuit of the present invention is also designed to place some of the detection components in the area where the weight of the electronic component is large, which may be the location of a heat sink, for example, as will be appreciated from the above. More specifically, the pad diameter of the inspection component corresponding to the heat spreader is not larger than the pad diameter of the heat spreader.
In addition, the area 204 with the narrowest trace width of the control circuit on the printed circuit board can be used as the wire width of the detection circuit. However, it will be appreciated by those skilled in the art that the lead width of the detection circuit may also be less than the narrowest trace width of the control circuit in the printed circuit board.
By adopting the detection circuit, the detection assembly in the circuit is placed in a specific area of the printed circuit board, such as an area which is easily damaged due to larger mechanical stress, an area with the narrowest wiring width or an area with heavier electronic components, so that the situation that circuit abnormality possibly occurs on the printed circuit board can be easily tracked and detected in time. In addition, the power supply device and the early warning component in the detection circuit form a detection loop independent of related functional circuits in the printed circuit board together with the detection component, so that the intended control function expected to be realized by the functional circuits is not influenced.
Hereinbefore, specific embodiments of the present invention are described with reference to the drawings. However, those skilled in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the present invention without departing from the spirit and scope of the invention. Such modifications and substitutions are intended to be included within the scope of the present invention as defined by the appended claims.
Claims (10)
1. A detection circuit adapted to detect a printed circuit board, the detection circuit comprising:
a power supply device for supplying power to the detection circuit;
a plurality of detection components which are respectively arranged in specific areas of the printed circuit board to detect whether the electronic components on the areas work abnormally or not;
the early warning assembly is used for sending out an early warning signal when at least one of the detection assemblies detects that the electronic element works abnormally; and
and the plurality of conducting wires are electrically connected with the power supply device, the detection assembly and the early warning assembly.
2. The detection circuit of claim 1, wherein the detection component is disposed on the printed circuit board using an SMT (Surface Mounted Technology) and/or DIP (Dual In-line Package) process.
3. The sensing circuit of claim 2, wherein at least two sensing elements are provided on each of four sides of the printed circuit board.
4. The sensing circuit of claim 3, wherein the two sensing elements on each side are respectively placed using an SMT process and a DIP process.
5. The detection circuit of claim 1, wherein the specific area is an area of the printed circuit board where mechanical stress is large, an area of the printed circuit board where a width of a circuit trace is narrowest, or an area of the printed circuit board where a weight of an electronic component is large.
6. The detection circuit of claim 5, wherein the areas of greater mechanical stress in the printed circuit board include a location where the connector is located and a location furthest from a printed circuit board screw lock attachment hole.
7. The detection circuit of claim 5, wherein the area of the printed circuit board where the weight of the electronic component is greater includes the location of the heat sink.
8. The detection circuit of claim 7, wherein a pad diameter of a detection component corresponding to the heat spreader is not greater than a pad diameter of the heat spreader.
9. The detection circuit of claim 1, wherein the pre-warning component is an LED indicator light, a buzzer, or a wireless transmitting device.
10. The detection circuit of claim 1, wherein a wire width of the detection circuit is not greater than a narrowest width of a circuit trace in the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010172620A CN101813746A (en) | 2010-05-05 | 2010-05-05 | Detection circuit for printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010172620A CN101813746A (en) | 2010-05-05 | 2010-05-05 | Detection circuit for printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101813746A true CN101813746A (en) | 2010-08-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010172620A Pending CN101813746A (en) | 2010-05-05 | 2010-05-05 | Detection circuit for printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101813746A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105222933A (en) * | 2015-09-22 | 2016-01-06 | 上海斐讯数据通信技术有限公司 | The stress monitoring method of a kind of electronic equipment and application thereof |
| CN105699398A (en) * | 2016-03-04 | 2016-06-22 | 广德英菲特电子有限公司 | Automatic detection machine for PCB production |
| CN105717253A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Circuit board for detecting gold permeability and circuit board production method |
-
2010
- 2010-05-05 CN CN201010172620A patent/CN101813746A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105717253A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Circuit board for detecting gold permeability and circuit board production method |
| CN105717253B (en) * | 2014-12-03 | 2018-07-10 | 北大方正集团有限公司 | The production method that the circuit board and circuit board of gold are oozed in detection |
| CN105222933A (en) * | 2015-09-22 | 2016-01-06 | 上海斐讯数据通信技术有限公司 | The stress monitoring method of a kind of electronic equipment and application thereof |
| CN105699398A (en) * | 2016-03-04 | 2016-06-22 | 广德英菲特电子有限公司 | Automatic detection machine for PCB production |
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Application publication date: 20100825 |