CN101810912A - Laser diode assembly - Google Patents
Laser diode assembly Download PDFInfo
- Publication number
- CN101810912A CN101810912A CN201010138386A CN201010138386A CN101810912A CN 101810912 A CN101810912 A CN 101810912A CN 201010138386 A CN201010138386 A CN 201010138386A CN 201010138386 A CN201010138386 A CN 201010138386A CN 101810912 A CN101810912 A CN 101810912A
- Authority
- CN
- China
- Prior art keywords
- laser diode
- unit
- plug
- cover
- diode assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims description 60
- 230000005855 radiation Effects 0.000 claims description 20
- 229910000838 Al alloy Inorganic materials 0.000 claims description 15
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 7
- 238000003306 harvesting Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000005755 formation reaction Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 241000931526 Acer campestre Species 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 238000011282 treatment Methods 0.000 abstract description 20
- 230000036541 health Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 7
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000000429 assembly Methods 0.000 abstract description 3
- 230000000712 assembly Effects 0.000 abstract description 3
- 230000008859 change Effects 0.000 abstract description 3
- 201000010099 disease Diseases 0.000 abstract description 2
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 abstract description 2
- 230000001225 therapeutic effect Effects 0.000 description 7
- 230000001737 promoting effect Effects 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 4
- 150000002118 epoxides Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 239000002671 adjuvant Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 230000001976 improved effect Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002647 laser therapy Methods 0.000 description 2
- 238000009196 low level laser therapy Methods 0.000 description 2
- 238000002560 therapeutic procedure Methods 0.000 description 2
- 201000004384 Alopecia Diseases 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 206010003246 arthritis Diseases 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000017531 blood circulation Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- -1 compiles thing Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 230000001537 neural effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 208000027753 pain disease Diseases 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 210000004761 scalp Anatomy 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Landscapes
- Semiconductor Lasers (AREA)
- Radiation-Therapy Devices (AREA)
Abstract
A laser diode assembly is designed in order to solve the following technical problems: the printed circuit substrates of the existing laser diode assemblies are liable to damage due to overheat, the light sources emitted by the laser diodes have low concentration rate or diffusion irradiation rate, and assembly, maintenance and change are inconvenient when the laser diode assemblies are applied to medical and health care products. The laser diode assembly is assembled on various medical and health care products as the main component by a sleeve matched with the laser diode assembly. Not only the laser diode assembly is convenient to assemble, but also the light source emitted by the laser diode assembly has good concentration effect or diffusion irradiation effect, thus ensuring storage and maintenance to be easier. Meanwhile, the heat energy generated by the laser diode assembly is released more efficiently and the effect is better when the released heat is applied to disease treatment or health care. Various products assembled by the laser diode assembly by utilizing the sleeve not only are convenient to assemble but also have excellent waterproof and dustproof properties.
Description
Technical field:
The present invention relates to a kind of laser medicine health promoting product assembly and use thereof, relate in particular to the laser diode assembly of a kind of laser diode assembly and band cover.Be mainly used in main member as the laser mattress, belt, medicated cap etc. of medical treatment, health promoting product.
Background technology:
As everyone knows, laser Diode (LD, Laser Diode) is a photoconduction effect of utilizing compound semiconductor, not only has been applied to optical communication OA, and the metering of AV has enlarged recently and is applied on the medical field.Light-chemical action about plant can be seen in the charcoal assimilation.During to the organism irradiates light, produce ATP according to optical effect and make cytoactiveization.Because the wavelength that laser produces is a low-intensity, therefore under the irradiation of laser, biological cell is not damaged.Turn into by the physiologically active of inducing organism and to be used for alleviating pain disease, regenerated rapidly in the affected part, remove treatment such as reason disease and widely carry out.At this moment, according to the light wavelength that is adopted, it is early known different therapeutic effect occurring.Recently, such a laser or utilization have the Therapeutic Method of the light of the wavelength of taking this as the standard, low level laser therapy (LLLT:LowLeveI Laser Therapy) or LED source therapy (LEDT; Light Emitting DiodeTherapy) etc. by known.The laser that is used in the low level laser therapy can adopt He-Ne laser or semiconductor laser or YAG laser etc., the size and in price, semiconductor laser is more favourable, mainly by GaAs (904nm), GaAIAs (780-820-870nm), InGaAIP (630-685NM) is widely used for the semiconductor laser of material etc.Multiple treatments such as therapeutic mattress that recently can irradiating laser or adjuvant are extensively gone on the market with product.But, the laser diode assembly member that in existing laser therapy, product for health care, uses, its drive circuit substrate is because overheated and fragile, exposure raties such as the light harvesting of laser or diffusion low with and assembly working very complicated, increased manufacturing cost; And when product needed is safeguarded,, make maintenances because that diode etc. is changed dismounting is inconvenient, to guarantee to keep in good repair efficient very low, influenced applying of product.
Summary of the invention:
The present invention is in order to solve laser diode assembly, and in the time of on being applied to medical treatment, health promoting product, its drive circuit substrate is because overheated and fragile, exposure raties such as the light harvesting of laser or diffusion low with and assembly working very complicated, increased manufacturing cost; And when product needed is safeguarded, because diode etc. are changed the dismounting inconvenience, make maintenance, guarantee to keep in good repair technical problems such as efficient is very low, following solution is provided:
Laser diode assembly, it mainly comprises the assembling body, described assembling body is made up of laser diode unit, printed circuit substrate, the auxilliary material connector of heat radiation and heat release lens; Described laser diode unit is by laser diode, have the base that holds the spatial circular sleeve of laser diode and be used for fixing laser diode and form; The base of described laser diode is fixed on the printed circuit substrate by the bottom and is electrically connected with subbasal lead; The auxilliary material connector of described heat radiation is provided with and holds the unitary receiving space of whole laser diode; Described heat release lens jacket is contained on the male half coupling of the auxilliary material connector of heat radiation upper end.
The laser diode assembly of band cover, it mainly comprises the assembling body, described assembling body is made up of laser diode unit, drive circuit substrate, the auxilliary material connector of heat radiation and heat release lens; Described laser diode unit by laser diode, have the base that holds the spatial circular sleeve of laser diode and be used for fixing laser diode and form, the base of described laser diode is fixed in the drive circuit substrate by the bottom and is electrically connected with subbasal lead; The material connector is assisted in described heat radiation, is made up of first plug-in unit and second plug-in unit, and described second plug-in unit and the first plug-in unit top movable are tightly connected; Described first and second plug-in unit leaves the gap at the periphery that is in contact with one another, and first adds pressure surface and second and adds pressure surface with what form that cover with laser diode assembling body is connected and fixed; The cover of described assembling body is provided with a plurality of pilot holes, is connected with the laser diode assembly movable sealing respectively in each pilot hole; Described cover is made by thermal conducting material.
Characteristics of the present invention and beneficial effect: the present invention adopts the laser diode assembly of band cover, can realize easily being assembled into as mattress as the main member on treatment, the health promoting product, seat cushion, belt, the bottom bands of trouser legs, cervical vertebra treatment band, medicated cap, mask etc., easier assembling with separate.And the decomposition ratio of cover and diode is easier to, and is more convenient for safeguarding and changing, and therefore can keep life-time service.
Owing to adopt the heat release adjuvant and adopt light harvesting and astigmatic heat release lens in plug-in unit part and base part, the heat that laser diode distributed is well discharged to the outside, and apply flexibly on therapeutic use, have advantages such as warm, heating.
Owing at the face that is in contact with one another of assembly each several part, adopt thread seal, hook sealing, be mingled with measures such as the auxilliary material of sealing, coating encapsulant, make laser diode and drive between the basal disc of loop and whole moisture resistance and water resistance very remarkable.
Description of drawings:
Fig. 1 is a laser diode assembly overall structure sketch map;
Fig. 2 is the decomposition texture sketch map of Fig. 1;
Fig. 3 is the whole cross-sectional view of Fig. 1;
The laser diode assembly overall structure sketch map of Fig. 4 band cover
Fig. 5 be among Fig. 4 laser diode assembly in conjunction with sectional schematic diagram
Fig. 6 is the decomposition texture sketch map of laser diode assembly among Fig. 4
Fig. 7 is the laser diode assembly overall structure sketch map of the 3rd embodiment band cover
Fig. 8 is a laser diode assembly exploded view among Fig. 7
Fig. 9 is the laser diode assembly overall structure sketch map of the 4th embodiment band cover
Figure 10 is a laser diode assembly exploded view among Fig. 9
Figure 11 be the 5th embodiment the band cover the laser diode assembly and in conjunction with sectional drawing
Figure 12 is the decomposition profile diagram of the laser diode assembly of the 6th embodiment band cover
Figure 13 is the figure of manufacturing engineering of the laser diode assembly of the 6th embodiment
Figure 14 is that the treatment of the 6th embodiment uses the part of cover in conjunction with sectional drawing
Figure 15 is the user mode figure of laser diode assembly on the treatment mattress of band cover
Figure 16 is the user mode figure of laser diode assembly on treatment belt of band cover
Figure 17 is the user mode figure of laser diode assembly on the anti-alopecia medicated cap of treatment of band cover
The specific embodiment:
Referring to Fig. 1-Fig. 3, laser diode assembly, it mainly comprises assembling body 100, described assembling body 100 is made up of laser diode unit 10, printed circuit substrate 20, the auxilliary material connector 30 of heat radiation and heat release lens 40; Described laser diode unit 10 by laser diode, have the circular sleeve 12 that holds laser diode and the base 11 that is used for fixing laser diode formed; The base 11 of described laser diode is fixed on the printed circuit substrate 20 with subbasal lead 21,22 by the bottom and is electrically connected; The auxilliary material connector 30 of described heat radiation is provided with the receiving space that holds whole laser diode unit 10; Described heat release lens 40 are sleeved on the male half coupling of auxilliary material connector 30 upper ends of heat radiation.
The part that the auxilliary material connector 30 of described laser diode unit 10 and heat radiation is in contact with one another is provided with in conjunction with protruding 10c and corresponding engagement groove 30c.
The auxilliary material connector 30 of described heat radiation is by aluminum, aluminium alloy, copper, copper alloy, silver, any one or two or more composition in the silver alloy.
Described heat release lens 40 are positioned at the top and the periphery of laser diode unit 10, are by containing SiO
2Glass lens, light-transmissive resin, any one or two or more formations in the epoxy resin; Be light harvesting convex lens, scattered-light concavees lens, concavo-convex bonded lens towards periphery, a kind of in the spherical or non-spherical lens.
Referring to Fig. 4-Fig. 6, the laser diode assembly of band cover, it mainly comprises assembling body 100, described assembling body 100 is made up of laser diode unit 150, drive circuit substrate 160, the auxilliary material connector of heat radiation and heat release lens; Described laser diode unit 150 by laser diode, have the circular sleeve 150b that holds laser diode and the base 150a that is used for fixing laser diode formed, the base 150a of described laser diode, be fixed in the drive circuit substrate 160 with subbasal lead 21,22 by the bottom and be electrically connected; The material connector is assisted in described heat radiation, is made up of first plug-in unit 110 and second plug-in unit 120, and described second plug-in unit 120 and first plug-in unit, 110 top movable are tightly connected; Described first plug-in unit and second plug-in unit leave the gap at the periphery that is in contact with one another, and first add pressure surface 330 and second and add pressure surface 350 with what form that cover 300 with laser diode assembling body 100 is connected and fixed; The cover 300 of described assembling body 100 is provided with a plurality of pilot holes, is connected with laser diode assembly 100 movable sealings respectively in each pilot hole; Described cover 300 is made by thermal conducting material.
Described first plug-in unit 110 and second plug-in unit 120 mutually combine the part be provided with screw thread in conjunction with projection and engagement groove, pilot hole on the described cover 300 is sleeved on first plug-in unit 110 and second plug-in unit 120 and mutually combines in the gap that the part periphery leaves, and by first plug-in unit 110 and second plug-in unit 120 be threaded and cover 300 pilot hole peripheries 320 are tightly connected.
Referring to Fig. 7-Fig. 8, described first plug-in unit 110 and second plug-in unit 120 are to add the corresponding grafting of hook groove 110c that is provided with on the pressure surface 330 with first plug-in unit and be tightly connected to add the hook 120d that is provided with on the pressure surface 350 at second plug-in unit in the part that mutually combines; Pilot hole on the described cover 300 is sleeved on first plug-in unit 110 and second plug-in unit 120 and mutually combines in the gap that the part periphery leaves, and is tightly connected by the grafting and the cover 300 pilot hole peripheries 320 of first plug-in unit 110 and second plug-in unit 120.
Laser diode unit, drive circuit substrate and first plug-in unit and second plug-in unit that are housed in first plug-in unit all adopt heat release to assist material; Top or outer surface at second plug-in unit are covered with lens; The bottom of described drive circuit substrate scribbles sealant.
Described second plug-in unit is made up of the metal material that comprises abundant nagative potential, promptly by aluminum, and aluminium alloy, silver, silver alloy, copper, any one or two or more composition in the copper alloy.
Described laser diode unit produces optical maser wavelength 600nm-890nm.
Referring to Fig. 1-Fig. 3, laser diode unit 10 comprises that inside has the base 11 that is used for fixing laser diode, and on base 11, has the circular sleeve that has port 12a 12 that the laser of laser diode generation is emitted to the outside.
Printed circuit substrate 20 and laser diode unit 10 are drawn more than one electric wire 21,22 to be electrically connected from this printed circuit substrate 20.
The inside of the auxilliary material connector 30 of heat release possesses receiving space, this receiving space is accommodated printed circuit substrate 20 and laser diode unit 10, in 10 whens work in the laser diode unit, the heat that produces from printed circuit substrate 20 and laser diode unit 10 is emitted to the outside.
By aluminum, aluminium alloy, copper, copper alloy, silver, the auxilliary material connector 30 of the heat radiation that the heat conductivity material of any one or two or more compositions constitutes in the silver alloy has improved exothermal efficiency.
The auxilliary material connector 30 of heat release is provided with in conjunction with trough 30c and corresponding mutually in conjunction with protruding 10c with the part that laser diode unit 10 is in contact with one another, and laser diode unit 10 is more firmly installed at the receiving space of the auxilliary material connector 30 of heat release.
The periphery of laser diode unit 10 has lens 40, the convex lens (light collecting lens) that these lens 40 can be light harvestings, and the concavees lens (distributing lens) of astigmatism effect towards periphery, concavo-convex bonded in conjunction with lens, a kind of in the multiple lens of spherical or non-spherical lens.
The material of lens 40 is by containing Sio
2Glass lens, light-transmissive resin, any one or two or more formation in the epoxy resin.
The receiving space of the auxilliary material connector 30 of the heat release of printed circuit substrate 20 bottoms is by sealing material 35 coatings such as epoxy resin.Be penetrated into the various moisture of laser diode unit 10 and printed circuit substrate 20 effectively from the bottom blocking-up.
The upper end of scioptics 40 parcel laser diode unit 10, and, prevented that effectively moisture or various foreign body are penetrated in laser diode unit 10 and the printed circuit substrate 20 by between printed circuit substrate 20 and laser diode unit 10, being coated with encapsulant.
Embodiment 2
Referring to Fig. 4-Fig. 6, the laser diode assembly 200 of band cover, it mainly comprises assembling body 100, and described assembling body 100 comprises second plug-in unit 120 that drive circuit substrate 160 reaches and the first plug-in unit top movable is tightly connected that laser diode unit 150, inside have first plug-in unit 110 of diode receiving space, are connected with the laser diode unit bottom of accommodating first plug-in unit.
Described laser diode assembly 100, it comprises laser diode unit 150, first and second plug-in unit 110,120.Laser diode unit 150 is fit to multiple therapeutic use, and its wavelength reaches 600nm-890nm.
By the driving laser diode in the receiving space 110a of first plug-in unit, in the drive circuit substrate, draw more than one electric wire 160a, 160b.
It is best selection that first and second plug-in units adopt by forming the good material of heat conductivity that the heat of sending from laser diode effectively discharges.Can adopt the good material aluminum of heat conductivity, aluminium alloy, copper, copper alloy, silver, silver alloy etc.
Draw the part that connects mutually at first and second plug-in units, at the edge that injects installing hole 320 on the cover between the pressure surface that adds of first and second plug-in units that leave spacing.Be installed in the laser diode assembly on the cover installing hole, by drawing more than one lead 160a in the drive circuit substrate, 160b is electrically connected mutually, and is encapsulated in cover 300 and the end cover 310.To be applied to the laser diode assembly of cover again on treatment, the health promoting product.
For the ease of a plurality of diode assemblies 100 being used for the treatment of, on the product such as health care bed mattress, making its assembly and disassembly more convenient and used the laser diode assembly of band cover.
Cover itself is by fabric, compiles thing, cloth, thin blanket is weaved cotton cloth, and any one or more than one institute in the multiple cover material such as sponge fiber forms, its positive meeting forms a lot of installing holes, and can install in these installing holes much can isolating laser diode assembly.
First plug-in unit of laser diode assembly inserts back first plug-in unit below installing hole notch part stretches out gap slot bolt and nut combination with second plug-in unit from installing hole, the adding pressure surface and can fixedly bite mutually on the seat at the installing hole of cover of such first and second plug-in units, is so can make very firm being fixed on above the cover of laser diode assembly.Can bite the installing hole on the cover in other words when making first and second plug-in units engaged, also in order to change and repair laser diode, separate by bolt and nut when first and second plug-in units are decomposed and decompose, institute thinks that repairing or change laser diode provides convenience.
First or second plug-in unit of the laser diode assembly of band cover is made of the material of conduction heat, and the heat that produces from laser diode can well discharge outward, and the heat that discharges by first and second plug-in units can play function warm or heating.
Also have in first or second plug-in unit, particularly the material of second plug-in unit of contact or contiguous human body is the metal material of electronegative position, more specifically by aluminum, aluminium alloy, silver, silver alloy, copper, material in the copper alloy constitutes, during with the Metal Contact human body of above-mentioned the same electronegative position, the muscle of human body or neural can reflection.So can improve pain or improve therapeutic efficiencies such as blood circulation.
The situation that special second plug-in unit is made up of aluminium alloy, aluminum accounts for percent 90 in the above-mentioned aluminium alloy, from Si, Fe, Cu, Mn, Mg, Zn, Ti, Ni, K, Ca, B, select more than one inorganic living element of volume to account for percent 10 among the V and form, above-mentioned aluminium alloy is processed into it and electronegatively extremely can uses in the mode of contact skin.
When also having second plug-in unit to be made up of silver or silver alloy, also can find has distinctive therapeutic effect because of the characteristic of silver-colored material when second plug-in unit contacts human body.
Embodiment 3
Referring to Fig. 7-Fig. 8, the laser diode assembly 100 of band cover, first plug-in unit 110 and second plug-in unit 120 are that to add the corresponding grafting of the hook groove 110c that is provided with on the pressure surface 330 with first plug-in unit be the laser diode assembly of characteristics to add the hook 120d that is provided with on the pressure surface 350 at second plug-in unit in the part that mutually combines, laser diode assembly 100 is installed in the installing hole 320 of cover, promptly the installing hole 320 peripheral 320a of laser diode assembly and cover 300 are tightly connected and are integral.
To stretch out and the gap slot that has second plug-in unit of linking up with 120d is plugged on together from installing hole adding first plug-in unit that has hook groove 110c on the pressure surface 330 inserts back first plug-in unit below installing hole notch part, pass through the interlock of hook and hook groove like this, make adding pressure surface and can fixedly biting mutually on the seat of first and second plug-in units, so can make very firm being fixed on above the cover of laser diode assembly at the installing hole of cover.
Remaining formation and effect are with embodiment 2, so do not add detailed description.
Embodiment 4
Referring to Fig. 9-Figure 10, laser diode assembly 400 is by laser diode unit 150, the auxilliary material 430 of first plug-in unit 410 or second plug-in unit 420 and heat release is formed, the inside of first plug-in unit has formed the space of accommodating laser diode unit 150 and the auxilliary material 430 of heat release, notch part is formed at its top, and this notch part exterior circumferential is made up of public screw 410c.
The top lens section 420d of second plug-in unit 420 is made of one-piece type or combination type, form limit 420a around the periphery of this lens section, the inside of second plug-in unit 420 is provided with the occlusal crib with 410 interlocks of first plug-in unit, and the inner periphery of this occlusal crib has formed the female screw 420c with the public screw interlock of above-mentioned notch part.When hemisphere sample lens section 420d adopts and to be made up of transparent material, the light that laser diode sends wider.
First or second plug-in unit is the interlock or the isolating combination of public screw portion of the occlusal crib of the notch part of first plug-in unit or second plug-in unit or female screw portion, thus its assembling with separate that to be very easy to be its strong point.Leaving the gap in addition between the interconnective part of first or second plug-in unit forms first and adds pressure surface 330 and second and add pressure surface 350, the first or second and add the fixed bit subdivision of inserting the pilot hole of cover itself between the pressure surface in the gap.
The auxilliary material 430 of heat release is housed in wherein in the receiving space of first plug-in unit, the laser diode unit housing is being with the heat release of port 430a to assist 430 li of materials, circular sleeve 150b stretches out from port 430a, be provided with groove 430c at port 430a periphery, fix with the corresponding combination of projection 150c on the laser diode unit base 150a.Be connected with drive circuit substrate 160 in this laser diode unit 150 base 150a bottom, with the more than one electric lead 160a that the laser diode unit is connected with substrate, 160b draws in the drive circuit substrate.
The space of accommodating the unitary part of laser diode and drive circuit substrate has been had both in auxilliary material 430 inside of heating, can protect laser diode and drive circuit substrate by such receiving space.
The auxilliary material 430 of heat release also can use the aluminum that can be good at outwards sending the heat that laser diode unit or drive circuit substrate sent, aluminium alloy, and copper, copper alloy, silver, the material that heat conductivities such as silver alloy are good improves the heat release efficiency.
In order to make first plug-in unit or second plug-in unit also have well release heat outward of laser diode unit or drive circuit substrate, can adopt aluminum, aluminium alloy, copper, copper alloy, silver, the material that conduction of heat such as silver alloy are good is made.
Above-mentioned laser diode assembly is assembled to treatment with on the cover, after the notch part of first plug-in unit is inserted in the pilot hole of cover itself then on the public screw and female buckle of the notch part of first plug-in unit and the gap slot of second plug-in unit, so make first plug-in unit and second plug-in unit add firm being fixed on the cover of pressure surface.
Come covering protection laser diode or drive circuit substrate not to make moist with lens above in present embodiment, treating with cover.
Using sealant to can be good at blocking dampness in addition on female screw of the public screw of first plug-in unit and second plug-in unit does not make moist laser diode and drive circuit substrate.
The auxilliary material of heat release has been accommodated in the bottom of the receiving space of first plug-in unit, the laser diode unit is inserted in the bottom of the receiving space of the auxilliary material of this heat release, the drive circuit substrate is inserted in the unitary bottom of this laser diode, has drawn an above electric wire in this drive circuit substrate and has connected.
Also have the bottom surfaces of drive circuit substrate to expose towards the bottom surface cover by the bottom of cover, so the lower face of DIP switch uses sealant coverings such as epoxide, so energy blocking laser diode or drive circuit substrate bottom infiltration moisture, and above-mentioned sealant can the better guarantee sealing in the auxilliary material of heating and laser diode or drive circuit substrate slit.That is to say that the treatment in present embodiment can be good at the heat that is taken place from laser diode and drive circuit substrate is discharged into the outside by the auxilliary material of heat release with cover, and the lens section on the top of second plug-in unit prevents that well moisture from infiltrating from top, because of sealant can prevent that dampness from permeating from the bottom, thereby improved the waterproof effect of laser diode or drive circuit substrate greatly.
Embodiment 5
Referring to Figure 11, the laser diode assembly 200 of band cover, the structure that the lens section exterior circumferential corner of second plug-in unit is removed in present embodiment, conforming to that the width of the width of corresponding first plug-in unit and second plug-in unit becomes is characteristics, so what show in the present embodiment is lighter and handier laser diode unit, and can be assembled to more easily on the cover body.Other are with embodiment 4.
Embodiment 6
Referring to Figure 12-Figure 14, the laser diode assembly 500 of band cover, by laser diode unit 150, first plug-in unit 510 and second plug-in unit 520, the auxilliary material 530 of heat release is formed, the inside of first plug-in unit is provided with the receiving space 510c that accommodates laser diode unit and the auxilliary material of heat release, and the inner surface of receiving space has female thread part 510b, and the hole 510a of perforation is arranged at the bottom of this receiving space.
The inside of second plug-in unit is provided with the receiving space 520c that accommodates laser diode, the jagged portion in the receiving space outside, and there is the public screw 520b of portion in this notch part outside, and through hole 520d has been opened on the top of this receiving space.
First or second plug-in unit makes the receiving space of the inside also engaged by the interlock of male and female screw, has accommodated the laser diode unit in the receiving space, the drive circuit substrate, and material is assisted in heat release.
The lens 515 of laser diode unit and neighboring form one, referring to Figure 13, inject transparent or semitransparent epoxide 25 in the gold shape mould 20, under injection ring oxide state, insert laser diode unit 150, cooling by certain hour is then taken out the epoxide of the molding in the golden shape mould incidence and laser diode unit are become one.
A lens section like this exposes its part by the through hole 520d of second plug-in unit, makes the office of laser diode irradiation can pastly on a large scale specify the diverse irradiation in angle.
First or second plug-in unit also can separate by the screw interlock, so have assembling and separate all advantage easily.And first or second plug-in unit when engaged first and second plug-in units add pressure surface form fixed interval, then the pilot hole on the cover body is injected this first and second plug-in unit and adds the institute that pressure surface forms and decide in the interval.The auxilliary material of the heat release of accommodating in the receiving space in first plug-in unit is designed to wrap up the structure of drive circuit substrate then, and this drive circuit substrate and laser diode join, and more than one electric wire is drawn in this drive circuit substrate.
The auxilliary material of heat release is by can the fine aluminum that the heat that laser diode discharged is discharged outward, aluminium alloy, copper, copper alloy, silver, the material formation of good thermal conductions such as silver alloy.
In order to allow first plug-in unit and second plug-in unit that laser diode can well be dispelled the heat, use the good aluminum of thermal diffusivity, aluminium alloy, copper, copper alloy, silver, the material structure that heat conductivities such as silver alloy are good.
Described laser diode assembly in the present embodiment is being installed on the cover of a plurality of pilot holes, after inserting the notch part of second plug-in unit in the pilot hole of cover, the notch part of second plug-in unit is because of the interlock combination of public screw and female screw of first plug-in unit, along with the pressurization of first and second plug-in units fixedly seat interlock, make that laser diode is very blocky to be fixed on the cover in the face of the pilot hole of cover itself.Lens section adopts the structure of the unitary outside of parcel laser diode in the present embodiment, thus can the blocking laser diode and the loop basal disc be not subjected to the infiltration of outside moisture.
And driving loop basal disc exposes to the bottom surface cover by the bottom of cover from its bottom, the bottom of this driving loop basal disc uses sealed material sealing such as epoxide to prevent from laser diode and drive the loop basal disc not make moist, and then this epoxide sealer is also placed on the slit of the auxilliary material of heat release and laser diode and driving loop basal disc its sealing property is promoted more.The medical cover that is to say present embodiment makes laser diode by the auxilliary material of heat release and drives well outside release of heat that the loop basal disc is discharged, and the lens section in the outside, parcel laser diode unit prevents that dampness from permeating from top, prevent the infiltration of bottom dampness by sealant, with this humidity resistance that significantly improves the laser diode unit and drive the loop basal disc.
Referring to Figure 15-Figure 17, the laser diode assembly of laser diode assembly in embodiment 1-6 or band cover, according to treatment, health promoting product needs, different structure feature and varying number laser diode assembly stationary positioned on cover, are constituted different product.Be applicable to the laser mattress of treatment as shown in figure 15; The laser belt that is applicable to treatment shown in Figure 16; The laser scalp therapeutic apparatus medicated cap that is applicable to treatment shown in Figure 17; And the arthritis treatment device or the like.
Claims (10)
1. laser diode assembly, it mainly comprises assembling body (100), it is characterized in that: described assembling body (100) is made up of laser diode unit (10), printed circuit substrate (20), the auxilliary material connector (30) of heat radiation and heat release lens (40); Described laser diode unit (10) by laser diode, have the circular sleeve (12) that holds laser diode and the base (11) that is used for fixing laser diode formed; The base of described laser diode (11) is fixed on printed circuit substrate (20) by the bottom and goes up and subbasal lead (21,22) electrical connection; The auxilliary material connector (30) of described heat radiation is provided with the receiving space that holds whole laser diode unit (10); Described heat release lens (40) are sleeved on the male half coupling of the auxilliary material connector (30) of heat radiation upper end.
2. laser diode assembly according to claim 1 is characterized in that: the part that the auxilliary material connector (30) of described laser diode unit (10) and heat radiation is in contact with one another is provided with in conjunction with projection (10c) and corresponding engagement groove (30c).
3. laser diode assembly according to claim 1 is characterized in that: the auxilliary material connector (30) of described heat radiation is by aluminum, aluminium alloy, copper, copper alloy, silver, any one or two or more composition in the silver alloy.
4. laser diode assembly according to claim 1 is characterized in that: described heat release lens (40) are positioned at the top and the periphery of laser diode unit (10), are by containing SiO
2Glass lens, light-transmissive resin, any one or two or more formations in the epoxy resin; Be light harvesting convex lens, scattered-light concavees lens, concavo-convex bonded lens towards periphery, a kind of in the spherical or non-spherical lens.
5. be with the laser diode assembly of cover, it mainly comprises assembling body (100), it is characterized in that: described assembling body (100) is made up of laser diode unit (150), drive circuit substrate (160), the auxilliary material connector of heat radiation and heat release lens; Described laser diode unit (150) by laser diode, have the circular sleeve (150b) that holds laser diode and the base (150a) that is used for fixing laser diode formed, the base of described laser diode (150a), being fixed on drive circuit substrate (160) by the bottom goes up and subbasal lead (21,22) electrical connection; The material connector is assisted in described heat radiation, is made up of first plug-in unit (110) and second plug-in unit (120), and described second plug-in unit (120) is tightly connected with first plug-in unit (110) top movable; Described first plug-in unit and second plug-in unit leave the gap at the periphery that is in contact with one another, and first add pressure surface (330) and second and add pressure surface (350) with what form that cover (300) with laser diode assembling body (100) is connected and fixed; The cover (300) of described assembling body (100) is provided with a plurality of pilot holes, is connected with laser diode assembly (100) movable sealing respectively in each pilot hole; Described cover (300) is made by thermal conducting material.
6. the laser diode assembly of band cover according to claim 5, it is characterized in that: described first plug-in unit (110) and second plug-in unit (120) mutually combine the part be provided with screw thread in conjunction with projection and engagement groove, pilot hole on the described cover (300) is sleeved on first plug-in unit (110) and second plug-in unit (120) and mutually combines in the gap that the part periphery leaves, and by first plug-in unit (110) and second plug-in unit (120) be threaded and cover (300) pilot hole periphery (320) is tightly connected.
7. the laser diode assembly of band cover according to claim 5 is characterized in that: described first plug-in unit (110) and second plug-in unit (120) are to add the corresponding grafting of hook groove (110c) that is provided with on the pressure surface (330) with first plug-in unit and be tightly connected to add the hook (120d) that is provided with on the pressure surface (350) at second plug-in unit in the part that mutually combines; Pilot hole on the described cover (300) is sleeved on first plug-in unit (110) and second plug-in unit (120) and mutually combines in the gap that the part periphery leaves, and is tightly connected by the grafting and cover (300) the pilot hole periphery (320) of first plug-in unit (110) and second plug-in unit (120).
8. according to the laser diode assembly of claim 6 or 7 described band covers, it is characterized in that: laser diode unit, drive circuit substrate and first plug-in unit and second plug-in unit that are housed in first plug-in unit all adopt heat release to assist material; Top or outer surface at second plug-in unit are covered with lens; The bottom of described drive circuit substrate scribbles sealant.
9. according to the laser diode assembly of claim 6 or 7 described band covers, it is characterized in that: described second plug-in unit is made up of the metal material that contains abundant nagative potential, promptly by aluminum, aluminium alloy, silver, silver alloy, copper, any one or two or more composition in the copper alloy.
10. according to the application of the laser diode assembly of claim 6 or 7 described band covers, it is characterized in that: described laser diode unit produces optical maser wavelength 600nm-890nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010138386 CN101810912B (en) | 2010-04-02 | 2010-04-02 | Laser diode assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010138386 CN101810912B (en) | 2010-04-02 | 2010-04-02 | Laser diode assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101810912A true CN101810912A (en) | 2010-08-25 |
| CN101810912B CN101810912B (en) | 2013-02-20 |
Family
ID=42618366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010138386 Active CN101810912B (en) | 2010-04-02 | 2010-04-02 | Laser diode assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101810912B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105363136A (en) * | 2015-12-10 | 2016-03-02 | 高川 | Waterproof laser device and laser healthcare bra with same |
| CN106369348A (en) * | 2016-10-26 | 2017-02-01 | 中山众纳电子有限公司 | White laser emitting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1407678A (en) * | 2001-08-28 | 2003-04-02 | 邢刚 | Laser source devices of near infrared mammary gland diagnosing device |
| JP2005159104A (en) * | 2003-11-27 | 2005-06-16 | Sony Corp | Laser system |
| CN201699309U (en) * | 2010-04-02 | 2011-01-05 | 沈阳碧根医疗器械有限公司 | Laser diode assembly |
-
2010
- 2010-04-02 CN CN 201010138386 patent/CN101810912B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1407678A (en) * | 2001-08-28 | 2003-04-02 | 邢刚 | Laser source devices of near infrared mammary gland diagnosing device |
| JP2005159104A (en) * | 2003-11-27 | 2005-06-16 | Sony Corp | Laser system |
| CN201699309U (en) * | 2010-04-02 | 2011-01-05 | 沈阳碧根医疗器械有限公司 | Laser diode assembly |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105363136A (en) * | 2015-12-10 | 2016-03-02 | 高川 | Waterproof laser device and laser healthcare bra with same |
| CN106369348A (en) * | 2016-10-26 | 2017-02-01 | 中山众纳电子有限公司 | White laser emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101810912B (en) | 2013-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2009238798B2 (en) | Laser hair-loss treatment device | |
| EP2491978B1 (en) | Face support having a drug carrier | |
| CN108465159A (en) | A kind of photo cosmetic device | |
| JP2010518618A (en) | Laser diode assembly and treatment sheet including the same | |
| KR20210125052A (en) | skin care device | |
| US20180178034A1 (en) | Light irradiation substrate | |
| US20060194164A1 (en) | Oral appliance with heat transfer mechanism | |
| JP6466561B2 (en) | Light irradiation apparatus and method of manufacturing light irradiation apparatus | |
| CN101810912B (en) | Laser diode assembly | |
| CN201699309U (en) | Laser diode assembly | |
| KR20120016748A (en) | Apparatus for led optical irradiation of medical | |
| CN112604149A (en) | Beauty treatment handle | |
| CN202036693U (en) | Heat insulation nano far infrared electric heating physiotherapy chip | |
| KR102305199B1 (en) | Cap attachment type scalp management device | |
| CN105708028A (en) | Shoes with sterilizing function and sterilizing method thereof | |
| WO2018154758A1 (en) | Skin care device | |
| EP2486955A1 (en) | Therapeutic cap | |
| KR100732339B1 (en) | Photochemistry laser diode assembly and photochemistry sheet having the same | |
| CN215135864U (en) | Beauty treatment handle | |
| KR20180000903U (en) | Wearable device for head with electronic moxibustion unit | |
| JPWO2019208177A1 (en) | Light irradiation device and light irradiation method | |
| KR20200102665A (en) | Device for Optical poulticing used Near-infrared ray LED | |
| KR20200109452A (en) | Skin care apparatus | |
| CN101682164A (en) | Photochemistry laser diode assembly and photochemistry sheet having the same | |
| RU48790U1 (en) | DEVICE FOR MAGNETO-LED THERAPY "SARDER 3" |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240423 Address after: 110000 No. 50-1, Manrong, Heping District, Shenyang, Liaoning Patentee after: Shenyang Bigen Health Products Co.,Ltd. Country or region after: China Address before: No. 50 Manrong, Dongling District, Shenyang City, Liaoning Province, 110000 Patentee before: VIGEN MEDICAL DEVICE Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |