CN101808469B - Exposure method of printed wiring board - Google Patents
Exposure method of printed wiring board Download PDFInfo
- Publication number
- CN101808469B CN101808469B CN2009101054421A CN200910105442A CN101808469B CN 101808469 B CN101808469 B CN 101808469B CN 2009101054421 A CN2009101054421 A CN 2009101054421A CN 200910105442 A CN200910105442 A CN 200910105442A CN 101808469 B CN101808469 B CN 101808469B
- Authority
- CN
- China
- Prior art keywords
- exposure
- wiring board
- regional group
- regional
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides an exposure method of a printed wiring board, which comprises the followings steps: a. dividing a photosensitive material into two or more than two regions according to the thickness of a line or the size of the space between adjacent lines on film used by the printed wiring board; and b. separately exposing the two or more than two regions divided in the step a by adopting exposure machines with different exposure resolutions. The method of the invention has concise step and easy implementation, and can effectively improve the exposure aging of the wiring board, reduce the purchase number of high-resolution exposure machines and reduce equipment cost.
Description
[technical field]
The present invention relates to the wiring board manufacturing technology, the exposure method of the printed wiring board that especially a kind of efficient is high, cost is low.
[background technology]
In the processing and manufacturing process of printed wiring board (PCB), image transfer is one of most important operation, and it mainly acts on the principle of taking pictures original layout through sensitization exactly, and transferring to needs to make on the wiring board of moulding.
Image transfer is mainly concerned with following main step: first is a press mold technology, uses photosensitive material the mode of hot pressing to be fitted in PCB surface to be processed earlier exactly; Be exactly exposure process then, will have the film of original layout appearance to be placed on the wiring board that presses photosensitive material; Re-use exposure machine and make the photosensitive material exposure, original circuit is transferred on the photosensitive material on the wiring board; Carry out developing process at last again, unnecessary photosensitive material partly handle is removed through chemical medicinal liquid, keep original layout shape, for the back direct etching of operation or electroplate processing and prepare.
Using exposure machine to make the process of photosensitive material exposure in the prior art generally all is that a plate face to wiring board carries out the disposable integral exposure; Generally the thinnest with original line midline road, the minimum place of adjacent lines spacing is as the foundation of the selection of the control of exposure accuracy, the grasp of time for exposure, exposure machine; Can cause waste to a certain degree the position that this is thick concerning circuit, the adjacent lines spacing is bigger, see problems such as having overall time length, equipment configuration cost height from resultant effect.
[summary of the invention]
Technical problem to be solved by this invention provides the exposure method of the printed wiring board that a kind of efficient is high, cost is low.
For solving the problems of the technologies described above, the present invention provides a kind of exposure method of printed wiring board, may further comprise the steps:
A. according to spacing size between circuit thickness degree on the used film of printed wiring board or the adjacent lines, photosensitive material on the wiring board is divided into two or more zones;
B. adopt the separately exposure of the different exposure machine of exposure resolution ratio with distinguishing two or more zones that obtain among the step a.
The inventive method is that photosensitive material is divided into different zones; Closely spaced zone is the higher zone of resolution between the thin or adjacent lines of circuit; The big zone of spacing is the lower zone of resolution between the thick or adjacent lines of circuit; Obtain two or more incomplete same zones of resolution like this, then the separately exposure of the different exposure machine of exposure resolution ratio is adopted in these zones.The separately exposure of the different exposure machine of two or more exposure resolution ratios is adopted in two or more incomplete same zones of resolution.
Photosensitive material is distinguished in these zones that obtain; The spacing size is all inequality between possible each regional circuit thickness degree and the adjacent lines; Circuit thickness degree that also might the subregion is identical/close or adjacent lines between the spacing size identical/close, circuit thickness degree is identical/close or adjacent lines between the spacing size identical/close zone might non-conterminous connecing.
On this basis, further:
Distinguish among the step a in the zone obtain, circuit thickness degree that might the subregion is identical/close or adjacent lines between the spacing size identical/close.With distinguishing two or more area dividing that obtain among the step a is two or more regional groups, and each regional group adopts the exposure machine of different exposure resolution ratios to make public respectively.The principle that the zone group is divided is; Circuit thickness degree is identical/close or adjacent lines between the spacing size identical/close area dividing is same regional group; That is the area dividing that can adopt same exposure resolution ratio is the same area group, and the same area group adopts same exposure machine to make public like this.The resolution of the used exposure machine of the same area group is suitably selected according to spacing size between circuit thickness degree in this zone group or the adjacent lines.Because circuit thickness degree is identical/close or adjacent lines between the spacing size identical/close several zones possibly be divided into same regional group, so the number of regional group is less than or equal to the number of regions that differentiation obtains among the step a.
The process of " each regional group adopts the exposure machine of different exposure resolution ratios to make public respectively " is: adopt the exposure machine of corresponding exposure resolution ratio to make public to a regional group earlier, when this zone group is made public other regional group is carried out the shading protection; Adopt the exposure machine of corresponding exposure resolution ratio to make public to the regional group of the next one then, when this next one zone group is made public other regional group is carried out the shading protection; Adopt the exposure machine of corresponding exposure resolution ratio to make public to next regional group more then, during this next more regional group exposure other regional group is carried out the shading protection; ..., accomplish exposure until the Zone Full group.The inventive method does not have special demands to the sequencing of zones of different group exposure, can arrange according to the actual conditions in producing.
Exposure machine can be the different CCD exposure machine of CCD number, the CCD exposure machine exposure resolution ratio difference separately that the CCD number is different.
The invention has the beneficial effects as follows: the inventive method step is simple and clear, implements can improve the wiring board exposure aging effectively easily, reduces the purchase quantity of high-resolution exposure machine, reduces equipment cost.
[embodiment]
Below be to adopt the inventive method to make the part process of wiring board:
Mode with hot pressing is fitted in PCB surface to be processed with photosensitive material;
To there be the film of original layout appearance to be placed on the appropriate location on the wiring board that presses photosensitive material then;
According to spacing size between circuit thickness degree in the photosensitive material or the adjacent lines, photosensitive material on the wiring board is divided into high-resolution and two zones of low resolution;
Use of the photosensitive material exposure of 4CCD exposure machine, the original circuit of high-resolution areas is transferred to the photosensitive material relevant position on the wiring board high-resolution areas; Use of the photosensitive material exposure of 2CCD exposure machine, the original circuit in low resolution zone is transferred to the photosensitive material relevant position on the wiring board the low resolution zone;
Carry out developing process at last again, unnecessary photosensitive material is partly handled through chemical medicinal liquid removed.
During practical implementation, photosensitive material is divided into what zones and what groups, adopted the exposure machine of how many individual different exposure resolution ratios, consider based on the required precision of specific product.Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (3)
1. the exposure method of a printed wiring board is characterized in that: may further comprise the steps:
A. according to spacing size between circuit thickness degree on the used film of printed wiring board or the adjacent lines, photosensitive material on the wiring board is divided into two or more zones;
B. adopt the separately exposure of the different exposure machine of exposure resolution ratio with distinguishing two or more said zones that obtain among the step a;
Step b is: with distinguishing two or more said area dividing that obtain among the step a is two or more regional groups, and each said regional group adopts the exposure machine of different exposure resolution ratios to make public respectively; The principle that said regional group is divided is: circuit thickness degree is identical/close or adjacent lines between the spacing size identical/close area dividing is same regional group.
2. the exposure method of printed wiring board according to claim 1; It is characterized in that: the process of " each said regional group adopts the exposure machine of different exposure resolution ratios to make public respectively " is: adopt the exposure machine of corresponding exposure resolution ratio to make public to a said regional group earlier, when this zone group is made public other said regional group is carried out the shading protection; Adopt the exposure machine of corresponding exposure resolution ratio to make public to the said regional group of the next one then, when the said regional group of this next one is made public other said regional group is carried out the shading protection; Adopt the exposure machine of corresponding exposure resolution ratio to make public to next regional group more then, during this next more regional group exposure other regional group is carried out the shading protection; ..., accomplish exposure until whole said regional groups.
3. the exposure method of printed wiring board according to claim 1 and 2, it is characterized in that: said exposure machine is the different CCD exposure machine of CCD number, the different CCD exposure machine exposure resolution ratio separately of CCD number is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101054421A CN101808469B (en) | 2009-02-13 | 2009-02-13 | Exposure method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101054421A CN101808469B (en) | 2009-02-13 | 2009-02-13 | Exposure method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101808469A CN101808469A (en) | 2010-08-18 |
| CN101808469B true CN101808469B (en) | 2012-03-14 |
Family
ID=42610020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101054421A Expired - Fee Related CN101808469B (en) | 2009-02-13 | 2009-02-13 | Exposure method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101808469B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888175B (en) * | 2020-12-18 | 2022-03-18 | 珠海崇达电路技术有限公司 | Method for manufacturing inner and outer layer patterns of oversized backboard |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307792A (en) * | 1998-07-13 | 2001-08-08 | 比利时西门子公司 | Method for producing printed circuit boards with rouch conducting structures and at least one area with fine conducting structures |
| CN1457225A (en) * | 2003-06-05 | 2003-11-19 | 华中科技大学 | Method for producing circuit board by laser ethcing |
| CN1743961A (en) * | 2004-09-03 | 2006-03-08 | 株式会社阿迪泰克工程 | Projection exposure apparatus and method for producing a printed circuit board |
| CN101109911A (en) * | 2006-07-21 | 2008-01-23 | 海力士半导体有限公司 | Pattern decomposition method for double exposure |
-
2009
- 2009-02-13 CN CN2009101054421A patent/CN101808469B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307792A (en) * | 1998-07-13 | 2001-08-08 | 比利时西门子公司 | Method for producing printed circuit boards with rouch conducting structures and at least one area with fine conducting structures |
| CN1457225A (en) * | 2003-06-05 | 2003-11-19 | 华中科技大学 | Method for producing circuit board by laser ethcing |
| CN1743961A (en) * | 2004-09-03 | 2006-03-08 | 株式会社阿迪泰克工程 | Projection exposure apparatus and method for producing a printed circuit board |
| CN101109911A (en) * | 2006-07-21 | 2008-01-23 | 海力士半导体有限公司 | Pattern decomposition method for double exposure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101808469A (en) | 2010-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101581884B (en) | Intaglio printing plate, production method for intaglio printing plate, production method for electronic substrate, and production method for display device | |
| EP1515537A3 (en) | Image processing information association processor; printing system, method of enabling layout data output, and program | |
| CN103246155B (en) | Photolithography mask and exposure method thereof | |
| CN101808469B (en) | Exposure method of printed wiring board | |
| EP0952488A3 (en) | Reticle inspecting apparatus capable of shortening an inspecting time | |
| CN101686635A (en) | Electronic component mounting system and method | |
| WO2006047012A3 (en) | Apparatus for the rapid development of photosensitive printing elements | |
| EP0843343A3 (en) | Processing system | |
| CN208993259U (en) | Full automatic screen printing equipment | |
| CN202388902U (en) | System for performing high-accuracy screen printing by direct plate making technology | |
| US20140373742A1 (en) | Method of manufacturing a high-resolution flexographic printing plate | |
| CN201523480U (en) | Circuit board with recognizing marks | |
| CN1681382A (en) | Support pin identifying method and device, screen printer and surface installation machine | |
| EP1418051B1 (en) | Reading apparatus | |
| CN217259207U (en) | Printer correction positioning device | |
| EP1155853A3 (en) | Printing press and printing press control method | |
| CN100553971C (en) | Utilize the method and apparatus of platform-type lathe printing pattern layer on planar substrate | |
| CN1716100A (en) | Photo development apparatus and method for fabricating a color filter substrate using the same | |
| TWI622863B (en) | Method of reprocessing after printing | |
| CN210776186U (en) | Photoetching device for electronic element production | |
| TW200419815A (en) | Dummy pattern for improving micro-lens formation in an image sensor | |
| CN105095580B (en) | A kind of method for improving sleeve type shrink film design accuracy | |
| CN110286566A (en) | A method of based on internal layer fool proof under direct-write type lithography machine jigsaw mode | |
| CN104669414B (en) | A kind of floating board mold of subway railroad switch and this mold use method | |
| CN207589284U (en) | A kind of de- material equipment for the molding machine for producing servomechanism mainboard |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120314 Termination date: 20130213 |