CN101805577A - Transparent epoxy resin packaging adhesive - Google Patents
Transparent epoxy resin packaging adhesive Download PDFInfo
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- CN101805577A CN101805577A CN 201010146358 CN201010146358A CN101805577A CN 101805577 A CN101805577 A CN 101805577A CN 201010146358 CN201010146358 CN 201010146358 CN 201010146358 A CN201010146358 A CN 201010146358A CN 101805577 A CN101805577 A CN 101805577A
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- epoxy resin
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Abstract
The invention discloses a transparent epoxy resin packaging adhesive, which is prepared with a component A and a component B according to a mass ratio of 1:0.9-1:1. The component A comprises 96-98 percent of bisphenol A epoxy resin, 1.6-3.6 percent of active diluent, 0.02-0.2 percent of transparent blue-violet dye colorant, 0.05-0.13 percent of release agent and 0.08- 0.18 percent of defoamer, and the component B is a mixture of 98-99 parts of curing agent, 0.2-0.8 part of promoter and 0.01-0.09 part of antioxidant. The transparent blue-violet dye colorant in the components can neutralize the yellow color generated by the epoxy resin. Due to the release agent, no release agent is needed for final curing formation, and the mold release is very convenient.
Description
Technical field
The present invention relates to a kind of epoxy resin encapsulation adhesive that is used for LED package.
Background technology
Along with the development that science and technology is maked rapid progress, the electronic product encapsulation technology is used for the epoxy encapsulation material of LED package also in development at high speed, because it is good to have anti-light decay ability, set time is short, and ageing resistance is good, the characteristics that operable time is long are used more and more universal.
Present light-emitting diode packaging material mainly adopts the preparation of auxiliary materials such as Resins, epoxy and promotor, and the Resins, epoxy after the curing is easy to generate yellow, and need use releasing agent during the demoulding, brings inconvenience to industrial production.
Summary of the invention
The purpose of this invention is to provide a kind of back need not releasing agent for water-white, the demoulding encapsulating adhesive that solidifies.
The technical solution adopted for the present invention to solve the technical problems is: a kind of transparent epoxy resin packaging adhesive, by the quality proportioning is 1: the A component of 0.9-1 and B mix for two groups, wherein the A component is made up of the bisphenol A epoxide resin of 96-98%, the reactive thinner of 1.6-3.6%, the transparent royal purple dye paste of 0.02-0.1%, the releasing agent of 0.05-0.13% and the defoamer of 0.08-0.18%, and the B component is mixed by the solidifying agent of 98-99 part, the promotor of 0.2-0.8 part and the antioxidant of 0.01-0.09 part.
Wherein, described reactive thinner is a C12-C14 alcohol glycidyl ether.
Wherein, described solidifying agent is a methyl hexahydrophthalic anhydride.
Wherein, described promotor is Ethyltriphenylphosphonium brimide.
Wherein, described antioxidant is pure dissolubility Tenox PG.
Contain transparent royal purple dye paste in the component of the present invention, can in and the yellow that produces of Resins, epoxy because internal mold release, need not releasing agent during final curing molding, the demoulding is quite convenient.
Embodiment
Below in conjunction with embodiment the present invention is described in further detail.
Embodiment one
Tackiness agent of the present invention is mixed for two groups by 1: 0.9 A component and B.
Wherein the A component is made up of 96% bisphenol A epoxide resin, 3.6% C12-C14 alcohol glycidyl ether, 0.1% transparent royal purple dye paste, 0.13% releasing agent and 0.17% defoamer, and the B component is mixed by 98 parts methyl hexahydrophthalic anhydride, 0.8 part Ethyltriphenylphosphonium brimide and 0.01 part pure dissolubility Tenox PG.
Embodiment two
Tackiness agent of the present invention is mixed for two groups by 1: 1 A component and B.
Wherein the A component is made up of 98% bisphenol A epoxide resin, 1.6% C12-C14 alcohol glycidyl ether, 0.1% transparent royal purple dye paste, 0.12% releasing agent and 0.18% defoamer, and the B component is mixed by 99 parts methyl hexahydrophthalic anhydride, 0.2 part Ethyltriphenylphosphonium brimide and 0.08 part pure dissolubility Tenox PG.
Embodiment three
Tackiness agent of the present invention is mixed for two groups by 1: 1 A component and B.
Wherein the A component is made up of 97% bisphenol A epoxide resin, 2.75% C12-C14 alcohol glycidyl ether, 0.05% transparent royal purple dye paste, 0.1% releasing agent and 0.1% defoamer, and the B component is mixed by 99 parts methyl hexahydrophthalic anhydride, 0.6 part Ethyltriphenylphosphonium brimide and 0.05 part pure dissolubility Tenox PG.
Claims (5)
1. transparent epoxy resin packaging adhesive, it is characterized in that: by the quality proportioning is 1: the A component of 0.9-1 and B mix for two groups, and the mass percent of wherein said each composition of A component is as follows
Bisphenol A epoxide resin 96-98%
Reactive thinner 1.6-3.6%
Transparent royal purple dye paste 0.02-0.1%
Releasing agent 0.05-0.13%
Defoamer 0.08-0.18%;
Described B component is mixed by the solidifying agent of 98-99 part, the promotor of 0.2-0.8 part and the antioxidant of 0.01-0.09 part.
2. encapsulating adhesive according to claim 1 is characterized in that, described reactive thinner is a C12-C14 alcohol glycidyl ether.
3. encapsulating adhesive according to claim 2 is characterized in that, described solidifying agent is a methyl hexahydrophthalic anhydride.
4. encapsulating adhesive according to claim 3 is characterized in that, described promotor is Ethyltriphenylphosphonium brimide.
5. encapsulating adhesive according to claim 4 is characterized in that, described antioxidant is pure dissolubility Tenox PG.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010146358 CN101805577A (en) | 2010-04-09 | 2010-04-09 | Transparent epoxy resin packaging adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010146358 CN101805577A (en) | 2010-04-09 | 2010-04-09 | Transparent epoxy resin packaging adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101805577A true CN101805577A (en) | 2010-08-18 |
Family
ID=42607532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010146358 Pending CN101805577A (en) | 2010-04-09 | 2010-04-09 | Transparent epoxy resin packaging adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101805577A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108048010A (en) * | 2017-12-25 | 2018-05-18 | 广州惠利电子材料有限公司 | Excellent charactron encapsulation glue of a kind of antifoam performance and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1827684A (en) * | 2005-03-01 | 2006-09-06 | 日东电工株式会社 | Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| CN1935896A (en) * | 2006-10-23 | 2007-03-28 | 江苏科技大学 | Epoxy vesin complex and its use |
| JP2008101171A (en) * | 2006-10-20 | 2008-05-01 | Daicel Chem Ind Ltd | Epoxy resin composition and epoxy resin cured product |
| CN101372608A (en) * | 2007-08-20 | 2009-02-25 | 大连芯拓光电有限公司 | Epoxy resin encapsulation adhesive and use thereof |
-
2010
- 2010-04-09 CN CN 201010146358 patent/CN101805577A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1827684A (en) * | 2005-03-01 | 2006-09-06 | 日东电工株式会社 | Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| US20060204761A1 (en) * | 2005-03-01 | 2006-09-14 | Nitto Denko Corporation | Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| JP2008101171A (en) * | 2006-10-20 | 2008-05-01 | Daicel Chem Ind Ltd | Epoxy resin composition and epoxy resin cured product |
| CN1935896A (en) * | 2006-10-23 | 2007-03-28 | 江苏科技大学 | Epoxy vesin complex and its use |
| CN101372608A (en) * | 2007-08-20 | 2009-02-25 | 大连芯拓光电有限公司 | Epoxy resin encapsulation adhesive and use thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108048010A (en) * | 2017-12-25 | 2018-05-18 | 广州惠利电子材料有限公司 | Excellent charactron encapsulation glue of a kind of antifoam performance and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100818 |