CN101794739A - Diode ceramic packaging template - Google Patents
Diode ceramic packaging template Download PDFInfo
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- CN101794739A CN101794739A CN 201010129051 CN201010129051A CN101794739A CN 101794739 A CN101794739 A CN 101794739A CN 201010129051 CN201010129051 CN 201010129051 CN 201010129051 A CN201010129051 A CN 201010129051A CN 101794739 A CN101794739 A CN 101794739A
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- diode
- laminate body
- pin positioning
- positioning round
- packaging template
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Abstract
The invention discloses a diode ceramic packaging template which comprises a ceramic plate body, wherein both side edges of the ceramic plate body are provided with screw holes, and the middle of the ceramic plate body is provided with a pin positioning round hole. When the diode ceramic packaging template is used, dust is not generated, and the surface of the template cannot be abraded; and the aperture of the pin positioning hole cannot become large during long-term use, thus the service life of the template is long.
Description
Technical field
The present invention relates to a kind of diode package template, concrete is a kind of diode ceramic packaging template.
Background technology
At present, related encapsulation template in the encapsulation process of diode all adopts graphite template and plastic formwork both at home and abroad, in production application, the plate quality of graphite template is loose, produce the drawback of a large amount of dust in the use in surface and the hole, because the appearance of dust, electronic product has produced unsteadiness aborning, thereby make decrease in yield, and in terminal use from now on, produce electron drift, increased unsteadiness; Plastic formwork has not wear-resisting, and useful life is short, and needs shortcomings such as nitrogen protection at the initial stage of producing.
Summary of the invention
For overcoming deficiency of the prior art, the object of the present invention is to provide a kind of diode ceramic packaging template, it has been eliminated dust aborning and has reduced pollution, uses simply in the operation, and has obtained increasing exponentially the useful life of product.
In order to achieve the above object, the present invention has adopted following technical scheme:
A kind of diode ceramic packaging template comprises a ceramic laminate body, has screw hole on the described ceramic laminate body dual-side, has the pin positioning round orifice in the middle of the described ceramic laminate body.
Preferably, have 800 pin positioning round orifice in the middle of the described ceramic laminate body.
Preferably, have 1000 pin positioning round orifice in the middle of the described ceramic laminate body.
Preferably, have 1280 pin positioning round orifice in the middle of the described ceramic laminate body.
Preferably, have 1495 pin positioning round orifice in the middle of the described ceramic laminate body.
Preferably, have 1500 pin positioning round orifice on the described ceramic laminate body.
Preferably, have 2280 pin positioning round orifice on the described ceramic laminate body.
Further, diode ceramic packaging plate of the present invention can be applicable to switching tube, voltage-stabiliser tube, detection tube, in the encapsulation of the products such as pipe that boost.
The ceramic laminate body of ceramic packaging template of the present invention has mainly adopted raw materials commonly used such as kaolin, Al2O3, SiO2, feldspar to cooperate some extraordinary raw materials through reasonable proportioning, through the disposable compacting of 350T press, fires in 1700 ℃ high temperature then and forms.The pin positioning round orifice of ceramic packaging template of the present invention is by steel alloy needle penetration pore-forming.
Beneficial effect of the present invention:
Diode ceramic packaging plate of the present invention has the characteristic of general pottery: acidproof, alkaline-resisting, high temperature resistant, anti-high voltage; Simultaneously, in the application of encapsulation diode: need not nitrogen protection, no dust produces in the work, and the aperture of pin positioning round orifice can not become big long service life in long-term the use; And in the glass tube encapsulation, the encapsulation template is thoroughly separated with the glass physical efficiency behind diode forming, can not paste mutually.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. describe in detail as after.The specific embodiment of the present invention is provided in detail by following examples and accompanying drawing thereof.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is the structural representation of diode ceramic packaging template of the present invention.
Number in the figure explanation: 1. ceramic laminate body, 2. screw hole, 3. pin positioning round orifice.
Specific implementation method
Below in conjunction with accompanying drawing the present invention is described in detail.
A kind of diode ceramic packaging template comprises a ceramic laminate body 1, has screw hole 2 on described ceramic laminate body 1 dual-side, has pin positioning round orifice 3 in the middle of the described ceramic laminate body 1.
Preferably, have 800 pin positioning round orifice 3 in the middle of the described ceramic laminate body 1.
Preferably, have 1000 pin positioning round orifice 3 in the middle of the described ceramic laminate body 1.
Preferably, have 1280 pin positioning round orifice 3 in the middle of the described ceramic laminate body 1.
Preferably, have 1495 pin positioning round orifice 3 in the middle of the described ceramic laminate body 1.
Preferably, have 1500 pin positioning round orifice 3 on the described ceramic laminate body 1.
Preferably, have 2280 pin positioning round orifice 3 on the described ceramic laminate body 1.
Further, diode ceramic packaging plate of the present invention can be applicable to switching tube, voltage-stabiliser tube, detection tube, in the encapsulation of the products such as pipe that boost.
The ceramic laminate body 1 of ceramic packaging template of the present invention has mainly adopted raw materials commonly used such as kaolin, Al2O3, SiO2, feldspar to cooperate some extraordinary raw materials through reasonable proportioning, through the disposable compacting of 350T press, fires in 1700 ℃ high temperature then and forms.The pin positioning round orifice 3 of ceramic packaging template of the present invention is by steel alloy needle penetration pore-forming.
More than the diode ceramic packaging plate that the embodiment of the invention provided is described in detail, for one of ordinary skill in the art, all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (7)
1. a diode ceramic packaging template is characterized in that: comprise a ceramic laminate body (1), have screw hole (2) on described ceramic laminate body (1) dual-side, have pin positioning round orifice (3) in the middle of the described ceramic laminate body (1).
2. diode ceramic packaging template according to claim 1 is characterized in that: have 800 pin positioning round orifice (3) in the middle of the described ceramic laminate body (1).
3. diode ceramic packaging template according to claim 1 is characterized in that: have 1000 pin positioning round orifice (3) in the middle of the described ceramic laminate body (1).
4. diode ceramic packaging template according to claim 1 is characterized in that: have 1280 pin positioning round orifice (3) in the middle of the described ceramic laminate body (1).
5. diode ceramic packaging template according to claim 1 is characterized in that: have 1495 pin positioning round orifice (3) in the middle of the described ceramic laminate body (1).
6. diode ceramic packaging template according to claim 1 is characterized in that: have 1500 pin positioning round orifice (3) on the described ceramic laminate body (1).
7. diode ceramic packaging template according to claim 1 is characterized in that: have 2280 pin positioning round orifice (3) on the described ceramic laminate body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010129051 CN101794739A (en) | 2010-03-22 | 2010-03-22 | Diode ceramic packaging template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010129051 CN101794739A (en) | 2010-03-22 | 2010-03-22 | Diode ceramic packaging template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101794739A true CN101794739A (en) | 2010-08-04 |
Family
ID=42587316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010129051 Pending CN101794739A (en) | 2010-03-22 | 2010-03-22 | Diode ceramic packaging template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101794739A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6375340B1 (en) * | 1999-07-08 | 2002-04-23 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh | Led component group with heat dissipating support |
| CN2901587Y (en) * | 2006-05-26 | 2007-05-16 | 北京工业大学 | Heat radiation device of LED |
| US20080191225A1 (en) * | 2007-02-12 | 2008-08-14 | Medendorp Nicholas W | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
| CN201318563Y (en) * | 2008-11-27 | 2009-09-30 | 北京万方广源数码光源技术有限公司 | Luminescence unit structure of light-emitting diode provided with aluminum circuit substrate |
| CN201355611Y (en) * | 2009-01-23 | 2009-12-02 | 九豪精密陶瓷(昆山)有限公司 | Die bonding base plate with surface polishing layer |
-
2010
- 2010-03-22 CN CN 201010129051 patent/CN101794739A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6375340B1 (en) * | 1999-07-08 | 2002-04-23 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh | Led component group with heat dissipating support |
| CN2901587Y (en) * | 2006-05-26 | 2007-05-16 | 北京工业大学 | Heat radiation device of LED |
| US20080191225A1 (en) * | 2007-02-12 | 2008-08-14 | Medendorp Nicholas W | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
| CN201318563Y (en) * | 2008-11-27 | 2009-09-30 | 北京万方广源数码光源技术有限公司 | Luminescence unit structure of light-emitting diode provided with aluminum circuit substrate |
| CN201355611Y (en) * | 2009-01-23 | 2009-12-02 | 九豪精密陶瓷(昆山)有限公司 | Die bonding base plate with surface polishing layer |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100804 |