CN101781442B - Halogen-free resin glue and film manufactured from same - Google Patents
Halogen-free resin glue and film manufactured from same Download PDFInfo
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- CN101781442B CN101781442B CN2009100048743A CN200910004874A CN101781442B CN 101781442 B CN101781442 B CN 101781442B CN 2009100048743 A CN2009100048743 A CN 2009100048743A CN 200910004874 A CN200910004874 A CN 200910004874A CN 101781442 B CN101781442 B CN 101781442B
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Abstract
The invention relates to halogen-free resin glue. The resin glue is characterized by comprising a component (A), namely epoxy resin, a component (B), namely a compound hardening agent, a component (C), namely aromatic condensed phosphate, and a component (D), namely a filling material, wherein the compound hardening agent is prepared by mixing benzoxazine (BZ) resin and amino triazine phenolic aldehyde (ATN) resin in a preset proportion; and the filling material comprises aluminium hydroxide and silicon dioxide. Therefore, a film manufactured by impregnating the film in the halogen-free resin glue can have excellent heat resistance and burning resistance, and low hydroscopic property.
Description
Technical field
The invention relates to a kind of halogen-free resin glue, refer to a kind of halogen-free resin glue especially with compound stiffening agent, aromatic condensation SULPHOSUCCINIC ACID ESTER and stopping composition.
Background technology
Applied scope of printed substrate and field are quite extensive at present; Electronic package in the general electronic products all is plugged on the printed substrate; And printed substrate now is for the range of application of the assembly that meets superpower and high calorie; So on the heat radiation function of printed substrate, develop and study, to improve the radiating efficiency and the superpower of circuit card.
And printed substrate is by impregnation film (PP), or contain the Copper Foil film (Copper clad laminate, CCL) or plural film such as Copper Foil utilize the hot pressing program to fill a part pressing; And the film after this impregnation is glasscloth to be impregnated in an epoxy resin preimpregnation body form glue, and carries out successive process such as drying and form a kind of slim film.
But because the new line of environmental consciousness in recent years, many consumer electronics article do not use the copper clad laminate that contains halogen gradually, and use halogen-free copper foil base plate instead.And the making epoxy resin that aforesaid substrate adopted; The stiffening agent of its collocation can be divided into Dyhard RU 100 (Dicyandiamide) and two kinds of systems of phenol resol (Phenol novolac resin); But the former base material has high-hygroscopicity and the not good shortcoming of thermotolerance; The latter's agent of low hygroscopicity and thermotolerance all are superior to the base material of Dyhard RU 100 stiffening system, but still further research and development are formed with the glue that the resol stiffening agent of multiple variation is arranged in pairs or groups.For example No. the 293831st, the TaiWan, China patent, and its exposure utilizes the benzoxazine colophony (BZ resin) and the glue composition of P contained compound to possess anti-combustion characteristic to reach made resin film.No. the 583258th, TaiWan, China patent for example again; Disclose and a kind ofly utilize benzoxazine colophony (BZ resin) and phenols, have the stiffening agent of the compound of triazine ring and the copolymer resin of aldehydes (ATN resin) both and usefulness; The glue of this composition can promote for the anti-combustion of film to some extent, but it advocates to adopt a large amount of BZ type hardening of resin agent, and relative ATN amount of resin is then less; Therefore; Though can improve the Tg of film and reduce the water-absorbent of film, the floating tin result (heat-resistant quality) and then can reduce of film, and made substrate has, and toughness is not good excessively will to cause the not good problem of thermotolerance with adding.
The inventor is in order to overcome above-mentioned defective, proposes a kind of reasonable in design and effectively improve the present invention of above-mentioned disappearance.
Summary of the invention
Main purpose of the present invention is to provide a kind of halogen-free resin glue, wherein has compound stiffening agent, can make made film take into account thermotolerance, flame resistivity and agent of low hygroscopicity.
A purpose more of the present invention; Be to provide a kind of halogen-free resin glue; Wherein more be added with weighting material and P contained compound, impregnated in the made film of this halogen-free resin glue with the lifting glass cloth and can have better thermotolerance, flame resistivity and agent of low hygroscopicity.
The present invention provides a kind of halogen-free resin glue, it is characterized in that, comprising: component (A): epoxy resin; Component (B): compound stiffening agent, wherein this compound stiffening agent be by benzoxazine (Benzoxazine) (BZ) resin and aminotriazine phenolic aldehyde (Amino triazine novolac) (ATN) resin mix with a predetermined proportion; Component (C): aromatic condensation SULPHOSUCCINIC ACID ESTER; And component (D): stopping composition, wherein this stopping composition comprises white lake and silicon-dioxide.
The present invention also provides a kind of this glasscloth impregnated in the above-mentioned halogen-free resin glue, and through solidify, after the drying and other steps, and form have high heat resistance, high flame resistivity and a low film of water-absorbent.
The present invention has following useful effect: the present invention utilizes two kinds of stiffening agent collocation to form a combined type stiffening agent; And use this combined type stiffening agent in a main resin to form the halogen-free resin glue; Therefore; When glasscloth impregnated in this glue, can promote the flame resistivity of the film behind the dipping, also can take into account the water-absorbent of film simultaneously; In this glue, add low-molecular-weight P contained compound simultaneously, to increase the flame resistivity of above-mentioned film.
For enabling further to understand characteristic of the present invention and technology contents, see also following relevant detailed description of the present invention.
Embodiment
The present invention provides a kind of compound stiffening agent; Should make an addition in the epoxy resin by compound stiffening agent; Make glasscloth be able to form thermotolerance height and the low film of water absorbability (water-absorbent), and then above-mentioned film capable of using and Copper Foil are produced the laminated plates of taking into account heat-resisting and moisture-absorption characteristics with hot pressed mode through after impregnation (dipping) step.In addition, the present invention further adds a kind of low-molecular-weight P contained compound to promote the heat-resisting and flame-retarding characteristic of the resin of being modulated; Moreover the present invention more adds the stopping composition of suitable proportion, to produce the film with preferable anti-combustion and heat-resistant quality.
This compound stiffening agent is mainly mixed with a predetermined proportion by benzoxazine (BZ) resin and aminotriazine phenolic aldehyde (ATN) resin by compound stiffening agent.Aminotriazine phenolic aldehyde (ATN) resin is phenols, have the compound of triazine ring and the copolymer resin of aldehydes; When above-mentioned phenols produces multipolymer with compound with triazine ring and aldehydes; Employed phenols can be given an example like the polyatomic phenol of phenol or dihydroxyphenyl propane, Bisphenol F, bisphenol S etc.; Or the induced by alkyl hydroxybenzene of cresols, xylenol, ethyl phenol, butylphenol etc., amido phenol, phenyl phenol etc. can be separately or more than two kinds and use.And during with phenol and dihydroxyphenyl propane or phenol and alkylphenol, the reactive downtrod plasticity of person is preferable to use phenol more separately in general; It is good simultaneously using dihydroxyphenyl propane or alkylphenol person's flame retardancy more separately.In addition; Compound with triazine ring can be given an example like the guanamine verivate of melamine, benzene a pair of horses going side by side guanamine, acetyl guanamine etc.; The cyanuric acid verivate of cyanuric acid or cyanuric acid methyl esters, cyanuric acid ethyl ester etc., or the tricarbimide verivate of tricarbimide or methyl isocyanurate, tricarbimide ethyl ester etc. etc.Wherein the thermotolerance of melamine and difficult combustion characteristic are good, and cost consideration is comparatively desirable.But the present invention is not exceeded with above-mentioned, can have the kind and the usage quantity of the compound of triazine ring according to the purpose selection, and obtain the righttest flame retardancy, reactivity and thermotolerance by its nitrogen content of adjustment.Moreover the aldehydes of above-mentioned use can be given an example like formaldehyde, Paraformaldehyde 96 、 trioxane, tetrahydroxy methane etc., but is not limited in above-mentioned scope.With regard to ease of use, comparatively suitable with formaldehyde, especially with Superlysoform, Paraformaldehyde 96 for better.
Benzoxazine (BZ) resin is the resin of principal constituent for the compound with benzoxazine then, so long as have benzoxazine and the hardened resin gets final product by the ring-opening reaction of benzoxazine, does not have other restriction.The characteristic of benzoxazine (BZ) resin is to have characteristics such as the low-dielectric loss factor, snappiness rate, high heat resistance, low water absorbable, high glass transition temperature, high flame retardancy and punching processing property etc.; And the softening temperature of this BZ resin of control that can be suitable, to reduce the stiff and shortcoming of lacking toughness of its body frame structure; Splitting when reducing the profile punching simultaneously, and improve the gluing power of the resin layer contact with the multi-layer wiring board internal layer circuit is to improve the come off effect of intensity of internal layer.
So the present invention forms the composite resin stiffening agent with above-mentioned two kinds of hardening resins; And further allocate learning best resin adhesive liquid combination formula for the composition of BZ and the agent of ATN hardening of resin, to promote thermotolerance and the characteristic of low moisture absorption outside the anti-combustion characteristic.Below will carry out the collocation of many group embodiment, reach best film characteristic by the allotment of both ratios with explanation to BZ and ATN resin.
Table 1
Table 1 shows the glue of three kinds of heterogeneity ratios; Wherein main resin (being the epoxy resin of component A) is 100 amount parts; And this epoxy resin is o-Hydroxytoluene formaldehyde epoxy resin (cresol novalac epoxy resin), phenol novolac epoxy resins (phenol novalac epoxy resin), bisphenol-A phenolic epoxy resin (bisphenol-A novalac epoxy resin) or above-mentioned two or more mixed resin; But do not exceed with above-mentioned; And the embodiment 1 of table 1, reference examples 1 and reference examples 2 mainly are the agent of BZ hardening of resin and the compositions of ATN hardening of resin agent that changes in the compound stiffening agent of component B, and carry out the various characteristics analysis to the different made films of forming of glue.Wherein, water-absorbent can be called water absorbability again, and it mainly is to judge the water absorption character of this film, because film can receive temperature and humidity effect and the dilatational strain or the absorption aqueous vapor of environment.And under the too high situation of these film water cut, packed moisture, be prone to make the printed substrate of being suppressed to produce the problem of plate bursting or defective of other circuit card or the like, so absorptive characteristic is one of important feature of film.Traditionally, can carry out IR spectroscopic analysis or hot weight loss method analysis to this material, to confirm the water-absorbent of this film.So can find from table 1; Water-absorbent analysis from reference examples 1, reference examples 2 to embodiment 1; When the ratio of agent of ATN hardening of resin and the agent of BZ hardening of resin by 56/0 (not adding the BZ stiffening agent) to 48/8 under the situation of (promptly 6/1), the water-absorbent of film can drop to 0.151% gradually by 0.174%.
Thermotolerance: promptly float the tin result; Heat-resistant experiment is according to industry standard IPC-TM-650Method 2.4.13.1; The film that will dispel the heat be soaked in 288 ℃ of tin stove to plate bursting required times (minute); Can learn that wherein the film that is undertaken making after the operation of glasscloth dipping by resin adhesive liquid proposed by the invention has higher thermotolerance, so required time of plate bursting length and meet test specification.Can find from table 1; Float the tin result from reference examples 1, reference examples 2 to embodiment 1; When the ratio of agent of ATN hardening of resin and the agent of BZ hardening of resin by 56/0 (not adding the BZ stiffening agent) to 48/8 under the situation of (promptly 6/1), the tin result that floats of film can be by rising to ten minutes gradually (it is good judgment standard that ten minutes the tin time of floating can be considered thermotolerance usually) less than ten minutes.
Flame resistivity: i.e. flame retardancy, measure according to UL 94 methods, be meant the test of plastic material flame resistivity, it stipulates the anti-combustion grade of plastic material with the spontaneous combustion time of plastic material standard test piece behind flame, spontaneous combustion speed, the graininess that drops.And good and bad according to anti-combustion grade, be HB, V-2, V-1, V-0 successively, be up to the 5V grade.And UL 94 testing method are meant that plastic material burns on flame with vertical mode.With per ten seconds be a test period, its step is following: step 1: put in the flame test piece into ten seconds and remove again, measure remove after this test piece burn away the time (T1); Step 2: after treating the test piece fray-out of flame, put in the flame ten seconds again into and remove again, measure again remove after this test piece burn away the time (T2); Step 3: repeat to test and get for several times its MV; Step 4: the sum total of calculating T1+T2.And the requirement of UL 94V-0 grade to be the average neither of average and T2 at test piece single combustion time of T1 must surpass 10 seconds, and the sum total of its T1 and T2 is must not be above 50 seconds square meet UL 94V-0 requirement.So reference examples 1, reference examples 2 and the embodiment 1 made film of table 1 all can reach the requirement of UL 94V-0.
Therefore; Water-absorbent, thermotolerance and flame resistant characteristic by table 1 are analyzed; Be under 6/1 the situation when the ratio of agent of ATN hardening of resin and the agent of BZ hardening of resin; Above-mentioned characteristic all can be reached quite good, and in other words, the ratio of agent of ATN hardening of resin and the agent of BZ hardening of resin is 6/1 promptly to can be considered the best aspect of implementing of the present invention.
Table 2
Table 2 shows the agent of ATN hardening of resin and the BZ hardening of resin agent composition of multiple different ratios; According to the result of table 2 with table 1; Ratio the best that the agent of ATN hardening of resin and the agent of BZ hardening of resin are formed is 48/8 (6/1), but the agent of ATN hardening of resin and the scope of BZ hardening of resin agent composition can be relaxed in 1/1 (as contrasting 7 ratio promptly near 1/1) to 8/1 (as contrasting 9 ratio promptly near 8/1).And table 2 more shows epoxy group(ing) and the hydroxy mole number and the stable on heating difference of different ratios, and above-mentioned epoxy group(ing) is the epoxy resin of host amount, and hydroxy is then represented the ATN resin.Can learn that from table 2 working as hydroxy gets over for a long time, thermotolerance can descend, and hereat, the ratio of hydroxy (being the ATN resin) also must limit.By the analytical data of the contrast 9 of table 2, in contrast 9, the ratio of main resin (epoxy group(ing)) and ATN resin (hydroxy) is 100/50 (promptly 2/1); And produced film characteristic is as shown in table 2, wherein can find, the film of contrast 9 is in the experiment of floating tin; The tin result that floats of film is merely six to seven minutes, thus thermotolerance and falling short of specifications, therefore; By above-mentioned experimental data, the weight ratio of this epoxy resin and aminotriazine phenolic aldehyde (ATN) resin is smaller or equal to (≤) 2.
On the other hand, the present invention further adds component (C): P contained compound is in this halogen-free resin glue.Be the anti-combustion characteristic of reinforcement product, and do not influence the anti-combustion and the heat-resistant quality of resin, the present invention adopts a kind of low-molecular-weight anti-retardant compound, with the flame resistivity of the resin of the present invention that gains.And this specific embodiment adopts a kind of molecular weight less than 600 aromatic condensation SULPHOSUCCINIC ACID ESTER, and consumption is 25 to 40 parts of main resin, and is good with 33 parts of consumptions, is with [OC
6H
3(CH
3)
2] 2P (O) OC
6H
4OP (O) [OC
6H
3(CH
3)
2]
2Be the principal constituent structure.
In addition, the present invention further adds component (D): stopping composition is in this halogen-free resin glue, to promote the resin film of anti-combustion, heat-resisting, low water absorbable; And in this specific embodiment, this stopping composition comprises white lake and silicon-dioxide, and white lake mainly provides anti-combustion (fire-retardant) characteristic, and its reason white lake is heated and can emits the crystal water molecule; Silicon-dioxide then is the good material of heat-resistant quality.Please refer to table 3, it is that the white lake of different ratios and the interpolation of silicon-dioxide are formed, and for the influence of resin film characteristic, and the composition of the main ring epoxy resins among each embodiment of table 3, ATN stiffening agent, BZ stiffening agent and P contained compound is all identical.
Table 3
The comparative example 3 of table 3 can find that wherein the anti-combustion grade of its resin film drops to the V-1 grade, so the flame resistivity of the film of comparative example 3 is substandard for there not being the stopping composition of interpolation fully.1 of comparative example adds 40 parts of white lakes and does not have interpolation silicon-dioxide, so the anti-combustion grade of the film of comparative example 1 is the V-0 grade, on the contrary, the heat-resistant quality of the film of comparative example 1 is not good, and it floats the tin result and is merely four to five minutes.And 2 of comparative examples add 40 parts silicon-dioxide and do not have interpolation white lake; So the heat-resistant quality of the film of comparative example 2 rose to ten minutes in four to five minutes by the tin result that floats of the film of comparative example 1; Otherwise the anti-combustion grade of the film of comparative example 2 then is reduced to the V-1 grade by the V-0 grade of comparative example 1; On the other hand, the thermostability of comparative example 2 (can be known by the data of Td) also significantly promotes than comparative example 1.Therefore no matter, can be found by comparative example 1 to 3, be that the resin film that does not add stopping composition fully or only add a certain stopping composition made all can produce the deficiency on certain specific character, causes the off-gauge product requirement of film.Please again with reference to comparative example 5, wherein add 40 parts of silicon-dioxide and 40 parts of white lakes simultaneously, and the film characteristic of comparative example 5 mades just can meet requirement of products, wherein the tin result that floats of film surpasses ten minutes, and the anti-combustion grade of film is the V-0 grade.And the present invention further finely tunes the ratio of silicon-dioxide and white lake, and wherein the umber of silicon-dioxide is 50 parts, and white lake then drops to 30 parts; And form the making of carrying out film with this; Wherein can find that by table 3 thermotolerance and flame resistivity all maintain highest ranking, and the water-absorbent of film improves further, the suction of film drops to 0.151% by 0.169% of comparative example 5; So in most preferred embodiment; The ratio of this silicon-dioxide and white lake is 5/3, and the stopping composition of this component (D) is 70 to 90 parts of main resin, and the best is 80 parts.
In sum, the present invention further proposes a kind of halogen-free resin glue, and it comprises component (A): epoxy resin; Component (B): compound stiffening agent, wherein this compound stiffening agent is to be mixed with a predetermined proportion by benzoxazine (BZ) resin and aminotriazine phenolic aldehyde (ATN) resin; Component (C): aromatic condensation SULPHOSUCCINIC ACID ESTER; And component (D): stopping composition, wherein this stopping composition comprises white lake and silicon-dioxide.Table 4 shows that then the best group of this halogen-free resin glue is proportional; Wherein, this halogen-free resin glue more includes component (E): additive, for example promotor in the table 4 and solvent; And in this most preferred embodiment; This promotor is imidazolium compounds, glyoxal ethyline for example, and its function is to quicken to control the setting time of glue; Solvent then is MEK, PM, pimelinketone of 15-30 part etc.
Table 4
The present invention further proposes a kind ofly to use above-mentioned halogen-free resin glue with the method for making film and the film of made moulding.This method is used above-mentioned halogen-free resin glue, and it comprises component (A): epoxy resin; Component (B): compound stiffening agent, wherein this compound stiffening agent is to be mixed with a predetermined proportion by benzoxazine (BZ) resin and aminotriazine phenolic aldehyde (ATN) resin; Component (C): aromatic condensation SULPHOSUCCINIC ACID ESTER; And component (D): stopping composition, wherein this stopping composition comprises white lake and silicon-dioxide, and a glasscloth is flooded (dipping) in this glue.And more can further contain component (E) in this glue: additive, compound such as promotor, solvent for example, but do not exceed with above-mentioned; In addition, be like above-mentioned experimental data gained in order to the proportion of composing of the halogen-free resin glue of impregnated glass fiber cloth, repeat no more at this.
In sum, the present invention has following all advantage:
1. the present invention utilizes two kinds of stiffening agent collocation to form a combined type stiffening agent; And use this combined type stiffening agent in a main resin to form the halogen-free resin glue; To promote the flame resistivity of the made film of this glue, also can take into account the low water absorbable and the thermotolerance of film simultaneously; In this glue, add low-molecular-weight P contained compound simultaneously, to increase the flame resistivity of above-mentioned film.
2. on the other hand, more be added with in the halogen-free resin glue of the present invention and have a certain proportion of stopping composition (white lake and silicon-dioxide), to reach the resin film characteristic of anti-combustion, heat-resisting, low suction.
Only the above is merely preferred embodiment of the present invention; Non-ly be intended to limit to scope of patent protection of the present invention; So the equivalence of using specification sheets of the present invention and graphic content to do such as changes, and all in like manner all is contained in the protection domain of claim of the present invention, closes and gives Chen Ming.
Claims (9)
1. a halogen-free resin glue is characterized in that, comprising:
Component (A): epoxy resin;
Component (B): compound stiffening agent; Wherein said compound stiffening agent is mixed with a predetermined proportion by benzoxazine (BZ) resin and aminotriazine phenolic aldehyde (ATN) resin; The part by weight of aminotriazine phenolic aldehyde (ATN) resin in the said compound stiffening agent and benzoxazine (BZ) resin is 6, and the weight ratio of aminotriazine phenolic aldehyde (ATN) resin in the epoxy resin of said component (A) and the component (B) is smaller or equal to 2; Component (C): the aromatic condensation SULPHOSUCCINIC ACID ESTER, wherein said aromatic condensation SULPHOSUCCINIC ACID ESTER is [OC
6H
3(CH
3)
2]
2P (O) OC
6H
4OP (O) [OC
6H
3(CH
3)
2]
2And
Component (D): stopping composition, wherein this stopping composition comprises white lake and silicon-dioxide.
2. halogen-free resin glue as claimed in claim 1 is characterized in that: with respect to the component (A) of 100 weight parts, the consumption of said aromatic condensation SULPHOSUCCINIC ACID ESTER is 25 to 40 parts.
3. halogen-free resin glue as claimed in claim 2 is characterized in that: with respect to the component (A) of 100 weight parts, the consumption of said aromatic condensation SULPHOSUCCINIC ACID ESTER is 33 parts.
4. halogen-free resin glue as claimed in claim 2 is characterized in that: with respect to the component (A) of 100 weight parts, the stopping composition of said component (D) is 70 to 90 parts.
5. halogen-free resin glue as claimed in claim 4 is characterized in that: the silicon-dioxide in the said component (D) and the weight ratio of white lake are 5: 3.
6. halogen-free resin glue as claimed in claim 5 is characterized in that: further comprise: component (E): additive, said additive are promotor and solvent.
7. halogen-free resin glue as claimed in claim 6 is characterized in that: said promotor is imidazolium compounds.
8. halogen-free resin glue as claimed in claim 1 is characterized in that: said epoxy resin is o-Hydroxytoluene formaldehyde epoxy resin, phenol novolac epoxy resins, bisphenol-A phenolic epoxy resin or above-mentioned two or more hybrid resin.
9. one kind impregnated among the claim 1-8 film of made in each described halogen-free resin glue with the glass adhesive plaster.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100048743A CN101781442B (en) | 2009-01-21 | 2009-01-21 | Halogen-free resin glue and film manufactured from same |
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|---|---|---|---|
| CN2009100048743A CN101781442B (en) | 2009-01-21 | 2009-01-21 | Halogen-free resin glue and film manufactured from same |
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|---|---|
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| CN101781442B true CN101781442B (en) | 2012-11-28 |
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| CN102372903B (en) * | 2010-08-18 | 2014-04-16 | 合正科技股份有限公司 | Halogen-free phosphorus-free thermosetting resin composition |
| CN103788576B (en) * | 2013-12-02 | 2017-01-11 | 上海南亚覆铜箔板有限公司 | Epoxy resin composition and preparation method thereof |
| US9963590B2 (en) * | 2014-06-10 | 2018-05-08 | Shengyi Technology Co., Ltd. | Halogen-free resin composition, and a prepreg and a laminate used for printed circuit using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101104727A (en) * | 2007-06-12 | 2008-01-16 | 广东生益科技股份有限公司 | Halogen-free resin composition and resin-coated copper foil of the same for high-density interconnection |
| US20080241578A1 (en) * | 2007-03-28 | 2008-10-02 | Grand Tek Advance Material Science Co., Ltd. | Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad lamination |
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2009
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080241578A1 (en) * | 2007-03-28 | 2008-10-02 | Grand Tek Advance Material Science Co., Ltd. | Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad lamination |
| CN101104727A (en) * | 2007-06-12 | 2008-01-16 | 广东生益科技股份有限公司 | Halogen-free resin composition and resin-coated copper foil of the same for high-density interconnection |
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Effective date of registration: 20180117 Address after: Xishan Economic Development Zone, Wuxi, Jiangsu Patentee after: Lianmao (Wuxi) Electronics Technology Co., Ltd. Address before: China Taiwan Taoyuan County Patentee before: Iteq Electronic Co., Ltd. |
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