CN101775760A - Broad-width multi-layer compound package material joint device and method - Google Patents
Broad-width multi-layer compound package material joint device and method Download PDFInfo
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- CN101775760A CN101775760A CN200910201475A CN200910201475A CN101775760A CN 101775760 A CN101775760 A CN 101775760A CN 200910201475 A CN200910201475 A CN 200910201475A CN 200910201475 A CN200910201475 A CN 200910201475A CN 101775760 A CN101775760 A CN 101775760A
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Abstract
The invention relates to a broad-width multi-layer compound package material joint device and a method. A regulation screw nut (8) is sequentially connected with a knife body of a casting (1), a paper pad (2), a heating block (3) and a first aluminum block (4) from top to bottom, and is positioned at the upper part of the middle of the device, a second aluminum block (7) is positioned right under the first aluminum block (4), and is connected with a bottom fixed device, a piece of Teflon high-temperature cloth (5) is covered outside the first aluminum block (4) and is used as a heat insulation device, and the upper surface of the second aluminum block (7) is provided with a silicon rubber high-temperature resistance strip (6) to be used as a heat insulation device. The method comprises the following process flows in sequence: unreeling new rolls of composite materials, lapping and overlapping new rolls of materials and old rolls of materials, clamping and fixing two layers of materials, heating a hot sealing knife and tightly clamping the hot sealing knife for hot sealing and releasing. The invention can solve the problem of the hot sealing of composite materials with large thickness in the prior art.
Description
Technical field
The invention belongs to wrapping paper and make the field, particularly relate to a kind of broad-width multi-layer compound package material joint device and method.
Background technology
The multi-layer compound package material is composited jointly by cardboard, aluminium foil, laminated plastics, is characterized in that thickness is very thick, reaches 300-500mm, and the wide 1.4m that reaches of fabric width is with general heat-sealing technology---the ultrasonic wave high-frequency mode is difficult to reach the effect of tightening seal splice grafting head.
Summary of the invention
Technical problem to be solved by this invention provides a kind of broad-width multi-layer compound package material joint device and method, to solve the big problems of composite of heat-sealing thickness in the prior art.
The technical solution adopted for the present invention to solve the technical problems is: a kind of broad-width multi-layer compound package material joint device is provided, comprise foundry goods (blade), paper washer (heat insulating mattress), heat block, aluminium block I (hot knife I), high temperature cloth, soft of high temperature, aluminium block II (hot knife II), adjust nut and alignment pin, described adjustment nut is connected with foundry goods from top to bottom in turn, paper washer, heat block, aluminium block I (hot knife I), and be positioned at top in the middle of the device, soft of described high temperature be positioned at aluminium block I (hot knife I) under, its bottom is connected with aluminium block II (hot knife II).
The cross sectional shape of described foundry goods (blade) is " recessed " font.
Described aluminium block I (hot knife I) outsourcing high temperature cloth.
The length of described foundry goods (blade), paper washer (heat insulating mattress), heat block, aluminium block I (hot knife I), high temperature cloth, soft of high temperature and aluminium block II (hot knife II) is 1～2m.
A kind of method of using broad-width multi-layer compound package material joint device is provided, comprises that technological process is followed successively by, the new volume of composite unreels, new roll of material is with old roll of material joining is overlapping, two layers of material is clamped fixing, hot knife clamping heat seal, unclamp.
Hot knife heats simultaneously up and down, has improved heat transfer efficiency, 250 ℃-260 ℃ of temperature.
Use two cylinders guaranteed wide cut situation downforce even, pressure 6-8kg/cm
2Push down simultaneously and have enough pressure to put on the material, length 1m～2m.
Because the heat-sealing time is long, reach 8-12s, therefore adopted the thermal insulation design of high temperature cloth and heat-resisting soft bar, make that heat is unlikely to be transmitted on the cylinder, guaranteed the reliability and the security of installing.
Beneficial effect
1. used heat-proof device on the hot knife of the present invention, prevented the hot knife distortion effectively, and protected cylinder, made it not to be damaged;
2. the present invention uses single cylinder to guarantee the uniformity of pressure;
3. heat seal width reaches 30mm.
Description of drawings
Fig. 1 is a front view of the present invention.
Fig. 2 is a side view of the present invention.
Wherein: 1-foundry goods (blade), 2-paper washer (heat insulating mattress), the 3-heat block, 4-aluminium block I (hot knife I), the 5-high temperature cloth, soft of 6-high temperature, 7-aluminium block II (hot knife II), 8-adjusts nut, 9-alignment pin.
The specific embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in and limit the scope of the invention.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
As shown in Figures 1 and 2, a kind of piecing devices of broad-width multi-layer compound package material, comprise foundry goods 1 (blade), paper washer 2 (heat insulating mattress), heat block 3, aluminium block I 4 (hot knife I), high temperature cloth 5, soft 6 of high temperature, aluminium block II 7 (hot knife II), adjust nut 8 and alignment pin 9, described adjustment nut 8 is connected with foundry goods 1 (blade) from top to bottom in turn, paper washer 2, heat block 3, aluminium block I 4 (hot knife I), and be positioned at top in the middle of the device, soft 6 of described high temperature be positioned at aluminium block I 4 (hot knife I) under, its bottom is connected with aluminium block II 7 (hot knife II).
The cross sectional shape of described foundry goods 1 (blade) is " recessed " font.
Described aluminium block I 4 (hot knife I) outsourcing high temperature cloth 5.
Position relation between heat block 3 and the aluminium block I 4 (hot knife I) is adjusted by adjusting nut 8.
The technological process of implementing is followed successively by, and the new volume of composite unreels, new roll of material is with old roll of material joining is overlapping, two layers of material is clamped fixing, hot knife clamping heat seal, unclamp.
Claims (8)
1. the piecing devices of a broad-width multi-layer compound package material, comprise foundry goods (1) blade, paper washer (2), heat block (3), aluminium block I (4) hot knife I, high temperature cloth (5), soft of high temperature (6), aluminium block II (7) hot knife II, adjust nut (8) and alignment pin (9), it is characterized in that: described adjustment nut (8) is connected with foundry goods (1) from top to bottom in turn, blade, paper washer (2), heat block (3) and aluminium block I (4), and as last hot sealing device, described aluminium block II (7) be positioned at aluminium block I (4) under, and be connected with base fixture as hot sealing device down.
2. the piecing devices of a kind of broad-width multi-layer compound package material according to claim 1 is characterized in that: be connected with two cylinders above the described upward hot sealing device.
3. a kind of broad-width multi-layer compound package material joint device according to claim 1, it is characterized in that: described aluminium block I (4) outsourcing Teflon high temperature cloth (5) is as heat-proof device, and described aluminium block II (7) upper surface has silicon rubber heat-resisting soft bar (6) as heat-proof device.
4. a kind of broad-width multi-layer compound package material joint device according to claim 1 is characterized in that: the cross sectional shape of described foundry goods (1) is " recessed " font.
5. method of using broad-width multi-layer compound package material joint device, it is characterized in that: comprise that technological process is followed successively by, the new volume of composite unreels, new roll of material is with old roll of material joining is overlapping, two layers of material is clamped fixing, hot knife clamping heat seal, unclamp.
6. a kind of method of using broad-width multi-layer compound package material joint device according to claim 5 is characterized in that: described cylinder pressure is 6-8kg/cm
2
7. a kind of method of using broad-width multi-layer compound package material joint device according to claim 5 is characterized in that: the described heat-sealing time reaches 8-12s.
8. a kind of method of using broad-width multi-layer compound package material joint device according to claim 5 is characterized in that: described heat-sealing temperature is 250 ℃-260 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102014756A CN101775760B (en) | 2009-12-18 | 2009-12-18 | Broad-width multi-layer compound package material joint device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102014756A CN101775760B (en) | 2009-12-18 | 2009-12-18 | Broad-width multi-layer compound package material joint device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101775760A true CN101775760A (en) | 2010-07-14 |
| CN101775760B CN101775760B (en) | 2012-02-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102014756A Active CN101775760B (en) | 2009-12-18 | 2009-12-18 | Broad-width multi-layer compound package material joint device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112932550A (en) * | 2021-01-28 | 2021-06-11 | 宋涛 | Endocrine sample storage device |
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2009
- 2009-12-18 CN CN2009102014756A patent/CN101775760B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112932550A (en) * | 2021-01-28 | 2021-06-11 | 宋涛 | Endocrine sample storage device |
| CN112932550B (en) * | 2021-01-28 | 2022-09-06 | 宋涛 | Endocrine sample storage device |
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| Publication number | Publication date |
|---|---|
| CN101775760B (en) | 2012-02-29 |
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