CN101772275B - Method for fixing magnetic core in PCB (Printed Circuit Board) taphole - Google Patents
Method for fixing magnetic core in PCB (Printed Circuit Board) taphole Download PDFInfo
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- CN101772275B CN101772275B CN2010100428209A CN201010042820A CN101772275B CN 101772275 B CN101772275 B CN 101772275B CN 2010100428209 A CN2010100428209 A CN 2010100428209A CN 201010042820 A CN201010042820 A CN 201010042820A CN 101772275 B CN101772275 B CN 101772275B
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- magnetic core
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Abstract
The invention discloses a method for fixing a magnetic core in a PCB (Printed Circuit Board) taphole. The method comprises the following steps of: (1) material preparation: preparing a core plate; (2) drilling: drilling a through hole and a depth control hole on the core plate, wherein the through hole and the depth control hole form a step hole, and the diameter of the through hole is smaller than that of the depth control hole; (3) magnetic core placement: placing a magnetic core on the step of the step hole of the core plate and filling resin in the magnetic core, wherein the magnetic core is arranged in the depth control hole; and (4) press-fitting: sequentially press-fitting a prepreg and a copper foil on the surface of the core plate. In the method, the magnetic core is directly placed in the step hole of the core plate, i.e. the magnetic core is fixed by utilizing the step of the step hole, the magnetic core is firmly fixed, and resin is conveniently to fill in the magnetic core. In addition, the prepreg and the copper foil are sequentially press-fitted on the surface of the core plate, i.e. the copper foil and the core plate with the magnetic core are bonded together through the prepreg, thus the magnetic core can be more firmly fixed. The magnetic core is fixed by adopting a press-fitting mode, thus the processing method is simple, convenient to operate and convenient for subsequent processing.
Description
Technical field
The present invention relates to the preparation field of PCB, relate in particular to the method that a kind of PCB goes up fixed magnetic core.
Background technology
At present, along with the fast development of PCB industry, it is used also more and more widely.Electronic equipment is little to arrive computer, communication electronic equipment, military armament systems greatly to electronic watch, calculator, general-purpose computer, as long as electronic devices and components such as integrated circuit are arranged, the electric interconnection between them all will be used PCB.
In electron trade, combining mainly of transformer element and PCB realizes by following mode: 1) coiling mode by hand is installed on the pcb board then; Or 2) process two semicircle PCB earlier, then magnetic core is stuck between the two semicircle pcb boards, to form inductive effect.But above-mentioned processing method complexity, operation inconvenience and cost are higher.
Summary of the invention
The technical problem that the present invention mainly solves provides the method for simple, the easy to operate PCB consent fixed magnetic core of a kind of method.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of method of PCB consent fixed magnetic core is provided, and it may further comprise the steps:
1) gets the raw materials ready: prepare central layer;
2) boring: drill through hole and control deep hole on central layer, described through hole and control deep hole form stepped hole;
Wherein, the diameter of through hole is less than the diameter of control deep hole;
3) place magnetic core: on the step of the stepped hole of central layer, place magnetic core, and in magnetic core potting resin;
Wherein, described magnetic core is positioned at the control deep hole;
4) pressing: pressing prepreg and Copper Foil successively on the surface of central layer.
Wherein, in above-mentioned steps 2) afterwards, before the step 3), comprise the decontamination processing, central layer is carried out desmearing handle.
Wherein, the mode of described decontamination processing employing is that plasma treatment or liquor potassic permanganate are handled.
Wherein, described plasma treatment adopts hydrogen, oxygen or argon gas.
Wherein, in above-mentioned steps 2) in, the step that drills through hole and control deep hole is: a) drill through the hole, drill through the hole on central layer; B) bore the control deep hole, on the basis of above-mentioned through hole, bore the control deep hole, obtain stepped hole.
Wherein, in above-mentioned steps 2) in, the step that drills through hole and control deep hole is: a) bore the control deep hole, bore the control deep hole on central layer; B) drill through the hole, on the basis of above-mentioned control deep hole, drill through the hole, obtain stepped hole.
Wherein, in above-mentioned steps 3) in, the external diameter of described magnetic core is consistent with the diameter of control deep hole.
Wherein, in above-mentioned steps 3) in, the height of described magnetic core is consistent with the height of control deep hole.
Wherein, in above-mentioned steps 1) in, described central layer is double sided board or multi-layer sheet.
Wherein, in above-mentioned steps 4) afterwards, magnetic core internal diameter and central layer boring are electroplated etching then.
The invention has the beneficial effects as follows: the present invention promptly utilizes the step fixed magnetic core of stepped hole by directly put into magnetic core in the stepped hole of central layer, magnetic core fixation, and convenience potting resin in magnetic core; In addition, pressing prepreg and Copper Foil successively on the surface of central layer promptly bond together Copper Foil and the central layer that has a magnetic core by prepreg, can fixedly secure magnetic core more.And adopt pressing mode fixed magnetic core, its processing method is simple, easy to operate and be convenient to following process.
Description of drawings
Fig. 1 is the process chart of the method for PCB consent fixed magnetic core of the present invention.
The primary clustering symbol description
Central layer 1; Stepped hole 2; Magnetic core 3; Resin 4; Prepreg 5; Copper Foil 6; Through hole 21; Control deep hole 22.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also shown in Figure 1ly, the invention discloses a kind of method of PCB consent fixed magnetic core, may further comprise the steps:
1) get the raw materials ready: prepare central layer 1, described central layer 1 is double sided board or multi-layer sheet;
2) boring: drill through hole 21 and control deep hole 22 on central layer 1, described through hole 21 and control deep hole 22 form stepped hole 2;
Wherein, the described step that drills through hole and control deep hole is: a) drill through the hole, hole diameter is the through hole 21 of D on central layer 1; B) bore the control deep hole, hole diameter is the control deep hole 22 of d on the basis of above-mentioned through hole 21, and described through hole 21 and control deep hole 22 form stepped hole 2;
Wherein, the height H of through hole is greater than the height of control deep hole H1, and the diameter D of through hole is less than the diameter d of control deep hole;
3) place magnetic core: on the step of the stepped hole 2 of central layer 1, place magnetic core 3, then potting resin 4 in magnetic core 3;
Wherein, described magnetic core 3 is positioned at control deep hole 22, and the outer diameter D 1 of promptly described magnetic core 3 is consistent with the diameter d of control deep hole, and the height H 2 of described magnetic core 3 is consistent with the height H 1 of control deep hole; Wherein, the diameter d of described control deep hole is smaller or equal to D1+0.2mm, and more than or equal to D1-0.1mm, the inside diameter D 2 of magnetic core is less than the diameter D of through hole, and the height H 1 of control deep hole more than or equal to H2-0.5mm, makes things convenient for the fixing of magnetic core smaller or equal to H2+0.5mm;
The present invention is by utilizing the step fixed magnetic core 3 of stepped hole, magnetic core 3 fixations, and magnetic core comes off from central layer in the time of effectively preventing in magnetic core 3 potting resin 4;
4) pressing: pressing prepreg 5 and Copper Foil 6 successively on the surface of central layer 1, promptly Copper Foil 6 and the central layer 1 that has a magnetic core 3 are bonded together by prepreg 5, can fixedly secure magnetic core 3 more;
When described central layer 1 is double sided board, need be on the two sides of central layer 1 pressing prepreg 5 and Copper Foil 6 successively, thereby make the fixing more firm of magnetic core 3.
In other embodiment of the present invention, in above-mentioned steps 2) in, the described step that drills through hole and control deep hole can also for: a) bore the control deep hole, hole diameter is the control deep hole 22 of d on central layer 1; B) drill through the hole, hole diameter is the through hole 21 of D on the basis of above-mentioned control deep hole 22, and described through hole 21 and control deep hole 22 form stepped hole 2; Wherein, the diameter D of through hole is less than the diameter d of control deep hole.
Wherein, in above-mentioned steps 3) in, can also can place magnetic core by manually placing magnetic core 3 by specific instrument (as: manipulator, anchor clamps etc.).
In order to improve the fitness between magnetic core 3 and the central layer 1, in above-mentioned steps 2) afterwards, before the step 3), also comprise the decontamination processing, it is central layer 1 to be carried out desmearing handle.Wherein, the mode of described decontamination processing employing is that plasma treatment or liquor potassic permanganate are handled.
In the preferred embodiments of the present invention, described plasma treatment adopts gases such as hydrogen, oxygen or argon gas that central layer 1 is handled.
Wherein, in above-mentioned steps 4) afterwards, also comprise the plating of holing of magnetic core 3 internal diameters and central layer 1, realize magnetic core 3 coilings, carry out etching then, make the PCB that processes directly have inductance performance.
The present invention promptly utilizes the step fixed magnetic core of stepped hole by directly put into magnetic core 3 in the stepped hole 2 of central layer 1, and magnetic core 3 fixations are convenient at magnetic core 3 inner diameter zone potting resins 4; And magnetic core comes off from central layer in the time of effectively preventing in magnetic core 3 potting resin 4; Pressing prepreg 5 and Copper Foil 6 successively on the surface of central layer 1, promptly Copper Foil 6 and the central layer 1 that has magnetic core 3 are bonded together by prepreg 5, can fixedly secure magnetic core more, and adopt pressing mode fixed magnetic core 3, its processing method is simple, easy to operate and be convenient to following process.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. the method for a PCB consent fixed magnetic core is characterized in that, may further comprise the steps:
1) gets the raw materials ready: prepare central layer;
2) boring: drill through hole and control deep hole on central layer, described through hole and control deep hole form stepped hole;
Wherein, the diameter of through hole is less than the diameter of control deep hole;
3) place magnetic core: on the step of the stepped hole of central layer, place magnetic core, and in magnetic core potting resin;
Wherein, described magnetic core is positioned at the control deep hole;
4) pressing: pressing prepreg and Copper Foil successively on the surface of central layer.
2. the method for PCB consent fixed magnetic core according to claim 1 is characterized in that: in above-mentioned steps 2) afterwards, before the step 3), comprise the decontamination processing, central layer is carried out desmearing handle.
3. the method for PCB consent fixed magnetic core according to claim 2 is characterized in that: it is that plasma treatment or liquor potassic permanganate are handled that the mode that adopts is handled in described decontamination.
4. the method for PCB consent fixed magnetic core according to claim 3 is characterized in that: described plasma treatment adopts hydrogen, oxygen or argon gas.
5. the method for PCB consent fixed magnetic core according to claim 1 is characterized in that: in above-mentioned steps 2) in, the step that drills through hole and control deep hole is: a) drill through the hole, drill through the hole on central layer; B) bore the control deep hole, on the basis of above-mentioned through hole, bore the control deep hole, obtain stepped hole.
6. the method for PCB consent fixed magnetic core according to claim 1 is characterized in that: in above-mentioned steps 2) in, the step that drills through hole and control deep hole is: a) bore the control deep hole, bore the control deep hole on central layer; B) drill through the hole, on the basis of above-mentioned control deep hole, drill through the hole, obtain stepped hole.
7. the method for PCB consent fixed magnetic core according to claim 1 is characterized in that: in above-mentioned steps 3) in, the external diameter of described magnetic core is consistent with the diameter of control deep hole.
8. the method for PCB consent fixed magnetic core according to claim 1 is characterized in that: in above-mentioned steps 3) in, the height of described magnetic core is consistent with the height of control deep hole.
9. the method for PCB consent fixed magnetic core according to claim 1 is characterized in that: in above-mentioned steps 1) in, described central layer is double sided board or multi-layer sheet.
10. the method for PCB consent fixed magnetic core according to claim 1 is characterized in that: in above-mentioned steps 4) afterwards, magnetic core internal diameter and central layer boring are electroplated etching then.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100428209A CN101772275B (en) | 2010-01-13 | 2010-01-13 | Method for fixing magnetic core in PCB (Printed Circuit Board) taphole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100428209A CN101772275B (en) | 2010-01-13 | 2010-01-13 | Method for fixing magnetic core in PCB (Printed Circuit Board) taphole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101772275A CN101772275A (en) | 2010-07-07 |
| CN101772275B true CN101772275B (en) | 2011-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010100428209A Active CN101772275B (en) | 2010-01-13 | 2010-01-13 | Method for fixing magnetic core in PCB (Printed Circuit Board) taphole |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105530771A (en) * | 2016-02-02 | 2016-04-27 | 东莞翔国光电科技有限公司 | Process of manufacturing multilayer printed circuit board with embedded magnetic core |
| CN114501835B (en) * | 2021-12-31 | 2024-01-26 | 惠州市金百泽电路科技有限公司 | Magnetic core embedding method of embedded magnetic core PCB |
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| Publication number | Publication date |
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| CN101772275A (en) | 2010-07-07 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |