CN101771393B - Method for manufacturing piezoelectric ceramic energy trap type oscillator - Google Patents
Method for manufacturing piezoelectric ceramic energy trap type oscillator Download PDFInfo
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- CN101771393B CN101771393B CN201010039546XA CN201010039546A CN101771393B CN 101771393 B CN101771393 B CN 101771393B CN 201010039546X A CN201010039546X A CN 201010039546XA CN 201010039546 A CN201010039546 A CN 201010039546A CN 101771393 B CN101771393 B CN 101771393B
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Abstract
The invention relates to a method for manufacturing a piezoelectric ceramic energy trap type oscillator, which comprises the following steps of: A, manufacturing piezoelectric ceramic sticks; B, manufacturing general ceramic plates and manufacturing a plurality of parallel grooves on the surface of each general ceramic plate; C, adhering one piezoelectric ceramic stick in each groove of each general ceramic plate by using glass glaze, overlapping and adhering a plurality of general ceramic plates which are adhered with the piezoelectric ceramic sticks together, and pressurizing and heating to solidify to form a composite ceramic block; D, cutting the composite ceramic block into composite ceramic sheets along the direction vertical to the axis of the piezoelectric ceramic sticks and grinding the surface of each ceramic sheet; E, manufacturing an extraction electrode and a point electrode on each ceramic sheet; and F, cutting each ceramic sheet into a plurality of single piezoelectric ceramic energy trap type oscillators. The piezoelectric ceramic material of the manufactured piezoelectric ceramic energy trap type oscillator is less than one sixth of that of the whole oscillator so as to greatly reduce the using amount of piezoelectric ceramic, reduce the occurrence frequency of the phenomena that the extraction electrode loosens and drops and increase the rate of the qualified oscillators.
Description
Technical field
The present invention relates to a kind of manufacturing approach of oscillator of piezoelectric ceramic frequency device, a kind of manufacturing approach of piezoelectric ceramic energy trap type oscillator.
Background technology
The piezoelectric ceramic frequency device selects as frequency and frequency control device is widely used in fields such as communication, TV, computer, industrial automation.The critical component of piezoelectric ceramic frequency device is a piezoelectric ceramic vibrator.Usually, the structure of piezoelectric ceramic energy trap type oscillator is as shown in Figure 1, is to make two symmetrical mutually metal electrodes 2 as vibrating electrode on the two sides of a piezoelectric ceramic plate 9, and vibrating electrode is drawn by extraction electrode 3.Vibrating electrode 2 also is called point electrode; The area of point electrode is very little; Only account for the minimum part of monoblock piezoelectric ceramic plate; The vibration effective coverage 4 at the center of oscillator (dotted line inner region among the figure) is bigger slightly than the area of point electrode 2, big approximately by about 20%, and the area of vibration effective coverage is less than 1/6 of whole sheet oscillator.Piezoceramic material commonly used is leaded pottery, how to reduce plumbous consumption, does not even use lead, is the problem that the manufacturing of current piezoelectric ceramic frequency device must be considered.At present existing lead-free piezoelectric ceramic, but the price of leadless piezoelectric ceramics is higher, and cost is higher when making the piezoelectric ceramic frequency device with it.In addition, the extraction electrode of piezoelectric ceramic vibrator also is produced on the same piezoelectric ceramic plate, because the adhesion of piezoceramic material and metal extraction electrode is not fine, adds processing such as high temperature, bonding, usually produces defectives such as loose or dislocation.
Summary of the invention
The present invention is intended to propose a kind of manufacturing approach of using the piezoelectric ceramic energy trap type oscillator of a small amount of piezoceramic material.
The concrete steps of the manufacturing approach of this piezoelectric ceramic energy trap type oscillator are following:
A, excellent with piezoelectric ceramic making piezoelectric ceramic, the cross section of piezoelectric ceramic rod is a bit larger tham the area of the effective vibrating area of oscillator;
B, make general ceramic wafer with conventional ceramic, the width of general ceramic wafer is identical with the length of piezoelectric ceramic rod, and generally the thickness of ceramic wafer is a bit larger tham the width of an oscillator; General ceramic wafer is carried out thickness and end surface grinding; Surface at general ceramic wafer makes several grooves parallel to each other; It is consistent that the cross sectional shape of groove and A go on foot the excellent cross sectional shape of prepared piezoelectric ceramic; The cross section that the size in groove cross section is more excellent than piezoelectric ceramic is big slightly, the length that the centre-to-centre spacing between two adjacent grooves is a bit larger tham an oscillator;
C,, glues B piezoelectric ceramic rod in going on foot every groove of prepared general ceramic wafer into an A step gained with glass glaze; Again with glass glaze with several piece bonding the general ceramic wafer of piezoelectric ceramic rod together bonding; Pressurized, heated is solidified, and becomes composite ceramic block;
Cut with the perpendicular direction of axis of piezoelectric ceramic rod on D, the composite ceramic block edge that C is gone on foot gained, and composite ceramic block is cut into the compound ceramics thicker slightly than the thickness of oscillator, again attrition process is carried out on compound ceramics surface;
E, the compound ceramics of D step gained is carried out sputter, polarization, printing, corrosion treatment, process extraction electrode and point electrode;
F, the compound ceramics that E is gone on foot gained cut into single energy trap type piezoelectric vibrator.
The oscillator of processing with this piezoelectric ceramic energy trap type oscillator manufacturing approach; Owing to only adopt piezoceramic material in the vibration effective coverage at the center of oscillator; Used piezoceramic material is less than 1/6 of whole sheet oscillator, thereby can significantly reduce the consumption of piezoelectric ceramic; And, owing to the good bonding strength of general pottery, can reduce the phenomenon of extraction electrode loose or dislocation with the metal extraction electrode, improve the percentage of A-class goods of piezoelectric ceramic energy trap type oscillator.
Description of drawings
Fig. 1 is the structure chart of the piezoelectric ceramic energy trap type oscillator of prior art;
Fig. 2 is the structure chart of the piezoelectric ceramic energy trap type oscillator of the present invention's proposition;
Fig. 3 is the profile of piezoelectric ceramic energy trap type oscillator shown in Figure 2;
Fig. 4 is the another kind of structure chart of piezoelectric ceramic energy trap type oscillator;
Fig. 5 is the cylindrical piezoelectric ceramic rod;
Fig. 6 is a square column type piezoelectric ceramic rod;
Fig. 7 is the ceramic wafer that has semi-cylindrical groove;
Fig. 8 is the ceramic wafer that has the square column type groove;
Fig. 9 is adhered to the sketch map in the groove on the ceramic wafer for the piezoelectric ceramic rod;
Figure 10 has the ceramic wafer of groove for the two sides;
Figure 11 is a composite ceramic block;
Figure 12 is compound ceramics.
Embodiment
The concrete steps of the manufacturing approach of this piezoelectric ceramic energy trap type oscillator are following:
A, excellent with the piezoelectric ceramic of piezoelectric ceramic making square column type cylindrical or shown in Figure 6 shown in Figure 5, the cross section of piezoelectric ceramic rod is a bit larger tham the area of the effective vibrating area of oscillator; The piezoelectric ceramic rod of square column type can form with the piezoelectric ceramics block cutting, and columniform piezoelectric ceramic rod can grind with centerless grinder with the piezoelectric ceramic rod of square column type and process.
B, as shown in Figure 7 makes general ceramic wafer 6 with conventional ceramic.General ceramic wafer is made the method for sintering again that can adopt after the conventional compression moulding.The width of general ceramic wafer is identical with the length of piezoelectric ceramic rod, and the thickness of general ceramic wafer is a bit larger tham the width of an oscillator (width that approximates an oscillator adds a cutting seam).General ceramic wafer is carried out thickness and end surface grinding; Surface at general ceramic wafer makes several parallel grooves 7; It is consistent that the cross sectional shape of groove and A go on foot the excellent cross section of prepared piezoelectric ceramic; The cross section that the size of groove is more excellent than piezoelectric ceramic is big slightly, and the centre-to-centre spacing between two adjacent grooves is a bit larger tham the length (length that approximates an oscillator adds a cutting seam) of an oscillator.Groove on the above-mentioned general ceramic wafer can be processed with scribing machine or cylindrical cutting machine.
C, as shown in Figure 9;, glues B piezoelectric ceramic rod 8 in going on foot every groove of prepared general ceramic wafer with glass glaze into an A step gained; Again with several piece bonding the general ceramic wafer of piezoelectric ceramic rod fold mutually with the glass glaze multilayer and be bonded together; Pressurized, heated is solidified, and becomes composite ceramic block shown in figure 11; Bonding used glass glaze can adopt the industry to use glass glaze always.
The thick slightly compound ceramics of thickness that D, the composite ceramic block edge and the perpendicular direction of axis of piezoelectric ceramic rod that C are gone on foot gained cut into ratio oscillator shown in figure 12 carries out attrition process to compound ceramics surface again.
E, the compound ceramics of D step gained is carried out sputter, polarization, printing, corrosion treatment, process extraction electrode and point electrode.
F, the compound ceramics that E is gone on foot gained cut into satisfactory single piezoelectric ceramic energy trap type oscillator shown in Figure 2.
In the manufacturing approach of this piezoelectric ceramic energy trap type oscillator; The cross section of the piezoelectric ceramic rod described in A step is shown in Figure 5 when circular; Semicircle can be processed in the cross section of the groove on the general ceramic wafer described in the B step, and is in the composite ceramic block of C in the step, fluted on the lower surface of the general ceramic wafer of the superiors; Fluted on the upper surface of undermost general ceramic wafer, their structure is as shown in Figure 6.All fluted on the upper and lower surface of the general ceramic wafer at middle position, its structure is as shown in Figure 9.
In the manufacturing approach of this piezoelectric ceramic energy trap type oscillator; The cross section of the piezoelectric ceramic rod described in A step is shown in Figure 6 when square; Square can be processed in the cross section of the groove on the general ceramic wafer described in the B step; In the composite ceramic block in C step, machined grooves not on the general ceramic wafer of the superiors, processing groove as shown in Figure 8 on the upper surface of remaining general ceramic wafer.
In the manufacturing approach of this piezoelectric ceramic energy trap type oscillator; When the cross section of the piezoelectric ceramic rod described in the A step is square; Square also can be processed into half in the cross section of the groove on the general ceramic wafer described in the B step, and is in the composite ceramic block of C in the step, fluted on the lower surface of the general ceramic wafer of the superiors; Fluted on the upper surface of undermost general ceramic wafer, all fluted on the upper and lower surface of the general ceramic wafer at middle position.
In the manufacturing approach of this piezoelectric ceramic energy trap type oscillator, the piezoelectric ceramic rod can be made with the leaded piezoceramic material of lead titanates and so on, also can use niobic acid strontium bismuth (SrBi
2Nb
2O
9), bismuth titanium niobate (Bi
3-xM
xNb
1+yTi
1-yO
9) and so on lead-free piezoceramic material make.General ceramic wafer can be made with the plumbous general ceramic material that do not conform to of titanium magnesium porcelain and so on.
The structure of the piezoelectric ceramic energy trap type oscillator of processing with this piezoelectric ceramic energy trap type oscillator manufacturing approach such as Fig. 2, Fig. 3 and shown in Figure 4; It comprises a sheet oscillator; There are two point electrodes 2 of symmetry mutually at the upper surface of sheet oscillator and the center of lower surface, and above-mentioned point electrode is drawn by extraction electrode 3.The sheet oscillator is made up of two parts: the vibration effective coverage at sheet oscillator center is a piezoceramic material piece 5, and other zone 1 of sheet oscillator is general ceramic material.The actual size of this piezoelectric ceramic energy trap type oscillator is 2.5 * 2.0～8.0 * 6.0mm; The diameter of point electrode is 0.6～1.6mm; The diameter of piezoceramic material piece (or length of side) is 1.0～2.0mm; Piezoceramic material account for whole sheet oscillator less than 1/6, thereby can significantly reduce the consumption of piezoelectric ceramic.And the good bonding strength of general pottery and metal extraction electrode has reduced the phenomenon of extraction electrode loose or dislocation, has improved the percentage of A-class goods of piezoelectric ceramic energy trap type oscillator.
Claims (2)
1. the manufacturing approach of a piezoelectric ceramic energy trap type oscillator is characterized in that concrete steps are following:
A, excellent with piezoelectric ceramic making piezoelectric ceramic, the cross section with its axis normal of piezoelectric ceramic rod is a square, this cross section is a bit larger tham the area of the effective vibrating area of oscillator;
B, make general ceramic wafer with conventional ceramic, the width of general ceramic wafer is identical with the length of piezoelectric ceramic rod, and generally the thickness of ceramic wafer is a bit larger tham the width of an oscillator; General ceramic wafer is carried out thickness and end surface grinding; Surface at general ceramic wafer makes several grooves parallel to each other; The cross section vertical of this groove with the groove parallel direction be shaped as square; The cross section that the size in groove cross section is more excellent than piezoelectric ceramic is big slightly, the length that the centre-to-centre spacing between two adjacent grooves is a bit larger tham an oscillator;
C,, glues B piezoelectric ceramic rod in going on foot every groove of prepared general ceramic wafer into an A step gained with glass glaze; Again with glass glaze with several piece bonding the general ceramic wafer of piezoelectric ceramic rod together bonding; There is not groove on the general ceramic wafer of the superiors; Pressurized, heated is solidified, and becomes composite ceramic block;
Cut with the perpendicular direction of axis of piezoelectric ceramic rod on D, the composite ceramic block edge that C is gone on foot gained, and composite ceramic block is cut into the compound ceramics thicker slightly than the thickness of oscillator, again attrition process is carried out on compound ceramics surface;
E, the compound ceramics of D step gained is carried out sputter, polarization, printing, corrosion treatment, process extraction electrode and point electrode;
F, the compound ceramics that E is gone on foot gained cut into single piezoelectric ceramic energy trap type oscillator.
2. the manufacturing approach of a piezoelectric ceramic energy trap type oscillator is characterized in that concrete steps are following:
A, excellent with piezoelectric ceramic making piezoelectric ceramic, the cross section with its axis normal of piezoelectric ceramic rod is circular, this cross section is a bit larger tham the area of the effective vibrating area of oscillator;
B, make general ceramic wafer with conventional ceramic, the width of general ceramic wafer is identical with the length of piezoelectric ceramic rod, and generally the thickness of ceramic wafer is a bit larger tham the width of an oscillator; General ceramic wafer is carried out thickness and end surface grinding; Surface at general ceramic wafer makes several grooves parallel to each other; The cross section vertical of this groove with the groove parallel direction be shaped as semicircle; This semicircular diameter is bigger slightly than the diameter that A goes on foot the excellent cross section of prepared piezoelectric ceramic, the length that the centre-to-centre spacing between two adjacent grooves is a bit larger tham an oscillator;
C,, glues B piezoelectric ceramic rod in going on foot every groove of prepared general ceramic wafer into an A step gained with glass glaze; Again with glass glaze with several piece bonding the general ceramic wafer of piezoelectric ceramic rod together bonding; Wherein fluted on the lower surface of the general ceramic wafer of the superiors, fluted on the upper surface of undermost general ceramic wafer, all fluted on the upper and lower surface of the general ceramic wafer at middle position; Pressurized, heated is solidified, and becomes composite ceramic block;
Cut with the perpendicular direction of axis of piezoelectric ceramic rod on D, the composite ceramic block edge that C is gone on foot gained, and composite ceramic block is cut into the compound ceramics thicker slightly than the thickness of oscillator, again attrition process is carried out on compound ceramics surface;
E, the compound ceramics of D step gained is carried out sputter, polarization, printing, corrosion treatment, process extraction electrode and point electrode;
F, the compound ceramics that E is gone on foot gained cut into single piezoelectric ceramic energy trap type oscillator.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2442249Y (en) * | 2000-09-08 | 2001-08-08 | 长江水利委员会长江工程地球物理勘测研究院(武汉) | Medium hole radial composite piezoelectric ceramic wave detector |
| CN1728549A (en) * | 2005-06-27 | 2006-02-01 | 严盛喜 | small-size chip high-frequency piezoelectric ceramic resonator |
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2010
- 2010-01-05 CN CN201010039546XA patent/CN101771393B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2442249Y (en) * | 2000-09-08 | 2001-08-08 | 长江水利委员会长江工程地球物理勘测研究院(武汉) | Medium hole radial composite piezoelectric ceramic wave detector |
| CN1728549A (en) * | 2005-06-27 | 2006-02-01 | 严盛喜 | small-size chip high-frequency piezoelectric ceramic resonator |
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