CN101769451A - 发光二极管灯具 - Google Patents
发光二极管灯具 Download PDFInfo
- Publication number
- CN101769451A CN101769451A CN200810306610A CN200810306610A CN101769451A CN 101769451 A CN101769451 A CN 101769451A CN 200810306610 A CN200810306610 A CN 200810306610A CN 200810306610 A CN200810306610 A CN 200810306610A CN 101769451 A CN101769451 A CN 101769451A
- Authority
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- China
- Prior art keywords
- light emitting
- emitting diode
- led lamp
- light
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
- F21V7/30—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings the coatings comprising photoluminescent substances
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/40—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48092—Helix
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
Description
温度传感器信号 | 湿度传感器信号 | 高优先级 |
I | III | III |
温度传感器信号 | 湿度传感器信号 | 高优先级 |
I | IV | IV |
II | III | II |
II | IV | II |
Claims (14)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103066109A CN101769451B (zh) | 2008-12-29 | 2008-12-29 | 发光二极管灯具 |
US12/436,784 US8025421B2 (en) | 2008-12-29 | 2009-05-07 | Light emitting diode lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103066109A CN101769451B (zh) | 2008-12-29 | 2008-12-29 | 发光二极管灯具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101769451A true CN101769451A (zh) | 2010-07-07 |
CN101769451B CN101769451B (zh) | 2012-03-14 |
Family
ID=42284705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008103066109A Expired - Fee Related CN101769451B (zh) | 2008-12-29 | 2008-12-29 | 发光二极管灯具 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8025421B2 (zh) |
CN (1) | CN101769451B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102466160A (zh) * | 2010-11-08 | 2012-05-23 | Lg伊诺特有限公司 | 照明装置 |
CN102478165A (zh) * | 2010-11-29 | 2012-05-30 | 展晶科技(深圳)有限公司 | 照明装置 |
CN102620153A (zh) * | 2011-01-31 | 2012-08-01 | 旭丽电子(广州)有限公司 | 灯具 |
CN108870136A (zh) * | 2018-05-03 | 2018-11-23 | 东莞市闻誉实业有限公司 | 应急灯 |
CN110599762A (zh) * | 2018-06-12 | 2019-12-20 | 光宝电子(广州)有限公司 | 道路状况感测系统及方法 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101771025A (zh) * | 2008-12-26 | 2010-07-07 | 富准精密工业(深圳)有限公司 | 发光二极管 |
US8308318B2 (en) * | 2009-05-01 | 2012-11-13 | Lighting Science Group Corporation | Sustainable outdoor lighting system |
JP5421799B2 (ja) * | 2010-01-18 | 2014-02-19 | パナソニック株式会社 | Ledユニット |
KR101064036B1 (ko) * | 2010-06-01 | 2011-09-08 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 조명 시스템 |
US8147093B2 (en) * | 2010-06-14 | 2012-04-03 | Bridgelux | Light source having LEDs of selected spectral output, and method for constructing same |
KR101742615B1 (ko) * | 2010-09-20 | 2017-06-01 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 발광 모듈 |
US8227962B1 (en) * | 2011-03-09 | 2012-07-24 | Allen Hui Long Su | LED light bulb having an LED light engine with illuminated curved surfaces |
EP2699839B1 (en) * | 2011-04-18 | 2017-12-20 | MariMils Oy | Illuminated stripe and illuminated stripe system |
TWI437919B (zh) * | 2011-06-15 | 2014-05-11 | Nat Univ Tsing Hua | 可切換日/夜照明模式之照明裝置 |
DE102011078572B4 (de) * | 2011-07-04 | 2016-06-02 | Osram Gmbh | Beleuchtungsvorrichtung |
US20130026902A1 (en) * | 2011-07-28 | 2013-01-31 | Chao-Chuan Chen | Led package for increasing illumination and spotlighting |
US8866392B2 (en) | 2011-08-31 | 2014-10-21 | Chia-Teh Chen | Two-level LED security light with motion sensor |
US8899776B2 (en) | 2012-05-07 | 2014-12-02 | Lighting Science Group Corporation | Low-angle thoroughfare surface lighting device |
TWI485349B (zh) * | 2012-07-18 | 2015-05-21 | Lextar Electronics Corp | 發光裝置 |
US9463075B2 (en) * | 2012-09-19 | 2016-10-11 | Southern Linac, Llc | Replaceable light source and radiation generating device including the same |
TW201417362A (zh) * | 2012-10-16 | 2014-05-01 | Gcsol Tech Co Ltd | 有機發光裝置及調光方法 |
DE102013101260A1 (de) * | 2013-02-08 | 2014-08-14 | Osram Opto Semiconductors Gmbh | Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement |
US8899800B2 (en) * | 2013-02-19 | 2014-12-02 | Wen-Sung Lee | Intelligent light device for a vehicle |
KR20150025231A (ko) * | 2013-08-28 | 2015-03-10 | 서울반도체 주식회사 | 광원 모듈 및 그 제조 방법, 및 백라이트 유닛 |
JP5935067B2 (ja) * | 2013-10-10 | 2016-06-15 | パナソニックIpマネジメント株式会社 | 波長変換板、およびそれを用いた照明装置 |
DE102015103840A1 (de) * | 2015-03-16 | 2016-09-22 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierende Baugruppe |
US9974138B2 (en) | 2015-04-21 | 2018-05-15 | GE Lighting Solutions, LLC | Multi-channel lamp system and method with mixed spectrum |
TWI556688B (zh) * | 2015-04-28 | 2016-11-01 | 佳世達科技股份有限公司 | 具有不同調光比例之發光模組的燈具 |
KR102419890B1 (ko) * | 2015-11-05 | 2022-07-13 | 삼성전자주식회사 | 발광 장치 및 그 제조 방법 |
DE102017101267B4 (de) * | 2017-01-24 | 2023-11-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100622607B1 (ko) * | 2004-10-06 | 2006-09-19 | 라이텍코리아 (주) | 각도 조절형 가로등기구 |
GB2421367B (en) * | 2004-12-20 | 2008-09-03 | Stephen Bryce Hayes | Lighting apparatus and method |
US20060273331A1 (en) * | 2005-06-07 | 2006-12-07 | Lim Kevin Len L | Two-terminal LED device with tunable color |
CN200961822Y (zh) * | 2006-09-25 | 2007-10-17 | 上海广茂达伙伴机器人有限公司 | 一种旋转式灯具 |
JP2010507218A (ja) * | 2006-10-19 | 2010-03-04 | フィリップス ソリッド−ステート ライティング ソリューションズ インコーポレイテッド | ネットワーク化可能なledベースの照明設備およびそれに電力を供給しかつ制御するための方法 |
ES2310147B1 (es) * | 2007-12-21 | 2009-11-05 | Javier Fernandez De Valderrama Alvarez | Pantalla modular emisora de luz. |
CN201149223Y (zh) * | 2007-12-26 | 2008-11-12 | 精碟科技股份有限公司 | 双轴折叠式的灯具结构 |
-
2008
- 2008-12-29 CN CN2008103066109A patent/CN101769451B/zh not_active Expired - Fee Related
-
2009
- 2009-05-07 US US12/436,784 patent/US8025421B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102466160A (zh) * | 2010-11-08 | 2012-05-23 | Lg伊诺特有限公司 | 照明装置 |
CN102478165A (zh) * | 2010-11-29 | 2012-05-30 | 展晶科技(深圳)有限公司 | 照明装置 |
CN102620153A (zh) * | 2011-01-31 | 2012-08-01 | 旭丽电子(广州)有限公司 | 灯具 |
CN108870136A (zh) * | 2018-05-03 | 2018-11-23 | 东莞市闻誉实业有限公司 | 应急灯 |
CN110599762A (zh) * | 2018-06-12 | 2019-12-20 | 光宝电子(广州)有限公司 | 道路状况感测系统及方法 |
Also Published As
Publication number | Publication date |
---|---|
US8025421B2 (en) | 2011-09-27 |
US20100165600A1 (en) | 2010-07-01 |
CN101769451B (zh) | 2012-03-14 |
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