CN101748815A - Novel heat insulation plate - Google Patents
Novel heat insulation plate Download PDFInfo
- Publication number
- CN101748815A CN101748815A CN200810235907A CN200810235907A CN101748815A CN 101748815 A CN101748815 A CN 101748815A CN 200810235907 A CN200810235907 A CN 200810235907A CN 200810235907 A CN200810235907 A CN 200810235907A CN 101748815 A CN101748815 A CN 101748815A
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- China
- Prior art keywords
- heat insulation
- insulation plate
- novel heat
- warming plate
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a novel heat insulation plate which comprises a heat insulation plate, wherein the heat insulation plate is made from heat insulation material, and a plurality of small through holes and netty grooves are arranged on the heat insulation plate; the thickness of the heat insulation plate is 20-50mm; the depth of the netty grooves is 3-6mm; and when the small through holes and the netty grooves on the novel heat insulation plate of the scheme are installed, a cement substrate at the outer wall of a building can enter the small through holes and the netty grooves, so that the heat insulation plate is tightly embedded into the outer wall of the building, is bonded firmly and is not easy to fall off.
Description
Technical field
The present invention relates to a kind of Outwall thermal insulation board, belong to the constructional ornamental material technical field.
Background technology
Along with the Chinese national economy construction develops rapidly and the improvement of work and dwelling environment, building trade is also more and more higher to building heat preservation finishing performance demands.Although China's exterior wall insulating temperature technique accounts for the overwhelming majority in building operations at present, External Thermal Insulation Technology for External but is the direction of building heat preservation development from now on.In recent years; China has also carried out the trial of multiple beneficial in the exterior-wall heat insulation application facet; developed the external wall outer insulation product of several types; make external wall insulation foam polyphenyl particle cement polymer mortar insulation layer as the surface of wall outside the building; outside the building paste sticking polyphenyl plate and add weathering protective layer; polyphenylene heat insulation slab and body of wall are built addition polymerization compound mortar cover; cement and polystyrene board member etc.; obtained certain insulation and economic effect, solved such as cold bridge; dewfall; cracking; be difficult for finishing; the discharging of fire poison gas; the aging blocks renovation; the problem that insulation exists in the energy-conservation grade.Yet also there are some problems in the prior art, as, because some foaming insulation boards are plane structures, paste the unreal hollowing that very easily produces and peel off phenomenon, cause hidden danger.
Summary of the invention
At the problems referred to above, the objective of the invention is to: provide a kind of stickup solid, the exterior wall novel heat insulation plate of difficult drop-off.
The present invention is achieved through the following technical solutions.A kind of novel heat insulation plate comprises warming plate, and described warming plate is to make with heat insulating material, and described warming plate is provided with a plurality of small through hole, and meshed grooves.
The thickness of described warming plate is 20-50mm.
The degree of depth of described meshed grooves is at 3-6mm.
A plurality of small through hole and meshed grooves on the described novel heat insulation plate of the present invention program when mounted, can enter described small through hole and meshed grooves at the bottom of the cement of skin, thus warming plate embedding skin tightly, paste solid, difficult drop-off.
Description of drawings
The present invention is further described below in conjunction with accompanying drawing:
Accompanying drawing 1 is stereogram of the present invention;
Wherein: 1, warming plate; 2, small through hole; 3, meshed grooves.
The specific embodiment
See accompanying drawing 1, novel heat insulation plate of the present invention comprises warming plate 1, and described warming plate is to make with heat insulating material, and described warming plate is provided with a plurality of small through hole 2, and meshed grooves 3; The thickness of described warming plate 1 is 20-50mm; The degree of depth of described meshed grooves 3 is at 3-6mm.The thickness that the thickness of described warming plate 1 is different according to the geographical environment different choice, southern weather is warmer, so that the thickness of warming plate 1 can be selected is thinner, generally is 20-30mm; The weather in the north is colder, and the thickness of warming plate 1 just can be selected thicker, can reach 50mm; A plurality of small through hole and meshed grooves on the described novel heat insulation plate when mounted, can enter described small through hole and meshed grooves at the bottom of the cement of skin, thus warming plate embedding skin tightly, paste solid, difficult drop-off.
The foregoing description only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the personage that is familiar with this technology can understand content of the present invention and is implemented; can not limit protection scope of the present invention with this; all equivalences that spirit essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (3)
1. a novel heat insulation plate comprises warming plate, it is characterized in that: described warming plate is to make with heat insulating material, and described warming plate is provided with a plurality of small through hole, and meshed grooves.
2. novel heat insulation plate according to claim 1 is characterized in that: the thickness of described warming plate is 20-50mm.
3. novel heat insulation plate according to claim 1 is characterized in that: the degree of depth of described meshed grooves is at 3-6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810235907A CN101748815A (en) | 2008-12-01 | 2008-12-01 | Novel heat insulation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810235907A CN101748815A (en) | 2008-12-01 | 2008-12-01 | Novel heat insulation plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101748815A true CN101748815A (en) | 2010-06-23 |
Family
ID=42476383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810235907A Pending CN101748815A (en) | 2008-12-01 | 2008-12-01 | Novel heat insulation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101748815A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102465570A (en) * | 2010-11-18 | 2012-05-23 | 史世英 | Novel insulation board and use method thereof |
-
2008
- 2008-12-01 CN CN200810235907A patent/CN101748815A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102465570A (en) * | 2010-11-18 | 2012-05-23 | 史世英 | Novel insulation board and use method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100623 |