CN101738118A - Three-dimensional slab heat pipe with multi-layer microporous pipe arrays and processing technique thereof - Google Patents
Three-dimensional slab heat pipe with multi-layer microporous pipe arrays and processing technique thereof Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000003491 array Methods 0.000 title abstract 3
- 238000007789 sealing Methods 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 33
- 230000008859 change Effects 0.000 claims abstract description 22
- 239000007769 metal material Substances 0.000 claims abstract description 11
- 238000004080 punching Methods 0.000 claims abstract description 11
- 238000005516 engineering process Methods 0.000 claims description 55
- 238000001125 extrusion Methods 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 230000008602 contraction Effects 0.000 claims description 7
- 230000003416 augmentation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract 3
- 230000008569 process Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 238000000641 cold extrusion Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000000304 warm extrusion Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000001192 hot extrusion Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 208000030208 low-grade fever Diseases 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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Abstract
The invention relates to a three-dimensional slab heat pipe with multi-layer microporous pipe arrays and a processing technique thereof. The three-dimensional slab heat pipe comprises a heat conductor, wherein the heat conductor is formed by extruding or punching metal materials and is provided with two or more than two layers of the microporous pipe arrays arranged in parallel; each layer of the microporous pipe array comprises two or more than two microporous pipes arranged in parallel; a working medium, which has the functions of phase change and heat transfer, is encapsulated in each microporous pipe; and two ends of the heat conductor are sealed and at least one end head is provided with a gradually-shrinking sealing strip which is formed by cold welding. The three-dimensional slab heat pipe provided by the invention has the advantages of low thermal resistance, high heat-exchanging efficiency, strong bearing capacity and high reliability.
Description
Technical field
The present invention relates to the heat transfer technology field, particularly a kind of three-dimensional slab heat pipe and processing technology thereof with multi-layer microporous pipe array.
Background technology
Compare with the heat exchange mode of free convection and forced convertion, because the mode heat transfer efficiency height of phase-change heat-exchange, utilize the heat exchanger of phase-change heat-exchange technology in industry, to obtain using widely, in this type of phase-change heat-exchanger technology, most typically to belong to the heat exchange of heat pipe technology, the main heat transfer type of heat pipe has the advantages that for evaporation and condensation heat-transfer capability is big, temperature control capability is strong, heat transfer efficiency is high.
Traditional heat pipe generally is to adopt the pipe with certain diameter, closed at both ends after the can working medium, and this structure is compared other heat pipe, as shell-and-tube heat exchanger, plate type heat exchanger etc., heat exchange efficiency height not only, and also it is little to have a volume, long service life, advantage such as non-maintaining.But the preparation of the manufacture craft of heat pipe such as capillary wick material and maintenance process are very complicated, and this makes its application be very restricted, and general heat pipe and the element face contact area that is cooled is little, causes equivalent thermal resistance big.
For dull and stereotyped heat-transfer surface, adopt flat heat pipe to have the characteristic that thermal resistance is little, heat exchange efficiency is high, existing flat heat pipe has two kinds of structures usually: a kind of is traditional flat heat pipe, the single heat pipe structure of main employing, its inner bearing capacity, reliability, local maximum heat exchange density and maximum heat conveying capacity all are very limited.Another is the novel flat-plate heat pipe that the applicant provides, see that application number is: 200910078903.0, name is called a kind of application for a patent for invention with novel flat-plate heat pipe of stratose microflute low-grade fever nest of tubes, the flat-plate heat pipe of this application comprises the metal matter flat board that is formed by monolithic extruded, and be provided with the array type through hole that is arranged side by side more than in dull and stereotyped inside, can working medium in the through hole, dull and stereotyped sealed at both ends, thereby constitute holistic flat-plate heat pipe, technology is simple, when having saved existing heat pipe and making such as technology such as capillary wick material preparation, strengthen the exchange capability of heat of liquid working substance, improved heat exchange efficiency.Though this flat-plate heat pipe has overcome the disadvantage of traditional flat heat pipe, but owing to be the flat-plate heat pipe of individual layer microporous pipe array, the intensity of flat-plate heat pipe and reliability are still waiting to improve, and the contact area between flat-plate heat pipe and the heat exchange object is limited, so form the heat-transfer surface of limited area between the two, be all to be limited as the area of the evaporator section of heat absorbing part and as the area of the condensation segment of radiator portion in the flat-plate heat pipe, if want to improve local maximum heat exchange density, can only be by dwindling the distance between the through hole that is arranged side by side in the flat-plate heat pipe and the diameter of through hole self, this will increase to the requirement of extrusion process, also can influence the intensity and the reliability of flat-plate heat pipe.And in the prior art the technology of the termination sealing of the heat pipe that is arranged side by side is normally packed into the capping of heat pipe termination or with heat pipe and again sleeve-port is welded capping in the sleeve or be processed as one the termination fusion is integral braze-welded, technology is very complicated, and sealing and unfailing performance are low.
Summary of the invention
The present invention is directed to the defective or the deficiency that exist in the prior art, a kind of novel three-dimensional slab heat pipe with multi-layer microporous pipe array is provided, can improve local maximum heat exchange density, have the advantage that thermal resistance is little, heat exchange efficiency is high, bearing capacity is strong, reliability is high.The present invention also provides a kind of processing technology of described three-dimensional slab heat pipe.Technical scheme of the present invention is as follows:
A kind of three-dimensional slab heat pipe with multi-layer microporous pipe array, it is characterized in that: comprise by metal material through extruding or stamping forming heat carrier with microporous pipe array of two-layer or two-layer above parallel arrangement, described every layer of microporous pipe array comprises the microporous pipe of two or more parallel arrangements, be filled with the working medium of phase-change heat-exchange effect in the described microporous pipe, sealed at both ends and at least one termination of described heat carrier has the Sealing strap of the gradual change contraction that is formed by cold welding.
At least one longitudinal section of described heat carrier is punctured into a bit along the gradual change of microporous pipe pipe range direction in the outer side edges at this Sealing strap place, and described outer side edges is two arc limits of relative indent.
At least one longitudinal section of described heat carrier is punctured into a bit along the gradual change of microporous pipe pipe range direction at the inner side edge at this Sealing strap place, and described inner side edge is two arc limits of relative indent.
Heat carrier has the reinforcing weld bond and/or the described heat carrier that curl that are formed by soldering or ratio-frequency welding at Sealing strap place end and in the outer setting of Sealing strap place end protective sleeve is arranged.
The microporous pipe array of described parallel arrangement is parallel to the strip of heat carrier or the surface of plate-like transverse wider width.
The length-width ratio that the channel cross-section of microporous pipe is set exists
Between 1.5, the minimum tube wall of described new heat pipe and the ratio of each microporous pipe equivalent diameter are all more than or equal to 0.2.
When the gross thickness of heat carrier during smaller or equal to 3mm, the extended length that described Sealing strap gradual change is shunk and the ratio of heat carrier gross thickness are between 0.75 to 1.5; When the gross thickness of heat carrier between the 3mm to 5mm the time, the extended length that described Sealing strap gradual change is shunk and the ratio of heat carrier gross thickness are between 0.6 to 1.5; When the gross thickness of heat carrier during greater than 5mm, the extended length that described Sealing strap gradual change is shunk and the ratio of heat carrier gross thickness are between 0.5 to 1.5.
Described each microporous pipe two ends are all sealed, and each microporous pipe is independent heat pipe structure, form three-dimensional micro heat pipe array; Or described each microporous pipe one end is open in heat carrier, and promptly each microporous pipe communicates with each other, but heat carrier should be held sealing, each microporous pipe other end sealing, and each microporous pipe is semi-independent heat pipe structure, forms the single integral heat pipe of three-dimensional micropore pipe array.
In the vias inner walls of described each microporous pipe, be provided with little fin with augmentation of heat transfer effect or the indent based on capillary slot that moves towards along the microporous pipe length direction, the size of described little fin and structure are suitable for forming along the based on capillary slot of microporous pipe length direction trend with the microporous pipe inwall, and the drift angle place that drift angle place that described little fin and microporous pipe inwall form and indent based on capillary slot and microporous pipe inwall form is level and smooth fillet.
Adjacent microporous pipe is the consistency from top to bottom arrangement or is staggered in the microporous pipe array of described levels.
A kind of processing technology of aforesaid three-dimensional slab heat pipe is characterized in that: comprise the steps:
A, employing extruding or Sheet Metal Forming Technology are prepared the strip of the microporous pipe array that has two-layer or two-layer above parallel arrangement in it and connect or tabular heat carrier, and described every layer of microporous pipe array comprises the microporous pipe of two or more parallel arrangements;
B, with the termination sealing of an end of heat carrier;
C, the micropore inner air tube is discharged and filling liquid working medium;
D, the cold welding technique sealed package is adopted in the termination of the other end of heat carrier, described cold welding technique makes it distortion for the termination by edge of a knife extruding heat carrier and seals and cut off.
The processing technology of above-mentioned three-dimensional slab heat pipe, it is characterized in that, the technology of the termination sealing of the described end with heat carrier of step B is for adopting the cold welding technique sealed package, and described cold welding technique makes it distortion for this termination by edge of a knife extruding heat carrier and seals and cut off; Or the technology of the termination sealing of the described end with heat carrier of step B be after being flattened, curl in this termination of heat carrier, adopts soldering or ratio-frequency welding to seal reinforcing or seals at this termination point casing upper bush.
The processing technology of above-mentioned three-dimensional slab heat pipe is characterized in that, behind the execution of step D, also carries out following step:
E, the two ends of heat carrier is installed protective sleeve.
The described heat carrier of steps A is the metal or alloy material, the metal or alloy material is heated to injects the extrusion die extruding behind the softening temperature or by the diel punching press, described extruding or diel have the two-layer or two-layer above column punch of parallel arrangement, described heat carrier be extruded or punching press after be cooled to normal temperature.
Be provided with some nicks hole or outer fin on the column punch in described extrusion die of steps A or the diel, make to have extruding or stamping forming some little fin or indent based on capillary slot on the described microporous pipe inwall with augmentation of heat transfer effect.
Technique effect of the present invention is as follows:
Three-dimensional slab heat pipe with multi-layer microporous pipe array provided by the invention, comprise that one has the heat carrier of the microporous pipe that the multilayer stratiform arranges, heat carrier seals and has been filled with the working medium of phase-change heat-exchange effect in microporous pipe, be to be filled with working medium in the microporous pipe to form micro heat pipe, and conduct heat in the mode of phase-change heat-exchange, form the heat pipe effect naturally.The three-dimensional slab heat pipe structure of this multi-layer microporous pipe array be arranged so that this three-dimensional slab heat pipe and heat exchange object are under limited contact area, carry out the heat conduction transmission between the micro heat pipe of each layer successively, the i.e. evaporator section heat conduction of the micro heat pipe of the ground floor that contacts with the heat exchange object makes it also form evaporator section for the micro heat pipe of the second layer, if also have the 3rd layer micro heat pipe, the second layer can be again to the 3rd layer of heat conduction transmission, final heat conduction is to all layers, the equal carburation by evaporation of the evaporator section of each layer, flow to the condensation segment of micro heat pipe separately, evaporator section is flowed back in condensation segment heat release liquefaction, automatically finish the circulation of micro heat pipe separately, and also be that mutual heat conduction is transmitted between the condensation segment of each layer, so the efficient of the whole condensation heat release of micro heat pipe and maximum heat freight volume are than the flat-plate heat pipe height of individual layer microporous pipe array, improve the heat exchange density of local maximum, need not to dwindle the distance between the microporous pipe that is arranged side by side in the heat pipe and the diameter of microporous pipe self.Sealed at both ends and at least one termination of heat carrier has the Sealing strap of the gradual change contraction that is formed by cold welding, be by using cold welding technique to prepare the unique texture that this three-dimensional slab heat pipe forms, pack into the capping of heat pipe termination or with heat pipe and again sleeve-port is welded capping in the sleeve or be processed as one the termination fusion is integral braze-welded and traditional end sealer technology typically uses hot welding, technology is very complicated, and the present invention adopts unique end sealer cold welding technique disposable closure to encapsulate to form the three-dimensional slab heat pipe of unique Sealing strap with gradual change contraction.In addition, the three-dimensional slab heat pipe structure of this multi-layer microporous pipe array has further improved the intensity and the reliability of three-dimensional slab heat pipe.For dull and stereotyped heat-transfer surface, adopt three-dimensional slab heat pipe of the present invention to have the characteristic that thermal resistance is little, heat exchange efficiency is high simultaneously, traditional especially circular heat pipe is incomparable.But also can be in a lot of fields, in order to substitute existing cooling device, as in field of electronics, because the restriction of structure space, the cooling of electronic devices and components relies on fan to finish usually, but use three-dimensional slab heat pipe of the present invention, just the significant miniaturization of three-dimensional slab heat pipe, microminiaturization can be used for electronic devices and components are carried out cooling heat dissipation.
By seal and the oxidation resistance that reinforcing weld bond and protective sleeve can strengthen the end sealer of three-dimensional slab heat pipe of the present invention is set.
Gross thickness by heat carrier is in different spans, set the span of ratio between the extended length that the Sealing strap gradual change of this gross thickness and heat carrier shrinks, make sealing part can possess enough intensity, thereby the pressure that microporous pipe inside is born can be greater than 2.0MPa, to satisfy the pressure that different liquids working medium can be born in the microporous pipe under various operating temperatures, adapt to heat pipe need of work in all cases.
The sealed at both ends encapsulation of each microporous pipe, make each microporous pipe form the micro heat pipe that works alone, like this, the micro heat pipe that microporous pipe in every layer of microporous pipe array forms two and two above parallel arrangements and works alone, help three-dimensional slab heat pipe whole reliability and security maintenance so more, can not influence the work of other microporous pipe in this microporous pipe array just in case a microporous pipe in certain microporous pipe array is damaged yet, more can not influence the work of the microporous pipe in the microporous pipe array of other layer.And, need not the termination of closed porosity pipe for the microporous pipe array of semi-independent heat pipe structure or the microporous pipe of semi-independent heat pipe structure, reduced three-dimensional slab heat pipe to the vacuum requirement.
In the vias inner walls of each microporous pipe, be provided with little fin with augmentation of heat transfer effect, can further strengthen the phase-change heat-exchange ability of working medium, also can form wick structure if distance is suitable between little fin, significantly increase owing to specific area simultaneously, heat flow density than the flat-plate heat pipe of individual layer microporous pipe array under identical heat-transfer surface is bigger, so have higher heat exchange efficiency, perhaps can be under identical heat exchange efficiency, realize significantly reducing of volume, can save spillage of material, thereby this three-dimensional slab heat pipe have higher heat exchange efficiency and littler volume than the flat-plate heat pipe of traditional heat pipe or individual layer microporous pipe array.The distance that suitable little fin is set can also significantly strengthen mechanical properties such as the bending resistance of three-dimensional slab heat pipe own, heat resistanceheat resistant.The size of little fin and structure are suitable for forming the based on capillary slot that moves towards along the microporous pipe length direction with the microporous pipe inwall can further improve the apparent heat current density of three-dimensional slab heat pipe and the two-way heat transfer characteristic of heat pipe.
The integrative-structure of each microporous pipe for adopting extruding or being stamped to form in the processing technology of the three-dimensional slab heat pipe that the present invention relates to, with heat carrier is the microporous pipe array of two-layer or two-layer above parallel arrangement through monolithic extruded or punch forming, each microporous pipe array comprises the microporous pipe of two and two above parallel arrangements, discharge air in the microporous pipe and be filled with liquid working substance and form micro heat pipe, naturally form the heat pipe effect, owing to be extruding or punch forming, technology is simple, when having saved existing heat pipe and having made such as technologies such as capillary wick material preparation and maintenance, again because be global formation, thus need not to use soldering processes in soldering oven by the integral braze-welded structure that is processed as one.The tube wall of the aluminothermy pipe pipe material of GB (GB9082.1-88) defined should be greater than 1.0mm, and the application's three-dimensional slab heat pipe is because between each layer microporous pipe array and with supporting mutually between each microporous pipe of one deck microporous pipe array, can strengthen the intensity of each microporous pipe mutually, so the tube wall of three-dimensional slab heat pipe can be reduced to about 0.2-0.4mm, termination sealed package technology for heat pipe with light wall pipe wall like this, if adopt capping encapsulation of the prior art, be easy to reveal, influence airtight performance, if adopt the encapsulation of termination fusion soldering processes, rupture again easily in the termination.The application's end sealer adopts cold welding technique, can make it distortion by the termination that the edge of a knife pushes heat carrier and seal and cut off, make the heat carrier termination form the Sealing strap that gradual change is shunk, can disposable closure encapsulate, technology is simple, good airproof performance can not revealed, and has strengthened security and unfailing performance.And the processing technology of three-dimensional slab heat pipe of the present invention helps suitability for industrialized production, heat carrier can place on the production line in batches, enter following procedure through the extrusion die extruding or after by the diel punching press, help the batch process of this three-dimensional slab heat pipe, improved the production efficiency of three-dimensional slab heat pipe simultaneously.
Description of drawings
Fig. 1 is the vertical section structure schematic diagram of three-dimensional slab heat pipe of the present invention;
Fig. 2 is the structural representation of first kind of embodiment of three-dimensional slab heat pipe of the present invention;
Fig. 3 is the structural representation of second kind of embodiment of three-dimensional slab heat pipe of the present invention;
Fig. 4 is the structural representation of the third embodiment of three-dimensional slab heat pipe of the present invention;
Fig. 5 is the structural representation of the 4th kind of embodiment of three-dimensional slab heat pipe of the present invention;
Fig. 6 is the structural representation of the 5th kind of embodiment of three-dimensional slab heat pipe of the present invention;
Fig. 7 is the structural representation of the 6th kind of embodiment of three-dimensional slab heat pipe of the present invention;
Fig. 8 is the structural representation of the 7th kind of embodiment of three-dimensional slab heat pipe of the present invention;
Fig. 9 is the selection process flow process figure of the processing technology of three-dimensional slab heat pipe of the present invention;
Figure 10 is the process chart of the heat carrier end sealer of the processing technology of three-dimensional slab heat pipe of the present invention.
The specific embodiment
The present invention will be described below in conjunction with accompanying drawing.
Fig. 2 is the structural representation of first kind of embodiment of three-dimensional slab heat pipe of the present invention, three-dimensional slab heat pipe with multi-layer microporous pipe array shown in Figure 2 comprises by metal material through extruding or stamping forming heat carrier 1 with microporous pipe array of two-layer parallel arrangement, heat carrier 1 among this embodiment is a plate body, each layer microporous pipe array includes the microporous pipe 2 of two or more parallel arrangements, the microporous pipe 2 of parallel arrangement is parallel to the surface of plate body transverse width broad, the channel cross-section of microporous pipe 2 is shaped as rectangle, be filled with liquid working substance in the microporous pipe 2 and form micro heat pipe, mode with phase-change heat-exchange is conducted heat, and forms the heat pipe effect naturally.For making the heat flow density and the phase-change heat-exchange of this three-dimensional slab heat pipe better, the length-width ratio that the channel cross-section of microporous pipe preferably is set exists
Between 1.5, the minimum tube wall of three-dimensional slab heat pipe and the ratio of each microporous pipe equivalent diameter are all more than or equal to 0.2.
Wherein, sealed at both ends and the two ends of heat carrier 1 all has the Sealing strap of the gradual change contraction that is formed by cold welding; the two ends of each microporous pipe 2 in each layer microporous pipe array is all sealed; and at least one longitudinal section of heat carrier 1 all is punctured into a bit along microporous pipe 2 pipe range direction gradual changes on the outer side edges and the interior survey limit at this Sealing strap place; this outer side edges and interior survey limit are two arc limits of relative indent; the vertical section structure schematic diagram of three-dimensional slab heat pipe of the present invention as shown in Figure 1; heat carrier 1 has by soldering or ratio-frequency welding or other welding method at Sealing strap place end reinforces the curling reinforcing weld bond 4 that forms, and the outer setting of this reinforcing weld bond 4 has protective sleeve.Suppose that the extended length that the Sealing strap gradual change is shunk and the ratio of heat carrier gross thickness are δ, when the gross thickness of heat carrier during smaller or equal to 3mm, 0.75≤δ≤1.5; When the gross thickness of heat carrier between the 3mm to 5mm the time, 0.6≤δ≤1.5; When the gross thickness of heat carrier during greater than 5mm, 0.5≤δ≤1.5.The relation of the extended length of shrinking for the gross thickness of heat carrier and Sealing strap gradual change is set, the pressure that makes microporous pipe inside bear can be greater than 2.0MPa, to satisfy the pressure that different liquids working medium can be born in the microporous pipe under various operating temperatures, adapt to heat pipe need of work in all cases.For example, when the gross thickness of heat carrier was 3mm, the extended length that Sealing strap gradual change contraction can be set was 2.5mm or 3mm etc., and when the gross thickness of heat carrier was 4mm, the extended length that Sealing strap gradual change contraction can be set was 2.8mm or 3mm etc.
Each microporous pipe in each microporous pipe array and each the microporous pipe array all can form independent heat pipe structure or semi-independent heat pipe structure respectively.For example, each microporous pipe array forms the heat pipe of separate work when the sealed at both ends encapsulation of each microporous pipe array, be that three-dimensional slab heat pipe has contained the microporous pipe array that each layer all works alone, help three-dimensional slab heat pipe whole reliability and security maintenance like this, can't influence the work of the microporous pipe of other layer array just in case the microporous pipe array of certain one deck is damaged; Microporous pipe when each microporous pipe 2 two ends is all sealed in every layer of microporous pipe array all forms the micro heat pipe that works alone, promptly form three-dimensional micro heat pipe array, just in case a microporous pipe in certain microporous pipe array is damaged such as the work that also can not influence other microporous pipe after the gas leakage.Open in heat carrier when each microporous pipe array one end, promptly the microporous pipe array communicates with each other, but heat carrier 1 should be held sealing, and during each microporous pipe array other end sealing, each microporous pipe array is semi-independent heat pipe structure; When each microporous pipe 2 one end is opened in heat carrier, be that each microporous pipe 2 communicates with each other, open mode can be hollow sleeve on this termination point casing of heat carrier 1, make heat carrier 1 this end seal, and each microporous pipe 2 communicates with each other at this end, be that each microporous pipe 2 is semi-independent heat pipe structure, semi-independent heat pipe structure integral body has constituted microporous pipe array heat pipe, need not to seal the termination of each microporous pipe because the termination of microporous pipe array is open, thereby reduced three-dimensional slab heat pipe to the vacuum requirement, the situation of the heat carrier sealing of this end needs welding procedure when making but the termination of this each microporous pipe array or the termination of each microporous pipe are opened in heat carrier, as use argon arc welding, welding procedure such as ratio-frequency welding or soldering is made, and each microporous pipe array or each microporous pipe are owing to be semi-independent heat pipe, be communicated with in the end mutually between each microporous pipe, real is single heat pipe structure, be the single integral heat pipe structure of three-dimensional micropore pipe array, in case a certain microporous pipe array is damaged and will influences the work of other microporous pipe array, or a certain microporous pipe is damaged and will influences the work of other microporous pipe, cause the inefficacy of heat pipe integral body, so reliability is understood some reduction.
Fig. 3 is the structural representation of second kind of embodiment of three-dimensional slab heat pipe of the present invention, the difference of this embodiment and first kind of embodiment shown in Figure 2 is, the three-dimensional slab heat pipe of this embodiment comprises the microporous pipe array of three layers of parallel arrangement, be provided with little fin 3 that some Heat Conduction Materials make in each layer microporous pipe array on the relative up and down inwall of the microporous pipe 2 of each rectangle or along the indent based on capillary slot of microporous pipe 2 length directions trend, suitably can form capillary wick along distance between the adjacent little fin 3 of three-dimensional slab heat pipe length direction of the present invention, further, the formation based on capillary slot of arranging along the adjacent little fin 3 of three-dimensional slab heat pipe length direction of the present invention, little fin 3 is the level and smooth fillet with certain curvature with the drift angle place of the inwall formation of microporous pipe 2 and the drift angle place of indent based on capillary slot and the formation of microporous pipe 2 inwalls, concentrates to avoid stress.In addition, little fin 3 can be provided with on the relative up and down inwall of microporous pipe 2, also only the side in microporous pipe 2 inwalls or both sides or three sides or four side settings arbitrarily.The setting of little fin, capillary wick and based on capillary slot can improve the heat transfer efficiency of three-dimensional slab heat pipe, makes three-dimensional slab heat pipe of the present invention have higher heat exchange efficiency and littler volume.
Fig. 4 is the structural representation of the third embodiment of three-dimensional slab heat pipe of the present invention, the difference of this embodiment and second kind of embodiment shown in Figure 3 is, four corner angle of the heat carrier 1 among Fig. 3 are the right angle, and four corner angle of the heat carrier 1 among Fig. 4 are circular arc, the extruding preparation both had been convenient in the circular arc setting, was convenient to remove commentaries on classics again.Three-dimensional slab heat pipe preparation technology of the present invention is simple, the profile of its slab construction also can be flexible and changeable, in the structural representation of the 4th kind of embodiment of three-dimensional slab heat pipe of the present invention as shown in Figure 5, comprise two-layer microporous pipe array, the profile of heat carrier 1 is a half elliptic.
Fig. 6 and Fig. 7 are respectively the structural representation of the 5th kind and the 6th kind embodiment of three-dimensional slab heat pipe of the present invention, three-dimensional slab heat pipe among these two embodiment includes three layers of microporous pipe array, and the channel cross-section shape of microporous pipe 2 is circle, certainly the channel cross-section of microporous pipe also can for other polygonal (as triangle and square etc.),, ellipse or other do not form the random geometry that stress is concentrated, wherein, polygonal drift angle place should be the level and smooth fillet with certain curvature.The difference of two embodiment is that consistency from top to bottom is arranged for adjacent microporous pipe in the microporous pipe array of levels among Fig. 6, and among Fig. 7 in the microporous pipe array of levels adjacent microporous pipe for being staggered.The difference of the relative position setting of each microporous pipe causes the difference of the direction of heat flow in the three-dimensional slab heat pipe, arrow is represented direction of heat flow shown in the figure, hot-fluid flows to three directions among Fig. 6, and the hot-fluid among Fig. 7 is to flow to both direction, separately heat flow density can be drawn according to arranging between the structure of microporous pipe self and the microporous pipe, corresponding three-dimensional slab heat pipe can be selected according to the concrete application of this three-dimensional slab heat pipe.
Fig. 8 is the structural representation of the 7th kind of embodiment of three-dimensional slab heat pipe of the present invention, with the difference of the 5th kind of embodiment shown in Figure 6 be, each circular microporous pipe 2 is provided with little fin 3 that a large amount of Heat Conduction Materials is made on the inwall all around among this embodiment, suitably can form capillary wick along distance between the adjacent little fin 3 of three-dimensional slab heat pipe length direction of the present invention, further, form a large amount of based on capillary slot along arranging of the adjacent little fin 3 of three-dimensional slab heat pipe length direction of the present invention.
Fig. 9 is the selection process flow process figure of the processing technology of three-dimensional slab heat pipe of the present invention, and this processing technology comprises the steps:
A, employing extruding or Sheet Metal Forming Technology are prepared the heat carrier of the microporous pipe array that has two-layer or two-layer above parallel arrangement in it and connect, and every layer of microporous pipe array comprises the microporous pipe that two or more are arranged side by side; This heat carrier can be metal material, metal material is heated to injects the extrusion die extruding behind the softening temperature, the side of this extrusion die is provided with dull and stereotyped shell, enclosure is provided with the column punch of the two-layer or two-layer above parallel arrangement parallel with the shell difference, and the side is provided with some nicks hole around this column punch;
After being extruded, A ', metal material be cooled to normal temperature, be shaped to the slab construction of microporous pipe array with two-layer or two-layer above parallel arrangement, each microporous pipe array includes the microporous pipe of two and two above parallel arrangements, and has the some little fin with augmentation of heat transfer effect of extrusion modling on the microporous pipe inwall;
B, with the termination sealing of an end of heat carrier: concrete grammar can have three kinds, a kind of is to adopt the cold welding technique sealed package, the process chart of the heat carrier end sealer of the processing technology of three-dimensional slab heat pipe of the present invention as shown in figure 10, this cold welding technique is for to place cutter 5 respectively at heat carrier termination upper and lower, and the termination of the edge of a knife extruding heat carrier 1 by cutter 5 makes it distortion and seals and cut off; Second method is after being flattened, curl in this termination of heat carrier, to adopt soldering or ratio-frequency welding to seal reinforcing; The third method is that this termination point casing upper bush at heat carrier seals;
C, the micropore inner air tube is discharged (for example vacuumizing) form micro heat pipe to discharge not concretive gas and filling liquid working medium;
D, the cold welding technique sealed package is adopted in the termination of the other end of heat carrier, the process chart of the heat carrier end sealer of the processing technology of three-dimensional slab heat pipe of the present invention as shown in figure 10, this cold welding technique is for to place cutter 5 respectively at heat carrier termination upper and lower, and the termination of the edge of a knife extruding heat carrier 1 by cutter 5 makes it distortion and seals and cut off; Adopt the cold welding technique sealed package again after also can earlier aluminium wire being inserted into the mouth of pipe of microporous pipe 2;
E, the two ends of heat carrier is installed protective sleeve respectively, this protective sleeve can select sleeve to realize the reinforcing weldering of the end sealer of heat carrier.
The three-dimensional slab heat pipe that above-mentioned processing technology is prepared is the three-dimensional slab heat pipe of the 7th kind of embodiment shown in Figure 8, its vertical section structure schematic diagram as shown in Figure 1, if the nick hole is not set on the column punch in the extrusion die in the processing technology, then each circular microporous pipe of Zhi Bei three-dimensional slab heat pipe does not just have little fin on the inwall all around, and when the adjacent column punch of the levels in the extrusion die is the consistency from top to bottom arrangement, form three-dimensional slab heat pipe shown in Figure 6; When the adjacent column punch of the levels in the extrusion die is when being staggered, form three-dimensional slab heat pipe shown in Figure 7.
The processing technology of the three-dimensional slab heat pipe among this embodiment is a hot extrusion technique, except that this technology, can also select cold extrusion or warm extrusion technology, in cold extrusion or warm extrusion technology, should select the extrusion die wear-resistant, that hardness is high, and need very big squeeze pressure to remove the extrusion metal material, cold extrusion or warm extrusion technology are than hot extrusion cost height, but the heat pipe surface smoothness and the smoothness height that squeeze out.Can certainly select Sheet Metal Forming Technology to prepare three-dimensional slab heat pipe of the present invention, remove the punching press heat carrier by the diel that has the two-layer or two-layer above column punch that is arranged side by side, when especially processing relatively shorter three-dimensional slab heat pipe, the easier realization of this Sheet Metal Forming Technology, equally, can select drop stamping, warm punching press or cold punching technology to prepare.This three-dimensional slab heat pipe is extruding or punching press global formation, technology is simple, when having saved existing heat pipe and having made such as technologies such as capillary wick material preparation and maintenance, also need not to use soldering processes in soldering oven by the integral braze-welded structure that is processed as one, and processing technology of the present invention helps suitability for industrialized production, heat carrier can place on the production line in batches, enter following procedure through the extrusion die extruding or after by the diel punching press, help the batch process of this three-dimensional slab heat pipe, improved the production efficiency of three-dimensional slab heat pipe simultaneously.
Should be pointed out that the above specific embodiment can make those skilled in the art more fully understand the invention, but do not limit the present invention in any way creation.Therefore; although this specification has been described in detail the invention with reference to drawings and Examples; but; those skilled in the art are to be understood that; still can make amendment or be equal to replacement the invention; in a word, all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the invention, and it all should be encompassed in the middle of the protection domain of the invention patent.
Claims (15)
1. three-dimensional slab heat pipe with multi-layer microporous pipe array, it is characterized in that: comprise by metal material through extruding or stamping forming heat carrier with microporous pipe array of two-layer or two-layer above parallel arrangement, described every layer of microporous pipe array comprises the microporous pipe of two or more parallel arrangements, be filled with the working medium of phase-change heat-exchange effect in the described microporous pipe, sealed at both ends and at least one termination of described heat carrier has the Sealing strap of the gradual change contraction that is formed by cold welding.
2. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 1, it is characterized in that, at least one longitudinal section of described heat carrier is punctured into a bit along the gradual change of microporous pipe pipe range direction in the outer side edges at this Sealing strap place, and described outer side edges is two arc limits of relative indent.
3. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 2, it is characterized in that, at least one longitudinal section of described heat carrier is punctured into a bit along the gradual change of microporous pipe pipe range direction at the inner side edge at this Sealing strap place, and described inner side edge is two arc limits of relative indent.
4. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 3; it is characterized in that heat carrier has the reinforcing weld bond and/or the described heat carrier that curl that are formed by soldering or ratio-frequency welding at Sealing strap place end and in the outer setting of Sealing strap place end protective sleeve arranged.
5. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 4 is characterized in that, the microporous pipe array of described parallel arrangement is parallel to the surface of the strip or the plate body transverse width broad of heat carrier.
6. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 5 is characterized in that the length-width ratio that the channel cross-section of microporous pipe is set exists
Between 1.5, the minimum tube wall of described new heat pipe and the ratio of each microporous pipe equivalent diameter are all more than or equal to 0.2.
7. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 6, it is characterized in that, when the gross thickness of heat carrier during smaller or equal to 3mm, the extended length that described Sealing strap gradual change is shunk and the ratio of heat carrier gross thickness are between 0.75 to 1.5; When the gross thickness of heat carrier between the 3mm to 5mm the time, the extended length that described Sealing strap gradual change is shunk and the ratio of heat carrier gross thickness are between 0.6 to 1.5; When the gross thickness of heat carrier during greater than 5mm, the extended length that described Sealing strap gradual change is shunk and the ratio of heat carrier gross thickness are between 0.5 to 1.5.
8. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 7 is characterized in that, described each microporous pipe two ends are all sealed, and each microporous pipe is independent heat pipe structure, forms three-dimensional micro heat pipe array; Or described each microporous pipe one end is open in heat carrier, and promptly each microporous pipe communicates with each other, but heat carrier should be held sealing, each microporous pipe other end sealing, and each microporous pipe is semi-independent heat pipe structure, forms the single integral heat pipe of three-dimensional micropore pipe array.
9. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 8, it is characterized in that, in the vias inner walls of described each microporous pipe, be provided with little fin with augmentation of heat transfer effect or the indent based on capillary slot that moves towards along the microporous pipe length direction, the size of described little fin and structure are suitable for forming along the based on capillary slot of microporous pipe length direction trend with the microporous pipe inwall, and the drift angle place that drift angle place that described little fin and microporous pipe inwall form and indent based on capillary slot and microporous pipe inwall form is level and smooth fillet.
10. the three-dimensional slab heat pipe with multi-layer microporous pipe array according to claim 8 is characterized in that, adjacent microporous pipe is the consistency from top to bottom arrangement or is staggered in the microporous pipe array of described levels.
11. the processing technology as the described three-dimensional slab heat pipe of one of claim 1 to 10 is characterized in that: comprise the steps:
A, employing extruding or Sheet Metal Forming Technology are prepared the strip of the microporous pipe array that has two-layer or two-layer above parallel arrangement in it and connect or tabular heat carrier, and described every layer of microporous pipe array comprises the microporous pipe of two or more parallel arrangements;
B, with the termination sealing of an end of heat carrier;
C, the micropore inner air tube is discharged and filling liquid working medium;
D, the cold welding technique sealed package is adopted in the termination of the other end of heat carrier, described cold welding technique makes it distortion for the termination by edge of a knife extruding heat carrier and seals and cut off.
12. processing technology according to claim 11, it is characterized in that, the technology of the termination sealing of the described end with heat carrier of step B is for adopting the cold welding technique sealed package, and described cold welding technique makes it distortion for this termination by edge of a knife extruding heat carrier and seals and cut off; Or the technology of the termination sealing of the described end with heat carrier of step B be after being flattened, curl in this termination of heat carrier, adopts soldering or ratio-frequency welding to seal reinforcing or seals at this termination point casing upper bush.
13. according to claim 11 or 12 described processing technologys, it is characterized in that, behind the execution of step D, also carry out following step:
E, the two ends of heat carrier is installed protective sleeve.
14. processing technology according to claim 13, it is characterized in that, the described heat carrier of steps A is the metal or alloy material, heat carrier is heated to injects the extrusion die extruding behind the softening temperature or by the diel punching press, described extruding or diel have the two-layer or two-layer above column punch of parallel arrangement, described heat carrier be extruded or punching press after be cooled to normal temperature.
15. processing technology according to claim 14, it is characterized in that, be provided with some nicks hole or outer fin on the column punch in described extrusion die of steps A or the diel, make to have extruding or stamping forming some little fin or indent based on capillary slot on the described microporous pipe inwall with augmentation of heat transfer effect.
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| CN2009102370799A CN101738118B (en) | 2009-11-03 | 2009-11-03 | Three-dimensional slab heat pipe with multi-layer microporous pipe arrays and processing technique thereof |
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| CN102012181A (en) * | 2010-06-21 | 2011-04-13 | 邹飞龙 | Thermal superconducting pipe of plate multi-channel special-shape cavity |
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| CN104215104A (en) * | 2013-06-04 | 2014-12-17 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method of multi-cavity heat conduction tube |
| CN104215104B (en) * | 2013-06-04 | 2016-04-13 | 国研高能（北京）稳态传热传质技术研究院有限公司 | The preparation method of multi-cavity heat pipe |
| CN104006685A (en) * | 2014-05-06 | 2014-08-27 | 新疆太阳能科技开发公司 | Multi-array planar heat tube |
| CN105241287A (en) * | 2014-07-07 | 2016-01-13 | 杨积文 | Columnar heat transfer device and pipeline and method used for heat transfer of fluid matter |
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