CN101737753A - Electronic assembly and backlight module - Google Patents
Electronic assembly and backlight module Download PDFInfo
- Publication number
- CN101737753A CN101737753A CN200810176744A CN200810176744A CN101737753A CN 101737753 A CN101737753 A CN 101737753A CN 200810176744 A CN200810176744 A CN 200810176744A CN 200810176744 A CN200810176744 A CN 200810176744A CN 101737753 A CN101737753 A CN 101737753A
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- heat
- substrate
- thermal
- emitting diode
- light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
An electronic assembly comprises a heat-conductive substrate, a circuit board device and a plurality of light-emitting diode devices, wherein the circuit board device is arranged on the heat-conductive substrate, the light-emitting diode devices are arranged on the heat-conductive substrate; each light-emitting diode device comprises a plurality of electric connection parts and at least one heat-conductive connection part; the electric connection parts are electrically connected with the circuit board device, the heat-conductive connection part is connected with the heat-conductive substrate in a heat-conductive manner; and the connection part of the circuit board device and the electric connection parts and the connection part of the heat-conductive substrate and the heat-conductive connection part are in the same plane. In addition, the invention also provides a backlight module with the electronic assembly.
Description
Technical field
The present invention relates to a kind of electronic assembly (electronic assembly), and be particularly related to a kind of backlight module (backlight module) with above-mentioned electronic assembly.
Background technology
Figure 1 shows that the generalized section of existing a kind of electronic assembly.Consult Fig. 1, existing electronic assembly 100 comprises metal substrate (metal substrate) 110, circuit board (circuit board) 120 and a plurality of package structure for LED (light-emitting diode package, LED package) 130.Circuit board 120 is disposed at metal substrate 110, and has line layer (circuit layer) 122 and insulating barrier (dielectric layer) 124.
Package structure for LED 130 is disposed on the circuit board 120, and has two pins 132, radiating seat 134 and light-emitting diode chip for backlight unit (LED chip) 136.Light-emitting diode chip for backlight unit 136 is disposed on the radiating seat 134, and is electrically connected to these pins 132 by two bonding wires (not shown).These pins 132 of package structure for LED 130 are electrically connected to the line layer 122 of circuit board 120.
When producing heat, the heat that is produced can be passed to outside the package structure for LED 130 by the radiating seat 134 of correspondence when light-emitting diode chip for backlight unit 136 is luminous.Yet, because circuit board 120 has insulating barrier 124, so the heat that light-emitting diode chip for backlight unit 136 is produced can't be passed to metal substrate 110 effectively.In other words, generally speaking, the thermal resistance of circuit board 120 is bigger, the transmission that it is unfavorable for heat, and the efficient that makes the heat of existing electronic assembly 100 transmit is relatively poor.
Summary of the invention
The invention provides a kind of electronic assembly, the efficient that its heat transmits is preferable.
The invention provides a kind of backlight module, have the preferable electronic assembly of above-mentioned heat transfer efficiency.
Other purpose of the present invention and advantage can be further understood from technical characterictic disclosed in this invention.
For reaching one of above-mentioned or partly or all purposes or other purpose, one embodiment of the invention propose a kind of electronic assembly, comprise heat-conducting substrate (thermally-conductive substrate), circuit board arrangement and a plurality of light-emitting diode assembly (LED device).Circuit board arrangement is disposed on the heat-conducting substrate, and described a plurality of light-emitting diode assembly is disposed on the heat-conducting substrate.Light-emitting diode assembly comprises a plurality of electrical connection sections (electrical connection portion) and at least one heat-conductive connection part (thermalconnection portion).Described a plurality of electrical connection section is electrically connected to circuit board arrangement, and heat-conductive connection part is connected to heat-conducting substrate with thermal conductivity.The junction that junction that circuit board arrangement is connected with described a plurality of electrical connection sections and heat-conducting substrate are connected with heat-conductive connection part is in the same plane.
For reaching one of above-mentioned or partly or all purposes or other purpose, one embodiment of the invention propose a kind of backlight module, comprise LGP (light-guiding plate) and above-mentioned electronic assembly.LGP has incidence surface (light incident surface) and exiting surface (light-emitting surface), and the contiguous LGP of electronic assembly.In addition, light-emitting diode assembly is suitable for sending the light beam that passes incidence surface.
Because the heat-conductive connection part of light-emitting diode assembly is connected to heat-conducting substrate with thermal conductivity,, and then be passed in the external environment so the heat-conductive connection part of light-emitting diode assembly is passed to heat-conducting substrate with the heat that light-emitting diode assembly produced of correspondence.Therefore, compared with prior art, the heat transfer efficiency of the electronic assembly of the embodiment of the invention is preferable.
For the above-mentioned feature and advantage of the embodiment of the invention can be become apparent, embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1 shows that the generalized section of existing a kind of electronic assembly;
Fig. 2 A is depicted as the schematic top plan view of a kind of backlight module of first embodiment of the invention;
Fig. 2 B is depicted as the generalized section of the backlight module of Fig. 2 A along line A-A;
Fig. 3 A is depicted as the schematic top plan view of a kind of electronic assembly of second embodiment of the invention;
Fig. 3 B is depicted as the generalized section of the electronic assembly of Fig. 3 A along line B-B;
Figure 4 shows that the schematic top plan view of the another kind of electronic assembly of second embodiment of the invention;
Figure 5 shows that the generalized section of a kind of electronic assembly of third embodiment of the invention;
Figure 6 shows that the generalized section of a kind of electronic assembly of fourth embodiment of the invention; And
Figure 7 shows that the generalized section of a kind of electronic assembly of fifth embodiment of the invention.
[primary clustering symbol description]
100,200,300,300 ', 400,500,600: electronic assembly
110: metal substrate
120,220,320,320 ', 520,620: circuit board
122,222: line layer
124,224: insulating barrier
130: package structure for LED
132: pin
134: radiating seat
136: light-emitting diode chip for backlight unit
210,310,410,510,610: heat-conducting substrate
230,330,430,530,630: light-emitting diode assembly
232,332,632: electrical connection section
234,334,434,534,634: heat-conductive connection part
236: light-emitting diode chip for backlight unit
312: groove
314,414,514: thermal-conductivity substrate
316,416: heat-conducting layer
340,340 ': intermediary's electrical connector
342 ': connector
414a: thickness
418: the heat conduction penetration piece
418a: head
418b: run through portion
419: passage of heat
516: heat pipe
638: bonding wire
650: intermediary substrate
660: cladding
C1, C2, C3: circuit board arrangement
D1, D2: direction
L: light beam
M: backlight module
P: LGP
R: reflector plate
S: plane
S1: incidence surface
S2: exiting surface
S3: bottom surface
The specific embodiment
About aforementioned and other technology contents, characteristics and effect of the present invention, in following cooperation DETAILED DESCRIPTION OF THE PREFERRED with reference to the accompanying drawings, can clearly present.The direction term of being mentioned in following examples, for example: upper and lower, left and right, front or rear etc. only are directions with reference to the accompanying drawings.Therefore, the direction term of use is to be used for illustrating not to be to be used for limiting the present invention.
[first embodiment]
Fig. 2 A is depicted as the schematic top plan view of a kind of backlight module of first embodiment of the invention, and Fig. 2 B is depicted as the generalized section of the backlight module of Fig. 2 A along line A-A.Consult Fig. 2 A and Fig. 2 B, the backlight module M of present embodiment comprises LGP P and electronic assembly 200.LGP P has incidence surface S1 and exiting surface S2, and electronic assembly 200 contiguous LGP P.
These light-emitting diode assemblies 230 can be disposed on the heat-conducting substrate 210 in array.Light-emitting diode assembly 230 comprises a plurality of electrical connection sections 232 and at least one heat-conductive connection part 234.These electrical connection sections 232 of light-emitting diode assembly 230 are electrically connected to first line layer 222 of the first circuit board 220 of circuit board arrangement C1, and the heat-conductive connection part 234 of light-emitting diode assembly 230 is connected to heat-conducting substrate 210 with thermal conductivity.The junction that junction that the first circuit board 220 of circuit board arrangement C1 is connected with these electrical connection sections 232 and heat-conducting substrate 210 are connected with these heat-conductive connection part 234 is to be positioned on the same planar S.
In detail, in the present embodiment, light-emitting diode assembly 230 for example is a package structure for LED, and it also comprises light-emitting diode chip for backlight unit 236.In addition, the electrical connection section 232 of light-emitting diode assembly 230 for example is a pin, and the heat-conductive connection part 234 of light-emitting diode assembly 230 for example is a radiating seat.Light-emitting diode chip for backlight unit 236 is disposed on the corresponding heat-conductive connection part 234, and is electrically connected to these corresponding electrical connection sections 232 by corresponding a plurality of bonding wires (not shown).In addition, these electrical connection sections 232 of light-emitting diode assembly 230 are positioned at the same side of the light-emitting diode assembly 230 with it.
When light-emitting diode assembly 230 work, the light-emitting diode chip for backlight unit 236 of light-emitting diode assembly 230 sends the light beam L of the incidence surface S1 that passes LGP P, and produces heat.Light beam L is configured in the reflector plate R reflection on the bottom surface S3 of LGP P, and then leaves from the exiting surface S2 of LGP P.At this moment, the heat-conductive connection part 234 of light-emitting diode assembly 230 is passed to heat-conducting substrate 210 with the heat that the light-emitting diode chip for backlight unit 236 of correspondence is produced, and then is passed in the external environment.Therefore, compared with prior art, the heat transfer efficiency of the electronic assembly 200 of the backlight module M of present embodiment is preferable.
[second embodiment]
Fig. 3 A is depicted as the schematic top plan view of a kind of electronic assembly of second embodiment of the invention, and Fig. 3 B is depicted as the generalized section of the electronic assembly of Fig. 3 A along line B-B.Consult Fig. 3 A and Fig. 3 B, the difference of the electronic assembly 300 of present embodiment and the electronic assembly 200 of first embodiment is, the circuit board arrangement C2 of electronic assembly 300 comprises a plurality of first circuit boards 320 and intermediary's electrical connector 340, and heat-conducting substrate 310 is a composite base plate.
Heat-conducting substrate 310 has a plurality of grooves 312, and first circuit board 320 is positioned at groove 312.These first circuit boards 320 are arranged in parallel with each other.Contiguous these first circuit boards 320 of light-emitting diode assembly 330 at least one of them, and the electrical connection section 332 of light-emitting diode assembly 330 is electrically connected to these first circuit boards 320 one of them.In detail, in the present embodiment, light-emitting diode assembly 330 is between adjacent two first circuit boards 320.These electrical connection sections 332 of light-emitting diode assembly 330 are positioned at the relative both sides of the light-emitting diode assembly 330 with it, and are electrically connected to adjacent two first circuit boards 320 respectively.
Intermediary's electrical connector 340 for example is a second circuit board, and it is disposed on the heat-conducting substrate 310 and is electrically connected these first circuit boards 320.
Heat-conducting substrate 310 comprises thermal-conductivity substrate 314 and heat-conducting layer 316.Heat-conducting layer 316 is disposed on the thermal-conductivity substrate 314, and the material of thermal-conductivity substrate 314 is different from the material of heat-conducting layer 316.In detail, the thermal conductivity factor of thermal-conductivity substrate 314 is less than the thermal conductivity factor of heat-conducting layer 316, and the heat-conductive connection part 334 of light-emitting diode assembly 330 is disposed on the heat-conducting layer 316.In addition, the material of thermal-conductivity substrate 314 for example is an aluminium, and the material of heat-conducting layer 316 for example is a copper.
Figure 4 shows that the schematic top plan view of the another kind of electronic assembly of second embodiment of the invention.Consult Fig. 4, intermediary's electrical connector 340 ' of electronic assembly 300 ' comprises a plurality of connectors 342 '.Connector 342 ' is electrically connected adjacent two first circuit boards 320 '.
[the 3rd embodiment]
Figure 5 shows that the generalized section of a kind of electronic assembly of third embodiment of the invention.Consult Fig. 5, the difference of the electronic assembly 400 of present embodiment and the electronic assembly 300 of second embodiment is that heat-conducting substrate 410 also comprises a plurality of heat conduction penetration pieces 418 and a plurality of passages of heat 419 that run through heat-conducting layer 416.Heat conduction penetration piece 418 runs through heat-conducting layer 416 and is connected to thermal-conductivity substrate 414 with thermal conductivity.In the present embodiment, heat conduction penetration piece 418 for example is the spike thing, and it comprises head 418a and runs through the 418b of portion.The 418b of the portion of running through of heat conduction penetration piece 418 runs through heat-conducting layer 416 and thermal-conductivity substrate 414.The heat-conductive connection part 434 of light-emitting diode assembly 430 is disposed on the head 418a of heat conduction penetration piece 418.In addition, passage of heat 419 connects the head 418a of thermal-conductivity substrate 414 and heat conduction penetration piece 418 with thermal conductivity.
It should be noted that thermal-conductivity substrate 414 has first thermal conductivity factor on the first direction D1 that is parallel to its thickness 414a, and thermal-conductivity substrate 414 has second thermal conductivity factor on the second direction D2 perpendicular to its thickness 414a.Heat-conducting layer 416 has the 3rd thermal conductivity factor on first direction D1, and heat-conducting layer 416 has the 4th thermal conductivity factor on second direction D2.First thermal conductivity factor is greater than the 3rd thermal conductivity factor, and second thermal conductivity factor is less than the 4th thermal conductivity factor.In other words, on first direction D1, the thermal resistance of thermal-conductivity substrate 414 is less than the thermal resistance of heat-conducting layer 416; On second direction D2, also be on the plane of vertical first direction D1, the thermal resistance of thermal-conductivity substrate 414 is greater than the thermal resistance of heat-conducting layer 416.
Particularly, in the present embodiment, the material of thermal-conductivity substrate 414 is metal (for example for copper or aluminium), and the material of heat-conducting layer 416 is graphite, and the material of heat conduction penetration piece 418 is metal (for example being copper or aluminium).Via as can be known above-mentioned, the efficient that the heat of heat-conducting substrate 410 transmits is better.
[the 4th embodiment]
Figure 6 shows that the generalized section of a kind of electronic assembly of fourth embodiment of the invention.Consult Fig. 6, the difference of the electronic assembly 500 of present embodiment and the electronic assembly 400 of the 3rd embodiment is that heat-conducting substrate 510 comprises thermal-conductivity substrate 514 and at least one heat pipe 516 (Fig. 6 schematically is depicted as three).These heat pipes 516 are disposed on the thermal-conductivity substrate 514.These first circuit boards 520 of circuit board arrangement C3 are disposed on the thermal-conductivity substrate 514, and the heat-conductive connection part 534 of light-emitting diode assembly 530 is disposed on the corresponding heat pipe 516.
[the 5th embodiment]
Figure 7 shows that the generalized section of a kind of electronic assembly of fifth embodiment of the invention.Consult Fig. 7, the light-emitting diode assembly 630 of the electronic assembly 600 of present embodiment is a light-emitting diode chip for backlight unit.The electrical connection section 632 of light-emitting diode assembly 630 for example is a pad (pad), and is electrically connected to these first circuit boards 620 one of them by bonding wire 638.In addition, the heat-conductive connection part 634 of light-emitting diode assembly 630 for example is the back side of light-emitting diode chip for backlight unit.
It should be noted that if the material of heat-conducting substrate 610 is an aluminium, then for example be not complementary for the thermal coefficient of expansion (thermal expansion coefficient) of the light-emitting diode assembly 630 of light-emitting diode chip for backlight unit thermal coefficient of expansion with heat-conducting substrate 610.Therefore, configurable intermediary substrate between light-emitting diode assembly 630 and heat-conducting substrate 610 (medium substrate) 650, the thermal coefficient of expansion of its thermal coefficient of expansion and light-emitting diode chip for backlight unit is close, with the buffering intermediary as thermal stress between light-emitting diode assembly 630 and the heat-conducting substrate 610.Intermediary substrate 650 materials for example are silicon (Si) or aluminium nitride (AlN).
In addition, electronic assembly 600 also comprises a plurality of claddings (encapsulant) 660, and it coats these light-emitting diode assemblies 630 and these corresponding bonding wires 638 respectively, to protect these light-emitting diode assemblies 630 and these corresponding bonding wires 638.
In sum, the electronic assembly of the embodiment of the invention and the backlight module of using it have following one of them or other advantage at least:
One,,, and then is passed in the external environment so the heat-conductive connection part of light-emitting diode assembly is passed to heat-conducting substrate with the heat that light-emitting diode assembly produced of correspondence because the heat-conductive connection part of light-emitting diode assembly is connected to heat-conducting substrate with thermal conductivity.Therefore, compared with prior art, the heat transfer efficiency of the electronic assembly of the embodiment of the invention is preferable.
Two, because heat-conducting substrate can be composite base plate, so generally speaking, the efficient of the heat transmission of the heat-conducting substrate of the electronic assembly of the embodiment of the invention can be enhanced according to designer's demand.
Though the present invention with preferred embodiment openly as above; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the invention; can make various modifications and variations, so protection scope of the present invention should be as the criterion with the scope of appended claims.Arbitrary embodiment of the present invention in addition or claim must not reached whole purpose disclosed in this invention or advantage or characteristics.In addition, summary part and title only are to be used for auxiliary patent document search, are not to be used for limiting interest field of the present invention.
Claims (20)
1. electronic assembly comprises:
Heat-conducting substrate;
Circuit board arrangement is disposed on the described heat-conducting substrate; And
A plurality of light-emitting diode assemblies are disposed on the described heat-conducting substrate, and wherein said light-emitting diode assembly comprises:
A plurality of electrical connection sections are electrically connected to described circuit board arrangement; And
At least one heat-conductive connection part is connected to described heat-conducting substrate with thermal conductivity, and junction and described heat-conducting substrate that wherein said circuit board arrangement is connected with described a plurality of electrical connection sections are in the same plane with the junction that described heat-conductive connection part is connected.
2. electronic assembly according to claim 1, wherein said heat-conducting substrate are composite base plate.
3. electronic assembly according to claim 2, wherein said heat-conducting substrate comprises:
Thermal-conductivity substrate; And
Heat-conducting layer is disposed on the described thermal-conductivity substrate, and the material of wherein said thermal-conductivity substrate is different from the material of described heat-conducting layer.
4. electronic assembly according to claim 3, the thermal conductivity factor of wherein said thermal-conductivity substrate are less than the thermal conductivity factor of described heat-conducting layer, and the described heat-conductive connection part of described light-emitting diode assembly is disposed on the described heat-conducting layer.
5. electronic assembly according to claim 4, the material of wherein said thermal-conductivity substrate are aluminium, and the material of described heat-conducting layer is a copper.
6. electronic assembly according to claim 3, wherein said heat-conducting substrate also comprises a plurality of heat conduction penetration pieces, described heat conduction penetration piece runs through described heat-conducting layer and is connected to described thermal-conductivity substrate with thermal conductivity, the described heat-conductive connection part of described light-emitting diode assembly is disposed on the described heat conduction penetration piece, described thermal-conductivity substrate has first thermal conductivity factor being parallel on the first direction of its thickness, described thermal-conductivity substrate has second thermal conductivity factor on the second direction perpendicular to its thickness, described heat-conducting layer has the 3rd thermal conductivity factor on described first direction, described heat-conducting layer has the 4th thermal conductivity factor on described second direction, described first thermal conductivity factor is greater than described the 3rd thermal conductivity factor, and described second thermal conductivity factor is less than described the 4th thermal conductivity factor.
7. electronic assembly according to claim 6, the material of wherein said thermal-conductivity substrate are metal, and the material of described heat-conducting layer is a graphite, and the material of described heat conduction penetration piece is a metal.
8. electronic assembly according to claim 6, wherein said heat-conducting substrate also comprise a plurality of passages of heat that run through described heat-conducting layer, and described passage of heat connects described thermal-conductivity substrate and described heat conduction penetration piece with thermal conductivity.
9. electronic assembly according to claim 2, wherein said heat-conducting substrate comprises:
Thermal-conductivity substrate, wherein said circuit board arrangement are disposed on the described thermal-conductivity substrate; And
At least one heat pipe is disposed on the described thermal-conductivity substrate, and the described heat-conductive connection part of a light-emitting diode assembly in wherein said a plurality of light-emitting diode assemblies is disposed on the described heat pipe.
10. electronic assembly according to claim 1, wherein said circuit board arrangement comprises:
A plurality of first circuit boards, wherein said a plurality of first circuit board is arranged in parallel with each other, at least one of the contiguous described a plurality of first circuit boards of described light-emitting diode assembly is provided with, and the described electrical connection section of described light-emitting diode assembly is electrically connected to described a plurality of first circuit boards one of them; And
Intermediary's electrical connector is disposed on the described heat-conducting substrate and is electrically connected described a plurality of first circuit board.
11. electronic assembly according to claim 10, wherein said heat-conducting substrate has a plurality of grooves, and described first circuit board is positioned at described groove.
12. electronic assembly according to claim 10, wherein said intermediary electrical connector is a second circuit board.
13. electronic assembly according to claim 10, wherein said intermediary electrical connector comprises a plurality of connectors, and wherein said connector is electrically connected adjacent two described first circuit boards.
14. electronic assembly according to claim 1, described a plurality of electrical connection sections of wherein said light-emitting diode assembly are positioned at the same side of the described light-emitting diode assembly with it.
15. electronic assembly according to claim 1, described a plurality of electrical connection sections of wherein said light-emitting diode assembly are positioned at the relative both sides of the described light-emitting diode assembly with it.
16. a backlight module comprises:
LGP has incidence surface and exiting surface; And
Electronic assembly, contiguous described LGP comprises:
Heat-conducting substrate;
Circuit board arrangement is disposed on the described heat-conducting substrate; And
A plurality of light-emitting diode assemblies are disposed on the described heat-conducting substrate, and wherein said light-emitting diode assembly is suitable for sending the light beam that passes described incidence surface, and described light-emitting diode assembly comprises:
A plurality of electrical connection sections are electrically connected to described circuit board arrangement; And
At least one heat-conductive connection part is connected to described heat-conducting substrate with thermal conductivity, and junction and described heat-conducting substrate that wherein said circuit board arrangement is connected with described a plurality of electrical connection sections are in the same plane with the junction that described heat-conductive connection part is connected.
17. backlight module according to claim 16, wherein said heat-conducting substrate has at least one groove, and described circuit board arrangement is positioned at described groove.
18. backlight module according to claim 16, wherein said heat-conducting substrate are composite base plate.
19. backlight module according to claim 18, wherein said heat-conducting substrate comprises:
Thermal-conductivity substrate; And
Heat-conducting layer is disposed on the described thermal-conductivity substrate, and the material of wherein said thermal-conductivity substrate is different from the material of described heat-conducting layer.
20. backlight module according to claim 19, the thermal conductivity factor of wherein said thermal-conductivity substrate are less than the thermal conductivity factor of described heat-conducting layer, and the described heat-conductive connection part of described light-emitting diode assembly is disposed on the described heat-conducting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810176744A CN101737753A (en) | 2008-11-20 | 2008-11-20 | Electronic assembly and backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810176744A CN101737753A (en) | 2008-11-20 | 2008-11-20 | Electronic assembly and backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101737753A true CN101737753A (en) | 2010-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810176744A Pending CN101737753A (en) | 2008-11-20 | 2008-11-20 | Electronic assembly and backlight module |
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| CN (1) | CN101737753A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751269A (en) * | 2011-04-20 | 2012-10-24 | 亮明光电科技股份有限公司 | Light-emitting diode module encapsulation structure |
-
2008
- 2008-11-20 CN CN200810176744A patent/CN101737753A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751269A (en) * | 2011-04-20 | 2012-10-24 | 亮明光电科技股份有限公司 | Light-emitting diode module encapsulation structure |
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Application publication date: 20100616 |