CN101736329A - Polyimide film activation solution and method for metalizing polyimide film - Google Patents
Polyimide film activation solution and method for metalizing polyimide film Download PDFInfo
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- CN101736329A CN101736329A CN200810217841A CN200810217841A CN101736329A CN 101736329 A CN101736329 A CN 101736329A CN 200810217841 A CN200810217841 A CN 200810217841A CN 200810217841 A CN200810217841 A CN 200810217841A CN 101736329 A CN101736329 A CN 101736329A
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Abstract
The invention discloses polyimide film activation solution and a method for metalizing a polyimide film. The polyimide film activation solution contains metal ions, ammonia and a polyimide film wetting agent. The pH of the polyimide film activation solution is 9-14 and the molar ratio of metal ions to ammonia is 1:4-8. The method for metalizing the polyimide film is characterized by contacting the polyimide film with the polyimide film activation solution according to claim 1; and carrying out heat treatment or reduction treatment on the polyimide film after being contacted with the polyimide film activation solution to obtain the polyimide film with surface being metalized. The preparation technology can be simplified by employing the polyimide film activation solution to metalize the polyimide film, and the metal layer formed on the surface of the polyimide film has good adhesion.
Description
[technical field]
The present invention relates to a kind of polyimide film activation solution and adopt the method for this polyimide film activation solution to the polyimide film surface metalation, especially a kind of this polyimide film activation solution of employing carries out metallized method to Kapton.
[background technology]
Polyimide (PI) film becomes the first-selected base material of high-performance electronic, information industry because of excellent properties such as acidproof, alkaline-resisting, high temperature resistant, that intensity is high, specific inductivity is low, flexibility is good, according to service requirements, usually need carry out metalized to the Kapton surface, so the method for metallising of Kapton also receives much attention.
In the prior art film surface being carried out metallized method is: film surface is carried out alligatoring, activate then, reduction and electroless plating.Wherein activation solution is generally alkalescence, comprising metal ion, pH regulator agent, organic complexing agent.This method need be carried out roughening treatment to film surface, forms coarse surface, is beneficial to the absorption of the complex compound of metal ion and organic complexing agent formation at this uneven surface.And after reduction, can only obtain some metal active centers, also need further carry out electroless plating and just can obtain complete metal level.
[summary of the invention]
The shortcoming that technology is more loaded down with trivial details and adhesive force of metal layer is low when metallizing on the polyimide film surface in order to overcome in the prior art, the invention discloses a kind of polyimide film activation solution and adopt this polyimide film activation solution that metallized method is carried out on the polyimide film surface, can simplify technology by adopting above-mentioned polyimide film activation solution to be metallized in the polyimide film surface, do not need to carry out electroless plating, and the sticking power of polyimide metal film surface metal-layer is good.
Polyimide film activation solution disclosed by the invention comprises metal ion, ammonia and polyimide film wetting agent, and the pH of described polyimide film activation solution is 9-14, and the mol ratio of metal ion and ammonia is 1: 4-8.
The invention also discloses the metallized method of a kind of polyimide film, comprising: the described polyimide film activation solution of polyimide film and claim 1 is contacted; To heat-treat or reduce processing with the polyimide film after the polyimide film activation solution contacts, obtain the polyimide film of surface metalation.
Among the present invention, the polyimide film activation solution is that pH is the strong basicity environment of 9-14, and in this environment, generally, metal ion all can generate insolubles and precipitate.The present inventor finds that when containing ammonia in the above-mentioned strong basicity environment, ammonia can form complex compound with metal ion, avoids metal ion to form precipitation.
Owing in the structure of polyimide imide structure is arranged, hydrolysis easily takes place under alkaline condition, when polyimide film contacted with polyimide film activation solution disclosed by the invention, hydrolysis took place in the polyimide film surface, forms polyamic acid.Because NH
3Stable inadequately with the complex compound that metal ion forms,,, discharge metal ion easily under certain condition as heating.And the compound that polyamic acid can generate with metal ion, its stability is higher relatively.Effect through the polyimide film wetting agent, when the ammonia complex of metal ion contacts with the polyimide film surface, the metal ion that is discharged by ammonia can form more stable compound with the polyamic acid that polyimide through hydrolysis obtains, promptly obtain metallic compound on the polyimide film surface; By reduction the metal ion in the metallic compound is reduced to atoms metal and constantly accumulation then, forms a metal level on the polyimide film surface, the polyamic acid generation cyclization that hydrolysis simultaneously generates forms polyimide again.
Adopt polyimide film activation solution provided by the invention, in the time of behind the polyimide through hydrolysis on polyimide film surface, the polyamic acid that metal ion can be immediately obtains with polyimide through hydrolysis forms more stable compound, can obtain the polyimide film that surface attachment has metal level through reduction then.The present invention combines with polyimide film by metal ion, and after reduction, the metal level that obtains is attached on the polyimide film, do not need to carry out electroless plating, and the sticking power of metal level is good.
[embodiment]
The invention discloses a kind of polyimide film activation solution, comprise metal ion, ammonia and polyimide film wetting agent, the pH of described polyimide film activation solution is 9-14, and the mol ratio of metal ion and ammonia is 1: 4-8.
Among the present invention, described polyimide film activation solution is preferably the aqueous solution, and described metal ion is Cu
2+, Ni
2+, Ag
+, Co
2+In one or more.Described metal ion can add by above-mentioned various metal soluble salt classes, and for example: described solubility salt can be in the vitriol of above-mentioned various metals, villaumite, the nitrate one or more.
Ammonia in the described polyimide film activation solution can be introduced by variety of way, as: with ammonium salt or ammoniacal liquor.Ammonium salt can be for the various salts of ammonia, as (NH
4)
2SO
4, NH
4Cl, NH
4NO
3, when introducing ammonia by the interpolation ammonium salt, ammonium salt must be in the alkaline environment, makes the NH in the ammonium salt
4 +Change into NH
3
In described polyimide film activation solution, the mol ratio of metal ion and ammonia is 1: 4-8 is preferably 1: 5-7.
Among the present invention, when the amount of described metal ion and ammonia satisfied above-mentioned relation, the metal ion in the polyimide film activation solution can better form complex compound with ammonia, as [Cu (NH
3)
4]
2+, under alkaline condition, protect metal ion, make metal ion avoid generating sedimentable matter with the free hydroxide radical, keep the stable of whole polyimide film activation solution system.Avoid above-mentioned metal ion a large amount of precipitations that form in the strong basicity environment, influenced the quality of the metal level of reduction formation, cause can not get complete metal level.
Under the preferable case, concentration of metal ions is 0.03-0.20mol/l in the described polyimide film activation solution, and the concentration of ammonia is 0.12-1.00mol/l.More preferably concentration of metal ions is 0.05-0.08mol/l, and the concentration of ammonia is 0.25-0.60mol/l.
When introducing ammonia, because under alkaline environment, ammonium ion can continuous hydrolysis generate NH by the mode of adding ammonium salt
3So, only need NH in the ammonium salt
4 +Amount in above-mentioned scope, get final product.
When introducing ammonia by interpolation ammoniacal liquor, the ammoniacal liquor that is adopted is chemical field ammoniacal liquor commonly used, and in the present invention, the ammonia in the polyimide film activation solution is meant with amino molecule NH
3The composition that form exists, the concentration of described ammonia is illustrated in NH in the described polyimide film activation solution
3Concentration.When the above-mentioned polyimide film activation solution of preparation, introduce NH by adding ammoniacal liquor
3, general NH in water
3Hydrolysis in various degree takes place in the capital, when in the polyimide film activation solution, adding ammoniacal liquor, and NH
3Hydrolysis degree change, but NH
3The NH that causes of hydrolysis
3Change in concentration little, in the present invention, can ignore, with the NH that contains in the ammoniacal liquor
3Amount of substance be as the criterion.
The polyimide film concentration of wetting agent is 0.5-8g/l in the described polyimide film activation solution, is preferably 1-5g/l.
Described polyimide film wetting agent is one or more in formyl hydrazine, ethylene glycol, ethanol, trolamine, glycerine, sorbyl alcohol, propylene glycol, the polyoxyethylene glycol, be preferably ethylene glycol, described polyimide film concentration of wetting agent is 0.5-8g/l, is preferably 1-5g/l.Described polyimide film wetting agent can be commercially available with crossing, as the ethylene glycol of chemical reagent engineering and technological research development centre, Guangdong Province production.
By in polyimide film activation solution disclosed by the invention, adding the polyimide film wetting agent, reduce the surface tension on polyimide film surface, the polyimide on polyimide film surface can well be soaked into by the polyimide film activation solution, ammonia can better contact with the polyamic acid that hydrolysis obtains with the complex compound that metal ion forms, thereby obtains more stable polyamic acid metallic compound.By the effect of above-mentioned polyimide film wetting agent, surface coarsening need not carried out in the polyimide film surface, has simplified processing step, and the metal level that reduction obtains is complete, and helps improving the sticking power of polyimide film surface metal-layer.
The pH of polyimide film activation solution disclosed in this invention is 9-14, is preferably 10-13.In the present invention, can control the pH value by adding the pH regulator agent, described pH regulator agent is the material that can influence the pH value of solution value known in this field, as sodium hydroxide, potassium hydroxide, its addition are the pH value of described polyimide film activation solution to be fallen in the above-mentioned scope get final product.Can before adding the pH regulator agent, calculate the amount of the required pH regulator agent of corresponding pH value.
When polyimide film activation solution disclosed by the invention is introduced ammonia by adding ammoniacal liquor, the pH value of described polyimide film activation solution can be controlled by adding the pH regulator agent, also can control by the addition of control ammoniacal liquor itself, under the preferable case, regulate the pH value and do not add the pH regulator agent in addition by the addition of control ammoniacal liquor.If the pH value that adopts ammoniacal liquor to regulate the polyimide film activation solution, when the addition of ammoniacal liquor made the concentration of ammonia fall in its scope, the pH value of prepared polyimide film activation solution was promptly in above-mentioned scope.Described pH value can record by means commonly known in the art, and (the SevenEasy pH meter of plum Teller-Tuo benefit production-S20) direct test obtains as adopting pH meter.
The preparation method of described polyimide film activation solution is this area method commonly used, as: when preparing 1 liter of this polyimide film activation solution, ammoniacal liquor and polyimide film wetting agent in the needed above-mentioned scope can be joined in the deionized water, under agitation condition, slowly add metal-salt then, be settled to 1 liter then and get final product.When introducing ammonia by the interpolation ammonium salt, can calculate the amount of required ammonium salt and pH regulator agent earlier, earlier pH regulator agent, ammonium salt are joined in the deionized water then, under agitation condition, slowly add metal-salt then, be settled to 1 liter at last and get final product.The polyimide film wetting agent can add in each stage, under the preferable case, added described polyimide film wetting agent again after other components interpolations finish.Wherein, the mode that adds metal-salt can also can be dissolved in metal-salt earlier in a certain amount of deionized water and form solution for directly adding metal salt solid, and the form with solution adds then.
The invention also discloses the metallized method of a kind of polyimide film, comprising: the described polyimide film activation solution of polyimide film and claim 1 is contacted; To heat-treat or reduce processing with the polyimide film after the polyimide film activation solution contacts, obtain the polyimide film of surface metalation.
Described thermal treatment is to contact with reducing solution at the 250-320 ℃ of following 20-60min of maintenance or with modified polyimide film with the polyimide film after the polyimide film activation solution contacts, and contains reducing substance in the described reducing solution.
As known to those skilled in the art, when described metal ion is silver ions or chromium ion, adopt thermal treatment, when metal ion is cupric ion or nickel ion, can adopt with reducing solution to contact.
Polyimide film of the present invention is this area polyimide film commonly used, can be commercially available, as the Kapton-H type polyimide film of E.I.Du Pont Company's production.
The polyimide film activation solution that is adopted in aforesaid method is above-mentioned disclosed polyimide film activation solution, and the composition of polyimide film activation solution and compound method do not repeat them here as previously mentioned.
The method that described polyimide film contacts with the polyimide film activation solution is: under 30-80 ℃, polyimide film is immersed 10-180min in the described polyimide film activation solution.
Owing to adopt polyimide film activation solution disclosed by the invention, when described polyimide film contacted with the polyimide film activation solution, polyimide film was under above-mentioned pH condition, and the polyimide generation hydrolysis on surface forms polyamic acid.Because NH
3The stability constant of the complex compound that forms with above-mentioned metal ion is not high enough, under certain conditions, as heating, discharges metal ion easily.And polyamic acid is relative higher with the compound stability that metal ion forms, so metal ion in the polyimide film activation solution and the polyamic acid behind the polyimide through hydrolysis form compound, obtain the compound of polyamic acid and metal ion this moment on the polyimide film surface, by reduction the metal ion in this compound is reduced to atoms metal and constantly accumulation then, form a metal level on the polyimide film surface, the polyamic acid generation cyclization of hydrolysis simultaneously forms polyimide again.
The concentration of reducing substance can change in a big way in the described reducing solution, and under the preferable case, the concentration of described reducing substance is 0.05-1.00mol/l.
The method that described modified polyimide film contacts with reducing solution is: under 20-100 ℃, polyimide film is immersed 10-180min in the described reducing solution.
Described reducing substance contains one or more in borine, SODIUM PHOSPHATE, MONOBASIC, the oxoethanoic acid.Described borine is this area reductibility borine commonly used, and under the preferable case, described borine can be one or more in sodium borohydride, POTASSIUM BOROHYDRIDE, dimethylin borane, the diethylamine borane.
Described reducing solution can be prepared by ordinary method, as, a certain amount of reducing substance is added in the deionized water, stirring gets final product.The addition of described reducing substance only need make its concentration get final product in above-mentioned scope.
When described modified polyimide film is contacted with reducing solution, the metal ion that is present in the polyimide film surface with compound form is reduced to atoms metal and is attached to the polyimide film surface, the atoms metal that reduction obtains is constantly accumulated, form a metal level on the polyimide film surface, the polyimide generation cyclization of hydrolysis takes place simultaneously, polyamic acid regenerates polyimide, thereby form a metal level on polyimide film surface, obtaining surface attachment has modified polyimide film with metal level.
The metallized method of polyimide film disclosed by the invention can also be included in carries out oil removing to polyimide film before described polyimide film contacts with the polyimide film activation solution.The method of described oil removing can be method well known in the art, as: polyimide film is immersed in the dehydrated alcohol, under ultrasonic environment, clean 10min, use deionized water rinsing 3min then, polyimide film after will washing again is immersed in the inorganic alkaline degreasing fluid, under ultrasonic environment, clean 10min, get final product with deionized water rinsing 3min at last.Described under ultrasonic environment, clean to analyse in the Ultrasonic Cleaners that excusing from death Instr Ltd. produces in the Shanghai life carry out.Described inorganic alkaline degreasing fluid is a degreasing fluid well known in the art, as contains the alkaline degreasing liquid of 20-30g/l yellow soda ash, 10-30g/l sodium phosphate, 10-20g/l sodium hydroxide, 2-5ml/l tensio-active agent (sodium laurylsulfonate, sodium lauryl sulphate or n-octyl sodium sulfate).
The metallized method of polyimide film disclosed by the invention can also be included in described polyimide film and contact the back described modified polyimide film of deionized water rinsing with the polyimide film activation solution, and contacts the back described polyimide metal film of deionized water rinsing with reducing solution at described modified polyimide film.
According to the present invention; modified polyimide film contacts with reducing solution; obtain the polyimide metal film that makes to be immersed 3-1800s in the protection liquid behind the polyimide metal film; described protection liquid is protection liquid well known in the art, as the EZ202 copper protective agent of the E Zhen of Shenzhen Science and Technology Ltd. production.Use deionized water rinsing 3min then, dry by the fire 30-120min down at 50-150 ℃ and get final product.
According to method disclosed by the invention, in the process of preparation polyimide metal film, by adopting polyimide film activation solution disclosed by the invention, only need through overactivation and two steps of reduction, simplified production technique, and do not need pyroreaction, the sticking power of the polyimide metal film surface metal-layer that makes also is improved.
The present invention is further illustrated below by embodiment.
Embodiment 1
Present embodiment is used to illustrate polyimide film activation solution disclosed by the invention and the metallized method of polyimide film.
The Kapton-H type that adopts E.I.Du Pont Company to produce, specification is that the polyimide film of 50 * 50 * 0.025mm experimentizes as sample.
1, the preparation of polyimide film activation solution
20g ammonium nitrate (being 0.25mol ammonium nitrate) is dissolved in the 750ml deionized water, slowly add 12g sodium hydroxide (being 0.30mol sodium hydroxide) then, add 1g ethylene glycol (production of chemical reagent engineering and technological research development centre, Guangdong Province) again, under stirring condition, slowly add 9.2g nickelous nitrate (being the 0.05mol nickelous nitrate) at last, stir, be settled to 1000ml then.At this moment, the mol ratio of nickel ion and ammonia 1: 5, the pH value of polyimide film activation solution is 12.8.
2, chemical modification
Under 60 ℃, will immerse 20min in the described polyimide film activation solution through the polyimide film of oil removal treatment.Take out then, use deionized water rinsing 3min again.Obtain modified polyimide film.
3, reduction
0.10mol dimethylin borane is dissolved in the 1000mL deionized water, and stirring promptly gets reducing solution.
Under 50 ℃, modified polyimide film is immersed in 30min in the above-mentioned reducing solution.Take out then, use deionized water rinsing 3min.Form complete metal level on the polyimide film surface, promptly obtain polyimide metal film A1.
Embodiment 2
Present embodiment is used to illustrate polyimide film activation solution disclosed by the invention and the metallized method of polyimide film.
Polyimide film that is adopted and the method for preparing the polyimide metal film are with embodiment 1, and different is:
1, the preparation of polyimide film activation solution
28g ammonium nitrate (being 0.35mol ammonium nitrate) is dissolved in the 750ml deionized water, slowly add 16g sodium hydroxide (being 0.40mol sodium hydroxide) then, add 3g ethanol (production of chemical reagent engineering and technological research development centre, Guangdong Province) again, under stirring condition, slowly add 12.81g nickelous nitrate (being the 0.07mol nickelous nitrate) at last, stir, be settled to 1000ml then.At this moment, the mol ratio of nickel ion and ammonia 1: 5, the pH value that records the polyimide film activation solution is 13.
Before employing polyimide film activation solution carries out chemical modification, comprise also polyimide film carried out oil removing that concrete grammar is as follows:
2, oil removing
Above-mentioned polyimide film is immersed in the dehydrated alcohol, clean 10min under ultrasonic environment, use deionized water rinsing 3min then, the polyimide film after will washing again is immersed in the inorganic alkaline degreasing fluid, under ultrasonic environment, clean 10min, get final product with deionized water rinsing 3min at last.
3, chemical modification
Under 50 ℃, will immerse 20min in the described polyimide film activation solution through the polyimide film of oil removal treatment.Take out then, use deionized water rinsing 3min again.Obtain modified polyimide film A20.
4, reduction
Reduction obtains the method for metal level with embodiment 1.Form complete metal level on the polyimide film surface, obtain polyimide metal film A2.
At last, comprise that also the polyimide metal film A2 to obtaining protects, concrete grammar is as follows:
5, protection
Polyimide metal film A2 is immersed 3min in the protection liquid (the EZ202 copper protective agent that the E Zhen of Shenzhen Science and Technology Ltd. produces), and baking 30min gets final product under 100 ℃.
Embodiment 3
Present embodiment is used to illustrate polyimide film activation solution disclosed by the invention and the metallized method of polyimide film.
Polyimide film that is adopted and the method for preparing the polyimide metal film are with embodiment 2, and different is:
1, the preparation of polyimide film activation solution
With 28.3g concentration 30% ammoniacal liquor (NH
3Amount be 0.5mol) be dissolved in the 700ml deionized water, slowly add 5g ethylene glycol (production of chemical reagent engineering and technological research development centre, Guangdong Province) then, under stirring condition, slowly add 16g copper sulfate (being 0.1mol copper sulfate) at last, stir, be settled to 1000ml then.At this moment, the mol ratio of cupric ion and ammonia 1: 5, the pH value of polyimide film activation solution is 11.3.
Form complete metal level on the polyimide film surface, obtain polyimide metal film A3.
Embodiment 4
Present embodiment is used to illustrate polyimide film activation solution disclosed by the invention and the metallized method of polyimide film.
Polyimide film that is adopted and the method for preparing the polyimide metal film are with embodiment 3, and different is: replace copper sulfate with 17g Silver Nitrate (being the 0.1mol Silver Nitrate).Obtain modified polyimide film A40.
With the modified polyimide film A40 for preparing at 300 ℃ of thermal treatment 40min.
Form complete metal level on the polyimide film surface, obtain polyimide metal film A4.
Comparative Examples 1
This Comparative Examples is used to illustrate polyimide film activation solution of the prior art and the metallized method of polyimide film.
Polyimide film that is adopted and the method for preparing the polyimide metal film are with embodiment 3, and different is: the polyimide film activation solution consists of: trolamine 0.1mol/l, and copper sulfate 0.02mol/l, sodium hydroxide 16g, pH are 13.
Obtain polyimide metal film D1.
Comparative Examples 2
This Comparative Examples is used to illustrate polyimide film activation solution disclosed by the invention and the metallized method of polyimide film.
Polyimide film that is adopted and the method for preparing the polyimide metal film are with embodiment 3, and different is: do not contain ethylene glycol in the polyimide film activation solution.
Obtain polyimide metal film D2.
Comparative Examples 3
This Comparative Examples is used to illustrate polyimide film activation solution disclosed by the invention and the metallized method of polyimide film.
Polyimide film that is adopted and the method for preparing the polyimide metal film are with embodiment 3, and different is: containing 5.7g concentration in the polyimide film activation solution and be 30% ammoniacal liquor (is NH
3Amount be 0.1mol), 8g copper sulfate (being 0.05mol copper sulfate), at this moment, the mol ratio of cupric ion and ammonia 1: 2.The pH value that records the polyimide film activation solution is 9.8.
Obtain polyimide metal film D3.
The sticking power test
On the metal level of above-mentioned polyimide metal film A1-A4 and D1-D3, draw 100 1 millimeter * 1 millimeter square lattice with drawing the lattice device.The model of producing with Minnesota Mining and Manufacturing Company is 600 smooth being bonded on the grid of scotch tape, does not stay a space, uncovers with 60 ° of angles of the fastest speed then, and whether observe cut edge has metal to come off.As be 5B without any coming off, the amount of coming off is 4B between 0-5%, is 3B between the 5-15%, is 2B between the 15-35%, is 1B between the 35-65%, is 0B more than 65%.
Test result sees Table 1.
Table 1
| Sample | ??A1 | ??A2 | ??A3 | ??A4 | ??D1 | ??D2 | ??D3 |
| Sticking power | ??4B | ??4B | ??4B | ??5B | No metal level | No metal level | No metal level |
From the test result of table 1 as can be seen, adopt polyimide film activation solution disclosed by the invention to show and form complete metal level, and the sticking power of metal level and polyimide film is good at polyimide film.On the other hand, than prior art,, under the prerequisite that guarantees adhesive force of metal layer, manufacture craft is more simplified owing to adopt polyimide film activation solution disclosed by the invention.
Claims (10)
1. a polyimide film activation solution contains metal ion, ammonia and polyimide film wetting agent, and the pH of described polyimide film activation solution is 9-14, the mol ratio 1 of metal ion and ammonia: 4-8.
2. polyimide film activation solution according to claim 1 is characterized in that: concentration of metal ions is 0.03-0.20mol/l in the described polyimide film activation solution, and the concentration of described ammonia is 0.12-1.00mol/l.
3. polyimide film activation solution according to claim 1 is characterized in that: the metal ion in the described polyimide film activation solution is selected from Cu
2+, Ni
2+, Ag
+, Co
2+
4. polyimide film activation solution according to claim 1 is characterized in that: the polyimide film concentration of wetting agent is 0.5-8g/l.
5. polyimide film activation solution according to claim 1 is characterized in that, described polyimide film wetting agent is one or more in formyl hydrazine, ethylene glycol, ethanol, trolamine, glycerine, sorbyl alcohol, propylene glycol, the polyoxyethylene glycol.
6. the metallized method of polyimide film comprises: the described polyimide film activation solution of polyimide film and claim 1 is contacted; To heat-treat or reduce processing with the polyimide film after the polyimide film activation solution contacts, obtain the polyimide film of surface metalation.
7. method according to claim 6, it is characterized in that, described thermal treatment is to contact with reducing solution at the 250-320 ℃ of following 20-60min of maintenance or with modified polyimide film with the polyimide film after the polyimide film activation solution contacts, and contains reducing substance in the described reducing solution.
8. method according to claim 7 is characterized in that described reducing substance contains one or more in borine, SODIUM PHOSPHATE, MONOBASIC, the oxoethanoic acid; The concentration of reducing substance is 0.05-1.00mol/l.
9. according to any described method in the claim 6,7 or 8, it is characterized in that, the method that described polyimide film contacts with the polyimide film activation solution is: under 30-80 ℃, polyimide film is immersed 10-180min in the described polyimide film activation solution.
10. according to claim 7 or 8 described methods, it is characterized in that the method that described modified polyimide film contacts with reducing solution is: under 20-100 ℃, polyimide film is immersed 10-180min in the described reducing solution.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747343A (en) * | 2012-07-24 | 2012-10-24 | 深圳市兴经纬科技开发有限公司 | Treating fluid for surface roughness of polyimide and preparation method thereof |
| CN103052481A (en) * | 2010-08-09 | 2013-04-17 | 新日铁住金化学株式会社 | Process for producing metal nanoparticle composite |
| CN111542647A (en) * | 2017-12-28 | 2020-08-14 | 石原化学株式会社 | Method for forming metal film on polyimide resin |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3736170A (en) * | 1971-06-28 | 1973-05-29 | Ibm | Process for improved adhesion of electroless copper to a polyimide surface |
| NO304746B1 (en) * | 1989-05-04 | 1999-02-08 | Ad Tech Holdings Ltd | Object that resists microbiological growth consisting of a non-conductive substrate coated with a funnel coated with a method of depositing |
| CN1858301A (en) * | 2006-06-08 | 2006-11-08 | 上海交通大学 | Method for chemical plating polyimide film surface |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103052481A (en) * | 2010-08-09 | 2013-04-17 | 新日铁住金化学株式会社 | Process for producing metal nanoparticle composite |
| CN103052481B (en) * | 2010-08-09 | 2015-06-17 | 新日铁住金化学株式会社 | Process for producing metal nanoparticle composite |
| CN105017562A (en) * | 2010-08-09 | 2015-11-04 | 新日铁住金化学株式会社 | Process for producing metal nanoparticle composite |
| CN102747343A (en) * | 2012-07-24 | 2012-10-24 | 深圳市兴经纬科技开发有限公司 | Treating fluid for surface roughness of polyimide and preparation method thereof |
| CN111542647A (en) * | 2017-12-28 | 2020-08-14 | 石原化学株式会社 | Method for forming metal film on polyimide resin |
| CN111542647B (en) * | 2017-12-28 | 2022-05-27 | 石原化学株式会社 | Method for forming metal film on polyimide resin |
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