CN101831645B - Cemented carbide steelwork surface electroless copper plating method - Google Patents
Cemented carbide steelwork surface electroless copper plating method Download PDFInfo
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- CN101831645B CN101831645B CN201010185979A CN201010185979A CN101831645B CN 101831645 B CN101831645 B CN 101831645B CN 201010185979 A CN201010185979 A CN 201010185979A CN 201010185979 A CN201010185979 A CN 201010185979A CN 101831645 B CN101831645 B CN 101831645B
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- copper plating
- steelwork
- electroless copper
- cemented carbide
- treatment
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Abstract
The invention discloses a cemented carbide steelwork surface electroless copper plating method comprising a degreasing process which is an alkali wash process, an activating process which is a scouring activating process and a copper plating process which applies electroless copper plating to a copper plating bath. The invention has the advantages of simple and practicable method, lower cost, even copper plating layer, strong adhesion, and the like.
Description
Technical field
The present invention relates to a kind of cemented carbide steelwork surface electroless copper plating method, belong to the metal material surface treatment technology.
Background technology
Hard alloy steel has premium propertiess, particularly its high firmness and wear resistance such as hardness height, wear-resisting, intensity and toughness is better and heat-resisting, corrosion-resistant, is widely used in fields such as cutter, measurer, mould and digging instrument.But hard alloy steel is to be staple with the carbide of high firmness refractory metal (for example WC, TiC) micron powder, is sticker with cobalt (Co), nickel (Ni) etc., because its surface wettability is relatively poor, and has limited it in some Application for Field.Ordinary steel hardness and wear resistance do not reach certain request for utilization in some fields, though hard alloy steel has reached request for utilization, are difficult to be used with other metalwork in some fields.
Summary of the invention
It is simple that the present invention aims to provide a kind of method, with low cost, and the uniform cemented carbide steelwork surface electroless copper plating method of copper plate is with the application performance of effective raising mechanical engineering structure.
The present invention realizes that the technological line of its purpose is; At first skimming treatment is carried out on wimet steelwork surface, adopted activation solution to carry out activation treatment then, save intermediate process steps such as traditional copper-plated alligatoring, sensitization; In the copper plating bath of certain temperature, handle certain hour then; Clean, after the drier, wrap up with pure water at last, in case hard alloy steel surface oxidation and make finished product with metal foil paper.
Based on above-mentioned technological line, the present invention realizes that the technical scheme of its purpose is:
A kind of cemented carbide steelwork surface electroless copper plating method, its process step comprise that the skimming treatment of wimet steelwork surface degreasing, surface activation process, Electroless copper are handled and plating back cleaning-drying is handled; Its innovative point is:
Said surface degreasing skimming treatment is the NaOH 15～40g/L that adopts unit weight content, Na
2CO
3The alkaline first liquid that 5～30g/L and OP emulsifying agent 3～8ml are mixed with is implemented alkali cleaning oil removing, skimming treatment to wimet steelwork surface;
Said surface activation process is the H that adopts weight percentage
2SO
43～15%, the acidic activated liquid that HCl1～20% is mixed with is handled the surface of the wimet steelwork after alkali cleaning enforcement acid-wash activation;
Said Electroless copper is handled, and at first prepares copper plating bath, and the weight content of the component of said copper plating bath and each component unit volume is: CuSO
43～20g/L, EDTA Disodium 5～30g/L, Seignette salt 2～10g/L, NaOH 4～15g/L, formaldehyde 7～25g/L, 1～5 (0.05～0.2mL) in yellow prussiate of potash 0.1～3g/L and ydrogen peroxide 50; And then will insert in the copper plating bath that keeps technological temperature through the wimet steelwork of surface degreasing degreasing activation treatment, adopt common chemical plating method, implement copper plating treatment.
Can be understood by above given technical scheme, method of the present invention is simple; Basic non-environmental-pollution; Copper plating bath can be reused, low production cost; Since the copper facing previous crops processing of alkali cleaning oil removing degreasing and acid-wash activation; The alligatoring that has not only saved traditional copper electroplating method, intermediate process steps such as sensitization have effectively improved productivity, pressure drop production cost, and wimet steelwork surface cleanliness is high; The copper plate strong adhesion; And the thickness of coating good uniformity has improved the quality of finished product, thereby has realized the object of the invention.
In technique scheme, the present invention advocates that also the time of said alkali cleaning oil removing, skimming treatment is in 5～15min scope; The time that said acid-wash activation is handled is in 3～13min scope.This technical scheme is that the present invention selects through TE, and it is good to have oil removing degreasing and an activation effect, and the higher relatively characteristics of productivity.
In technique scheme, the present invention advocates that also the technological temperature of said copper plating bath is in 15～45 ℃ of scopes, and its soaking time is in 0～5min scope.That is to say that the present invention can implement copper plating treatment at normal temperatures, and saved energy consumption.
In technique scheme, said plating back cleaning-drying is handled, and is with the wimet steelwork of accomplishing copper plating treatment, in copper plating bath, takes out, and immediately with zero(ppm) water or washed with de-ionized water, after blowing is dry, wraps with metal foil paper again.Said metal foil paper the present invention advocates to use tinfoil.
In technique scheme, the present invention advocates that the said enforcement copper plating treatment time is in 10～40min scope.This technical scheme is the component concentration at said copper plating bath, in the copper plating treatment time of satisfying under its content condition that provides.In actual production process, should carry out real-time quantitative analysis to the component of copper plating bath, and, add the component of not enough component concentration in real time in the copper plating bath, make it to reach the technology content requirement.
After technique scheme was able to implement, characteristics such as the method that the present invention had is simple, and production cost is relatively low, and copper plate is even were conspicuous.
Description of drawings
Fig. 1 is a flow process letter meaning diagrammatic sketch of the present invention.Can be understood by accompanying drawing 1, wimet steelwork surface degreasing, degreasing and activation treatment can be carried out with the preparation chemical bronze plating liquid simultaneously.
Embodiment
Ginseng is read accompanying drawing 1, and following examples are provided.
A kind of cemented carbide steelwork surface electroless copper plating method, carry out according to following steps successively:
A, employing 30g/LNaOH, 20g/LNa
2CO
3, 1～2 alkaline wash that the OP-10 emulsifying agent is mixed with is implemented oil removing, degreasing 5～15min to the wimet steelwork;
B, to adopt weight percentage again be H
2SO
46.5%, the acid-wash activation liquid of HCL 8% preparation is implemented activation treatment 10min to the wimet steelwork through the oil removing degreasing;
C, press 5g CuSO
45H
2O, 10g EDTA Disodium, 5g Seignette salt; 1L deionized water proportioning is processed intermediate solution, and stirs, and gets an amount of (for example 1g) yellow prussiate of potash again; An amount of ydrogen peroxide 50 (for example 0.2ml is promptly 4), 10g sodium hydroxide; 10ml formaldehyde is put into intermediate solution, and stirs, and makes wimet product Electroless copper liquid;
D, will deposit the said copper plating bath for preparing and insert in the container, water proof is heated to 15～45 ℃ in warm water bath, is incubated 0～5min again; If room temperature in 15～45 ℃ of scopes of said temperature the time, can heat;
E, at last the wimet steelwork is put into said copper plating bath, adopt common chemical plating method, implement copper plating treatment 10～40min, treat that the back is taken out use deionized water rinsing, after the drier, wrap up subsequent use with tinfoil.
Can be understood by above embodiment, of the present invention method is simple, the environmental protection low-carbon (LC), and production efficiency is high, can implement suitability for industrialized production, and its effect is very gratifying.
Claims (5)
1. cemented carbide steelwork surface electroless copper plating method, its process step comprise that the skimming treatment of wimet steelwork surface degreasing, surface activation process, Electroless copper are handled and plating back cleaning-drying is handled; It is characterized in that:
Said surface degreasing skimming treatment is the NaOH 15～40g/L that adopts unit weight content, Na
2CO
3The alkaline rinse that 5～30g/L and OP emulsifying agent 3～8ml/L are mixed with is implemented alkali cleaning oil removing, skimming treatment to wimet steelwork surface;
Said surface activation process is the H that adopts weight percentage
2SO
43～15%, the acidic activated liquid that HCl1～20% is mixed with is handled the surface of the wimet steelwork after alkali cleaning enforcement acid-wash activation;
Said Electroless copper is handled, and at first prepares copper plating bath, and the weight content of the component of said copper plating bath and each component unit volume is: CuSO
43～20g/L, EDTA Disodium 5～30g/L, Seignette salt 2～10g/L, NaOH 4～15g/L, formaldehyde 7～25g/L, yellow prussiate of potash 0.1～3g/L and 1～5/L of ydrogen peroxide 50; And then will insert in the copper plating bath that keeps technological temperature through the wimet steelwork of surface degreasing degreasing activation treatment, adopt common chemical plating method, implement copper plating treatment.
2. cemented carbide steelwork surface electroless copper plating method according to claim 1, the time of said alkali cleaning oil removing, skimming treatment is in 5～15min scope; The time that said acid-wash activation is handled is in 3～13min scope.
3. cemented carbide steelwork surface electroless copper plating method according to claim 1 is characterized in that, the technological temperature of said copper plating bath is in 15～45 ℃ of scopes, and its soaking time is in 0～5min scope.
4. cemented carbide steelwork surface electroless copper plating method according to claim 1; It is characterized in that; Said plating back cleaning-drying is handled, and is with the wimet steelwork of accomplishing copper plating treatment, in copper plating bath, takes out; With zero(ppm) water or washed with de-ionized water, after blowing is dry, wrap again immediately with metal foil paper.
5. according to the said cemented carbide steelwork surface electroless copper plating method of claim 1, it is characterized in that the said enforcement copper plating treatment time is in 10～40min scope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010185979A CN101831645B (en) | 2010-05-28 | 2010-05-28 | Cemented carbide steelwork surface electroless copper plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010185979A CN101831645B (en) | 2010-05-28 | 2010-05-28 | Cemented carbide steelwork surface electroless copper plating method |
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| Publication Number | Publication Date |
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| CN101831645A CN101831645A (en) | 2010-09-15 |
| CN101831645B true CN101831645B (en) | 2012-10-17 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102618857A (en) * | 2012-04-06 | 2012-08-01 | 柳州市红日焊丝制造有限公司 | Electroless copper plating technique for welding wire |
| CN107020793B (en) * | 2017-03-30 | 2019-03-22 | 绍兴青运激光制版有限公司 | A kind of printing preparation process of roller |
| CN107699871B (en) * | 2017-10-17 | 2018-08-14 | 南通赛可特电子有限公司 | A kind of technique preparing copper plate in silicon substrate surface using chemical copper plating solution |
| CN111020676A (en) * | 2019-12-25 | 2020-04-17 | 长沙新材料产业研究院有限公司 | Method for processing diamond coating hard alloy and method for processing hard alloy cutter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521513A (en) * | 1978-07-31 | 1980-02-15 | Sadaji Nagabori | Immersion plating method of lead or lead alloy on casting |
| GB0031806D0 (en) * | 2000-12-29 | 2001-02-07 | Chemetall Plc | Electroless copper plating of ferrous metal substrates |
| CN100451168C (en) * | 2005-11-25 | 2009-01-14 | 北京林业大学 | Composition for chemical Cu plating onto timber surface and the chemical Cu plating process |
| CN101698936B (en) * | 2009-11-11 | 2011-08-17 | 陕西师范大学 | Chemical copper plating solution of sodium hypophosphite disodium edetate system |
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