CN101733993B - Manufacturing method of lead-free copper-clad plate - Google Patents
Manufacturing method of lead-free copper-clad plate Download PDFInfo
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- CN101733993B CN101733993B CN 200810219027 CN200810219027A CN101733993B CN 101733993 B CN101733993 B CN 101733993B CN 200810219027 CN200810219027 CN 200810219027 CN 200810219027 A CN200810219027 A CN 200810219027A CN 101733993 B CN101733993 B CN 101733993B
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Abstract
The invention discloses a manufacturing method of a lead-free copper-clad plate of which a reinforcing plate has excellent heat resistance and adhesive force, which comprises: adding 195.096 parts of propylene glycol methyl ether by weight, 451.160 parts of cyclohexanone by weight, 731.610 parts of epoxy resin by weight, 3.219 parts of dicyandiamide by weight, 109.742 parts of tetrabromobisphemol A by weight, 512.737 parts of 627 resin by weight, 731.610 parts of epoxy resin by weight, 83.526 parts of xanthan gum by weight, 682.836 parts of high-bromine epoxy resin by weight, 286.547 parts of silicon dioxide by weight, 210.978 parts of aluminum hydroxide by weight, 0.360 parts of 2-methylimidazole by weight and 0.610 parts of coupling agent to a dissolving tank according to a set order to prepare an adhesive solution, immersing glass fiber cloth in the adhesive solution, drying to manufacture the reinforcing pate, and thermally pressing the reinforcing plate and a copper foil layer to manufacture the lead-free copper-clad plate.
Description
Technical field
The present invention relates to a kind of manufacturing method of lead-free copper-clad plate, it belongs to the circuit board plate material technical field.
Background technology
Existing lead-free copper-clad plate, it is after glass cloth be impregnated in binding agent such as epoxy resin, epoxy resin be converted into semi-cured state with heating when forming the semi-solid preparation layer and dry impregnated cloth in order to remove molten Ji, press copper foil layer and it carried out autoclave moulding on the upper strata of one side at least of described semi-solid preparation layer to make lead-free copper-clad plate.But known this lead-free copper-clad plate heat dispersion is poor, when the heat that sends when the various electronic devices and components on the circuit board can not in time be distributed, the circuit board temperature sharply raises, being directed at copper foil layer separates with enhancement Layer, along with great power LED is universal day by day as lighting device, the enhancement Layer of lead-free copper-clad plate is being further improved aspect hear resistance and the cohesive.
Summary of the invention
The purpose of this invention is to provide a kind of manufacturing method of lead-free copper-clad plate, prepared lead-free copper-clad plate has good hear resistance and cohesive.
The technical solution adopted in the present invention is such: a kind of manufacturing method of lead-free copper-clad plate comprises the steps:
1), the propylene glycol monomethyl ether of 195.096 weight portions, cyclohexanone and 731.610 parts by weight of epoxy resin of 451.160 weight portions are joined in the dissolving tank;
2), the dicyandiamide of 3.219 weight portions is joined dissolving tank and be stirred to dissolving fully;
3), join the tetrabromobisphenol A of 109.742 weight portions in the dissolving tank in batches and continuous the stirring until dissolving fully;
4), the aluminium hydroxide of the silica of the high bromine epoxy resin of the yellow glue of 627 resins of 512.737 weight portions, 731.610 parts by weight of epoxy resin, 83.526 weight portions, 682.836 weight portions, 286.547 weight portions and 210.948 weight portions is joined in the dissolving tank successively and high-speed stirred 70～120 minutes;
5), join in the dissolving tank high-speed stirred 60 minutes after the propylene glycol monomethyl ether dissolving of glyoxal ethyline with meltage with 0.360 weight portion;
6), the coupling agent that adds 0.610 weight portion is to dissolving tank and be stirred to mix and leave standstill slaking 8～24h;
7), glass cloth be impregnated in the glue that abovementioned steps prepares then to squeeze through the plastic squeeze roller and go unnecessary glue to enter drying baker again to dry to remove solvent;
8), stack copper foil layer with through the glass layer of cloth of impregnation oven dry and to put, and be placed on and carry out the compound lead-free copper-clad plate that makes of hot pressing in the hydraulic press.
By adopting the aforementioned techniques scheme, the invention has the beneficial effects as follows: its enhancement Layer of prepared lead-free copper-clad plate is owing to adopt special glue prescription, enhancement Layer is guaranteeing under the constant prerequisite of insulating properties, the heat resistance of lead-free copper-clad plate is improved greatly, and the bonding force of copper foil layer and enhancement Layer improves greatly simultaneously.
The specific embodiment
Lead-free copper-clad plate is the baseplate material of making printed circuit board (PCB), and it supports the various components and parts except being used as, and can realize being electrically connected or electric insulation between them.Embodiment discloses a kind of manufacturing method of lead-free copper-clad plate, and it comprises the steps:
1), the propylene glycol monomethyl ether of 195.096KG, the cyclohexanone of 451.160KG and the epoxy resin of 731.610KG are joined in the dissolving tank;
2), the dicyandiamide of 3.219KG is joined dissolving tank and stir 1 hour to dissolving fully;
3), the speed that added 50KG in 15 minutes by every interval join the tetrabromobisphenol A of 109.742KG in the dissolving tank in batches and stir about 1 hour until dissolving fully;
4), the Changchun of the all-in-one epoxy resin that the secondary company of the connection of 627 resins of 512.737KG, 731.610KG is produced, the 83.526KG aluminium hydroxide that produces the silica of the high bromine epoxy resin of yellow glue, 682.836KG, 286.547KG and 210.948KG joins in the dissolving tank and high-speed stirred 90 minutes successively;
5), join in the dissolving tank high-speed stirred 60 minutes after the propylene glycol monomethyl ether dissolving of glyoxal ethyline with meltage with 0.360KG;
6), the coupling agent that adds 0.610KG is to dissolving tank and be stirred to mix and leave standstill slaking 8～24h;
7), the glue after the slaking is added on the cement dipping machine, the fine cloth of glass be impregnated in behind this glue to squeeze through the plastic squeeze roller again go unnecessary glue to enter drying baker to dry to remove solvent, then dried impregnation material (being enhancement Layer) is sheared and checked, remove leftover pieces and defective goods;
8), stack copper foil layer with through the glass layer of cloth of impregnation oven dry and put, put into and be provided with mould release film or have in the middle of two corrosion resistant plates of releasing agent, lamination is put into together with steel plate that to carry out hot pressing in the hydraulic press compound, at last prepared lead-free copper-clad plate is carried out cutting by setting size, by pad one deck low sulfur content barrier paper between per two two-sided metal clad boards, put in the polyethylene plastic bag then or wrap moistureproof paper and finish packing.
Claims (1)
1. a manufacturing method of lead-free copper-clad plate is characterized in that comprising the steps:
1), the propylene glycol monomethyl ether of 195.096 weight portions, cyclohexanone and 731.610 parts by weight of epoxy resin of 451.160 weight portions are joined in the dissolving tank;
2), the dicyandiamide of 3.219 weight portions is joined dissolving tank and be stirred to dissolving fully;
3), join the tetrabromobisphenol A of 109.742 weight portions in the dissolving tank in batches and continuous the stirring until dissolving fully;
4), the aluminium hydroxide of the silica of the high bromine epoxy resin of the yellow glue of 627 resins of 512.737 weight portions, 731.610 parts by weight of epoxy resin, 83.526 weight portions, 682.836 weight portions, 286.547 weight portions and 210.948 weight portions is joined in the dissolving tank successively and high-speed stirred 70～120 minutes;
5), join in the dissolving tank high-speed stirred 60 minutes after the propylene glycol monomethyl ether dissolving of glyoxal ethyline with meltage with 0.360 weight portion;
6), the coupling agent that adds 0.610 weight portion is to dissolving tank and be stirred to mix and leave standstill slaking 8～24h;
7), glass cloth be impregnated in the glue that abovementioned steps prepares then to squeeze through the plastic squeeze roller and go unnecessary glue to enter drying baker again to dry to remove solvent;
8), stack copper foil layer with through the glass layer of cloth of impregnation oven dry and to put, and be placed on and carry out the compound lead-free copper-clad plate that makes of hot pressing in the hydraulic press.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810219027 CN101733993B (en) | 2008-11-07 | 2008-11-07 | Manufacturing method of lead-free copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810219027 CN101733993B (en) | 2008-11-07 | 2008-11-07 | Manufacturing method of lead-free copper-clad plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101733993A CN101733993A (en) | 2010-06-16 |
| CN101733993B true CN101733993B (en) | 2013-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200810219027 Active CN101733993B (en) | 2008-11-07 | 2008-11-07 | Manufacturing method of lead-free copper-clad plate |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
| CN101157077A (en) * | 2007-09-18 | 2008-04-09 | 湖北省化学研究院 | A preparation method of gum-free flexible copper-coating plate |
| CN101225276A (en) * | 2008-01-18 | 2008-07-23 | 义乌市先通电子材料有限公司 | Method for preparing copper clad laminate with high glass transition temperature |
-
2008
- 2008-11-07 CN CN 200810219027 patent/CN101733993B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
| CN101157077A (en) * | 2007-09-18 | 2008-04-09 | 湖北省化学研究院 | A preparation method of gum-free flexible copper-coating plate |
| CN101225276A (en) * | 2008-01-18 | 2008-07-23 | 义乌市先通电子材料有限公司 | Method for preparing copper clad laminate with high glass transition temperature |
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| Publication number | Publication date |
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| CN101733993A (en) | 2010-06-16 |
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Effective date of registration: 20180111 Address after: Chi Gang street 351100 Putian city in Fujian province Hanjiang District Jiangkou Town Red ganghuaqiao Development Zone No. 889 Patentee after: PUTIAN HANJIANG YD PCB CO., LTD. Address before: 351111 high and New Technology Industrial Development Zone (Chek Port Development Zone) in Putian City, Fujian Province Patentee before: FUJIAN NEW CENTURY ELECTRONIC MATERIAL CO., LTD. |